GOWIN GW1NS Series Quick start guide

GW1NS & GW1NSR & GW1NSE & GW1NSER Series of FPGA
Products Schematic Manual
UG292-1.0E
www.gowinsemi.com.en
1(15)
GW1NS & GW1NSR & GW1NSE & GW1NSER
Series of FPGA Products Schematic Manual
Introduction
You should follow some rules for circuit board design when using
GW1NS & GW1NSR & GW1NSE & GW1NSER series of FPGA products.
This manual describes the characteristics of GW1NS & GW1NSR &
GW1NSE & GW1NSER series of FPGA products. The main contents of
this manual are as follows:
Power Supply
JTAG
MSPI
Clock Pin
Difference Pin
READY, RECONFIG_N, DONE
MODE
JTAGSEL_N
FASTRD_N
Configure Dual-purpose Pin
External Crystal Oscillator Circuit Reference
Bank Voltage
Configuration Modes Supported by Each Device
MIPI
ADC
USB
Pinout
Power Supply
Overview
GW1NS & GW1NSR & GW1NSE & GW1NSER series of FPGA
products support LX, UX and LV versions. The voltage includes core
voltage (VCC), auxiliary voltage (VCCX) and bank voltage (VCCO).

GW1NS & GW1NSR & GW1NSE & GW1NSER Series of FPGA
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There is no linear voltage regulator in devices of LX version, and VCCX
needs to be set to 1.8V. The I/O Bank voltage VCCO can be set to 1.2 V, 1.5
V, or 1.8 V as required.
There is linear voltage regulator in devices of UX, and VCCX can be set
to 2.5 V or 3.3V. The I/O Bank voltage VCCO can be set to 1.2 V, 1.5 V, 1.8 V,
2.5 V, or 3.3 V as required. It should be noted that VCCX needs to be greater
than or equal to VCCO.
There is no linear voltage regulator in devices of LV version, and VCCX
can be set to 1.8V, 2.5V or 3.3V. The I/O Bank voltage VCCO can be set to
1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V as required.
Note!
LX and LX versions have the same functions, and the pins are compatible.
Vcc of these three versions is 1.2V. VCCX is the auxiliary power, which
is used to supply some circuits in the chip, supporting 1.8V, 2.5V and 3.3V.
After the chip powers on, VCCX can be turned off. VCCO Bank can be set to
1.2V, 1.5V, 1.8V, 2.5V, or 3.3V as required.
Power Index
The device can only operate when the power voltage is in the
recommended range. Table 1 lists the recommended range.
Table 1 Recommended Range
Name
Description
Min.
Max.
VCC
Core voltage
1.14V
1.26V
VCCOx
I/O Bank voltage for LX version
1.14V
1.89V
I/O Bank voltage for UX version
VCCX needs to be greater than or equal to VCCOx
for UX version.
1.14V
3.465V
I/O Bank voltage for LV version
1.14V
3.465V
VCCX
Auxiliary voltage for LX version
1.71V
1.89V
Auxiliary voltage for UX version
VCCX needs to be greater than or equal to VCCOx
for UX version.
2.375V
3.465V
Auxiliary voltage for LV version
1.71V
3.465V
Power Consumption
For specific density, packages, and resource utilization, you can use
GPAtool to evaluate and analyze the power consumption.
Power Rising Slope
The reference for power-on time: 0.01mV/μs ~ 10mV/μs.
Power Filter
Each FPGA power input pin is connected to the ground with a 0.1uF
ceramic capacitor.
Noise processing should be noted at the input end of the VCC, and the

GW1NS & GW1NSR & GW1NSE & GW1NSER Series of FPGA
Products Schematic Manual
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specific is as follows:
Figure 1 Noise Processing
V1P2
Vcc
FB
C
4.7uF
FB is a magnetic bead, and the reference model is MH2029-221Y. The
ceramic capacitance is 4.7uF, and It offers an accuracy of more than ±20%.
JTAG
Overview
JTAG interface is used for downloading the bitstream to SRAM,
on-chip flash or off-chip flash of FPGA.
Signal Description
Table 2 Signal Description
Name
I/O
Description
TCK
I
JTAG serial clock input
TMS
I, internal weak
pull-up
JTAG serial mode input
TDI
I, internal weak
pull-up
JTAG serial data input
TDO
O
JTAG serial data output
JTAG Circuit Reference
Figure 2 JTAG Circuit Reference
R
4.7K TCK R
R
R
R
22
22
22
22
VCC3P3
TDI
TDO
TMS
1
3
5
7
9
2
4
6
8
10
JTAG
J
Note!
The resistance accuracy is not less than ±5%;
The power of JTAG 6th pin can be set to VCC1P2, VCC1P5, VCC1P8, VCC2P5 as
required.

GW1NS & GW1NSR & GW1NSE & GW1NSER Series of FPGA
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MSPI
Overview
FPGA as a master device, MSPI reads the data automatically from the
off-chip flash then transmits it to the FPGASRAM.
Signal Description
Table 3 Signal Description
Name
I/O
Description
MCLK
O
Clock output in MSPI mode
MCS_N
O
MCS_N in MSPI mode, low-active
MI
I
Data input in MSPI mode
MO
O
Data output in MSPI mode
MSPI Circuit Reference
Figure 3 MSPI Circuit Reference
CS
WP
DO
GND
VCC
HOLD
CLK
DI
1
2
3
45
6
7
8
MCS_N
MI
R
VCC3P3
4.7K MCLK
MO
SPI FLASH
UR
4.7K
C
100nF
VCC3P3
R
1K
Note!
MCLK signal requires 1K pull-down resistor.
The resistance accuracy is not less than ±5%.
Clock Pins
Overview
The clock pins include GCLK global clock pins and PLL clock pins.
GCLK: GCLK in FPGA products distributes in L and R quadrants. Each
quadrant provides eight GCLK nets. The clock source of each GCLK
can be dedicated pin or CRU, and the dedicated pin can provide better
performance.
PLL: Frequency (multiplication and division), phase, and duty cycle can
be adjusted by configuring the parameters.

GW1NS & GW1NSR & GW1NSE & GW1NSER Series of FPGA
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Signal Description
Table 4 Signal Description
Name
I/O
Description
GCLKT_[x]
I/O
Pins in global clock input, T(True), [x]: global clock
No.
GCLKC_[x]
I/O
Pins for Global clock input, C(Comp), [x]: global
clock No.
LPLL_T_fb/RPLL_T_fb
I
Left/Right PLL feedback input pins, T(True)
LPLL_C_fb/RPLL_C_fb
I
Left/Right PLL feedback input pins, C(Comp)
LPLL_T_in/RPLL_T_in
I
Left/Right PLL clock input pin, T(True)
LPLL_C_in/RPLL_C_in
I
Left/Right PLL clock input pin, C(Comp)
Clock Input Selection
If the external clock as PLL clock, it is recommended to input from
PLL_T.
GCLK is the global clock and is connected to all resources in the
device. It is recommended to input from GCLK_T.
Differential Pins
Overview
Differential transmission is a kind of signal transmission, which is
different from the traditional signal line and ground line. Differential
transmission signals are transmitted on these two lines. These two signals
are with same amplitudeAmplitude, phase and opposite polarity.
Differential Type
Figure 5 Differential Type
I/O output standard
Single/Differ
Bank VCCO (V)
Output Driver Strength (mA)
LVPECL33E
Differential
3.3
16
MVLDS25E
Differential
2.5
16
BLVDS25E
Differential
2.5
16
RSDS25E
Differential
2.5
8
LVDS25E
Differential
2.5
8
LVDS25
Differential
2.5/3.3
3.5/2.5/2/6
RSDS
Differential
2.5/3.3
2
MINILVDS
Differential
2.5/3.3
2
PPLVDS
Differential
2.5/3.3
3.5
SSTL15D
Differential
1.5
8

GW1NS & GW1NSR & GW1NSE & GW1NSER Series of FPGA
Products Schematic Manual
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I/O output standard
Single/Differ
Bank VCCO (V)
Output Driver Strength (mA)
SSTL25D_I
Differential
2.5
8
SSTL25D_II
Differential
2.5
8
SSTL33D_I
Differential
3.3
8
SSTL33D_II
Differential
3.3
8
SSTL18D_I
Differential
1.8
8
SSTL18D_II
Differential
1.8
8
HSTL18D_I
Differential
1.8
8
HSTL18D_II
Differential
1.8
8
HSTL15D_I
Differential
1.5
8
Note!
See pinout manuals for specific differential pin positions.
READY, RECONFIG_N, DONE
Overview
RECONFIG_N, equivalent to the reset function of FPGAprogramming
configuration, FPGA cannot perform any configuration operation when
RECONFIG_N is pulled down.
As a configuration pin, a low level with a pulse width of not less than
25ns is required for GowinCONFIG configuration mode to enable the
device to reload the bitstream. You can control the pin by writing logic to
trigger the device to reconfigure as required.
You can configure FPGA only when the READY signal is high. The
device should be restored by power on or triggering RECONFIG_N when
the READY signal is low.
As an output configuration pin, it can indicate whether the FPGA can
be configured currently. If the device is ready, READY signal is high. If the
device fails to configure, the READY signal changes to low.As an input
configuration pin, you can delay the configuration by its own logic or pulling
down the READY signal.
DONE signal indicates that the FPGA is configured successfully. The
signal is high after successful configuration.
As an output configuration pin, it can indicate whether FPGA
configuration is successful. If configured successfully, DONE is high, and
the device enters into an operating state. If the device failed to configure,
the DONE signal remains low.As the input, you can delay the entry into
user mode by manually pulling down the DONE signal via the logic.
When RECONFIG_N or READY signals are low, DONE signal is also
low. When configuring SRAM using JTAG circuit, it does not need to take
DONE signal into account.

GW1NS & GW1NSR & GW1NSE & GW1NSER Series of FPGA
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Signal Description
Table 6 Signal Description
Name
I/O
Description
RECONFIG_N
I, internal weak
pull-up
Low level pulse: start new GowinCONFIG
configuration
READY
I/O
High-level pulse: The device can be
programmed and configured;
Low-level pulse: The device cannot be
programmed and configured,
DONE
I/O
High-level pulse: Successfully programmed
and configured;
Low-level pulse: Programming and
configuration uncompleted or failed.
READY, RECONFIG_N, DONE Reference Circuit
Figure 4 READY, RECONFIG_N, DONE Reference Circuit
READY
DONE
RECONFIG_N
R
4.7K
R
4.7K
R
4.7K
D
VCC3P3
Note!
The pull-up power supply is the bank voltage value VCCO0 of the corresponding pin;
The resistance accuracy is not less than ±5%;
MODE
Overview
MODE includes MODE0, MODE1, MODE2, and GowinCONFIG.
When FPGA powers on or a low pulse triggers RECONFIG_N, the device
enters the corresponding GowinCONFIG state according to the MODE
value. As the number of pins for each package is different, some MODE
pins are not all packaged, and the unpacked MODE pins are grounded
inside. Please refer to the corresponding pinout manual for further details.

GW1NS & GW1NSR & GW1NSE & GW1NSER Series of FPGA
Products Schematic Manual
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Signal Description
Table 7 Signal Description
Name
I/O
Description
MODE2
I, internal weak
pull-up
GowinCONFIG mode selection pin.
MODE1
I, internal weak
pull-up
GowinCONFIG modes selection pin.
MODE0
I, internal weak
pull-up
GowinCONFIG mode selection pin.
Mode Selection
Table 8 Mode Selection
Configuration Mode
MODE[2:0]
Description
JTAG
XXX
External Host configure FPGA products of
LittleBee®Family via JTAG interface.
GowinCONFIG
AUTO
BOOT
000
FPGAreads data from embedded Flash
for configuration
SSPI
001
External Host configure FPGA products of
LittleBee®Family via SPI interface.
MSPI
010
FPGA as Master, FPGA reads data from
external Flash (or other devices) via the
SPI interface for configuration..
DUAL
BOOT
110
FPGAreads data from external Flash first
and if the external Flash fails, it reads from
the internal Flash.
SERIAL
101
External Host configure FPGA products of
LittleBee®Family via DIN interface.
CPU
111
External Host configure FPGA products of
LittleBee®Family via DBUS interface.
JTAGSEL_N
Overview
JTAGSEL_N is JTAG mode selection signal. If the JTAG pin is set to
GPIO in Gowin software, the JTAG pin changes to GPIO after the device is
powered on to configure successfully. If JTAG configuration fails, you can
recover by pulling down JTAGSEL_N. If you do not set JTAG multiplexing,
the JTAG configuration function is always available.
Signal Description
Table 9 Signal Description
Pin Name
I/O
Description
JTAGSEL_N
I, internal weak
pull-up
Change JTAG pin from GPIO to
configuration pin, active-low
Note!

GW1NS & GW1NSR & GW1NSE & GW1NSER Series of FPGA
Products Schematic Manual
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The JTAGSEL_N pin and four JTAG pins (TCK, TMS, TDI, and TDO) configured as GPIO
are exclusive. JTAG pins can only be used as configuration pin if JTAGSEL_N is set to
GPIO. JTAGSEL_N can only be used as a configuration pin if JTAG pins are set to GPIOs.
FASTRD_N
Overview
MSPI configuration mode reads the SPI Flash speed selection signal.
When FASTRD_N is high, it is normal read mode. When FASTRD_N is low,
it is high speed read mode. Different manufacturers have different
high-speed read operation instructions, please refer to the corresponding
Flash datasheet.
Signal Description
Table 10 Signal Description
Pin Name
I/O
Description
FASTRD_N
I/O
As a configuration pin, internal weak pull-up,
READY signal rising edge samples MSPI
configuration speed mode;
As a GPIO, it can be used as input or output.
Note!
High level: Normal Flash mode, clock frequency should not be higher than 30MHz;
Low level: High speed Flash mode, clock frequency should be > 30MHz and <
80MHz
Configure Dual-purpose Pin
Overview
Dual-purpose pin configuration refers to performing configuration
function at the moment of power-on. After downloading bitstream files, it is
used as general I/O.
The steps are as follows:
1. Open the project in Gowin software;
2. Select "Project > Configuration > Dual Purpose Pin" from the menu, as
shown in Figure 5;
3. Check the corresponding options.

GW1NS & GW1NSR & GW1NSE & GW1NSER Series of FPGA
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Figure 5 Configure Dual-purpose Pin
Dual- purpose Pin
SSPI: As a GPIO, SSPI can be used as input or output;
MSPI: As a GPIO, MSPI can be used as input or output;
RECONFIG_N GPIO can only be used as an output. Set the initial
value of RECONFIG_N as high when multiplexing it.
READY: As a GPIO, READY can be used as input or output.As an
input GPIO, the initial value of READY should be 1. Otherwise, the
FPGA will fail to configure;
As a GPIO, DONE can be used as an input or output. If DONE is used
as an input GPIO, the initial value of DONE should be 1. Otherwise, the
FPGA will fail to enter the user mode after configuring;
As a GPIO, JTAG can be used as an input or output;
As a GPIO, JTAGSEL_N can be used as an input or output.
As a GPIO, JTAG can be used as an input or output. You multiplex
MODE pin, the correct value is needed to provided during configuration
(power-on or low-level pulse triggers RECONFIG_N). Up to three pins
can be multiplexed in MODE. Unpackaged pins are grounded internally.
Please refer to pinout manuasl for details. For the MODE value
corresponding to different configuration modes, please refer to the
corresponding device manual.
Note!
If the number of I/O ports is sufficient, use non-multiplexed pins first.

GW1NS & GW1NSR & GW1NSE & GW1NSER Series of FPGA
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FPGA External Crystal Oscillator Circuit Reference
Figure 6 FPGA External Crystal Oscillator Circuit
IN VCC
GND OUT R
C
22
10nF
VCC3P3
OSC
1
23
4
FB
CLK_G
FB is a magnetic bead, and MH2029-221Y is the reference model. The
resistance accuracy is not less than ±5% , and capacitance accuracy is not
less than ±20%.
Bank Voltage
For the Bank power supply requirements of the devices, please refer
to the Power section of the following documents.
UG825, GW1NS-2C Pinout
UG822, GW1NS-2 Pinout
UG824, GW1NS-4 & 4C Pinout
UG862, GW1NSR-2 & 2C Pinout
UG864, GW1NSR-4 Pinout
UG865, GW1NSR-4C Pinout
UG872, GW1NSE-2C Pinout
UG883, GW1NSER-4C Pinout
Configuration Modes Supported by Each Device
GW1NS-2
Table 11 GW1NS -2 Configuration Modes
Modes
JTAG
AUTO
BOOT
DUAL
BOOT
MSPI
SSPI
SERIAL
CPU
QN32
√
√
-
-
√
-
-
QN32U
√
√
-
-
-
-
-
CS36
√
√
-
-
-
-
-
CS36U
√
√
-
-
-
-
-
QN48
√
√
-
-
-
-
-
LQ144
√
√
√
-
√
√
√

GW1NS & GW1NSR & GW1NSE & GW1NSER Series of FPGA
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GW1NS-2C
Table 12 GW1NS -2 C Configuration Modes
Modes
JTAG
AUTO
BOOT
DUAL
BOOT
MSPI
SSPI
SERIAL
CPU
QN32
√
√
-
-
√
-
-
QN32U
√
√
-
-
-
-
-
CS36
√
√
-
-
-
-
-
QN48
√
√
-
-
-
-
-
LQ144
√
√
√
-
√
√
√
GW1NS-4/4C
Table 13 GW1NS-4 / 4C Configuration Modes
Configuration Modes
JTAG
AUTO BOOT
MSPI
CS49
√
√
-
QN48
√
√
√
MG64
√
√
-
GW1NSR-2/2C
Table 14 GW1NSR-2 / 2 C Configuration Modes
Configuration Modes
JTAG
AUTO BOOT
QN48
√
√
GW1NSE-2C
Table 15 GW1NSE -2 C Configuration Modes
Configuration Modes
JTAG
AUTO BOOT
QN48
√
√
LQ144
√
√
GW1NSER-4C
Table 16 GW1NSER -4 C Configuration Modes
Configuration Modes
JTAG
AUTO BOOT
QN48G
√
√
QN48P
√
√
GW1NSR-4C
Table 17 GW1NSR -4 C Configuration Modes
Configuration Modes
JTAG
AUTO BOOT
MG64P
√
√
MIPI
GW1NS series of FPGAproducts support embedded MIPI interface
modules. BANK0 of GW1NS-2 is MIPI input port and BANK2 is MIPI output

GW1NS & GW1NSR & GW1NSE & GW1NSER Series of FPGA
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13(15)
port. BANK0/BANK1 of GW1NS-4 is MIPI input and BANK2 supports MIPI
output.
Note!
For GW1NS-2C/2 devices of LX or UX version, VCCO0 is set to 1.2V when BANK0 is
used as MIPI input and VCCO2 is set to 1.2V when BANK2 is used as MIPI output. And
the MIPI speed of LX version is only 60% of that of UX version.
When BANK0/BANK1 of GW1NS-4C/4 is used as MIPI input, VCCO0/VCCO1 need to be
set to 1.2V, and when BANK2 is used as MIPI output, VCCO2 needs to be set to 1.2V;
When VCCX is set to 1.8 V, the speed of MIPI can only reach 60% of the speed of MIPI
when VCCX is set to 2.5V/3.3V.
ADC
GW1NS-2C/2 series of FPGA products integrate an eight-channel
single-ended 12 bits SAR ADC. It is a medium-speed ADC with low-power,
low-leakage current and high-speed.
Dynamic Performance
Slew Rate: Max. 1MHz
Dynamic range: >81 dB SFDR,>62 db SINAD
Linear performance: INL<1 LSB, DNL<0.5 LSB, no missing codes
ADC Reference Voltage
The reference voltage can be enabled or disabled by configuring
parameters.
VREF_EN=1, enabled;
VREF_EN=0, disabled, and Vref is provided by Vccx.
When Vref is enabled, there are two ways to provide Vref: internal and
external.
The internal is provided by Vccx and supports seven reference
voltages by configuring VREF_SEL. The external is provided by VREF.
Note!
It is recommended to add 10uF capacitance forADC signal pin.
It is recommended to use external reference voltage
USB
GW1NS-2C/2 is embedded with USB2.0 PHY with 480Mbps, USB1.1
1.5/12Mbps compatible, plug-and-play, hot-plug.
Note!
The VBUS pin of FPGA chip needs to be connected to the VBUS of USB connector.
The ID pin of FPGAchip needs to be connected to the ID of USB connector.
The XIN and XOUT pins of FPGA chip need to be connected to the external 12Mhz
crystal.
The REXT pin of FPGA chip must be connected to the pull-down 12.7K with
resistance of 1% accuracy.

GW1NS & GW1NSR & GW1NSE & GW1NSER Series of FPGA
Products Schematic Manual
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14(15)
Pinout
Before the design of the circuit, you should take the FPGA pinout into
consideration, and a reasonable choice should be made for IO LOGIC,
global clock resource, PLL and differential signals, etc.
Note!
During the configuration, all I/O (except TCK) of the device is weak pull-up, and I/O status
after configuration is controlled by user programs and constraints.

GW1NS & GW1NSR & GW1NSE & GW1NSER Series of FPGA
Products Schematic Manual
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15(15)
Support and Feedback
Gowin Semiconductor provides customers with comprehensive
technical support. If you have any questions, comments, or suggestions,
please feel free to contact us directly by the following ways.
Website: www.gowinsemi.com
E-mail: [email protected]
Revision History
Date
Version
Description
07/28/2020
1.0
Initial version published.

Copyright© 2020 Guangdong Gowin Semiconductor Corporation. All Rights Reserved.
No part of this document may be reproduced or transmitted in any form or by any denotes,
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consent of GOWINSEMI.
Disclaimer
GOWINSEMI®, LittleBee®,Arora, and the GOWINSEMI logos are trademarks of
GOWINSEMI and are registered in China, the U.S. Patent and Trademark Office, and other
countries. All other words and logos identified as trademarks or service marks are the
property of their respective holders, as described at www.gowinsemi.com. GOWINSEMI
assumes no liability and provides no warranty (either expressed or implied) and is not
responsible for any damage incurred to your hardware, software, data, or property resulting
from usage of the materials or intellectual property except as outlined in the GOWINSEMI
Terms and Conditions of Sale.All information in this document should be treated as
preliminary. GOWINSEMI may make changes to this document at any time without prior
notice. Anyone relying on this documentation should contact GOWINSEMI for the current
documentation and errata.
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