HP Aruba AP-63 Series Installation instructions

MF877-00 Page 1
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Networking
Marketing Name / Model
[List multiple models if applicable.]
HPE Aruba AP-63x Series Campus Access Point
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by
Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment
(WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries
All types including standard alkaline and lithium
coin or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0

MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Item Description
Notes
Quantity
of items
included
in product
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx screwdriver
TT10
Static electric tweezers
NA
Torx screwdriver
DEC
Torx screwdriver
PH1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove the two screws on the bracket at the position shown in the figure with the torque force equipment (Type:
DEC).
2. Put the unit onto the fixture and remove the four screws from the die cast with torque force equipment
(Type:TT10).
3. Remove the top cover.
4. Use electrostatic tweezers to remove the antenna cable from the PCBA board. Remove the four screws with torque
force equipment (Type:PH1).
5. Remove the antenna plate from the PCBA board. Please note that you should handle the edge of the antenna plate to
remove, don’t touch the antenna module and terminal.
6. Remove the three screws from PCBA board with torque force equipment (Type:PH1).
7. Remove the PCBA board from the die cast.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

MF877-00 Page 3
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
1.Remove the two screws on the bracket at the position shown in the figure with the torque force
equipment(Type:DEC).
2.Put the unit onto the fixture,and remove the four screws from the die cast with torque force equipment(Type:TT10).
3.Remove the top cover.
4.Use electrostatic tweezers to remove the antenna cable from the PCBA board. Remove the four screws with torque
force equipment(Type:PH1).
5.Remove the antenna plate from the PCBA board. Please note that you should handle the edge of the antenna plate to
remove, don’t touch the antenna module and terminal.

MF877-00 Page 4
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
6.Remove the three screws from PCBA board with torque force equipment(Type:PH1).
7.Remove the PCBA board from the die cast.