HP Aruba AP-374 Assembly instructions

EL-MF877-00
Template Revision A
Page 1
Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
AP-374
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1 in product, 1 in power adapter
1
Batteries All types including standard alkaline and lithium
coin or button style batteries 0
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries 0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants 0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos 0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
1.0 Items Requiring Selective Treatment

EL-MF877-00
Template Revision A
Page 2
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx screwdriver
T10/T20/T25
Cross-head screwdriver
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Use T25 screwdriver to remove the 4 screws on the chassis
2. Use Cross-head screwdriver to remove the 3 screws on the TOP
3. Use T25 screwdriver to remove the 6 screws on the bottom
4. Remove the antenna cable from PCBA.
5. Use Cross-head screwdriver to remove screws on the PCBA and AC Module.
6.
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
AP-374
1．Use T25 screwdriver to remove the 4 screws on the holder
2.0 Tools Required

EL-MF877-00
Template Revision A
Page 3
2．Use Cross-head screwdriver to remove screw on the TOP
3. Use T25 screwdriver to remove the 6 screws on the bottom
4. Remove the antenna cable from PCBA.

EL-MF877-00
Template Revision A
Page 4
,
5. Use Cross-head screwdriver to remove screws on the PCBA and AC Module.