Huawei ME909u-523 Installation instructions

HUAWEI ME909u-523 LTE LGA Module
Hardware Guide
Issue
01
Date
2014-05-24

Copyright © Huawei Technologies Co., Ltd. 2014. All rights reserved.
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HUAWEI ME909u-523 LTE LGA Module
Hardware Guide
About This Document
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About This Document
Revision History
Document
Version
Date
Chapter
Descriptions
01
2014-05-24
Creation

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Hardware Guide
Contents
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Contents
1 Introduction....................................................................................................................................7
2 Overall Description ......................................................................................................................8
2.1 About This Chapter........................................................................................................................... 8
2.2 Function Overview ........................................................................................................................... 8
2.3 Circuit Block Diagram..................................................................................................................... 10
2.4 Application Block Diagram ..............................................................................................................11
3 Description of the Application Interfaces..............................................................................12
3.1 About This Chapter......................................................................................................................... 12
3.2 LGA Interface ................................................................................................................................. 12
3.3 Power Interface.............................................................................................................................. 24
3.3.1 Overview................................................................................................................................ 24
3.3.2 Power Supply VBAT Interface............................................................................................... 24
3.3.3 Output Power Supply Interface ............................................................................................. 25
3.4 Signal Control Interface.................................................................................................................. 25
3.4.1 Overview................................................................................................................................ 25
3.4.2 Power-on/off (POWER_ON_OFF) Pin.................................................................................. 27
3.4.3 RESIN_N Pins....................................................................................................................... 28
3.4.4 WAKEUP_IN Signal .............................................................................................................. 29
3.4.5 WAKEUP_OUT Signal........................................................................................................... 30
3.4.6 SLEEP_STATUS Signal........................................................................................................ 31
3.4.7 LED_MODE Pin..................................................................................................................... 32
3.5 UART Interface............................................................................................................................... 33
3.5.1 Overview................................................................................................................................ 33
3.5.2 Circuit Recommended for the UART Interface...................................................................... 34
3.6 USB Interface................................................................................................................................. 35
3.7 USIM Card Interface....................................................................................................................... 36
3.7.1 Overview................................................................................................................................ 36
3.7.2 Circuit Recommended for the USIM Card Interface.............................................................. 36
3.8 Audio Interface ............................................................................................................................... 37
3.9 General Purpose I/O Interface....................................................................................................... 39
3.10 ADC Interface............................................................................................................................... 39
3.11 JTAG Interface.............................................................................................................................. 39

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3.12 RF Antenna Interface ................................................................................................................... 41
3.13 Tunable Antenna Control.............................................................................................................. 44
3.14 Reserved Interface....................................................................................................................... 45
3.15 NC Interface................................................................................................................................. 45
4 RF Specifications.........................................................................................................................46
4.1 About This Chapter......................................................................................................................... 46
4.2 Operating Frequencies................................................................................................................... 46
4.3 Conducted RF Measurement......................................................................................................... 47
4.3.1 Test Environment................................................................................................................... 47
4.3.2 Test Standards....................................................................................................................... 47
4.4 Conducted Rx Sensitivity and Tx Power........................................................................................ 47
4.4.1 Conducted Receive Sensitivity.............................................................................................. 47
4.4.2 Conducted Transmit Power................................................................................................... 48
4.5 Antenna Design Requirements ...................................................................................................... 49
4.5.1 Antenna Design Indicators .................................................................................................... 49
4.5.2 Interference ........................................................................................................................... 51
4.5.3 Antenna Requirements.......................................................................................................... 52
5 Electrical and Reliability Features...........................................................................................53
5.1 About This Chapter......................................................................................................................... 53
5.2 Absolute Ratings ............................................................................................................................ 53
5.3 Operating and Storage Temperatures............................................................................................ 53
5.4 Electrical Features of USIM ........................................................................................................... 54
5.5 Electrical Features of Application Interfaces.................................................................................. 54
5.6 Power Supply Features.................................................................................................................. 55
5.6.1 Input Power Supply ............................................................................................................... 55
5.6.2 Power Consumption.............................................................................................................. 56
5.6.3 Reliability Features................................................................................................................ 58
5.7 EMC and ESD Features................................................................................................................. 61
6 Mechanical Specifications.........................................................................................................64
6.1 About This Chapter......................................................................................................................... 64
6.2 Storage Requirement..................................................................................................................... 64
6.3 Moisture Sensitivity ........................................................................................................................ 64
6.4 Dimensions and Interfaces............................................................................................................. 65
6.5 Packaging....................................................................................................................................... 65
6.6 Label............................................................................................................................................... 67
6.7 Customer PCB Design................................................................................................................... 67
6.7.1 PCB Surface Finish............................................................................................................... 67
6.7.2 PCB Pad Design.................................................................................................................... 67
6.7.3 Heat Dissipation Solution ...................................................................................................... 68
6.7.4 Solder Mask........................................................................................................................... 68
6.7.5 Requirements on PCB Layout............................................................................................... 69

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6.8 Assembly Processes...................................................................................................................... 69
6.8.1 General Description ofAssembly Processes........................................................................ 69
6.8.2 Stencil Design........................................................................................................................ 69
6.8.3 Reflow Profile ........................................................................................................................ 70
6.9 Specification of Rework.................................................................................................................. 71
6.9.1 Process of Rework ................................................................................................................ 71
6.9.2 Preparations of Rework......................................................................................................... 72
6.9.3 Removing of the Module........................................................................................................ 72
6.9.4 Welding Area Treatment........................................................................................................ 72
6.9.5 Module Installation................................................................................................................. 73
6.9.6 Specifications of Rework....................................................................................................... 73
7 Certifications................................................................................................................................74
7.1 About This Chapter......................................................................................................................... 74
7.2 Certifications................................................................................................................................... 74
8 Safety Information......................................................................................................................75
8.1 Interference.................................................................................................................................... 75
8.2 Medical Device............................................................................................................................... 75
8.3 Area with Inflammables and Explosives......................................................................................... 75
8.4 Traffic Security................................................................................................................................ 76
8.5 Airline Security................................................................................................................................ 76
8.6 Safety of Children........................................................................................................................... 76
8.7 Environment Protection.................................................................................................................. 76
8.8 WEEE Approval.............................................................................................................................. 76
8.9 RoHS Approval............................................................................................................................... 76
8.10 Laws and Regulations Observance ............................................................................................. 77
8.11 Care and Maintenance................................................................................................................. 77
8.12 Emergency Call............................................................................................................................ 77
8.13 Regulatory Information................................................................................................................. 77
8.13.1 FCC Statement.................................................................................................................... 77
9 Appendix A Circuit of Typical Interface................................................................................79
10 Appendix B Acronyms and Abbreviations..........................................................................80

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Hardware Guide
Introduction
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1 Introduction
This document describes the hardware application interfaces and air interfaces
provided by HUAWEI ME909u-523 LTE LGA module (hereinafter referred to as the
ME909u-523 module).
This document helps hardware engineer to understand the interface specifications,
electrical features and related product information of the ME909u-523 module.

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Overall Description
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2 Overall Description
2.1 About This Chapter
This chapter gives a general description of the ME909u-523 module and provides:
Function Overview
Circuit Block Diagram
Application Block Diagram
2.2 Function Overview
Table 2-1 ME909u-523 module features
Feature
Description
Physical
Dimensions
Dimensions (L × W × H): 30 mm × 30 mm × 2.35 mm
Weight
about 5 g
Operating
Bands
LTE: FDD Band 2, Band 4, Band 5, Band 17, all bands with
diversity
WCDMA/HSDPA/HSUPA/HSPA+: Band II, Band IV, Band V, all
bands with diversity
GPS(L1): 1575.42 MHz
GLONASS: 1602 MHz
Operating
Temperature
Normal operating temperature: –20°C to +70°C
Extended operating temperature[1]: –30°C to +75°C
Storage
Temperature
–40°C to +85°C
Power
Voltage
DC 3.3 V to 4.2 V (typical value is 3.8 V)

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Feature
Description
AT
Commands
See the HUAWEI ME909u-523 LTE LGA Module AT Command
Interface Specification.
Application
Interface
(145-pin LGA
interface)
One standard USIM (Class B and Class C) interface
Audio interface: PCM interface[3]
USB 2.0 (High Speed)
4-wire UART x 2
2-wire UART[2] x 1
GPIO x 5
Power on/off pin
Hardware reset pin
Sleep indicator pin (SLEEP_STATUS)
Tunable antenna control (4 GPIOs)[3]
HSIC interface[4]
SDIO interface[4]
SPI interface[4]
I2C interface[4]
JTAG
Antenna interface (Main/AUX/GPS)
ADC x 2
Power supply
Antenna
Interface
WWAN primary antenna pad x 1
WWAN secondary antenna pad x 1
GPS antenna pad x 1
Data Services
WCDMA CS: DL 64 kbit/s; UL 64 kbit/s
WCDMA PS: DL 384 kbit/s; UL 384 kbit/s
HSPA+: DL 21.6 Mbit/s UL; 5.76 Mbit/s
DC-HSPA+: DL 43.2 Mbit/s; UL 5.76 Mbit/s
LTE FDD: DL 100 Mbit/s; UL 50 Mbit/s @20M BW cat3

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[1]: When the temperature is beyond the range of –20°C to +70°C, the module may slightly
deviate from 3GPP specifications.
[2]: This is only used for debugging.
[3]: The firmware function is planning.
[4]: These interfaces are reserved for intelligent module in future.
2.3 Circuit Block Diagram
Figure 2-1 shows the circuit block diagram of the ME909u-523 module. The major
functional units of the ME909u-523 module contain the following parts:
Power management
Baseband controller
Multi-chip package (MCP) memory
RF Circuit
Figure 2-1 Circuit block diagram of the ME909u-523 module

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2.4 Application Block Diagram
Figure 2-2 Application block diagram of the ME909u-523 module
UART Interface:
The module supports 3 UART interfaces. Two are 4-wire
UARTs. The one is 2-wire UART, which is only for debugging.
USB Interface:
The USB interface supports USB 2.0 high speed standard.
USIM Interface:
The USIM interface provides the interface for a USIM card.
GPIO
General Purpose I/O pins.
External Power
Supply:
DC 3.8 V is recommended.
Audio Interface:
The module supports one PCM interface. This firmware
function is planning.
RF Pad:
RF antenna interface.
Tunable ANT
CTRL:
Since LTE bands cover wide frequency, tunable ANT CTRL
helps customer for tunable antenna design. This firmware
function is planning.
ADC:
Analog-to-Digital Converter
SPI Interface:
Reserved for intelligent module in future.
SDIO Interface:
Reserved for intelligent module in future.
HSIC Interface:
Reserved for intelligent module in future.
I2C Interface:
Reserved for intelligent module in future.

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Description of the Application Interfaces
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3 Description of the Application Interfaces
3.1 About This Chapter
This chapter mainly describes the external application interfaces of the ME909u-523
module, including:
LGA Interface
Power Interface
Signal Control Interface
UART Interface
USB Interface
USIM Card Interface
Audio Interface
General Purpose I/O Interface
ADC Interface
JTAG Interface
RF Antenna Interface
Tunable Antenna Control
Reserved Interface
NC Interface
3.2 LGA Interface
The ME909u-523 module uses a 145-pin LGA as its external interface. For details
about the module and dimensions, see "6.4 Dimensions and Interfaces".

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Description of the Application Interfaces
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Figure 3-1 shows the sequence of pins on the 145-pin signal interface of the
ME909u-523 module.
Figure 3-1 Sequence of LGAinterface (Top view)
Figure 3-2 shows the appearance of ME909u-523 module. One is top view, and the
other is bottom view.

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Description of theApplication Interfaces
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Figure 3-2 Appearance of ME909u-523 module (without label)
Table 3-1 shows the definitions of pins on the 145-pin signal interface of the
ME909u-523 module.
Table 3-1 Definitions of pins on the LGAinterface
PIN
No.
Pin Name
Pad
Type
Description
Parameter
Min. (V)
Typ. (V)
Max. (V)
1
UART1_TX
O
UART1 transmit
output
VOH
1.35
1.8
1.8
VOL
0
-
0.45
2
UART1_RTS
O
UART1 ready for
receive
VOH
1.35
1.8
1.8
VOL
0
-
0.45
3
UART1_CTS
I
UART1 clear to
send
VIH
1.17
1.8
2.1
VIL
–0.3
-
0.63
4
UART1_RX
I
UART1 receive data
input
VIH
1.17
1.8
2.1
VIL
–0.3
-
0.63
5
PCM_SYNC
O
PCM interface sync
The firmware
function is planning.
VOH
1.35
1.8
1.8
VOL
0
-
0.45
6
PCM_DIN
I
PCM interface data
input
The firmware
function is planning.
VIH
1.17
1.8
2.1
VIL
–0.3
-
0.63
7
PCM_DOUT
O
PCM interface data
output
The firmware
function is planning.
VOH
1.35
1.8
1.8
VOL
0
-
0.45
8
PCM_CLK
O
PCM interface clock
VOH
1.35
1.8
1.8

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PIN
No.
Pin Name
Pad
Type
Description
Parameter
Min. (V)
Typ. (V)
Max. (V)
The firmware
function is planning.
VOL
0
-
0.45
9
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
10
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
11
WAKEUP_IN
I
Host to set the
module into sleep or
wake up the module
from sleep.
VIH
1.17
1.8
2.1
VIL
–0.3
-
0.63
12
VBAT
PI
Power supply input
-
3.3
3.8
4.2
13
VBAT
PI
Power supply input
-
3.3
3.8
4.2
14
PS_HOLD
I
Power supply hold
signal to PMU, used
for JTAG.
VIH
1.17
1.8
2.1
VIL
–0.3
-
0.63
15
SLEEP_STAT
US
O
Indicates sleep
status of
ME909u-523
module.
VOH
1.35
1.8
1.8
VOL
0
-
0.45
16
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
17
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
18
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
19
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
20
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
21
ANT_TUNE0
O
Tunable antenna
control signal, bit 0
The firmware
function is planning.
VOH
1.35
1.8
1.8
VOL
0
-
0.45
22
ANT_TUNE1
O
Tunable antenna
control signal, bit 1
The firmware
function is planning.
VOH
1.35
1.8
1.8
VOL
0
-
0.45
23
ANT_TUNE2
O
Tunable antenna
VOH
1.35
1.8
1.8

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PIN
No.
Pin Name
Pad
Type
Description
Parameter
Min. (V)
Typ. (V)
Max. (V)
control signal, bit 2
The firmware
function is planning.
VOL
0
-
0.45
24
ANT_TUNE3
O
Tunable antenna
control signal, bit 3
The firmware
function is planning.
VOH
1.35
1.8
1.8
VOL
0
-
0.45
25
NC
-
Not connected,
please keep this pin
open.
-
-
-
-
26
NC
-
Not connected,
please keep this pin
open.
-
-
-
-
27
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
28
UART2_TX
O
UART2 transmit
output
VOH
1.35
1.8
1.8
VOL
0
-
0.45
29
UART2_RX
I
UART2 receive data
input
VIH
1.17
1.8
2.1
VIL
–0.3
-
0.63
30
JTAG_TMS
I
JTAG test mode
select
VIH
1.17
1.8
2.1
VIL
–0.3
-
0.63
31
NC
-
Not connected,
please keep this pin
open.
-
-
-
-
32
VCC_EXT1
PO
1.8 V POWER
output
-
-
1.8
-
33
NC
-
Not connected,
please keep this pin
open.
-
-
-
-
34
SIM_VCC
PO
Output power
supply for USIM
card
-
-
1.8/2.85
-
35
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
36
JTAG_TRST_
N
I
JTAG reset
VIH
1.17
1.8
2.1
VIL
–0.3
-
0.63

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PIN
No.
Pin Name
Pad
Type
Description
Parameter
Min. (V)
Typ. (V)
Max. (V)
37
NC
-
Not connected,
please keep this pin
open.
-
-
-
-
38
NC
-
Not connected,
please keep this pin
open.
-
-
-
-
39
NC
-
Not connected,
please keep this pin
open.
-
-
-
-
40
NC
-
Not connected,
please keep this pin
open.
-
-
-
-
41
NC
-
Not connected,
please keep this pin
open.
-
-
-
-
42
JTAG_TCK
I
JTAG clock input
VIH
1.17
1.8
2.1
VIL
–0.3
-
0.63
43
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
44
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
45
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
46
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
47
JTAG_SRST_
N
I
JTAG reset for
debugging
VIH
1.17
1.8
2.1
VIL
–0.3
-
0.63
48
GND
G
Ground
-
-
-
-
49
NOT used
B
Do not design PAD
-
-
-
-
50
GND
G
Ground
-
-
-
-
51
GPIO
I/O
General Purpose
I/O pins. The
function of these
pins has not been
defined.
VOH
1.35
1.8
1.8
VOL
0
-
0.45
VIH
1.17
1.8
2.1
VIL
–0.3
-
0.63
52
GND
G
Ground
-
-
-
-
53
NOT used
B
Do not design PAD
-
-
-
-

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PIN
No.
Pin Name
Pad
Type
Description
Parameter
Min. (V)
Typ. (V)
Max. (V)
54
GND
G
Ground
-
-
-
-
55
GPIO
I/O
General Purpose
I/O pins. The
function of these
pins has not been
defined.
VOH
1.35
1.8
1.8
VOL
0
-
0.45
VIH
1.17
1.8
2.1
VIL
–0.3
-
0.63
56
GND
G
Ground
-
-
-
-
57
NOT used
B
Do not design PAD
-
-
-
-
58
GND
G
Ground
-
-
-
-
59
GND
G
Ground
-
-
-
-
60
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
61
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
62
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
63
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
64
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
65
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
66
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
67
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
68
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
69
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
70
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
71
WAKEUP_OU
T
O
Module to wake up
the host
VOH
1.35
1.8
1.8
VOL
0
-
0.45
72
JTAG_TDO
O
JTAG test data
VOH
1.35
1.8
1.8

HUAWEI ME909u-523 LTE LGA Module
Hardware Guide
Description of the Application Interfaces
Issue 01 (2014-05-24)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
19
PIN
No.
Pin Name
Pad
Type
Description
Parameter
Min. (V)
Typ. (V)
Max. (V)
output
VOL
0
-
0.45
73
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
74
UART0_RTS
O
UART0 Ready for
receive
VOH
1.35
1.8
1.8
VOL
0
-
0.45
75
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
76
UART0_TX
O
UART0 transmit
output
VOH
1.35
1.8
1.8
VOL
0
-
0.45
77
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
78
UART0_RX
I
UART0 receive data
input
VIH
1.17
1.8
2.1
VIL
–0.3
-
0.63
79
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
80
UART0_CTS
I
UART0 Clear to
Send
VIH
1.17
1.8
2.1
VIL
–0.3
-
0.63
81
POWER_ON_
OFF
I
System power-on or
power-off, pulled up
in module.
-
-
1.8
-
82
NC
-
Not connected,
please keep this pin
open.
-
-
-
-
83
NC
-
Not connected,
please keep this pin
open.
-
-
-
-
84
NC
-
Not connected,
please keep this pin
open.
-
-
-
-
85
USB_DM
I/O
USB Data- defined
in the USB 2.0
Specification
-
-
-
-
86
USB_DP
I/O
USB Data+ defined
in the USB 2.0
Specification
-
-
-
-
87
JTAG_TDI
I
JTAG test data input
VIH
1.17
1.8
2.1
VIL
–0.3
-
0.63

HUAWEI ME909u-523 LTE LGA Module
Hardware Guide
Description of theApplication Interfaces
Issue 01 (2014-05-24)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
20
PIN
No.
Pin Name
Pad
Type
Description
Parameter
Min. (V)
Typ. (V)
Max. (V)
88
SIM_RESET
O
SIM reset
-
-
1.8/2.85
-
89
SIM_DATA
I/O
SIM data
-
1.8/2.85
90
SIM_CLK
O
SIM clock
-
-
1.8/2.85
-
91
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
92
Reserved
-
Reserved, must
keep this pin open.
-
-
-
-
93
JTAG_RTCK
O
JTAG return clock
VOH
1.35
1.8
1.8
VOL
0
-
0.45
94
NC
-
Not connected,
please keep this pin
open.
-
-
-
-
95
NC
-
Not connected,
please keep this pin
open.
-
-
-
-
96
NC
-
Not connected,
please keep this pin
open.
-
-
-
-
97
NC
-
Not connected,
please keep this pin
open.
-
-
-
98
NC
-
Not connected,
please keep this pin
open.
-
-
-
99
NC
-
Not connected,
please keep this pin
open.
-
-
-
-
100
RESIN_N
I
Reset module, this
pin is pulled up on
module.
-
-
1.8
-
101
LED_MODE
O
Mode indicator
Current sink
Drive strength: 10
mA
-
-
-
-
102
ADC_1
AI
Conversion
interface for analog
signals to digital
signals
-
0.3
-
VBAT