Huawei MC509 Installation instructions

HUAWEI MC509 Series CDMA LGA Module
Hardware Guide
Issue
02
Date
2013-05-06

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Copyright © Huawei Technologies Co., Ltd. 2013. All rights reserved.
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Notice
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HUAWEI MC509 Series CDMA LGA Module
Hardware Guide
About This Document
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3
About This Document
Revision History
Document
Version
Date
Chapter
Descriptions
01
2011-07-04
Creation
02
2013-05-06
2.2
Updated Table 2-1 Feature
2.3
Updated Figure 2-1 Circuit block diagram
of the MC509 module
2.4
Updated Figure 2-2 Application block
diagram of the MC509 module
3.2
Updated Table 3-1 Definitions of pins on
the LGA interface
3.2
Updated Figure 3-1 Bottom view of
sequence of LGA interface pins
3.3
Deleted the description related to VCOIN
interface
3.4.3
Updated Table 3-6 List of the
LED_STATUS pin and LED_MODE pin
3.5
Updated the description of UART Interface
3.7.1
Updated Table 3-9 RUIM card interface
signals
3.7.2
Updated Figure 3-16 Circuit of the RUIM
card interface
3.7.3
Deleted ESD Protection for the RUIM Card
Interface in issue 01
4.6
Updated Antenna Design Requirements
6
Updated Mechanical Specifications
7.1
Updated Table 7-1 Product Certifications
8
Updated Safety Information
9
Updated Circuit of Typical Interfaces

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Hardware Guide
About This Document
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4
Summary
This document provides information about the major functions, supported services,
system architecture, and technical references of HUAWEI MC509 CDMA LGA
Module.
The following table lists the contents of this document.
Chapter
Details
1 Introduction
Describes the short introduction of the
product.
2 Overall Description
Describes the Function overview, Circuit
Block Diagram and Application Block
Diagram of the product.
3 Description of the Application
Interfaces
Describes the external application
interfaces of the product.
4 RF Specifications
Describes the RF specifications of the
product.
5 Electrical and Reliability Features
Describes the electrical and reliability
features of the interfaces in the product.
6 Mechanical Specifications
Describes the Dimensions, Label and
Packing System of the product.
7 Certifications
Describes the certifications of the
product.
8 Safety Information
Lists the safety information of using the
product.
9 Appendix A Circuit of Typical
InterfacesI
Lists the circuit of typical interface of the
product.
10 Appendix B Acronyms and
Abbreviations
Lists the acronyms and abbreviations
mentioned in this document.

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Content
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Content
1 Introduction....................................................................................................................................8
2 Overall Description ......................................................................................................................9
2.1 About This Chapter........................................................................................................................... 9
2.2 Function Overview............................................................................................................................ 9
2.3 Circuit Block Diagram......................................................................................................................11
2.4 Application Block Diagram ............................................................................................................. 12
3 Description of the Application Interfaces..............................................................................13
3.1 About This Chapter......................................................................................................................... 13
3.2 LGA Interface ................................................................................................................................. 13
3.3 Power Interface.............................................................................................................................. 22
3.3.1 Overview................................................................................................................................ 22
3.3.2 VBAT Interface....................................................................................................................... 23
3.3.3 Output Power Supply Interface ............................................................................................. 24
3.4 Signal Control Interface.................................................................................................................. 24
3.4.1 Overview................................................................................................................................ 24
3.4.2 Input Signal Control Pins....................................................................................................... 25
3.4.3 Output Signal Control Pin...................................................................................................... 29
3.4.4 WAKEUP_IN Signal............................................................................................................... 33
3.4.5 WAKEUP_OUT Signal........................................................................................................... 33
3.5 UART Interface............................................................................................................................... 34
3.5.1 Overview................................................................................................................................ 34
3.5.2 Circuit Recommended for the UART Interface...................................................................... 35
3.6 USB Interface................................................................................................................................. 36
3.7 RUIM Card Interface ...................................................................................................................... 37
3.7.1 Overview................................................................................................................................ 37
3.7.2 Circuit Recommended for the RUIM Card Interface ............................................................. 38
3.8 Audio Interface ............................................................................................................................... 40
3.8.1 Analogue Audio...................................................................................................................... 40
3.8.2 Digital Audio........................................................................................................................... 41
3.9 General Purpose I/O Interface....................................................................................................... 43
3.10 JTAG Interface ............................................................................................................................. 43
3.11 RF Antenna Interface.................................................................................................................... 44

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3.12 Reserved Interface....................................................................................................................... 44
3.13 NC Interface................................................................................................................................. 44
4 RF Specifications.........................................................................................................................45
4.1 About This Chapter......................................................................................................................... 45
4.2 Antenna Installation Guidelines...................................................................................................... 45
4.3 Operating Frequencies................................................................................................................... 45
4.4 Conducted RF Measurement......................................................................................................... 46
4.4.1 Test Environment................................................................................................................... 46
4.4.2 Test Standards....................................................................................................................... 46
4.5 Conducted Rx Sensitivity and Tx Power........................................................................................ 46
4.5.1 Conducted Receive Sensitivity.............................................................................................. 46
4.5.2 Conducted Transmit Power................................................................................................... 47
4.6 Antenna Design Requirements ...................................................................................................... 47
4.6.1 Antenna Design Indicators..................................................................................................... 47
4.6.2 Interference ........................................................................................................................... 50
4.6.3 CDMAAntenna Requirements .............................................................................................. 50
4.6.4 Radio Test Environment ........................................................................................................ 51
5 Electrical and Reliability Features...........................................................................................52
5.1 About This Chapter......................................................................................................................... 52
5.2 Extreme Working Conditions.......................................................................................................... 52
5.3 Operating and Storage Temperatures and Humidity...................................................................... 53
5.4 Electrical Features of Application Interfaces.................................................................................. 53
5.5 Power Supply Features.................................................................................................................. 54
5.5.1 Input Power Supply ............................................................................................................... 54
5.5.2 Power Consumption.............................................................................................................. 54
5.6 Reliability Features......................................................................................................................... 55
5.7 EMC and ESD Features................................................................................................................. 56
6 Mechanical Specifications.........................................................................................................58
6.1 About This Chapter......................................................................................................................... 58
6.2 Storage Requirement..................................................................................................................... 58
6.3 Moisture Sensitivity ........................................................................................................................ 58
6.4 Dimensions and interfaces............................................................................................................. 59
6.5 PCB Pad Design ............................................................................................................................ 61
6.6 Packaging....................................................................................................................................... 61
6.7 Label............................................................................................................................................... 63
6.8 Customer PCB Design................................................................................................................... 64
6.8.1 PCB Surface Finish............................................................................................................... 64
6.8.2 PCB Pad Design.................................................................................................................... 65
6.8.3 Solder Mask........................................................................................................................... 65
6.8.4 Requirements on PCB Layout............................................................................................... 65
6.9 Assembly Processes...................................................................................................................... 66

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6.9.1 General Description of Assembly Processes ........................................................................ 66
6.9.2 Stencil Design........................................................................................................................ 66
6.9.3 Reflow Profile ........................................................................................................................ 67
6.10 Specification of Rework................................................................................................................ 69
6.10.1 Process of Rework .............................................................................................................. 69
6.10.2 Preparations of Rework....................................................................................................... 69
6.10.3 Removing of the Module ..................................................................................................... 69
6.10.4 Welding Area Treatment...................................................................................................... 70
6.10.5 Module Installation............................................................................................................... 70
6.10.6 Specifications of Rework..................................................................................................... 71
7 Certifications................................................................................................................................72
7.1 About This Chapter......................................................................................................................... 72
8 Safety Information......................................................................................................................73
8.1 Interference .................................................................................................................................... 73
8.2 Medical Device............................................................................................................................... 73
8.3 Area with Inflammables and Explosives......................................................................................... 73
8.4 Traffic Security................................................................................................................................ 74
8.5 Airline Security................................................................................................................................ 74
8.6 Safety of Children........................................................................................................................... 74
8.7 Environment Protection.................................................................................................................. 74
8.8 RoHS Approval............................................................................................................................... 74
8.9 Laws and Regulations Observance ............................................................................................... 74
8.10 Care and Maintenance................................................................................................................. 75
8.11 Emergency Call............................................................................................................................ 75
8.12 Regulatory Information................................................................................................................. 75
8.12.1 FCC Statement.................................................................................................................... 75
9 Appendix A Circuit of Typical Interfaces ..............................................................................76
10 Appendix B Acronyms and Abbreviations..........................................................................77

HUAWEI MC509 Series CDMA LGA Module
Hardware Guide
Introduction
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1 Introduction
This document describes the hardware application interfaces and air interfaces that
are provided when the HUAWEI MC509 CDMALGAModule (hereinafter referred to
as the MC509 module) is used.
This document helps you to understand the interface specifications, electrical
features, and related product information of the MC509 module.
Product name
Model name
Description
MC509
MC509
CDMA/EVDO 1900 MHz/800 MHz
GPS
MC509
MC509-a
CDMA/EVDO 800 MHz
GPS
CDMA/EVDO 1900 MHz/800 MHz (Data only or Telematics)
MC509 model has two editions: Data only or Telematics. Data only does not support
the voice function.
Data only
Telematics
Analog voice input function
×
√
Analog voice output function
×
√
PCM voice function
×
√

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Overall Description
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2 Overall Description
2.1 About This Chapter
This chapter gives a general description of the MC509 module and provides:
Function Overview
Circuit Block Diagram
Application Block Diagram
2.2 Function Overview
Table 2-1 Feature
Feature
Description
Physical
Features
Dimensions (L ×W ×H): 30 mm ×30 mm ×2.65 mm
Weight about 5.5 g
Working Bands
MC509: CDMA2000 1x, CDMA2000 EV-DO Rev 0,
CDMA2000 EV-DO Rev A
Supports BC0 (800MHz band), BC1 (1900MHz band)
GPS
MC509-a: CDMA2000 1x, CDMA2000 EV-DO Rev 0,
CDMA2000 EV-DO Rev A
Supports BC0 (800MHz band)
GPS
Operating
Temperature
Normal working temperature: –20°C to +70°C
Extreme working temperatures[1]: –30°C to+75°C
Ambient
Temperature
for Storage
–40°C to +85°C
Power Voltage
3.3 V to 4.2 V (3.8 V is recommended.)

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Feature
Description
AT Commands
See the HUAWEI MC509 CDMA LGA Module AT Command
Interface Specification.
Application
Interface (145-
pin LGA
interface)
Universal Asynchronous Receiver-Transmitter (UART)
Supporting 8-wire UART
One standard Removable User Identity Module (RUIM) card (3
V or 1.8 V)
Audio (OPTION): (only telematics version supports this function)
2×Micphone in
1×Speaker out
1×Earphone out
1×PCM
USB 2.0 (full speed)
Power on/off
Hardware Reset
Wakeup_In
Wakeup_out
Light-emitting Diode
Configurable General-purpose I/O (GPIO)
WWAN MAIN antenna pad x1, WWAN AUX antenna pad x1,
GPS antenna pad x1
Power
SMS
New message alert, text message receiving, and text message
sending
Management of text messages: read messages, delete
messages, storage status, and list message
Support for the Protocol Data Unit (PDU) mode
Data Services
CDMA2000 1X: UL/DL 153.6 kbps
CDMA2000 1X/EVDO Rev.0: UL 153.6 kbps DL 2.4 Mbps
CDMA2000 1X/EVDO Rev A: UL 1.8 Mbps DL 3.1 Mbps
Applications
GPS Standalone
Certification
Information
Restriction of the use of certain Hazardous Substances
(RoHS)
Federal Communications Commission (FCC)
China Compulsory Certification(CCC)

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Overall Description
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[1]:The temperatures outside of the range –20°C to +70°C ; the module might slightly deviate
from 3GPP2 C.S057D specifications.
2.3 Circuit Block Diagram
Figure 2-1 shows the circuit block diagram of the MC509 module. The application
block diagram and major functional units of the MC509 module contain the following
parts:
Single chip
Multi-chip package (MCP) memory
RF Circuit
Figure 2-1 Circuit block diagram of the MC509 module
Only telematics version supports the audio function.
MC509-a module supports CDMA/EVDO 800 MHz only.

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2.4 Application Block Diagram
Figure 2-2 Application block diagram of the MC509 module
UART Interface:
The module supports 8-wire UART.
USB Interface:
The USB interface supports USB 2.0 full speed standard.
RUIM Interface:
The RUIM interface provides the interface for a RUIM card.
The RUIM card can be inserted into the host side.
Power Supply:
DC 3.8 V is recommended.
Audio Interface:
The module supports two microphone, one earphone, one
speaker and one PCM interface (only telematics version
supports the audio function).
RF Pad:
RF antenna interface

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Hardware Guide
Description of the Application Interfaces
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3 Description of the Application Interfaces
3.1 About This Chapter
This chapter mainly describes the external application interfaces of the MC509
module, including:
LGA Interface
Power Interface
Signal Control Interface
UART Interface
USB Interface
RUIM Card Interface
Audio Interface
General Purpose I/O Interface
JTAG Interface
RF Antenna Interface
Reserved Interface
NC Interface
3.2 LGA Interface
The MC509 module uses a 145-pin LGA as its external interface. For details about
the module and dimensions of the LGA, see “6.4 Dimensions and interfaces”.
If DTE supports Huawei LGA module, such as module with system of CDMA, you can
refer to Huawei LGA Module Migration Guide to get the details.
Table 3-1 shows the definitions of pins on the 145-pin signal interface of the MC509
module.

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Description of the Application Interfaces
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Table 3-1 Definitions of pins on the LGAinterface
PIN
No.
Pin Name
I/O
Description
DC Characteristics (V)
Normal
MUX
Min.
Typ.
Max.
1
NC
-
-
Not connected, please keep this
pin open
-
-
-
2
NC
-
-
Not connected, please keep this
pin open
-
-
-
3
NC
-
-
Not connected, please keep this
pin open
-
-
-
4
NC
-
-
Not connected, please keep this
pin open
-
-
-
5
PCM_SYNC
-
O
PCM interface sync
–0.3
2.6
2.9
6
PCM_DIN
-
I
PCM I/F data in
–0.3
2.6
2.9
7
PCM_DOUT
-
O
PCM I/F data out
–0.3
2.6
2.9
8
PCM_CLK
-
O
PCM interface clock
-0.3
2.6
2.9
9
NC
-
-
Not connected, please keep this
pin open
-
-
-
10
NC
-
-
Not connected, please keep this
pin open
-
-
-
11
WAKEUP_IN
-
I
Host to wake up Module
–0.3
2.6
2.9
12
VBAT
-
P
Power supply input
3.3
3.8
4.2
13
VBAT
-
P
Power supply input
3.3
3.8
4.2
14
PS_HOLD
-
-
Used for JTAG interfaces
assigning a test point for it.
-
1.8
-
15
Reserved
-
-
Reserved
-
-
-
16
NC
-
-
Not connected, please keep this
pin open
-
-
-
17
NC
-
-
Not connected, please keep open
-
-
-
18
NC
-
-
Not connected, please keep this
pin open
-
-
-
19
NC
-
-
Not connected, please keep this
pin open
-
-
-
20
NC
-
-
Not connected, please keep this
pin open
-
-
-
21
NC
-
-
Not connected, please keep this
pin open
-
-
-

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Description of the Application Interfaces
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PIN
No.
Pin Name
I/O
Description
DC Characteristics (V)
Normal
MUX
Min.
Typ.
Max.
22
NC
-
-
Not connected, please keep this
pin open
-
-
-
23
NC
-
-
Not connected, please keep this
pin open
-
-
-
24
NC
-
-
Not connected, please keep this
pin open
-
-
-
25
NC
-
-
Not connected, please keep this
pin open
-
-
-
26
NC
-
-
Not connected, please keep this
pin open
-
-
-
27
NC
-
-
Not connected, please keep this
pin open
-
-
-
28
Reserved
-
-
Reserved
-
-
-
29
Reserved
-
-
Reserved
-
-
-
30
JTAG_TMS
-
I
JTAG Test mode select
–0.3
2.6
2.9
31
VCC_EXT2
-
P
2.6V POWER output
-
2.6
-
32
VCC_EXT1
-
P
1.8V POWER output
-
1.8
-
33
NC
-
-
Not connected, please keep this
pin open
-
-
-
34
RUIM_VCC
-
P
Power supply for RUIM card
1.8/2.85
35
NC
-
-
NC
-
-
-
36
JTAG_TRST_N
-
I
JTAG reset
–0.3
2.6
2.9
37
NC
-
-
Not connected, please keep this
pin open
-
-
-
38
MIC2_P
-
AI
(Only telematics version supports
audio function, Data only version
does not support this function)
Positive pole of the input of audio
interface 2
-
-
-
39
MIC2_N
-
AI
(Only telematics version supports
audio function, Data only version
does not support this function)
Negative pole of the input of
audio interface 2
-
-
-

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Description of the Application Interfaces
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PIN
No.
Pin Name
I/O
Description
DC Characteristics (V)
Normal
MUX
Min.
Typ.
Max.
40
MIC1_P
-
AI
(Only telematics version supports
audio function , Data only version
does not support this function)
Positive pole of the input of audio
interface 1
-
-
-
41
MIC1_N
-
AI
(Only telematics version supports
audio function , Data only version
does not support this function)
Negative pole of the input of
audio interface 1
-
-
-
42
JTAG_TCK
-
I
JTAG clock input
–0.3
2.6
2.9
43
Reserved
-
-
Reserved
-
-
-
44
GPIO
-
I/O
General I/O pin. The function of
these pins has not been defined
–0.3
2.6
2.9
45
W_DISABLE
-
I
Close wireless communications
–0.3
2.6
2.9
46
GPIO
-
I/O
General I/O pins. The function of
these pins has not been defined
–0.3
2.6
2.9
47
NC
-
-
Not connected, please keep this
pin open
-
-
-
48
GND
-
-
Ground
-
-
-
49
GND
-
-
Ground
-
-
-
50
GND
-
-
Ground
-
-
-
51
GPIO
-
I/O
General I/O pins. The function of
these pins has not been defined
–0.3
2.6
2.9
52
GND
-
-
Ground
-
-
-
53
GND
-
-
Ground
-
-
-
54
GND
-
-
Ground
-
-
-
55
GPIO
-
I/O
General I/O pins. The function of
these pins has not been defined
–0.3
2.6
2.9
56
GND
-
-
Ground
-
-
-
57
GND
-
-
Ground
-
-
-
58
GND
-
-
Ground
-
-
-
59
GND
-
-
Ground
-
-
-
60
NC
-
-
Not connected, please keep this
pin open
-
-
-

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Description of the Application Interfaces
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PIN
No.
Pin Name
I/O
Description
DC Characteristics (V)
Normal
MUX
Min.
Typ.
Max.
61
NC
-
-
Not connected, please keep this
pin open
-
-
-
62
NC
-
-
Not connected, please keep this
pin open
-
-
-
63
NC
-
-
Not connected, please keep this
pin open
-
-
-
64
NC
-
-
Not connected, please keep this
pin open
-
-
-
65
NC
-
-
Not connected, please keep this
pin open
-
-
-
66
NC
-
-
Not connected, please keep this
pin open
-
-
-
67
NC
-
-
Not connected, please keep this
pin open
-
-
-
68
NC
-
-
Not connected, please keep this
pin open
-
-
-
69
NC
-
-
Not connected, please keep this
pin open
-
-
-
70
NC
-
-
Not connected, please keep this
pin open
-
-
-
71
WAKEUP_OUT
-
O
Module to wake up the host
–0.3
2.6
2.9
72
JTAG_TDO
-
O
JTAG test data output
–0.3
2.6
2.9
73
UART_DSR
-
O
UART Data Set Ready
–0.3
2.6
2.9
74
UART_RTS
-
O
UART Ready for receive
–0.3
2.6
2.9
75
UART_DCD
-
O
UART Data Carrier Detect
–0.3
2.6
2.9
76
UART_TX
-
O
UART transmit output
–0.3
2.6
2.9
77
UART_RING
-
O
UART Ring Indicator
–0.3
2.6
2.9
78
UART_RX
-
I
UART receive data input
–0.3
2.6
2.9
79
UART_DTR
-
I
Data Terminal Ready
–0.3
2.6
2.9
80
UART_CTS
-
I
UART Clear to Send
–0.3
2.6
2.9
81
POWER_ON_
OFF
-
I
System power-on or power-off
-
Pulled
up on
chip
-
82
NC
-
-
Not connected, please keep this
pin open
-
-
-

HUAWEI MC509 Series CDMA LGA Module
Hardware Guide
Description of the Application Interfaces
Issue 02 (2013-05-06)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
18
PIN
No.
Pin Name
I/O
Description
DC Characteristics (V)
Normal
MUX
Min.
Typ.
Max.
83
NC
-
-
Not connected, please keep this
pin open
-
-
-
84
NC
-
-
Not connected, please keep this
pin open
-
-
-
85
USB_DM
-
I/O
Full-speed USB D-
-
-
-
86
USB_DP
-
I/O
Full-speed USB D+
-
-
-
87
JTAG_TDI
-
I
JTAG test data input
–0.3
2.6
2.9
88
RUIM_RESET
-
O
RUIM reset
1.8/2.85
89
RUIM_DATA
-
I/O
RUIM Data
1.8/2.85
90
RUIM_CLK
-
O
RUIM Clock
1.8/2.85
91
LED_STATUS
-
I
Status indicator
SINK current source
Driver strength: 10mA
-
-
-
92
NC
-
-
Not connected, please keep this
pin open
-
-
-
93
JTAG_RTCK
-
I
JTAG return clock
–0.3
2.6
2.9
94
NC
-
Not connected, please keep this
pin open
-
-
-
95
NC
-
Not connected, please keep this
pin open
-
-
-
96
EAR_OUT_N
-
AO
(Only telematics version supports
audio function , Data only version
does not support this function)
Negative pole of the output of
Earphone interface
-
-
-
97
EAR_OUT_P
-
AO
(Only telematics version supports
audio function , Data only version
does not support this function)
Positive pole of the output of
Earphone interface
-
-
-
98
SPKR_OUT_P
-
AO
(Only telematics version supports
audio function, Data only version
does not support this function)
Positive pole of the output of
speaker interface
-
-
-

HUAWEI MC509 Series CDMA LGA Module
Hardware Guide
Description of the Application Interfaces
Issue 02 (2013-05-06)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
19
PIN
No.
Pin Name
I/O
Description
DC Characteristics (V)
Normal
MUX
Min.
Typ.
Max.
99
SPKR_OUT_N
-
AO
(Only telematics version supports
audio function, Data only version
does not support this function)
Negative pole of the output of
speaker interface
-
-
-
100
RESIN_N
-
I
Reset module.
–0.3
1.8
2.1
101
LED_MODE
-
I
Mode indicator
SINK current source
Driver strength: 10 mA
-
-
-
102
NC
-
-
Not connected, please keep this
pin open
-
-
-
103
NC
-
-
Not connected, please keep this
pin open
-
-
-
104
NC
-
-
Not connected, please keep this
pin open
-
-
-
105
GPIO
-
I/O
General I/O pins. The function of
these pins has not been defined.
–0.3
2.6
2.9
106
GND
-
-
Ground
-
-
-
107
MAIN_ANT
-
-
RF main antenna pad
-
-
-
108
GND
-
-
Ground
-
-
-
109
GPIO
-
I/O
General I/O pins. The function of
these pins has not been defined
–0.3
2.6
2.9
110
GND
-
-
Ground
-
-
-
111
GPS_ANT
-
-
RF GPS antenna pad
-
-
-
112
GND
-
-
Ground
-
-
-
113
GPIO
-
I/O
General I/O pins. The function of
these pins has not been defined
–0.3
2.6
2.9
114
GND
-
-
Ground
-
-
-
115
AUX_ANT
-
-
RF divert antenna pad
-
-
-
116
GND
-
-
Ground
-
-
-
117
NC
-
-
Not connected, please keep this
pin open
-
-
-
118
NC
-
-
Not connected, please keep this
pin open
-
-
-
119
NC
-
-
Not connected, please keep this
pin open
-
-
-

HUAWEI MC509 Series CDMA LGA Module
Hardware Guide
Description of the Application Interfaces
Issue 02 (2013-05-06)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
20
PIN
No.
Pin Name
I/O
Description
DC Characteristics (V)
Normal
MUX
Min.
Typ.
Max.
120
NC
-
-
Not connected, please keep this
pin open
-
-
-
121
GND
-
-
Thermal Ground Pad
-
-
-
122
GND
-
-
Thermal Ground Pad
-
-
-
123
GND
-
-
Thermal Ground Pad
-
-
-
124
GND
-
-
Thermal Ground Pad
-
-
-
125
GND
-
-
Thermal Ground Pad
-
-
-
126
GND
-
-
Thermal Ground Pad
-
-
-
127
GND
-
-
Thermal Ground Pad
-
-
-
128
GND
-
-
Thermal Ground Pad
-
-
-
129
GND
-
-
Thermal Ground Pad
-
-
-
130
GND
-
-
Thermal Ground Pad
-
-
-
131
GND
-
-
Thermal Ground Pad
-
-
-
132
GND
-
-
Thermal Ground Pad
-
-
-
133
GND
-
-
Thermal Ground Pad
-
-
-
134
GND
-
-
Thermal Ground Pad
-
-
-
135
GND
-
-
Thermal Ground Pad
-
-
-
136
GND
-
-
Thermal Ground Pad
-
-
-
137
GND
-
-
Thermal Ground Pad
-
-
-
138
GND
-
-
Thermal Ground Pad
-
-
-
139
GND
-
-
Thermal Ground Pad
-
-
-
140
GND
-
-
Thermal Ground Pad
-
-
-
141
GND
-
-
Thermal Ground Pad
-
-
-
142
GND
-
-
Thermal Ground Pad
-
-
-
143
GND
-
-
Thermal Ground Pad
-
-
-
144
GND
-
-
Thermal Ground Pad
-
-
-
145
GND
-
-
Thermal Ground Pad
-
-
-