Huawei ME909s Series Installation instructions

HUAWEI ME909s Series LTE Mini PCIe Module
Hardware Guide
Issue
02
Date
2016-09-07

Copyright © Huawei Technologies Co., Ltd. 2016. All rights reserved.
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HUAWEI ME909s Series LTE Mini PCIe Module
Hardware Guide
About This Document
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3
About This Document
Revision History
Document
Version
Date
Chapter
Descriptions
01
2015-08-25
Creation
02
2016-09-07
2.2
Updated Table 2-1 Features
2.3
Updated Circuit Block Diagram
3.7.2
Updated Figure 3-11 Connections of the
USIM_DET pin
3.7.3
Updated Circuit Recommended for the
USIM Card Interface
4.2
Updated Operating Frequencies
4.5.3
Updated Antenna Requirements
5.4.2
Updated Table 5-5 Averaged standby DC
power consumption of ME909s-821 Mini
PCIe module and Table 5-6 Averaged
standby DC power consumption of
ME909s-120 Mini PCIe module
5.5
Updated Table 5-11 Test conditions and
results of the reliability of the ME909s Mini
PCIe module
5.6
Updated EMC and ESD Features
9
Updated Appendix A Circuit of Typical
Interface
Scope
ME909s-821
ME909s-120

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Hardware Guide
Contents
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Contents
1 Introduction....................................................................................................................................7
2 Overall Description ......................................................................................................................8
2.1 About This Chapter........................................................................................................................... 8
2.2 Function Overview............................................................................................................................ 8
2.3 Circuit Block Diagram..................................................................................................................... 10
3 Description of the Application Interfaces..............................................................................12
3.1 About This Chapter......................................................................................................................... 12
3.2 Mini PCIe Interface......................................................................................................................... 12
3.3 Power Interface.............................................................................................................................. 17
3.3.1 Power Sources and Grounds ................................................................................................ 17
3.3.2 Power Supply Time Sequence .............................................................................................. 18
3.4 Signal Control Interface.................................................................................................................. 19
3.4.1 Overview................................................................................................................................ 19
3.4.2 WAKE# Signal ....................................................................................................................... 20
3.4.3 WAKEUP_IN Signal............................................................................................................... 20
3.4.4 RESIN_N Signal.................................................................................................................... 21
3.4.5 LED_WWAN# Signal............................................................................................................. 22
3.5 UART Interface............................................................................................................................... 23
3.5.2 Circuit Recommended for the UART Interface...................................................................... 24
3.6 USB Interface................................................................................................................................. 24
3.7 USIM Card Interface ...................................................................................................................... 25
3.7.1 Overview................................................................................................................................ 25
3.7.2 USIM_DET Pin ...................................................................................................................... 26
3.7.3 Circuit Recommended for the USIM Card Interface.............................................................. 28
3.8 Audio Interface ............................................................................................................................... 29
3.9 NC Pins.......................................................................................................................................... 31
3.10 Reserved Pins.............................................................................................................................. 31
4 RF Specifications.........................................................................................................................32
4.1 About This Chapter......................................................................................................................... 32
4.2 Operating Frequencies................................................................................................................... 32
4.3 Conducted RF Measurement......................................................................................................... 34
4.3.1 Test Environment................................................................................................................... 34

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4.3.2 Test Standards....................................................................................................................... 34
4.4 Conducted Rx Sensitivity and Tx Power........................................................................................ 34
4.4.1 Conducted Receive Sensitivity.............................................................................................. 34
4.4.2 Conducted Transmit Power................................................................................................... 36
4.5 Antenna Design Requirements ...................................................................................................... 37
4.5.1 Antenna Design Indicators..................................................................................................... 37
4.5.2 Interference ........................................................................................................................... 40
4.5.3 Antenna Requirements.......................................................................................................... 40
4.6 Suggestions about LTE and 2.4 GHz Wi-Fi Co-existence............................................................. 41
4.6.1 Theory Analysis ..................................................................................................................... 41
4.6.2 Suggestions about the Interference ...................................................................................... 42
5 Electrical and Reliability Features...........................................................................................43
5.1 About This Chapter......................................................................................................................... 43
5.2 Absolute Ratings ............................................................................................................................ 43
5.3 Operating and Storage Temperatures............................................................................................ 43
5.4 Power Supply Features.................................................................................................................. 44
5.4.1 Input Power Supply ............................................................................................................... 44
5.4.2 Power Consumption.............................................................................................................. 45
5.5 Reliability Features......................................................................................................................... 54
5.6 EMC and ESD Features................................................................................................................. 57
6 Mechanical Specifications.........................................................................................................60
6.1 About This Chapter......................................................................................................................... 60
6.2 Dimensions..................................................................................................................................... 60
6.3 Packaging....................................................................................................................................... 62
6.4 Specification Selection for Fasteners............................................................................................. 64
6.4.1 Installing the Mini PCIeAdapter on the Main Board.............................................................. 64
6.4.2 Romoving the Mini PCIe Adapter from the Main Board ........................................................ 65
6.5 Antenna Plug.................................................................................................................................. 66
6.6 Thermal Design Guide ................................................................................................................... 67
7 Certifications................................................................................................................................70
7.1 About This Chapter......................................................................................................................... 70
7.2 Certifications................................................................................................................................... 70
8 Safety Information......................................................................................................................71
8.1 Interference .................................................................................................................................... 71
8.2 Medical Device............................................................................................................................... 71
8.3 Area with Inflammables and Explosives......................................................................................... 71
8.4 Traffic Security................................................................................................................................ 72
8.5 Airline Security................................................................................................................................ 72
8.6 Safety of Children........................................................................................................................... 72
8.7 Environment Protection.................................................................................................................. 72

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8.8 WEEE Approval.............................................................................................................................. 72
8.9 RoHS Approval............................................................................................................................... 72
8.10 Laws and Regulations Observance ............................................................................................. 73
8.11 Care and Maintenance................................................................................................................. 73
8.12 Emergency Call............................................................................................................................ 73
8.13 Regulatory Information................................................................................................................. 73
8.13.1 CE Approval (European Union)........................................................................................... 73
9 Appendix A Circuit of Typical Interface................................................................................74
10 Appendix B Acronyms and Abbreviations..........................................................................75

HUAWEI ME909s Series LTE Mini PCIe Module
Hardware Guide
Introduction
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1 Introduction
This document describes the hardware application interfaces and air interfaces
provided by HUAWEI ME909s Series (ME909s-821 and ME909s-120) LTE Mini PCIe
Module (hereinafter referred to as the ME909s Mini PCIe module).
This document helps hardware engineer to understand the interface specifications,
electrical features and related product information of the ME909s Mini PCIe module.

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Hardware Guide
Overall Description
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2 Overall Description
2.1 About This Chapter
This chapter gives a general description of the ME909s Mini PCIe module and
provides:
Function Overview
Circuit Block Diagram
2.2 Function Overview
Table 2-1 Features
Feature
Description
Physical
Dimensions
ME909s-821
Dimensions (L ×W ×H): 51 mm ×30.4 mm ×3.57 mm
Weight: about 10.46 g
ME909s-120
Dimensions (L ×W ×H): 51 mm ×30.4 mm ×3.52 mm
Weight: about 10.46 g
Operating
Bands
ME909s-821
FDD LTE: Band 1, Band 3, Band 8, all bands with diversity
TDD LTE: Band 38, Band 39, Band 40, Band 41, all bands with
diversity
DC-HSPA+/HSPA+/HSPA/UMTS: Band 1, Band 5, Band 8,
Band 9, all bands with diversity
TD-SCDMA: Band 34, Band 39
GSM/GPRS/EDGE: 1800 MHz/900 MHz

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Feature
Description
ME909s-120
FDD LTE: Band 1, Band 2, Band 3, Band 4, Band 5, Band 7,
Band 8, Band 20, all bands with diversity
WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 2, Band 5,
Band 8, all bands with diversity
GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz
Operating
Temperature
Normal operating temperature: –20°C to +60°C
Extended operating temperature[1]: –40°C to +85°C
Storage
Temperature
–40°C to +85°C
Humidity
RH5% to RH95%
Power
Voltage
DC 3.2 V–4.2 V (typical value is 3.8 V)
AT
Commands
See the HUAWEI ME909s Series LTE Module AT Command
Interface Specification.
Application
Interface
(52-pin Mini
PCIe interface
One standard USIMcard (Class B and Class C) interface
Audio interface: PCM interface
USB 2.0 (High Speed)
UART interface: 4-wire UART x 1
WAKE#
WAKEUP_IN
USIM_DET
LED_WWAN#: Active-low LED signal indicating the state of the
module
Antenna
connector
WWAN MAIN antenna connector x 1
WWAN AUX antenna connector x 1

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Overall Description
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Feature
Description
Data Services
ME909s-821
GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s
EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s
WCDMA CS: UL 64 kbit/s; DL 64 kbit/s
WCDMA PS: UL 384 kbit/s; DL 384 kbit/s
HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s
DC-HSPA+: UL 5.76 Mbit/s; DL 42 Mbit/s
TD-HSPA: UL 2.2 Mbit/s; DL 2.8 Mbit/s
TD-SCDMA PS: UL 384 kbit/s; DL 2.8 Mbit/s
LTE FDD: UL 50 Mbit/s; DL 150 Mbit/s @20M BW cat4
LTE TDD: UL 10 Mbit/s; DL 112 Mbit/s @20M BW cat4
(Uplink-downlink configuration 2, 1:3)
ME909s-120
GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s
EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s
WCDMA CS: UL 64 kbit/s; DL 64 kbit/s
WCDMA PS: UL 384 kbit/s; DL 384 kbit/s
HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s
DC-HSPA+: UL 5.76 Mbit/s; DL 42 Mbit/s
LTE FDD: UL 50 Mbit/s; DL 150 Mbit/s @20M BW cat4
Operating
Systems
Android 2.x/3.x/4.x
Linux (Kernel 2.6.29 or later)
Windows 7/8/8.1/10
Windows CE 5.0/6.0/7.0
[1]: When the ME909s Mini PCIe module works in the range from –40°C to –20°C or +60°C
to +85°C , NOT all their RF performances comply with 3GPP specifications.
The thermal design must be implemented according to the chapter 6.6 . If not, the overheat
protection mechanism will be triggered due to overheated Mini PCIe module and the
network connection will be terminated.
2.3 Circuit Block Diagram
The module is developed based on Huawei's Balong Hi6921M platform. Figure 2-1
shows the circuit block diagram of the ME909s Mini PCIeAdapter.The major
functional units of the Mini PCIe Adapter contain the following parts:
LGA Module
Control Signals
Antenna Connectors

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Hardware Guide
Overall Description
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Figure 2-1 Circuit block diagram of the ME909s Mini PCIe module

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Description of the Application Interfaces
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3 Description of the Application Interfaces
3.1 About This Chapter
This chapter mainly describes the external application interfaces of the ME909s Mini
PCIe module, including:
Mini PCIe Interface
Power Interface
Signal Control Interface
UART Interface
USB Interface
USIM Card Interface
Audio Interface
NC Pins
Reserved Pins
3.2 Mini PCIe Interface
The ME909s Mini PCIe module uses a Mini PCIe interface as its external interface.
For details about the module and dimensions, see 6.2 Dimensions.

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Hardware Guide
Description of the Application Interfaces
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Figure 3-1 shows the sequence of pins on the interface of the Mini PCIe Adapter.
Figure 3-1 Sequence of Mini PCIe interface
Top Bottom
Table 3-1 shows the pin definitions of the Mini PCIe Interface.
Table 3-1 Pin definitions of the Mini PCIe Interface
Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comment
Mini PCI
Express
Standard
Description
HUAWEI
Pin
Description
1
WAKE#
WAKE#
O
Open collector
active low signal.
This signal is used
to wake up the host.
VOL
0
-
0.45
-
2
3.3Vaux
VCC_3V3
PI
3.8 V DC supply
input
-
3.2
3.8
4.2
-
3
COEX1
UART_CTS
I
UART Clear to
Send
VIH
1.17
1.8
1.98
-
VIL
–0.3
-
0.63
-
4
GND
GND
-
Ground
-
-
-
-
-

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Description of the Application Interfaces
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Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comment
Mini PCI
Express
Standard
Description
HUAWEI
Pin
Description
5
COEX2
UART_RTS
O
UART request to
send
VOH
1.35
1.8
1.98
-
VOL
0
-
0.45
-
6
1.5 V
NC
-
Not connected
-
-
-
-
-
7
CLKREQ#
WAKEUP_I
N
I
Sleep authorization
signal.
H: Sleep mode is
disabled.
L: Sleep mode is
enabled (default
value).
VIH
1.17
1.8
1.98
-
VIL
–0.3
-
0.63
-
8
UIM_PWR
USIM_PWR
PO
Power supply for
USIM card
-
1.75
1.8
1.98
USIM_PWR
=1.8 V
-
2.75
3.0
3.3
USIM_PWR
=3.0 V
9
GND
GND
-
Ground
-
-
-
-
-
10
UIM_DATA
USIM_DAT
A
I/O
USIM card data
VIH
0.65
x
USI
M_P
WR
-
3.30
USIM_PWR
=1.8 V or
3.0 V
VIL
0
-
0.25
x
USI
M_P
WR
VOH
0.7 x
USI
M_P
WR
-
3.3
VOL
0
-
0.2 x
USI
M_P
WR
11
REFCLK-
NC
-
Not connected
-
-
-
-
-
12
UIM_CLK
USIM_CLK
O
USIM card clock
VOH
0.7 x
USI
M_P
WR
-
3.3
USIM_PWR
=1.8 V or
3.0 V

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Description of the Application Interfaces
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Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comment
Mini PCI
Express
Standard
Description
HUAWEI
Pin
Description
VOL
0
-
0.2 x
USI
M_P
WR
13
REFCLK+
NC
-
Not connected
-
-
-
-
-
14
UIM_RESE
T
USIM_RES
ET
O
USIM card reset
VOH
0.7 x
USI
M_P
WR
-
3.3
USIM_PWR
=1.8 V or
3.0 V
VOL
0
-
0.2 x
USI
M_P
WR
15
GND
GND
-
Ground
-
-
-
-
-
16
UIM_Vpp
NC
-
Not connected
-
-
-
-
-
17
Reserved
UART_RX
I
UART receive data
input
VIH
1.17
1.8
1.98
-
VIL
–0.3
-
0.63
-
18
GND
GND
-
Ground
-
-
-
-
-
19
Reserved
UART_TX
O
UART transmit
output
VOH
1.35
1.8
1.98
-
VOL
0
-
0.45
-
20
W_DISABL
E#
Reserved
-
Reserved
-
-
-
-
-
21
GND
GND
-
Ground
-
-
-
-
-
22
PERST#
RESIN_N
I
Reset module
Active-low
VIL
0
0
0.18
The signal is
internally
pulled up.
VIH
1.62
1.8
1.98
23
PERn0
NC
-
Not connected
-
-
-
-
-
24
3.3Vaux
VCC_3V3
PI
3.8 V DC supply
input
-
3.2
3.8
4.2
-
25
PERp0
NC
-
Not connected
-
-
-
-
-
26
GND
GND
-
Ground
-
-
-
-
-
27
GND
GND
-
Ground
-
-
-
-
-
28
1.5 V
NC
-
Not connected
-
-
-
-
-

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Description of the Application Interfaces
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Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comment
Mini PCI
Express
Standard
Description
HUAWEI
Pin
Description
29
GND
GND
-
Ground
-
-
-
-
-
30
SMB_CLK
NC
-
Not connected
-
-
-
-
-
31
PETn0
NC
-
Not connected
-
-
-
-
-
32
SMB_DATA
NC
-
Not connected
-
-
-
-
-
33
PETp0
NC
-
Not connected
-
-
-
-
-
34
GND
GND
-
Ground
-
-
-
-
-
35
GND
GND
-
Ground
-
-
-
-
-
36
USB_D-
USB_DM
I/O
USB signal D-
-
-
-
-
-
37
GND
GND
-
Ground
-
-
-
-
-
38
USB_D+
USB_DP
I/O
USB signal D+
-
-
-
-
-
39
3.3Vaux
VCC_3V3
PI
3.8 V DC supply
input
-
3.2
3.8
4.2
-
40
GND
GND
-
Ground
-
-
-
-
-
41
3.3Vaux
VCC_3V3
PI
3.8 V DC supply
input
-
3.2
3.8
4.2
-
42
LED_WWA
N#
LED_WWA
N#
O
Mode indicator
current sink
Drive strength: 10
mA
-
-
-
-
-
43
GND
GND
-
Ground
-
-
-
-
-
44
LED_WLAN
#
USIM_DET
I
USIM hot swap
detection pin.
When it is High,
USIM is present.
When it is Low,
USIM is absent.
VIH
1.62
1.8
1.98
The signal is
internally
pulled up.
Keep
USIM_DET
floating, if it
is not used.
VIL
0
-
0.18
45
Reserved
PCM_CLK
O
PCM interface clock
VOL
–0.3
0
0.45
-
VOH
1.35
1.8
1.98
-
46
LED_WPAN
#
NC
-
Not connected
-
-
-
-
-
47
Reserved
PCM_DOU
T
O
PCM I/F data output
VOL
–0.3
0
0.45
-
VOH
1.35
1.8
1.98
-

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Description of the Application Interfaces
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Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comment
Mini PCI
Express
Standard
Description
HUAWEI
Pin
Description
48
1.5 V
NC
-
Not connected
-
-
-
-
-
49
Reserved
PCM_DIN
I
PCM I/F data input
VIL
–0.3
0
0.63
-
VIH
1.17
1.8
1.98
-
50
GND
GND
-
Ground
-
-
-
-
-
51
Reserved
PCM_SYN
C
O
PCM interface sync
VOL
–0.3
0
0.45
-
VOH
1.35
1.8
1.98
-
52
3.3Vaux
VCC_3V3
PI
3.8 V DC supply
input
-
3.2
3.8
4.2
-
Pindicates power pins; Iindicates pins for digital signal input; Oindicates pins for digital
signal output. PO indicates power output pins; PI indicates power input pins.
VIL indicates Low-level Input voltage; VIH indicates High-level Input voltage; VOL indicates
Low-level Output voltage; VOH indicates High-level Output voltage.
The NC (Not Connected) pins are floating and there are no signal connected to these pins.
The Reserved pins are internally connected to the module. Therefore, these pins should not
be used, otherwise they may cause problems. Please contact with us for more details about
this information.
3.3 Power Interface
3.3.1 Power Sources and Grounds
For the Mini PCIe Adapter, +3.3Vaux is the only voltage supply that is available.
Table 3-2 Power and ground specifications
Pin No.
Pin Name
Pad
Type
Description
Parameter
Min. (V)
Typ. (V)
Max.
(V)
2, 24, 39, 41
and 52
VCC_3V3
PI
3.8 V DC supply
input
-
3.2
3.8
4.2
4, 9, 15, 18,
21, 26, 27,
29, 34, 35,
37, 40, 43,
and 50
GND
-
Ground
-
-
-
-

HUAWEI ME909s Series LTE Mini PCIe Module
Hardware Guide
Description of the Application Interfaces
Issue 02 (2016-09-07)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
18
To minimize the RF radiation through the power lines, it is suggested to add ceramic capacitors
of 10 pF and 100 nF in the power lines beside the Mini PCIe connector on the host side.
3.3.2 Power Supply Time Sequence
Power on Sequence
Figure 3-2 Power on timing sequence
Parameter
Remarks
Time (Nominal value)
Unit
TPD+
Power Valid to USB D+ high
5.5
s
Power off Sequence
Cutting off the VCC_3V3 power supply will power off the module.
Figure 3-3 Power supply time sequence for power cycling

HUAWEI ME909s Series LTE Mini PCIe Module
Hardware Guide
Description of the Application Interfaces
Issue 02 (2016-09-07)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
19
Parameter
Remarks
Time
Unit
Toff
Power off time
>100
ms
Ton
Power on time
<10
ms
The rising time of VCC_3V3 should be 100 µs at least.
3.4 Signal Control Interface
3.4.1 Overview
The signal control part of the interface in the ME909s Mini PCIe module consists of
the following:
WAKE# signal
WAKEUP_IN signal
RESIN_N signal
LED_WWAN# signal
Table 3-3 lists the pins on the signal control interface.
Table 3-3 Definitions of the pins on the signal control interface
Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comment
1
WAKE#
O
Open collector
active low signal.
This signal is
used to wake up
the host.
VOL
0
-
0.45
-
7
WAKEUP_I
N
I
Sleep
authorization
signal.
H: Sleep mode is
disabled.
L: Sleep mode is
enabled (default
value).
VIH
1.17
1.8
1.98
-
VIL
–0.3
-
0.63
-
22
RESIN_N
I
Reset module
Active-low
VIL
0
0
0.18
The signal is
internally
pulled up.
VIH
1.62
1.8
1.98

HUAWEI ME909s Series LTE Mini PCIe Module
Hardware Guide
Description of the Application Interfaces
Issue 02 (2016-09-07)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
20
Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comment
42
LED_WWA
N#
O
Mode indicator
current sink
Drive strength:
10 mA
-
-
-
-
-
3.4.2 WAKE# Signal
This signal is used for module to wake up the host. It is designed as an OC (Open
Collector) gate, so it should be pulled up by the host and it is active-low.
When the module wakes up the host, the WAKE# pin will output low-level-voltage for
1s to wake up the host.
Figure 3-4 Connections of the WAKE# pin
WAKE#
3.4.3 WAKEUP_IN Signal
WAKEUP_IN pin is the authorization signal of ME909s Mini PCIe module entering
sleep mode. If this pin is not connected, it will keep in low level by default.
Table 3-3 shows the definition of the WAKEUP_IN signal.