Huawei MU609 Installation instructions

HUAWEI MU609 HSPA LGA Module
Hardware Guide
Issue
04
Date
2016-12-12

Copyright © Huawei Technologies Co., Ltd. 2016. All rights reserved.
No part of this manual may be reproduced or transmitted in any form or by any means without prior written
consent of Huawei Technologies Co., Ltd. and its affiliates ("Huawei").
The product described in this manual may include copyrighted software of Huawei and possible licensors.
Customers shall not in any manner reproduce, distribute, modify, decompile, disassemble, decrypt, extract,
reverse engineer, lease, assign, or sublicense the said software, unless such restrictions are prohibited by
applicable laws or such actions are approved by respective copyright holders.
Trademarks and Permissions
, , and are trademarks or registered trademarks of Huawei Technologies Co., Ltd.
Other trademarks, product, service and company names mentioned may be the property of their respective
owners.
Notice
Some features of the product and its accessories described herein rely on the software installed, capacities
and settings of local network, and therefore may not be activated or may be limited by local network operators
or network service providers.
Thus, the descriptions herein may not exactly match the product or its accessories which you purchase.
Huawei reserves the right to change or modify any information or specifications contained in this manual
without prior notice and without any liability.
DISCLAIMER
ALL CONTENTS OF THIS MANUAL ARE PROVIDED “AS IS”. EXCEPT AS REQUIRED BY APPLICABLE
LAWS, NO WARRANTIES OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT
LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR
PURPOSE, ARE MADE IN RELATION TO THE ACCURACY, RELIABILITY OR CONTENTS OF THIS
MANUAL.
TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, IN NO EVENT SHALL HUAWEI BE
LIABLE FOR ANY SPECIAL, INCIDENTAL, INDIRECT, OR CONSEQUENTIAL DAMAGES, OR LOSS OF
PROFITS, BUSINESS, REVENUE, DATA, GOODWILL SAVINGS OR ANTICIPATED SAVINGS
REGARDLESS OF WHETHER SUCH LOSSES ARE FORSEEABLE OR NOT.
THE MAXIMUM LIABILITY (THIS LIMITATION SHALL NOT APPLY TO LIABILITY FOR PERSONAL
INJURY TO THE EXTENT APPLICABLE LAW PROHIBITS SUCH A LIMITATION) OF HUAWEI ARISING
FROM THE USE OF THE PRODUCT DESCRIBED IN THIS MANUAL SHALL BE LIMITED TO THE
AMOUNT PAID BY CUSTOMERS FOR THE PURCHASE OF THIS PRODUCT.
Import and Export Regulations
Customers shall comply with all applicable export or import laws and regulations and be responsible to obtain
all necessary governmental permits and licenses in order to export, re-export or import the product mentioned
in this manual including the software and technical data therein.
Privacy Policy
To better understand how we protect your personal information, please see the privacy policy at
http://consumer.huawei.com/privacy-policy.

HUAWEI MU609 HSPA LGA Module
Hardware Guide
About This Document
Issue 04 (2016-12-12)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
3
About This Document
Revision History
Document
Version
Date
Chapter
Descriptions
01
2013-04-10
Creation
02
2014-01-02
2.2
Updated Table 2-1 Feature
2.3
Updated Figure 2-1 Circuit block diagram of
the MU609 module
2.4
Updated Figure 2-2 Application block
diagram of the MU609 module
3.2
Updated Table 3-1 Definitions of pins on the
LGA interface and Figure 3-1 Sequence of
LGA interface (Top view)
3.3.2
Updated Figure 3-2 Recommended power
circuit of MU609 module
3.4
Added description related to LED_MODE
signal
3.6
Updated Figure 3-13 Recommended circuit
of USB interface and its note
3.7
Updated Figure 3-14 Circuit of the USIM
card interface
3.11
Updated 3.11 RF Antenna Interface
4.4.1
Updated Table 4-2 MU609 conducted Rx
sensitivity (unit: dBm)
5.6.2
Updated 5.6.2 Power Consumption
5.7
Updated 5.7 Reliability Features
5.8
Updated 5.8 EMC and ESD Features
9
Updated Circuit of Typical Interface
03
2014-12-03
1
Added two editions description of MU609
module

HUAWEI MU609 HSPA LGA Module
Hardware Guide
About This Document
Issue 04 (2016-12-12)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
4
Document
Version
Date
Chapter
Descriptions
3
Updated definitions of pins and UART level
description
4.4.2
Updated Table 4-4 MU609 conducted Tx
power
5.4
Deleted electrical features of USIM of issue
02
5.5
Deleted electrical features of application
interfaces of issue 02
6.5
Updated packaging of MU609 module
6.7.2
Deleted Figure 6-4 thermal pads design of
issue 02
7
Updated Table 7-1 product certifications
04
2016-12-12
2.2
Updated Table 2-1 Features
2.3
Updated Figure 2-1 Circuit block diagram of
the MU609 module
2.4
Updated Figure 2-2 Application block
diagram of the MU609 module
2.4
Deleted description related to Audio
Interface
3.1
Deleted description related to Audio
Interface
3.2
Updated Table 3-1 Definitions of pins on the
LGA interface and Figure 3-1 Sequence of
LGA interface (Top view)
3.8
Deleted section 3.8 in issue 03:
Audio Interface
9
Updated Appendix A Circuit of Typical
Interface
10
Updated Appendix B Acronyms and
Abbreviations

HUAWEI MU609 HSPA LGA Module
Hardware Guide
Contents
Issue 04 (2016-12-12)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
5
Contents
1 Introduction ...........................................................................................................................8
2 Overall Description...............................................................................................................9
2.1 About This Chapter..........................................................................................................................9
2.2 Function Overview ..........................................................................................................................9
2.3 Circuit Block Diagram....................................................................................................................10
2.4 Application Block Diagram.............................................................................................................11
3 Description of the Application Interfaces......................................................................... 13
3.1 About This Chapter........................................................................................................................13
3.2 LGA Interface................................................................................................................................13
3.3 Power Interface.............................................................................................................................23
3.3.1 Overview...............................................................................................................................23
3.3.2 Power Supply VBAT Interface...............................................................................................24
3.3.3 Output Power Supply Interface.............................................................................................25
3.4 Signal Control Interface.................................................................................................................25
3.4.1 Overview...............................................................................................................................25
3.4.2 Power-on/off (POWER_ON_OFF) Pin..................................................................................26
3.4.3 RESIN_N Pin........................................................................................................................28
3.4.4 WAKEUP_IN Signal..............................................................................................................29
3.4.5 WAKEUP_OUT Signal..........................................................................................................30
3.4.6 SLEEP_STATUS Signal........................................................................................................30
3.4.7 LED_MODE Signal...............................................................................................................31
3.5 UART Interface..............................................................................................................................32
3.5.1 Overview...............................................................................................................................32
3.5.2 Circuit Recommended for the UART Interface......................................................................34
3.6 USB Interface................................................................................................................................34
3.7 USIM Card Interface .....................................................................................................................36
3.7.1 Overview...............................................................................................................................36
3.7.2 Circuit Recommended for the USIM Card Interface..............................................................36
3.8 General Purpose I/O Interface ......................................................................................................37
3.9 JTAG Interface ..............................................................................................................................38
3.10 RF Antenna Interface..................................................................................................................39
3.11 Reserved Interface......................................................................................................................42

HUAWEI MU609 HSPA LGA Module
Hardware Guide
Contents
Issue 04 (2016-12-12)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
6
3.12 NC Interface................................................................................................................................43
4 RF Specifications ................................................................................................................. 44
4.1 About This Chapter........................................................................................................................44
4.2 Operating Frequencies..................................................................................................................44
4.3 Conducted RF Measurement........................................................................................................45
4.3.1 Test Environment..................................................................................................................45
4.3.2 Test Standards......................................................................................................................45
4.4 Conducted Rx Sensitivity and Tx Power .......................................................................................45
4.4.1 Conducted Receive Sensitivity .............................................................................................45
4.4.2 Conducted Transmit Power ..................................................................................................46
4.5 Antenna Design Requirements......................................................................................................47
4.5.1 Antenna Design Indicators....................................................................................................47
4.5.2 Interference ..........................................................................................................................49
4.5.3 GSM/WCDMA/GPS Antenna Requirements.........................................................................49
5 Electrical and Reliability Features ..................................................................................... 51
5.1 About This Chapter........................................................................................................................51
5.2 Absolute Ratings...........................................................................................................................51
5.3 Operating and Storage Temperatures and Humidity .....................................................................52
5.4 Power Supply Features.................................................................................................................52
5.4.1 Input Power Supply...............................................................................................................52
5.4.2 Power Consumption.............................................................................................................53
5.5 Reliability Features........................................................................................................................58
5.6 EMC and ESD Features................................................................................................................61
6 Mechanical Specifications .................................................................................................. 63
6.1 About This Chapter........................................................................................................................63
6.2 Storage Requirement....................................................................................................................63
6.3 Moisture Sensitivity .......................................................................................................................63
6.4 Dimensions and Interfaces............................................................................................................64
6.5 Packaging .....................................................................................................................................64
6.6 Label.............................................................................................................................................66
6.7 Customer PCB Design..................................................................................................................66
6.7.1 PCB Surface Finish..............................................................................................................66
6.7.2 PCB Pad Design...................................................................................................................66
6.7.3 Solder Mask..........................................................................................................................67
6.7.4 Requirements on PCB Layout..............................................................................................67
6.8 Assembly Processes.....................................................................................................................68
6.8.1 General Description of Assembly Processes........................................................................68
6.8.2 Stencil Design.......................................................................................................................68
6.8.3 Reflow Profile .......................................................................................................................69
6.9 Specification of Rework.................................................................................................................70
6.9.1 Process of Rework................................................................................................................70

HUAWEI MU609 HSPA LGA Module
Hardware Guide
Contents
Issue 04 (2016-12-12)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
7
6.9.2 Preparations of Rework ........................................................................................................70
6.9.3 Removing of the Module.......................................................................................................70
6.9.4 Welding Area Treatment.......................................................................................................71
6.9.5 Module Installation................................................................................................................71
6.9.6 Specifications of Rework.......................................................................................................71
7 Certifications........................................................................................................................ 73
7.1 About This Chapter........................................................................................................................73
7.2 Certifications .................................................................................................................................73
8 Safety Information .............................................................................................................. 74
8.1 Interference...................................................................................................................................74
8.2 Medical Device..............................................................................................................................74
8.3 Area with Inflammables and Explosives ........................................................................................74
8.4 Traffic Security ..............................................................................................................................75
8.5 Airline Security ..............................................................................................................................75
8.6 Safety of Children..........................................................................................................................75
8.7 Environment Protection.................................................................................................................75
8.8 WEEE Approval.............................................................................................................................75
8.9 RoHS Approval..............................................................................................................................75
8.10 Laws and Regulations Observance.............................................................................................76
8.11 Care and Maintenance................................................................................................................76
8.12 Emergency Call...........................................................................................................................76
8.13 Regulatory Information................................................................................................................76
8.13.1 CE Approval (European Union) ..........................................................................................76
8.13.2 FCC Statement...................................................................................................................77
9 Appendix A Circuit of Typical Interface........................................................................... 78
10 Appendix B Acronyms and Abbreviations ..................................................................... 79

HUAWEI MU609 HSPA LGA Module
Hardware Guide
Introduction
Issue 04 (2016-12-12)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
8
1 Introduction
This document describes the hardware application interfaces and air interfaces
provided by MU609 module.
This document helps hardware engineer to understand the interface specifications,
electrical features and related product information of the MU609 module.
MU609 module has two editions: GPS and No GPS.

HUAWEI MU609 HSPA LGA Module
Hardware Guide
Overall Description
Issue 04 (2016-12-12)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
9
2 Overall Description
2.1 About This Chapter
This chapter gives a general description of the MU609 module and provides:
Function Overview
Circuit Block Diagram
Application Block Diagram
2.2 Function Overview
Table 2-1 Features
Feature
Description
Physical
Dimensions
Dimensions (L ×W ×H): 30 mm ×30 mm ×2.27 mm
Weight: about 5 g
Operating
Bands
WCDMA/HSDPA/HSUPA/HSPA: Band 1, Band 2, Band 5, Band 8
GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz
GPS L1: 1575.42 MHz
Operating
Temperature
Normal operating temperature: –20°C to +70°C
Extended operating temperature[1]: –40°C to +85°C
Storage
Temperature
–40°C to +85°C
Power
Voltage
DC 3.3 V–4.2 V (typical value is 3.8 V)
AT
Commands
See the HUAWEI MU609 HSPA LGA Module AT Command
Interface Specification.
Application
Interface
(145-pin LGA
One standard USIM card (Class B and Class C)
USB 2.0 (High Speed)

HUAWEI MU609 HSPA LGA Module
Hardware Guide
Overall Description
Issue 04 (2016-12-12)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
10
Feature
Description
interface)
8-wire UART (Universal Asynchronous Receiver-Transmitter) x 1
2-wire UART x 1 (this is only used for debugging)
GPIO (General-purpose I/O) x 5
LED (Light-Emitting Diode) x 1
Power on/off interface
Hardware reset interface
USIM interface
JTAG (Joint Test Action Group) interface
Sleep indicator interface (SLEEP_STATUS)
Antenna
interface
WWAN MAIN antenna pad x1, WWAN AUX antenna pad x 1, GPS
antenna pad x 1
SMS
New message alert
Management of SMS: read SMS, write SMS, send SMS, delete
SMS and list SMS.
Supports MO and MT: Point-to-point
Data Services
GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s
EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s
WCDMA PS: UL 384 kbit/s; DL 384 kbit/s
HSPA: UL 5.76 Mbit/s; DL 14.4 Mbit/s
[1]:Whenthe MU609 module works in the range of –40°C to –20°C or +70°C to +85°C , NOT all
its RF performances comply with 3GPP specifications.
2.3 Circuit Block Diagram
Figure 2-1 shows the circuit block diagram of the MU609 module. The major
functional units of the MU609 module contain the following parts:
Power management
Baseband controller
Multi-chip package (MCP) memory
RF Circuit

HUAWEI MU609 HSPA LGA Module
Hardware Guide
Overall Description
Issue 04 (2016-12-12)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
11
Figure 2-1 Circuit block diagram of the MU609 module
2.4 Application Block Diagram
Figure 2-2 Application block diagram of the MU609 module
Antenna Interface
Application Interface
USIM Power on/
Power off
Module
USIM
Card
Power
Supply
UART
UART GPIO
GPIO
Wakeup_
IN/OUT
Wakeup_
IN/OUT
USB Reset
AUX_ANT MAIN_ANT GPS_ANT
3.3~
4.2 V
LED
LED
On/Off Reset

HUAWEI MU609 HSPA LGA Module
Hardware Guide
Overall Description
Issue 04 (2016-12-12)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
12
UART Interface:
The module supports 2 UART interfaces. One is 8-wire UART,
and the other is 2-wire UART (only for debugging).
USB Interface:
The USB interface supports USB 2.0 high speed standard.
USIM Interface:
The USIM interface provides the interface for a USIM card.
External Power
Supply:
DC 3.8 V is recommended.
LED:
Indicate the work status.
RF Pad:
RF antenna interface.

HUAWEI MU609 HSPA LGA Module
Hardware Guide
Description of the Application Interfaces
Issue 04 (2016-12-12)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
13
3 Description of the Application Interfaces
3.1 About This Chapter
This chapter mainly describes the external application interfaces of the MU609
module, including:
LGA Interface
Power Interface
Signal Control Interface
UART Interface
USB Interface
USIM Card Interface
General Purpose I/O Interface
JTAG Interface
RF Antenna Interface
Reserved Interface
NC Interface
3.2 LGA Interface
The MU609 module uses a 145-pin LGA as its external interface. For details about the
module and dimensions, see "Dimensions and Interfaces".

HUAWEI MU609 HSPA LGA Module
Hardware Guide
Description of the Application Interfaces
Issue 04 (2016-12-12)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
14
Figure 3-1 shows the sequence of pins on the 145-pin signal interface of the MU609
module.
Figure 3-1 Sequence of LGAinterface (Top view)
NC JTAG pads
Reserved pads
GND padsPower pads Control pads
UART pads USB pads
RF ANT pads
GPIO pads
SIM pads
1
2
3
4
5
6
7
8
9
10
11
12
13
14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29
30
31
32
33
34
35
36
37
38
39
40
41
42
43444546
101116 114 113 112 110 107
111 109 108 106 105 104 103 102
5254555657
59
60
61
62
63
64
65
66
67
68
69
70
71
72 73 74 75 76 77 78 79 80 81 82 83 84 85 86
88
89
90
93
94
95
97
98
99
96
92
91
87
58 53 51 50 49 48 47
100
117
118 119
120
125
124
123
122
121
126 127 128 129
130
131
132
133
140 141
142
143
144
145
139
138
137
136 135 134
115
Table 3-1 shows the definitions of pins on the 145-pin signal interface of the MU609
module.

HUAWEI MU609 HSPA LGA Module
Hardware Guide
Description of the Application Interfaces
Issue 04 (2016-12-12)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
15
Table 3-1 Definitions of pins on the LGAinterface
PIN
No.
Pin Name
Pad
Type
Description
Parameter
Min. (V)
Typ.
(V)
Max. (V)
Comments
1
UART1_TX
O
UART1 transmit
output for
debugging
VOH
1.35
-
1.8
-
VOL
0
-
0.45
-
2
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
3
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
4
UART1_RX
I
UART1 receive
data input for
debugging
VIH
1.2
1.8
2.1
-
VIL
–0.3
-
0.5
-
5
Reserved
-
Reserved
-
-
-
-
-
6
Reserved
-
Reserved
-
-
-
-
-
7
Reserved
-
Reserved
-
-
-
-
-
8
Reserved
-
Reserved
-
-
-
-
-
9
Reserved
-
Reserved
-
-
-
-
-
10
Reserved
-
Reserved
-
-
-
-
-
11
WAKEUP_I
N
I
Host to set the
module into sleep
or wake up the
module from sleep.
VIH
1.2
1.8
2.1
-
VIL
–0.3
-
0.5
-
12
VBAT
PI
Power supply input
-
3.3
3.8
4.2
-
13
VBAT
PI
Power supply input
-
3.3
3.8
4.2
-
14
PS_HOLD
I
Power supply hold
signal to the
module
VIH
1.2
1.8
2.1
-
VIL
–0.3
-
0.5
-
15
SLEEP_ST
ATUS
O
Sleep status of
MU609
VOH
1.35
-
1.8
-
VOL
0
-
0.45
-
16
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
17
NC
-
Not connected,
please keep open
-
-
-
-
-
18
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-

HUAWEI MU609 HSPA LGA Module
Hardware Guide
Description of the Application Interfaces
Issue 04 (2016-12-12)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
16
PIN
No.
Pin Name
Pad
Type
Description
Parameter
Min. (V)
Typ.
(V)
Max. (V)
Comments
19
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
20
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
21
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
22
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
23
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
24
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
25
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
26
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
27
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
28
Reserved
-
Reserved
-
-
-
-
-
29
Reserved
-
Reserved
-
-
-
-
-
30
JTAG_TMS
I
JTAG test mode
select
VIH
1.2
1.8
2.1
-
VIL
–0.3
-
0.5
-
31
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
32
VCC_EXT1
PO
1.8 V Power output
-
-
1.8
-
-
33
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
34
USIM_VCC
P
Power supply for
USIM card
-
1.75
1.8
1.98
USIM_VCC=1
.8 V

HUAWEI MU609 HSPA LGA Module
Hardware Guide
Description of the Application Interfaces
Issue 04 (2016-12-12)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
17
PIN
No.
Pin Name
Pad
Type
Description
Parameter
Min. (V)
Typ.
(V)
Max. (V)
Comments
-
2.75
2.85
3.3
USIM_VCC=2
.85 V
35
Reserved
-
Reserved
-
-
-
-
-
36
JTAG_TRS
T_N
I
JTAG reset
VIH
1.2
1.8
2.1
-
VIL
–0.3
-
0.5
-
37
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
38
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
39
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
40
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
41
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
42
JTAG_TCK
I
JTAG clock input
VIH
1.2
1.8
2.1
-
VIL
–0.3
-
0.5
-
43
Reserved
-
Reserved
-
-
-
-
-
44
Reserved
-
Reserved
-
-
-
-
-
45
Reserved
-
Reserved
-
-
-
-
-
46
Reserved
-
Reserved
-
-
-
-
-
47
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
48
GND
-
Ground
-
-
-
-
-
49
GND
-
Ground
-
-
-
-
-
50
GND
-
Ground
-
-
-
-
-
51
GPIO
I/O
General Purpose
I/O pins. The
function of these
pins has not been
defined.
VIH
1.2
1.8
2.1
-
VIL
–0.3
-
0.5
-
VOH
1.35
-
1.8
-
VOL
0
-
0.45
-

HUAWEI MU609 HSPA LGA Module
Hardware Guide
Description of the Application Interfaces
Issue 04 (2016-12-12)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
18
PIN
No.
Pin Name
Pad
Type
Description
Parameter
Min. (V)
Typ.
(V)
Max. (V)
Comments
52
GND
-
Ground
-
-
-
-
-
53
GND
-
Ground
-
-
-
-
-
54
GND
-
Ground
-
-
-
-
55
GPIO
I/O
General Purpose
I/O pins. The
function of these
pins has not been
defined.
VIH
1.2
1.8
2.1
-
VIL
–0.3
-
0.5
-
VOH
1.35
-
1.8
-
VOL
0
-
0.45
-
56
GND
-
Ground
-
-
-
-
-
57
GND
-
Ground
-
-
-
-
-
58
GND
-
Ground
-
-
-
-
-
59
GND
-
Ground
-
-
-
-
-
60
Reserved
-
Reserved
-
-
-
-
-
61
Reserved
-
Reserved
-
-
-
-
-
62
Reserved
-
Reserved
-
-
-
-
-
63
Reserved
-
Reserved
-
-
-
-
-
64
Reserved
-
Reserved
-
-
-
-
-
65
Reserved
-
Reserved
-
-
-
-
-
66
Reserved
-
Reserved
-
-
-
-
-
67
Reserved
-
Reserved
-
-
-
-
-
68
Reserved
-
Reserved
-
-
-
-
-
69
Reserved
-
Reserved
-
-
-
-
-
70
Reserved
-
Reserved
-
-
-
-
-
71
WAKEUP_O
UT
O
Module to wake up
the host
VOH
1.35
-
1.8
-
VOL
0
-
0.45
72
JTAG_TDO
O
JTAG test data
output
VOH
1.35
-
1.8
VOL
0
-
0.45
-
73
UART0_DS
R
O
UART0 data set
ready
VOH
1.35
-
1.8
-
VOL
0
-
0.45
-
74
UART0_RT
S
O
UART0 ready for
receive
VOH
1.35
-
1.8
-
VOL
0
-
0.45
-

HUAWEI MU609 HSPA LGA Module
Hardware Guide
Description of the Application Interfaces
Issue 04 (2016-12-12)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
19
PIN
No.
Pin Name
Pad
Type
Description
Parameter
Min. (V)
Typ.
(V)
Max. (V)
Comments
75
UART0_DC
D
O
UART0 data carrier
detect
VOH
1.35
-
1.8
-
VOL
0
-
0.45
-
76
UART0_TX
O
UART0 transmit
output
VOH
1.35
-
1.8
-
VOL
0
-
0.45
-
77
UART0_RIN
G
O
UART0 ring
indicator
VOH
1.35
-
1.8
-
VOL
0
-
0.45
-
78
UART0_RX
I
UART0 receive
data input
VIH
1.2
1.8
2.1
-
VIL
–0.3
-
0.5
-
79
UART0_DT
R
I
Data terminal ready
VIH
1.2
1.8
2.1
-
VIL
–0.3
-
0.5
80
UART0_CT
S
I
UART0 clear to
send
VIH
1.2
1.8
2.1
VIL
–0.3
-
0.5
81
POWER_O
N_OFF
I
System power-on
or power-off
VIH
1.2
1.8
2.1
-
VIL
–0.3
-
0.5
-
82
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
83
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
84
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
85
USB_DM
I/O
USB Data- defined
in the USB 2.0
Specification
-
-
-
-
-
86
USB_DP
I/O
USB Data+ defined
in the USB 2.0
Specification
-
-
-
-
-
87
JTAG_TDI
I
JTAG test data
input
VIH
1.2
1.8
2.1
-
VIL
–0.3
-
0.5
-
88
USIM_RES
ET
O
USIM card reset
VOH
0.7 x
USIM_VCC
-
3.3
USIM_VCC=1
.8 V or 2.85 V
VOL
0
-
0.2 x
USIM_VCC

HUAWEI MU609 HSPA LGA Module
Hardware Guide
Description of the Application Interfaces
Issue 04 (2016-12-12)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
20
PIN
No.
Pin Name
Pad
Type
Description
Parameter
Min. (V)
Typ.
(V)
Max. (V)
Comments
89
USIM_DAT
A
I/O
USIM card data
VIH
0.7 x
USIM_VCC
-
3.3
USIM_VCC=1
.8 V or 2.85 V
VIL
0
-
0.2 x
USIM_VCC
VOH
0.7 x
USIM_VCC
-
3.3
VOL
0
-
0.2 x
USIM_VCC
90
USIM_CLK
O
USIM card clock
VOH
0.7 x
USIM_VCC
-
3.3
USIM_VCC=1
.8 V or 2.85 V
VOL
0
-
0.2 x
USIM_VCC
91
Reserved
-
Reserved
-
-
-
-
-
92
Reserved
-
Reserved
-
-
-
-
-
93
JTAG_RTC
K
O
JTAG return clock
VOH
1.35
-
1.8
-
VOL
0
-
0.45
-
94
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
95
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
96
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
97
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
98
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
99
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
100
RESIN_N
I
Reset module.
VIH
1.2
1.8
2.1
-
VIL
–0.3
-
0.5
-