Huawei MU709s-2 Installation instructions

HUAWEI MU709s-2 HSPA+ Mini PCIe Module
Hardware Guide
Issue
0.1
Date
2014-06-03

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Hardware Guide
About This Document
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About This Document
Revision History
Document
Version
Date
Chapter
Descriptions
0.1
2014-06-03
This is a draft version, and some chapters
are still with "TBD".

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Contents
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Contents
1 Introduction....................................................................................................................................7
2 Overall Description ......................................................................................................................8
2.1 About This Chapter........................................................................................................................... 8
2.2 Function Overview............................................................................................................................ 8
2.3 Circuit Block Diagram....................................................................................................................... 9
3 Description of the Application Interfaces..............................................................................10
3.1 About This Chapter......................................................................................................................... 10
3.2 Mini PCIe Interface......................................................................................................................... 10
3.3 Power Sources and Grounds......................................................................................................... 14
3.4 Power Supply Time Sequence....................................................................................................... 15
3.5 WAKE# Signal................................................................................................................................ 16
3.6 RESIN_N Signal............................................................................................................................. 17
3.7 W_DISABLE# Signal...................................................................................................................... 18
3.8 LED_WWAN# Signal...................................................................................................................... 18
3.9 USB Interface................................................................................................................................. 19
3.10 USIM Card Interface .................................................................................................................... 20
3.10.1 Overview.............................................................................................................................. 20
3.10.2 Circuit Recommended for the USIM Card Interface............................................................ 20
3.11 Audio Interface.............................................................................................................................. 21
3.12 UART Interface............................................................................................................................. 23
3.13 RF Antenna Connector................................................................................................................. 23
3.14 NC Pins ........................................................................................................................................ 24
4 RF Specifications.........................................................................................................................25
4.1 About This Chapter......................................................................................................................... 25
4.2 Operating Frequencies................................................................................................................... 25
4.3 Conducted RF Measurement......................................................................................................... 26
4.3.1 Test Environment................................................................................................................... 26
4.3.2 Test Standards....................................................................................................................... 26
4.4 Conducted Rx Sensitivity and Tx Power........................................................................................ 26
4.4.1 Conducted Receive Sensitivity.............................................................................................. 26
4.4.2 Conducted Transmit Power................................................................................................... 27
4.5 Antenna Design Requirements ...................................................................................................... 27

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4.5.1 Antenna Design Indicators..................................................................................................... 27
4.5.2 Interference ........................................................................................................................... 30
4.5.3 GSM/WCDMAAntenna Requirements.................................................................................. 30
5 Electrical and Reliability Features...........................................................................................31
5.1 About This Chapter......................................................................................................................... 31
5.2 Absolute Ratings ............................................................................................................................ 31
5.3 Operating and Storage Temperatures............................................................................................ 32
5.4 Electrical Features of USIM ........................................................................................................... 32
5.5 Power Supply Features.................................................................................................................. 32
5.5.1 Input Power Supply ............................................................................................................... 32
5.5.2 Power Consumption.............................................................................................................. 33
5.6 Reliability Features......................................................................................................................... 37
5.7 EMC and ESD Features................................................................................................................. 40
6 Mechanical Specifications.........................................................................................................43
6.1 About This Chapter......................................................................................................................... 43
6.2 Dimensions and Interfaces............................................................................................................. 43
6.3 Dimensions of the Mini PCI Express Connector............................................................................ 44
6.4 Specification Selection for Fasteners............................................................................................. 45
6.4.1 Installing the Mini PCIe Adapter on the Main Board.............................................................. 45
6.4.2 Romoving the Mini PCIe Adapter from the Main Board ........................................................ 47
6.5 Label............................................................................................................................................... 48
7 Certifications................................................................................................................................49
7.1 About This Chapter......................................................................................................................... 49
7.2 Certifications................................................................................................................................... 49
8 Safety Information......................................................................................................................50
8.1 Interference .................................................................................................................................... 50
8.2 Medical Device............................................................................................................................... 50
8.3 Area with Inflammables and Explosives......................................................................................... 50
8.4 Traffic Security................................................................................................................................ 51
8.5 Airline Security................................................................................................................................ 51
8.6 Safety of Children........................................................................................................................... 51
8.7 Environment Protection.................................................................................................................. 51
8.8 WEEE Approval.............................................................................................................................. 51
8.9 RoHS Approval............................................................................................................................... 51
8.10 Laws and Regulations Observance ............................................................................................. 52
8.11 Care and Maintenance................................................................................................................. 52
8.12 Emergency Call............................................................................................................................ 52
8.13 Regulatory Information................................................................................................................. 52
8.13.1 CE Approval (European Union)........................................................................................... 52
8.13.2 FCC Statement.................................................................................................................... 53

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9 Appendix A Circuit of Typical Interface................................................................................54
10 Appendix B Acronyms and Abbreviations..........................................................................55

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Introduction
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1 Introduction
This document describes the hardware application interfaces and air interfaces
provided by MU709s-2 Mini PCIe Module (hereinafter referred to as the MU709s-2
module).
This document helps hardware engineer to understand the interface specifications,
electrical features and related product information of the MU709s-2 module.

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2 Overall Description
2.1 About This Chapter
This chapter gives a general description of the MU709s-2 module and provides:
Function Overview
Circuit Block Diagram
2.2 Function Overview
Table 2-1 Features
Feature
Description
Physical
Dimensions
Dimensions (L ×W ×H): 51 mm ×30.4 mm ×3.3 mm
Weight: about 12 g
Operating
Temperature
–40°C to +70°C
Storage
Temperature
–40°C to +85°C
Power
Voltage
DC 3.0 V–3.6 V (typical value is 3.3 V)
Application
Interface
(52-pin Mini
PCIe interface
One standard USIMcard (Class B and Class C)
Audio interface: PCM interface
USB 2.0 (High Speed)
UART(2-wire, up to 920kbps)
RESIN_N: Reset module
WAKE#: Wake up signal
W_DISABLE# Signal (the software version is planning)

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Feature
Description
LED_WWAN#: Active-low LED signal indicating the state of the
module
Antenna
connector
WWAN MAIN antenna connector x1
WWAN AUX antenna connector x1
2.3 Circuit Block Diagram
Figure 2-1 shows the circuit block diagram of the MU709s-2 Mini PCIe Adapter. The
major functional unit of the Mini PCIe Adapter contains the following parts:
DCDC Circuit
LGA Module
Control signals
Antenna Connectors
Figure 2-1 Circuit block diagram of the MU709s-2 module

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3 Description of the Application Interfaces
3.1 About This Chapter
This chapter mainly describes the external application interfaces of the MU709s-2
module, including:
Mini PCIe Interface
Power Sources and Grounds
Power Supply Time Sequence
WAKE# Signal
RESIN_N Signal
W_DISABLE# Signal
LED_WWAN# Signal
USB Interface
USIM Card Interface
Audio Interface
UART Interface
RF Antenna Connector
NC Pins
3.2 Mini PCIe Interface
The MU709s-2 module uses a Mini PCIe interface as its external interface. For details
about the module and dimensions, see "Dimensions and Interfaces".

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Figure 3-1 shows the sequence of pins on the interface of the Mini PCIeAdapter.
Figure 3-1 Sequence of Mini PCIe interface
Top Bottom
Table 3-1 shows the pin definitions of the Mini PCIe Interface.
Table 3-1 Pin definitions of the Mini PCIe Interface
PIN
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Mini PCI
Express
Standard
Description
HUAWEI Pin
Description
1
WAKE#
WAKE#
O
Open collector
active low signal.
This signal is
used to wake up
the host.
VOL
–0.3
0.45
2
3.3Vaux
VCC_3V3
P
3.3 V DC supply
input.
3.0
3.3
3.6
3
COEX1
NC
-
Not connected
-
-
-
4
GND
GND
-
Ground
-
-
-
5
COEX2
NC
-
Not connected
-
-
-
6
1.5 V
NC
-
Not connected
-
-
-

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PIN
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Mini PCI
Express
Standard
Description
HUAWEI Pin
Description
7
CLKREQ#
NC
-
Not connected
-
-
-
8
UIM_PWR
UIM_PWR
PO
Power source for
the external
USIM card
Class C
-0.3
1.8
1.98
Class B
-0.3
2.85
3.3
9
GND
GND
-
Ground
-
-
-
10
UIM_DATA
UIM_DATA
I/O
External USIM
data signal
-
1.8/2
.85
-
11
REFCLK-
NC
-
Not connected
-
-
-
12
UIM_CLK
UIM_CLK
O
External USIM
clock signal
-
1.8/2
.85
-
13
REFCLK+
NC
-
Not connected
-
-
-
14
UIM_RESET
UIM_RESET
O
External USIM
reset signal
-
1.8/2
.85
-
15
GND
GND
-
Ground
-
-
-
16
UIM_Vpp
NC
-
Not connected
-
-
-
17
Reserved
UART_RX
I
UART receive
VIH
1.17
1.8
2.1
VIL
-0.3
0
0.63
18
GND
GND
-
Ground
-
-
-
19
Reserved
UART_TX
O
UART transmit
VOH
1.35
1.8
2.1
VOL
-0.3
0
0.45
20
W_DISABL
E#
W_DISABLE#
I
The
W_DISABLE#
signal is an
active low signal
that when
asserted (driven
low) by the
system shall
disable radio
operation.
The software
version is
planning.
VIL
-0.3
0
0.3
VIH
1.17
1.8
2.1
21
GND
GND
-
Ground
-
-
-
22
PERST#
RESIN_N
I
Reset module
VIH
-0.3
0
0.3

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PIN
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Mini PCI
Express
Standard
Description
HUAWEI Pin
Description
Active-low
VIL
1.17
3.6
3.6
23
PERn0
NC
-
Not connected
-
-
-
24
3.3Vaux
VCC_3V3
P
3.3 V DC supply
input.
3.0
3.3
3.6
25
PERp0
NC
-
Not connected
-
-
-
26
GND
GND
-
Ground
-
-
-
27
GND
GND
-
Ground
-
-
-
28
1.5 V
NC
-
Not connected
-
-
-
29
GND
GND
-
Ground
-
-
-
30
SMB_CLK
NC
-
Not connected
-
-
-
31
PETn0
NC
-
Not connected
-
-
-
32
SMB_DATA
NC
-
Not connected
-
-
-
33
PETp0
NC
-
Not connected
-
-
-
34
GND
GND
-
Ground
-
-
-
35
GND
GND
-
Ground
-
-
-
36
USB_D-
USB_DM
I/O
USB signal D-
-
-
-
37
GND
GND
-
Ground
-
-
-
38
USB_D+
USB_DP
I/O
USB signal D+
-
-
-
39
3.3Vaux
VCC_3V3
P
3.3 V DC supply
input.
3.0
3.3
3.6
40
GND
GND
-
Ground
-
-
-
41
3.3Vaux
VCC_3V3
P
3.3 V DC supply
input.
3.0
3.3
3.6
42
LED_WWA
N#
LED_WWAN#
O
Active-low LED
signal indicating
the state of the
card.
VOL
–0.3
0.45
43
GND
GND
-
Ground
-
-
-
44
LED_WLAN
#
NC
-
Not connected
-
-
-
45
Reserved
PCM_CLK
O
PCM interface
VOH
1.35
1.8
2.1

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PIN
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Mini PCI
Express
Standard
Description
HUAWEI Pin
Description
clock
VOL
-0.3
0
0.45
46
LED_WPAN
#
NC
-
Not connected
-
-
-
47
Reserved
PCM_DOUT
O
PCM I/F data
output
VOH
1.35
1.8
2.1
VOL
-0.3
0
0.45
48
1.5 V
NC
-
Not connected
-
-
-
49
Reserved
PCM_DIN
I
PCM I/F data
input
VIH
1.17
1.8
2.1
VIL
-0.3
0
0.63
50
GND
GND
-
Ground
-
-
-
51
Reserved
PCM_SYNC
O
PCM interface
sync
VOH
1.35
1.8
2.1
VOL
-0.3
0
0.45
52
3.3Vaux
VCC_3V3
P
3.3 V DC supply
input.
3.0
3.3
3.6
Pindicates power pins; PO indicates output power pins; Iindicates pins for digital signal
input; Oindicates pins for digital signal output. AI indicates pins for analog signal input.
The NC (Not Connected) pins are floating and there are no signal connected to these pins.
Yet some of these pins may be used in MU509, MC509, MU609 and ME909 module,
therefore, before you deal with these pins, please refer to the corresponding hardware
guide.
The Reserved pins are internally connected to the module. Therefore, these pins should not
be used, otherwise they may cause problems. Please contact with us for more details about
this information.
3.3 Power Sources and Grounds
The PCIe Mini Card provides two power sources: one is 3.3 Vaux (+3.3 Vaux) and the
other is 1.5 V (+1.5 V). For the PCIe Adapter, however, +3.3 Vaux is the only voltage
supply that is available. The input voltage is 3.3 V±9%, as specified by PCI Express
Mini CEM Specifications 1.2.

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Table 3-2 Power and ground specifications
Pin Name
Pin No.
Min.(V)
Typ .(V)
Max..(V)
VCC_3V3
2, 24, 39, 41and 52
3.0
3.3
3.6
GND
4, 9, 15, 18, 21, 26, 27, 29,
34, 35, 37, 40, 43, and 50
-
To minimize the RF radiation through the power lines, it is suggested to add ceramic capacitors
of 10 pF and 100 nF in the power lines beside the Mini PCIe connector on the host side.
3.4 Power Supply Time Sequence
Power on sequence
Do not toggle RESIN_N pin during the power on sequence. Pulling RESIN_N pin low
will extend time for module startup.
Figure 3-2 Power on timing sequence
Parameter
Remarks
Time (Nominal value)
Unit
TPD+
Power Valid to USB
D+ high
3.0–5.0
s
Power off Sequence
Cutting off the 3.3 V power supply will power off the module.

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Figure 3-3 Power off timing sequence
3.5 WAKE# Signal
WAKE# pin (signal that the module uses to wake up the host) supports software
control.
This signal is used for 3G module to wake up the host. It is designed as an OC gate,
so it should be pulled up by the host and it is active-low.
When the module wakes up the host, the WAKE# pin will output low-level-voltage to
wake the host.
Figure 3-4 Connections of the WAKE# pin

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3.6 RESIN_N Signal
The RESIN_N pin is used to reset the module's system. When the module software
stops responding, the RESIN_N pin can be pulled down to reset the module
hardware.
The RESIN_N signal is internally pulled up to 1.8 V, which is automatically on when
3.3 V is applied and it is active-low.
Figure 3-5 Connections of the RESIN_N pin
As the RESIN_N signal are relatively sensitive, it is recommended that you install a
10 nF–0.1 µF capacitor near the RESIN_N pin of the interface for filtering. In
addition, when you design a circuit on the PCB of the interface board, it is
recommended that the circuit length should not exceed 20 mm and that the circuit
should be kept at a distance of 2.54 mm (100 mil) at least from the PCB edge.
Furthermore, you need to wrap the area adjacent to the signal wire with a ground
wire. Otherwise, the module may be reset due to interference.
The maximum Forward Voltage Drop of the diode used in the module is 0.6 V. So
when the host wants to reset the module, the low-level-voltage in the RESIN_N pin
should below 50 mV.
The MU709s-2 module supports hardware reset function. If the software of the
MU709s-2 module stops responding, you can reset the hardware through the
RESIN_N signal as shown in Figure 3-6 . When a low-level pulse is supplied through
the RESIN_N pin, the hardware will be reset.After the hardware is reset, the software
starts powering on the module and reports relevant information according to the actual
settings. For example, theAT command automatically reports ^SYSSTART.

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Figure 3-6 Reset pulse timing
The RESIN_N pin must not be pulled down for more than 1s.
The RESIN_N pin is optional, which can be not connected.
3.7 W_DISABLE# Signal
The W_DISABLE# signal is provided to allow users to disable wireless
communications of the module.
The software version is planning.
3.8 LED_WWAN# Signal
MU709s-2 provides a LED_WWAN# signal to indicate the work status.
Table 3-3 State of the LED_WWAN# pin
No.
Operating Status
LED_WWAN#
1
No service/Restricted service
Outputs: low(0.1s)-high (0.1s)-low
(0.1s)-high (1.7s)
2s cycle
2
Register to the network
Outputs: low (0.1s)-high (1.9s)
2s cycle
3
Dial-up successfully
Outputs: low
External Circuits
Figure 3-7 shows the recommended circuits of the LED_WWAN# pin. According to
LED feature, you can adjust the LED brightness by adjusting the resistance of resistor
R.

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Figure 3-7 Driving circuit
3.9 USB Interface
The MU709s-2 module is compliant with USB 2.0 protocol. The USB interface is
powered directly from the VBAT supply. The USB input/output lines are compatible
with the USB 2.0 signal specifications. Figure 3-8 shows the circuit of the USB
interface.
Table 3-4 Definition of the USB interface
PIN
No.
Pin Name
Pad Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
36
USB_DM
I/O
USB signal D-
-
-
-
-
38
USB_DP
I/O
USB signal D+
-
-
-
According to USB protocol, for bus timing or electrical characteristics of MU709s-2
USB signal, please refer to the chapter 7.3.2 of Universal Serial Bus Specification 1.2.

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Figure 3-8 Recommended circuit of USB interface
3.10 USIM Card Interface
3.10.1 Overview
The MU709s-2 module provides a USIM card interface complying with the ISO 7816-3
standard and supports both Class B and Class C USIM cards.
Table 3-5 USIM card interface signals
PIN
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
14
UIM_RESET
O
External USIM reset signal
-
1.8/2
.85
-
12
UIM_CLK
O
External USIM clock
signal
-
1.8/2
.85
-
10
UIM_DATA
I/O
External USIM data signal
-
1.8/2
.85
-
8
UIM_PWR
PO
Power source for the
external USIM card
Class C
-0.3
1.8
1.98
Class B
-0.3
2.85
3.3
3.10.2 Circuit Recommended for the USIM Card Interface
As the Mini PCIeAdapter is not equipped with an USIM socket, you need to place an
USIM socket on the user interface board.
Figure 3-9 shows the circuit of the USIM card interface.