Huawei ME909u-521 Installation instructions

HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
Issue
05
Date
2017-12-15

Copyright © Huawei Technologies Co., Ltd. 2017. All rights reserved.
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HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
About This Document
Issue 05 (2017-12-15)
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3
About This Document
Revision History
Document
Version
Date
Chapter
Descriptions
01
2013-07-12
Creation
02
2014-01-20
All
Deleted the description related to
ME909u-121 and ME909u-721 in issue 01
3.4.2
Updated Figure 3-4 power on timing
sequence
3.6
Updated Figure 3-14 recommended circuit
of USB interface and its notes
3.11
Updated RF antenna interface
4.4.1
Added Table 4-3 ME909u-521 module GPS
main characteristics
5.4.2
Updated power consumption
5.5
Updated reliability features
5.6
Updated EMC and ESD features
6.7.3
Added heat dissipation solution
9
Updated circuit of typical interface
03
2015-04-25
2.2
Updated Function Overview
3
Updated definitions of pins
3.3.2
Updated recommended manufacturer of
EMI ferrite bead
3.4.5
Updated description of WAKEUP_OUT
signal
4.4.2
Updated Table 4-4 ME909u-521 conducted
Tx power
4.6
Added Co-exsitence with 5 GHz WIFI
Design Guide

HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
About This Document
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Document
Version
Date
Chapter
Descriptions
5.4
Deleted electrical features of USIM of issue
02
5.4.2
Updated Table 5-5 Averaged power off DC
power consumption of ME909u-521
5.5
Deleted electrical features of application
interfaces of issue 02
6.5
Updated packaging of ME909u-521 module
6.6
Updated label of ME909u-521 module
6.7.2
Deleted Figure 6-4 thermal pads design of
issue 02
6.8
Added Thermal Design Solution
04
2017-06-28
6.6
Updated label of ME909u-521 module
8.13
Deleted section 8.13 Regulatory
Information in Issue 03
8.13
Added section 8.13 EU Regulatory
Conformance
05
2017-12-15
Deleted Privacy Policy
Added Software Update

HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
Contents
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5
Contents
1 Introduction....................................................................................................................................8
2 Overall Description ......................................................................................................................9
2.1 About This Chapter........................................................................................................................... 9
2.2 Function Overview............................................................................................................................ 9
2.3 Circuit Block Diagram......................................................................................................................11
2.4 Application Block Diagram ............................................................................................................. 12
3 Description of the Application Interfaces..............................................................................13
3.1 About This Chapter......................................................................................................................... 13
3.2 LGA Interface ................................................................................................................................. 13
3.3 Power Interface.............................................................................................................................. 25
3.3.1 Overview................................................................................................................................ 25
3.3.2 Power Supply VBAT Interface............................................................................................... 25
3.3.3 Output Power Supply Interface ............................................................................................. 26
3.4 Signal Control Interface.................................................................................................................. 27
3.4.1 Overview................................................................................................................................ 27
3.4.2 Power-on/off (POWER_ON_OFF) Pin .................................................................................. 28
3.4.3 RESIN_N Pin......................................................................................................................... 29
3.4.4 WAKEUP_IN Signal............................................................................................................... 31
3.4.5 WAKEUP_OUT Signal........................................................................................................... 31
3.4.6 SLEEP_STATUS Signal ........................................................................................................ 32
3.4.7 LED_MODE Signal................................................................................................................ 33
3.5 UART Interface............................................................................................................................... 34
3.5.1 Overview................................................................................................................................ 34
3.5.2 Circuit Recommended for the UART Interface...................................................................... 35
3.6 USB Interface................................................................................................................................. 35
3.7 USIM Card Interface ...................................................................................................................... 37
3.7.1 Overview................................................................................................................................ 37
3.7.2 Circuit Recommended for the USIM Card Interface.............................................................. 38
3.8 Audio Interface ............................................................................................................................... 39
3.9 General Purpose I/O Interface....................................................................................................... 40
3.10 JTAG Interface ............................................................................................................................. 41
3.11 RF Antenna Interface.................................................................................................................... 42

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3.12 Reserved Interface....................................................................................................................... 46
3.13 NC Interface................................................................................................................................. 46
3.14 Tunable Antenna Control.............................................................................................................. 47
4 RF Specifications.........................................................................................................................48
4.1 About This Chapter......................................................................................................................... 48
4.2 Operating Frequencies................................................................................................................... 48
4.3 Conducted RF Measurement......................................................................................................... 49
4.3.1 Test Environment................................................................................................................... 49
4.3.2 Test Standards....................................................................................................................... 49
4.4 Conducted Rx Sensitivity and Tx Power........................................................................................ 49
4.4.1 Conducted Receive Sensitivity.............................................................................................. 49
4.4.2 Conducted Transmit Power................................................................................................... 50
4.5 Antenna Design Requirements ...................................................................................................... 51
4.5.1 Antenna Design Indicators..................................................................................................... 51
4.5.2 Interference ........................................................................................................................... 54
4.5.3 Antenna Requirements.......................................................................................................... 54
4.6 Co-exsitence with 5 GHz WIFI Design Guide................................................................................ 55
4.6.1 Purpose ................................................................................................................................. 55
4.6.2 Co-exsitence Design Main Point ........................................................................................... 55
5 Electrical and Reliability Features...........................................................................................58
5.1 About This Chapter......................................................................................................................... 58
5.2 Absolute Ratings ............................................................................................................................ 58
5.3 Operating and Storage Temperatures............................................................................................ 59
5.4 Power Supply Features.................................................................................................................. 59
5.4.1 Input Power Supply ............................................................................................................... 59
5.4.2 Power Consumption.............................................................................................................. 60
5.5 Reliability Features......................................................................................................................... 65
5.6 EMC and ESD Features................................................................................................................. 68
6 Mechanical Specifications.........................................................................................................70
6.1 About This Chapter......................................................................................................................... 70
6.2 Storage Requirement ..................................................................................................................... 70
6.3 Moisture Sensitivity ........................................................................................................................ 70
6.4 Dimensions and Interfaces............................................................................................................. 71
6.5 Packaging....................................................................................................................................... 72
6.6 Label............................................................................................................................................... 73
6.7 Customer PCB Design................................................................................................................... 73
6.7.1 PCB Surface Finish............................................................................................................... 73
6.7.2 PCB Pad Design.................................................................................................................... 73
6.7.3 Solder Mask........................................................................................................................... 74
6.7.4 Requirements on PCB Layout............................................................................................... 74
6.8 Thermal Design Solution................................................................................................................ 75

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6.9 Assembly Processes...................................................................................................................... 77
6.9.1 General Description of Assembly Processes ........................................................................ 77
6.9.2 Stencil Design........................................................................................................................ 77
6.9.3 Reflow Profile ........................................................................................................................ 78
6.10 Specification of Rework................................................................................................................ 79
6.10.1 Process of Rework .............................................................................................................. 79
6.10.2 Preparations of Rework....................................................................................................... 79
6.10.3 Removing of the Module ..................................................................................................... 79
6.10.4 Welding Area Treatment...................................................................................................... 80
6.10.5 Module Installation............................................................................................................... 80
6.10.6 Specifications of Rework ..................................................................................................... 81
7 Certifications................................................................................................................................82
7.1 About This Chapter......................................................................................................................... 82
7.2 Certifications................................................................................................................................... 82
8 Safety Information......................................................................................................................83
8.1 Interference .................................................................................................................................... 83
8.2 Medical Device............................................................................................................................... 83
8.3 Area with Inflammables and Explosives......................................................................................... 83
8.4 Traffic Security................................................................................................................................ 84
8.5 Airline Security................................................................................................................................ 84
8.6 Safety of Children........................................................................................................................... 84
8.7 Environment Protection.................................................................................................................. 84
8.8 WEEE Approval.............................................................................................................................. 84
8.9 RoHS Approval............................................................................................................................... 84
8.10 Laws and Regulations Observance ............................................................................................. 85
8.11 Care and Maintenance................................................................................................................. 85
8.12 Emergency Call............................................................................................................................ 85
8.13 EU Regulatory Conformance....................................................................................................... 85
9 Appendix A Circuit of Typical Interface................................................................................87
10 Appendix B Acronyms and Abbreviations..........................................................................88

HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
Introduction
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1 Introduction
This document describes the hardware application interfaces and air interfaces
provided by HUAWEI ME909u-521 LTE LGAmodule.
This document helps hardware engineer to understand the interface specifications,
electrical features and related product information of the ME909u-521 module.
If customers want to design a board which is compatible between ME909u-521
module and other 30 mm x30 mm LGA modules, such as MU609, please refer to
HUAWEI 30 mm x 30 mm LGA Module Hardware Migration Guide. There are some
important information to help you make the correct design.

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Hardware Guide
Overall Description
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2 Overall Description
2.1 About This Chapter
This chapter gives a general description of the ME909u-521 module and provides:
Function Overview
Circuit Block Diagram
Application Block Diagram
2.2 Function Overview
Table 2-1 ME909u-521 module features
Feature
Description
Physical
Dimensions
Dimensions (L ×W ×H): 30 mm ×30 mm ×2.35 mm
Weight: about 5 g
Operating
Bands
LTE: FDD Band 1, Band 2, Band 3, Band 5, Band 7, Band 8,
Band 20, all bands with diversity
WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 2, Band 5,
Band 8, all bands with diversity
GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz
GPS/GLONASS: L1
Operating
Temperature
Normal operating temperature: –20°C to +70°C
Extended operating temperature[1]: –30°C to +75°C
Storage
Temperature
–40°C to +85°C
Power
Voltage
DC 3.3 V to 4.2 V (typical value is 3.8 V)
AT
Commands
See the HUAWEI ME909u-521 LTE LGA Module AT Command
Interface Specification.

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Overall Description
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Feature
Description
Application
Interface
(145-pin LGA
interface)
One standard USIM (Class B and Class C) interface
Audio interface: PCM interface
USB 2.0 (High Speed)
4-wire UART x 2
2-wire UART[2] x 1
GPIO (General-Purpose I/O) x 5
Power on/off pin
Hardware reset pin
Sleep indicator pin (SLEEP_STATUS)
Tunable Antenna control (4 GPIOs) (the firmware with this feature
is in plan.)
HSIC interface[3]
SDIO interface[3]
SPI interface[3]
I2C interface[3]
JTAG (Joint Test Action Group)
Antenna interface (MAIN/AUX/GPS)
ADC[3] x 2
Power supply
Antenna
interface
WWAN primary antenna pad x 1
WWAN secondary antenna pad x 1
GPS antenna pad x 1
Data Services
GPRS: DL 85.6 kbit/s; UL 85.6 kbit/s
EDGE: DL 236.8 kbit/s; UL 236.8 kbit/s
WCDMA CS: DL 64 kbit/s; UL 64 kbit/s
WCDMA PS: DL 384 kbit/s; UL 384 kbit/s
HSPA+: DL 21.6 Mbit/s; UL 5.76 Mbit/s
DC-HSPA+: DL 43.2 Mbit/s; UL 5.76 Mbit/s
LTE FDD: DL 100 Mbit/s; UL 50 Mbit/s @20M BW cat3

HUAWEI ME909u-521 LTE LGA Module
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Overall Description
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[1]: When the ME909u-521 module works in the range of –30°C to –20°C or +70°C to +75°C ,
NOT all its RF performances comply with 3GPP specifications.
[2]: This is only used for debugging.
[3]: These interfaces are reserved for intelligent module in future.
2.3 Circuit Block Diagram
Figure 2-1 shows the circuit block diagram of the ME909u-521 module. The major
functional units of the ME909u-521 module contain the following parts:
Power Management
Baseband Controller
Multi-chip Package (MCP) Memory
RF Circuit
Figure 2-1 Circuit block diagram of the ME909u-521 module

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Overall Description
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2.4 Application Block Diagram
Figure 2-2 Application block diagram of the ME909u-521 module
UART Interface:
The module supports 3 UART interfaces. Two are 4-wire
UARTs. One is 2-wire UART, which is only for debugging.
USB Interface:
The USB interface supports USB 2.0 high speed standard.
USIM Interface:
The USIM interface provides the interface for a USIM card.
External Power
Supply:
DC 3.8 V is recommended.
Audio Interface:
The module supports one PCM interface.
RF Pad:
RF antenna interface.
Tunable ANT
CTRL:
Since LTE bands cover wide frequency, tunable ANT CTRL
helps customers for tunable antenna design. The firmware
with this feature is in plan.
ADC:
Reserved for intelligent module in future.
SPI Interface:
Reserved for intelligent module in future.
SDIO Interface:
Reserved for intelligent module in future.
HSIC Interface:
Reserved for intelligent module in future.
I2C Interface:
Reserved for intelligent module in future.

HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
Description of the Application Interfaces
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3 Description of the Application Interfaces
3.1 About This Chapter
This chapter mainly describes the external application interfaces of the ME909u-521
module, including:
LGA Interface
Power Interface
Signal Control Interface
UART Interface
USB Interface
USIM Card Interface
Audio Interface
General Purpose I/O Interface
JTAG Interface
RF Antenna Interface
Reserved Interface
NC Interface
Tunable Antenna Control
3.2 LGA Interface
The ME909u-521 module uses a 145-pin LGA as its external interface. For details
about the module and dimensions, see 6.4 Dimensions and Interfaces.

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Hardware Guide
Description of the Application Interfaces
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Figure 3-1 shows the sequence of pins on the 145-pin signal interface of the
ME909u-521 module.
Figure 3-1 Sequence of LGAinterface (Top view)
Figure 3-2 shows the appearance of ME909u-521 module. The left one is top view,
and the right one is bottom view.

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Description of the Application Interfaces
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Figure 3-2 Appearance of ME909u-521 module (without label)
Table 3-1 shows the definitions of pins on the 145-pin signal interface of the
ME909u-521 module.
Table 3-1 Definitions of pins on the LGAinterface
Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
1
UART1_TX
O
UART1 transmit
output
VOH
1.35
1.8
1.8
-
VOL
0
-
0.45
-
2
UART1_RTS
O
UART1 Ready for
receive
VOH
1.35
1.8
1.8
-
VOL
0
-
0.45
-
3
UART1_CTS
I
UART1 Clear to
Send
VIH
1.17
1.8
2.1
-
VIL
–0.3
-
0.63
-
4
UART1_RX
I
UART1 receive
data input
VIH
1.17
1.8
2.1
-
VIL
–0.3
-
0.63
-
5
PCM_SYNC
O
PCM interface sync
VOH
1.35
1.8
1.8
-
VOL
0
-
0.45
-
6
PCM_DIN
I
PCM interface data
in
VIH
1.17
1.8
2.1
-
VIL
–0.3
-
0.63
-
7
PCM_DOUT
O
PCM interface data
out
VOH
1.35
1.8
1.8
-
VOL
0
-
0.45
-
8
PCM_CLK
O
PCM interface
clock
VOH
1.35
1.8
1.8
-
VOL
0
-
0.45
-

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Description of the Application Interfaces
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Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
9
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
10
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
11
WAKEUP_IN
I
Host to set the
module into sleep
or wake up the
module from sleep.
VIH
1.17
1.8
2.1
-
VIL
–0.3
-
0.63
-
12
VBAT
PI
Power supply input
-
3.3
3.8
4.2
-
13
VBAT
PI
Power supply input
-
3.3
3.8
4.2
-
14
PS_HOLD
I
Power supply hold
signal to PMU,
used for JTAG
VIH
1.17
1.8
2.1
-
VIL
–0.3
-
0.63
-
15
SLEEP_STAT
US
O
Indicates sleep
status of
ME909u-521
module
VOH
1.35
1.8
1.8
-
VOL
0
-
0.45
-
16
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
17
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
18
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
19
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
20
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
21
ANT_TUNE0
O
Tunable antenna
control signal, bit 0
VOH
1.35
1.8
1.8
-
VOL
0
-
0.45
-
22
ANT_TUNE1
O
Tunable antenna
control signal, bit 1
VOH
1.35
1.8
1.85
-
VOL
0
-
0.45
-
23
ANT_TUNE2
O
Tunable antenna
control signal, bit 2
VOH
1.35
1.8
1.8
-
VOL
0
-
0.45
-
24
ANT_TUNE3
O
Tunable antenna
control signal, bit 3
VOH
1.35
1.8
1.8
-
VOL
0
-
0.45
-

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Description of the Application Interfaces
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Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
25
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
26
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
27
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
28
UART2_TX
O
UART2 transmit
output
VOH
1.35
1.8
1.8
-
VOL
0
-
0.45
-
29
UART2_RX
I
UART2 receive
data input
VIH
1.17
1.8
2.1
-
VIL
–0.3
-
0.63
-
30
JTAG_TMS
I
JTAG test mode
select
VIH
1.17
1.8
2.1
-
VIL
–0.3
-
0.63
-
31
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
32
VCC_EXT1
PO
1.8 V POWER
output
-
1.75
1.8
1.85
-
33
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
34
USIM_VCC
P
Output power
supply for USIM
card
-
-
1.8/2.8
5
-
-
35
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
36
JTAG_TRST_
N
I
JTAG reset
VIH
1.17
1.8
2.1
-
VIL
–0.3
-
0.63
-
37
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
38
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
39
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-

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Hardware Guide
Description of the Application Interfaces
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Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
40
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
41
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
42
JTAG_TCK
I
JTAG clock input
VIH
1.17
1.8
2.1
-
VIL
–0.3
-
0.63
-
43
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
44
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
45
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
46
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
47
JTAG_SRST_
N
I
JTAG reset for
debugging
VIH
1.17
1.8
2.1
-
VIL
–0.3
-
0.63
-
48
GND
-
Ground
-
-
-
-
-
49
GND
-
Ground
-
-
-
-
-
50
GND
-
Ground
-
-
-
-
-
51
GPIO
I/O
General Purpose
I/O pins. The
function of these
pins has not been
defined.
VOH
1.35
1.8
1.8
-
VOL
0
-
0.45
-
VIH
1.17
1.8
2.1
-
VIL
–0.3
-
0.63
-
52
GND
-
Ground
-
-
-
-
-
53
GND
-
Ground
-
-
-
-
-
54
GND
-
Ground
-
-
-
-
-
55
GPIO
I/O
General Purpose
I/O pins. The
function of these
pins has not been
defined.
VOH
1.35
1.8
1.8
-
VOL
0
-
0.45
-
VIH
1.17
1.8
2.1
-
VIL
–0.3
-
0.63
-
56
GND
-
Ground
-
-
-
-
-

HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
Description of the Application Interfaces
Issue 05 (2017-12-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
19
Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
57
GND
-
Ground
-
-
-
-
-
58
GND
-
Ground
-
-
-
-
-
59
GND
-
Ground
-
-
-
-
-
60
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
61
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
62
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
63
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
64
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
65
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
66
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
67
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
68
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
69
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
70
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
71
WAKEUP_OU
T
O
Module to wake up
the host
VOH
1.35
1.8
1.8
-
VOL
0
-
0.45
-
72
JTAG_TDO
O
JTAG test data
output
VOH
1.35
1.8
1.8
-
VOL
0
-
0.45
-
73
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
74
UART0_RTS
O
UART0 Ready for
receive
VOH
1.35
1.8
1.8
-
VOL
0
-
0.45
-
75
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-

HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
Description of the Application Interfaces
Issue 05 (2017-12-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
20
Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
76
UART0_TX
O
UART0 transmit
output
VOH
1.35
1.8
1.8
-
VOL
0
-
0.45
-
77
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
78
UART0_RX
I
UART0 receive
data input
VIH
1.17
1.8
2.1
-
VIL
–0.3
-
0.63
79
Reserved
-
Reserved, must
keep this pin open
-
-
-
-
-
80
UART0_CTS
I
UART0 Clear to
Send
VIH
1.17
1.8
2.1
-
VIL
–0.3
-
0.63
-
81
POWER_ON_
OFF
I
System power-on
or power-off, pulled
up in module. Do
not pull up it any
more on the
customer board.
-
-
1.8
-
-
82
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
83
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
84
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
85
USB_DM
I/O
USB Data- defined
in the USB 2.0
Specification
-
-
-
-
-
86
USB_DP
I/O
USB Data+ defined
in the USB 2.0
Specification
-
-
-
-
-
87
JTAG_TDI
I
JTAG test data
input
VIH
1.17
1.8
2.1
-
VIL
–0.3
-
0.63
-
88
USIM_RESET
O
USIM reset
-
-
1.8/2.8
5
-
-
89
USIM_DATA
I/O
USIM data
-
-
1.8/2.8
5
-
-