Huawei ME909u-521 Installation instructions

HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
Issue
05
Date
2017-12-15

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HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
About This Document
Issue 05 (2017-12-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
3
About This Document
Revision History
Document
Version
Date
Chapter
Descriptions
01
2013-07-12
Creation
02
2014-01-20
All
Deleted the description related to
ME909u-121 and ME909u-721 in issue 01
3.4.2
Updated Figure 3-4 power on timing
sequence
3.6
Updated Figure 3-14 recommended circuit
of USB interface and its notes
3.11
Updated RF antenna interface
4.4.1
Added Table 4-3 ME909u-521 module GPS
main characteristics
5.4.2
Updated power consumption
5.5
Updated reliability features
5.6
Updated EMC and ESD features
6.7.3
Added heat dissipation solution
9
Updated circuit of typical interface
03
2015-04-25
2.2
Updated Function Overview
3
Updated definitions of pins
3.3.2
Updated recommended manufacturer of
EMI ferrite bead
3.4.5
Updated description of WAKEUP_OUT
signal
4.4.2
Updated Table 4-4 ME909u-521 conducted
Tx power
4.6
Added Co-exsitence with 5 GHz WIFI
Design Guide

HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
About This Document
Issue 05 (2017-12-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
4
Document
Version
Date
Chapter
Descriptions
5.4
Deleted electrical features of USIM of issue
02
5.4.2
Updated Table 5-5 Averaged power off DC
power consumption of ME909u-521
5.5
Deleted electrical features of application
interfaces of issue 02
6.5
Updated packaging of ME909u-521 module
6.6
Updated label of ME909u-521 module
6.7.2
Deleted Figure 6-4 thermal pads design of
issue 02
6.8
Added Thermal Design Solution
04
2017-06-28
6.6
Updated label of ME909u-521 module
8.13
Deleted section 8.13 Regulatory
Information in Issue 03
8.13
Added section 8.13 EU Regulatory
Conformance
05
2017-12-15
Deleted Privacy Policy
Added Software Update

HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
Contents
Issue 05 (2017-12-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
5
Contents
1 Introduction....................................................................................................................................8
2 Overall Description ......................................................................................................................9
2.1 About This Chapter........................................................................................................................... 9
2.2 Function Overview............................................................................................................................ 9
2.3 Circuit Block Diagram......................................................................................................................11
2.4 Application Block Diagram ............................................................................................................. 12
3 Description of the Application Interfaces..............................................................................13
3.1 About This Chapter......................................................................................................................... 13
3.2 LGA Interface ................................................................................................................................. 13
3.3 Power Interface.............................................................................................................................. 25
3.3.1 Overview................................................................................................................................ 25
3.3.2 Power Supply VBAT Interface............................................................................................... 25
3.3.3 Output Power Supply Interface ............................................................................................. 26
3.4 Signal Control Interface.................................................................................................................. 27
3.4.1 Overview................................................................................................................................ 27
3.4.2 Power-on/off (POWER_ON_OFF) Pin .................................................................................. 28
3.4.3 RESIN_N Pin......................................................................................................................... 29
3.4.4 WAKEUP_IN Signal............................................................................................................... 31
3.4.5 WAKEUP_OUT Signal........................................................................................................... 31
3.4.6 SLEEP_STATUS Signal ........................................................................................................ 32
3.4.7 LED_MODE Signal................................................................................................................ 33
3.5 UART Interface............................................................................................................................... 34
3.5.1 Overview................................................................................................................................ 34
3.5.2 Circuit Recommended for the UART Interface...................................................................... 35
3.6 USB Interface................................................................................................................................. 35
3.7 USIM Card Interface ...................................................................................................................... 37
3.7.1 Overview................................................................................................................................ 37
3.7.2 Circuit Recommended for the USIM Card Interface.............................................................. 38
3.8 Audio Interface ............................................................................................................................... 39
3.9 General Purpose I/O Interface....................................................................................................... 40
3.10 JTAG Interface ............................................................................................................................. 41
3.11 RF Antenna Interface.................................................................................................................... 42

HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
Contents
Issue 05 (2017-12-15)
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3.12 Reserved Interface....................................................................................................................... 46
3.13 NC Interface................................................................................................................................. 46
3.14 Tunable Antenna Control.............................................................................................................. 47
4 RF Specifications.........................................................................................................................48
4.1 About This Chapter......................................................................................................................... 48
4.2 Operating Frequencies................................................................................................................... 48
4.3 Conducted RF Measurement......................................................................................................... 49
4.3.1 Test Environment................................................................................................................... 49
4.3.2 Test Standards....................................................................................................................... 49
4.4 Conducted Rx Sensitivity and Tx Power........................................................................................ 49
4.4.1 Conducted Receive Sensitivity.............................................................................................. 49
4.4.2 Conducted Transmit Power................................................................................................... 50
4.5 Antenna Design Requirements ...................................................................................................... 51
4.5.1 Antenna Design Indicators..................................................................................................... 51
4.5.2 Interference ........................................................................................................................... 54
4.5.3 Antenna Requirements.......................................................................................................... 54
4.6 Co-exsitence with 5 GHz WIFI Design Guide................................................................................ 55
4.6.1 Purpose ................................................................................................................................. 55
4.6.2 Co-exsitence Design Main Point ........................................................................................... 55
5 Electrical and Reliability Features...........................................................................................58
5.1 About This Chapter......................................................................................................................... 58
5.2 Absolute Ratings ............................................................................................................................ 58
5.3 Operating and Storage Temperatures............................................................................................ 59
5.4 Power Supply Features.................................................................................................................. 59
5.4.1 Input Power Supply ............................................................................................................... 59
5.4.2 Power Consumption.............................................................................................................. 60
5.5 Reliability Features......................................................................................................................... 65
5.6 EMC and ESD Features................................................................................................................. 68
6 Mechanical Specifications.........................................................................................................70
6.1 About This Chapter......................................................................................................................... 70
6.2 Storage Requirement ..................................................................................................................... 70
6.3 Moisture Sensitivity ........................................................................................................................ 70
6.4 Dimensions and Interfaces............................................................................................................. 71
6.5 Packaging....................................................................................................................................... 72
6.6 Label............................................................................................................................................... 73
6.7 Customer PCB Design................................................................................................................... 73
6.7.1 PCB Surface Finish............................................................................................................... 73
6.7.2 PCB Pad Design.................................................................................................................... 73
6.7.3 Solder Mask........................................................................................................................... 74
6.7.4 Requirements on PCB Layout............................................................................................... 74
6.8 Thermal Design Solution................................................................................................................ 75

HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
Contents
Issue 05 (2017-12-15)
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Copyright © Huawei Technologies Co., Ltd.
7
6.9 Assembly Processes...................................................................................................................... 77
6.9.1 General Description of Assembly Processes ........................................................................ 77
6.9.2 Stencil Design........................................................................................................................ 77
6.9.3 Reflow Profile ........................................................................................................................ 78
6.10 Specification of Rework................................................................................................................ 79
6.10.1 Process of Rework .............................................................................................................. 79
6.10.2 Preparations of Rework....................................................................................................... 79
6.10.3 Removing of the Module ..................................................................................................... 79
6.10.4 Welding Area Treatment...................................................................................................... 80
6.10.5 Module Installation............................................................................................................... 80
6.10.6 Specifications of Rework ..................................................................................................... 81
7 Certifications................................................................................................................................82
7.1 About This Chapter......................................................................................................................... 82
7.2 Certifications................................................................................................................................... 82
8 Safety Information......................................................................................................................83
8.1 Interference .................................................................................................................................... 83
8.2 Medical Device............................................................................................................................... 83
8.3 Area with Inflammables and Explosives......................................................................................... 83
8.4 Traffic Security................................................................................................................................ 84
8.5 Airline Security................................................................................................................................ 84
8.6 Safety of Children........................................................................................................................... 84
8.7 Environment Protection.................................................................................................................. 84
8.8 WEEE Approval.............................................................................................................................. 84
8.9 RoHS Approval............................................................................................................................... 84
8.10 Laws and Regulations Observance ............................................................................................. 85
8.11 Care and Maintenance................................................................................................................. 85
8.12 Emergency Call............................................................................................................................ 85
8.13 EU Regulatory Conformance....................................................................................................... 85
9 Appendix A Circuit of Typical Interface................................................................................87
10 Appendix B Acronyms and Abbreviations..........................................................................88

HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
Introduction
Issue 05 (2017-12-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
8
1 Introduction
This document describes the hardware application interfaces and air interfaces
provided by HUAWEI ME909u-521 LTE LGAmodule.
This document helps hardware engineer to understand the interface specifications,
electrical features and related product information of the ME909u-521 module.
If customers want to design a board which is compatible between ME909u-521
module and other 30 mm x30 mm LGA modules, such as MU609, please refer to
HUAWEI 30 mm x 30 mm LGA Module Hardware Migration Guide. There are some
important information to help you make the correct design.

HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
Overall Description
Issue 05 (2017-12-15)
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Copyright © Huawei Technologies Co., Ltd.
9
2 Overall Description
2.1 About This Chapter
This chapter gives a general description of the ME909u-521 module and provides:
Function Overview
Circuit Block Diagram
Application Block Diagram
2.2 Function Overview
Table 2-1 ME909u-521 module features
Feature
Description
Physical
Dimensions
Dimensions (L ×W ×H): 30 mm ×30 mm ×2.35 mm
Weight: about 5 g
Operating
Bands
LTE: FDD Band 1, Band 2, Band 3, Band 5, Band 7, Band 8,
Band 20, all bands with diversity
WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 2, Band 5,
Band 8, all bands with diversity
GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz
GPS/GLONASS: L1
Operating
Temperature
Normal operating temperature: –20°C to +70°C
Extended operating temperature[1]: –30°C to +75°C
Storage
Temperature
–40°C to +85°C
Power
Voltage
DC 3.3 V to 4.2 V (typical value is 3.8 V)
AT
Commands
See the HUAWEI ME909u-521 LTE LGA Module AT Command
Interface Specification.

HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
Overall Description
Issue 05 (2017-12-15)
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Feature
Description
Application
Interface
(145-pin LGA
interface)
One standard USIM (Class B and Class C) interface
Audio interface: PCM interface
USB 2.0 (High Speed)
4-wire UART x 2
2-wire UART[2] x 1
GPIO (General-Purpose I/O) x 5
Power on/off pin
Hardware reset pin
Sleep indicator pin (SLEEP_STATUS)
Tunable Antenna control (4 GPIOs) (the firmware with this feature
is in plan.)
HSIC interface[3]
SDIO interface[3]
SPI interface[3]
I2C interface[3]
JTAG (Joint Test Action Group)
Antenna interface (MAIN/AUX/GPS)
ADC[3] x 2
Power supply
Antenna
interface
WWAN primary antenna pad x 1
WWAN secondary antenna pad x 1
GPS antenna pad x 1
Data Services
GPRS: DL 85.6 kbit/s; UL 85.6 kbit/s
EDGE: DL 236.8 kbit/s; UL 236.8 kbit/s
WCDMA CS: DL 64 kbit/s; UL 64 kbit/s
WCDMA PS: DL 384 kbit/s; UL 384 kbit/s
HSPA+: DL 21.6 Mbit/s; UL 5.76 Mbit/s
DC-HSPA+: DL 43.2 Mbit/s; UL 5.76 Mbit/s
LTE FDD: DL 100 Mbit/s; UL 50 Mbit/s @20M BW cat3