Huawei ME906s LTE M.2 Installation instructions

HUAWEI ME906s LTE M.2 Module
Hardware Guide
Issue
05
Date
2019-03-25

Copyright © Huawei Technologies Co., Ltd. 2019. All rights reserved.
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, , and are trademarks or registered trademarks of Huawei Technologies Co., Ltd.
LTE is a trade mark of ETSI.
Other trademarks, product, service and company names mentioned may be the property of their respective
owners.
Notice
Some features of the product and its accessories described herein rely on the software installed, capacities
and settings of local network, and therefore may not be activated or may be limited by local network operators
or network service providers.
Thus, the descriptions herein may not exactly match the product or its accessories which you purchase.
Huawei reserves the right to change or modify any information or specifications contained in this manual
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HUAWEI ME906s LTE M.2 Module
Hardware Guide
About This Document
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3
About This Document
Revision History
DocumentVer
sion
Date
Chapter
Descriptions
01
2015-06-10
Creation
02
2015-07-23
2.2
Updated dimensions in Table 2-1
Features
3.4.2
Updated the maximum value of the pull-
up resistor
4.3.1
Updated the test instrument
4.4.2
Updated Table 4-4 Conducted Tx power
5.4.1
Updated Table 5-4 Requirements for
input current
5.5
Updated test duration of temperature
cycle in Table 5-10 Test conditions and
results of the reliability
6.2
Updated the dimensions
03
2017-06-23
9.13.1
Updated section 9.13.1 EU
Regulatory Conformance
04
2017-12-11
Deleted privacy policy
05
2019-03-25
4.4.2
Updated Table 4-4 Conducted Tx
power
5.4.2
Updated Table Table 5-6 Averaged
standby DC power consumption
(WCDMA/HSDPA/LTE/GSM) and
Table 5-7 Averaged Data
Transmission DC power
consumption (WCDMA/HSDPA/LTE)
and Table 5-8 Averaged DC power
consumption (GSM/GPRS/EDGE)
8
Updated Table 8-1 Product
certifications

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Contents
1 Introduction....................................................................................................................................7
2 Overall Description ......................................................................................................................8
2.1 About This Chapter........................................................................................................................... 8
2.2 Function Overview............................................................................................................................ 8
2.3 Circuit Block Diagram....................................................................................................................... 9
3 Description of the Application Interfaces..............................................................................11
3.1 About This Chapter..........................................................................................................................11
3.2 75-pin Gold Finger...........................................................................................................................11
3.3 Power Interface.............................................................................................................................. 19
3.3.1 Overview................................................................................................................................ 19
3.3.2 Power Supply 3.3V Interface................................................................................................. 19
3.3.3 USIM Power Output USIM_PWR.......................................................................................... 21
3.4 Signal Control Interface.................................................................................................................. 21
3.4.1 Overview................................................................................................................................ 21
3.4.2 Power_On_Off Control Pin.................................................................................................... 23
3.4.3 RESET# Pin .......................................................................................................................... 28
3.4.4 LED# Pin ............................................................................................................................... 30
3.4.5 W_DISABLE# Pin.................................................................................................................. 30
3.4.6 GPS_DISABLE# Pin.............................................................................................................. 31
3.4.7 Wake_On_WWAN# Pin......................................................................................................... 32
3.4.8 BodySAR_N Pin .................................................................................................................... 32
3.4.9 USIM_DET Pin ...................................................................................................................... 33
3.5 USB Interface................................................................................................................................. 35
3.6 USIM Card Interface ...................................................................................................................... 36
3.6.1 Overview................................................................................................................................ 36
3.6.2 Circuit Recommended for the USIM Card Interface.............................................................. 37
3.7 Tunable Antenna Control................................................................................................................ 38
3.8 Config Pins..................................................................................................................................... 39
3.9 Reserved Pins................................................................................................................................ 40
3.10 NC Pins ........................................................................................................................................ 41
3.11 RF Antenna Interface.................................................................................................................... 41
3.11.1 RF Connector location......................................................................................................... 41

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3.11.2 Coaxial RF Connector Guidelines ....................................................................................... 42
4 RF Specifications.........................................................................................................................45
4.1 About This Chapter......................................................................................................................... 45
4.2 Operating Frequencies................................................................................................................... 45
4.3 Conducted RF Measurement......................................................................................................... 46
4.3.1 Test Environment................................................................................................................... 46
4.3.2 Test Standards....................................................................................................................... 46
4.4 Conducted Rx Sensitivity and Tx Power........................................................................................ 46
4.4.1 Conducted Receive Sensitivity.............................................................................................. 46
4.4.2 Conducted Transmit Power................................................................................................... 48
4.5 Antenna Design Requirements ...................................................................................................... 49
4.5.1 Antenna Design Indicators..................................................................................................... 49
4.5.2 Interference ........................................................................................................................... 51
4.5.3 Antenna Requirements.......................................................................................................... 51
5 Electrical and Reliability Features...........................................................................................53
5.1 About This Chapter......................................................................................................................... 53
5.2 Absolute Ratings ............................................................................................................................ 53
5.3 Operating and Storage Temperatures............................................................................................ 53
5.4 Power Supply Features.................................................................................................................. 54
5.4.1 Input Power Supply ............................................................................................................... 54
5.4.2 Power Consumption.............................................................................................................. 55
5.5 Reliability Features......................................................................................................................... 60
5.6 EMC and ESD Features................................................................................................................. 63
6 Mechanical Specifications.........................................................................................................65
6.1 About This Chapter......................................................................................................................... 65
6.2 Dimensions..................................................................................................................................... 65
6.3 Packing System.............................................................................................................................. 66
7 Installation....................................................................................................................................67
7.1 About This Chapter......................................................................................................................... 67
7.2 Connect ME906s to board ............................................................................................................. 67
7.3 Thermal Management.................................................................................................................... 68
7.4 Antenna Plug.................................................................................................................................. 68
8 Certifications................................................................................................................................70
9 Safety Information......................................................................................................................71
9.1 Interference .................................................................................................................................... 71
9.2 Medical Device............................................................................................................................... 71
9.3 Area with Inflammables and Explosives......................................................................................... 71
9.4 Traffic Security................................................................................................................................ 72
9.5 Airline Security................................................................................................................................ 72

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9.6 Safety of Children........................................................................................................................... 72
9.7 Environment Protection.................................................................................................................. 72
9.8 WEEE Approval.............................................................................................................................. 72
9.9 RoHS Approval............................................................................................................................... 72
9.10 Laws and Regulations Observance ............................................................................................. 73
9.11 Care and Maintenance................................................................................................................. 73
9.12 Emergency Call............................................................................................................................ 73
9.13 Regulatory Information................................................................................................................. 73
9.13.1 EU Regulatory Conformance .............................................................................................. 73
9.13.2 FCC Statement.................................................................................................................... 74
10 Appendix A Circuit of Typical Interface..............................................................................75
11 Appendix B Acronyms and Abbreviations..........................................................................76

HUAWEI ME906s LTE M.2 Module
Hardware Guide
Introduction
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1 Introduction
This document describes the hardware application interfaces and air interfaces that
are provided when HUAWEI ME906s LTE M.2 Module (hereinafter referred to as the
ME906s module) is used.
M.2 is the new name for NGFF (Next Generation Form Factor), which is the
specification of PCI-SIG (Peripheral Component Interconnect Special Interest
Group).
This document helps you to understand the interface specifications, electrical
features and related product information of the ME906s module.

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Hardware Guide
Overall Description
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2 Overall Description
2.1 About This Chapter
This chapter gives a general description of the ME906s module and provides:
Function Overview
Circuit Block Diagram
2.2 Function Overview
Table 2-1 Features
Feature
Description
Physical
Features
Dimensions (L ×W ×H): 42 mm ×30 mm ×2.22 mm
Weight: about 6 g
Operating
Bands
FDD LTE: Band 1, Band 2, Band 3, Band 5, Band 7, Band 8,
Band 20, Band 28, all bands with diversity
WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 2, Band 5, Band
8, all bands with diversity
GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz
GPS/GLONASS: L1
Operating
Temperature
Normal operating temperature: –10°C to +55°C
Extended operating temperature[1]: –20°C to +70°C
Storage
Temperature
–40°C to +85°C
Power Voltage
3.135 V to 4.4 V (3.3 V is typical)
Application
Interface (75-
pin Gold
Finger)
USIM (3.0 V or 1.8 V)
USIM_DET pin (USIM Hot Swap Detection)
USB 2.0 (High-Speed)

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Overall Description
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Feature
Description
Power_On_Off pin
RESET# pin
LED# pin
W_DISABLE# pin
GPS_DISABLE# pin
Tunable Antenna control (4 GPIOs)
Wake_On_WWAN# pin
BodySAR_N pin
Power supply (5 pins)
Antenna
Connectors
MAIN and AUX (supports Diversity and GPS simultaneously)
SMS
Supports MO and MT
Supports formats of PDU
Point-to-point and cell broadcast
Data Services
GPRS: DL 85.6 kbit/s; UL 85.6 kbit/s
EDGE: DL 236.8 kbit/s; UL 236.8 kbit/s
WCDMA CS: DL 64 kbit/s; UL 64 kbit/s
WCDMA PS: DL 384 kbit/s; UL 384 kbit/s
HSPA+: DL 21.6 Mbit/s; UL 5.76 Mbit/s
DC-HSPA+: DL 42 Mbit/s; UL 5.76 Mbit/s
LTE FDD: DL 150 Mbit/s; UL 50 Mbit/s @20M BW cat3
Operating
System
Windows 7/8/8.1/10, Android 4.0 or later
[1]: When the ME906s module works at –20°C to –10°C or +55°C to +70°C , NOT all its RF
specifications comply with the 3GPP specifications.
2.3 Circuit Block Diagram
The ME906s module is developed based on Huawei's Balong Hi6921M platform.
Figure 2-1 shows the circuit block diagram of the ME906s module. The application
block diagram and major functional units of the ME906s module contain the following
parts:
Baseband controller

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Power manager
Nand Flash
Radio Frequency (RF) transceiver
RF Front End
Figure 2-1 Circuit block diagram

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Hardware Guide
Description of the Application Interfaces
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3 Description of the Application Interfaces
3.1 About This Chapter
This chapter mainly describes the application interfaces of the ME906s module,
including:
75-pin Gold Finger
Power Interface
Signal Control Interface
USB Interface
USIM Card Interface
Tunable Antenna Control
Config Pins
Reserved Pins
NC Pins
RFAntenna Interface
3.2 75-pin Gold Finger
The ME906s module uses a 75-pin Gold Finger as its external interface. For details
about the module dimensions, see 6.2 Dimensions.
Figure 3-1 shows the sequence of pins on the 75-pin signal interface of the ME906s
module.

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Hardware Guide
Description of the Application Interfaces
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Figure 3-1 TOPviewof gold finger interface pins
Table 3-1 shows the definitions of the 75-pin interface (67 for signals and 8 for notch)
of the ME906s module.
As M.2 Nomenclature, ME906s is Type 3042-S3-B (30 mm ×42 mm, Max.
Component Height on Top is 1.5 mm and single-sided, Key ID is B).

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Hardware Guide
Description of the Application Interfaces
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Table 3-1 Definitions of pins on the M.2 interface
Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
1
CONFIG_3
O
Connected to Ground
internally.
-
-
0
-
The
module is
configured
as WWAN-
SSIC 0.
2
3.3V
PI
Power supply
-
3.135
3.3
4.4
-
3
Ground
PI
Ground
-
-
0
-
-
4
3.3V
PI
Power supply
-
3.135
3.3
4.4
-
5
Ground
PI
Ground
-
-
0
-
-
6
Power_On_Off
I
A single control to turn
On/Off WWAN.
When it is Low, WWAN is
powered off.
When it is High, WWAN is
powered on.
It is internally pulled to
Low.
It is 3.3 V tolerant but can
be driven by either 1.8 V or
3.3 V GPIO.
VIH
1.26
-
3.6
The
module is
pulled
down
inside by a
1 MΩ
resistor.
VIL
–0.3
-
0.3
7
USB_D+
I/O
USB Data + defined in the
USB 2.0 specification
-
-
-
-
-
8
W_DISABLE#
I
WWAN disable function
When it is High, WWAN
function is determined by
software AT command.
Default enabled.
When it is Low, WWAN
function will be turned off.
VIH
1.26
-
3.6
-
VIL
–0.3
-
0.3
9
USB_D-
I/O
USB Data - defined in the
USB 2.0 specification
-
-
-
-
-
10
LED#
O
It is an open drain, active
low signal, used to allow
the M.2 card to provide
status indicators via LED
devices that will be
provided by the host.
VOL
0
-
0.48
The
maximum
IOL is 40
mA.
11
Ground
PI
Ground
-
-
0
-
-
12
Notch
-
-
-
-
-
-
-
13
Notch
-
-
-
-
-
-
-

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Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
14
Notch
-
-
-
-
-
-
-
15
Notch
-
-
-
-
-
-
-
16
Notch
-
-
-
-
-
-
-
17
Notch
-
-
-
-
-
-
-
18
Notch
-
-
-
-
-
-
-
19
Notch
-
-
-
-
-
-
-
20
Reserved
-
Reserved for future use,
please keep it not
connected in the host side.
-
-
-
-
-
21
CONFIG_0
O
Not Connected internally.
-
-
-
-
The
module is
configured
as WWAN-
SSIC 0.
22
Reserved
-
Reserved for future use,
please keep it not
connected in the host side.
-
-
-
-
-
23
Wake_On_W
WAN#
O
It is open drain and active
low.
WWAN to wake up the
host.
VOL
0
-
0.48
The
maximum
IOL is 40
mA.
24
Reserved
-
Reserved for future use,
please keep it not
connected in the host side.
-
-
-
-
-
25
BodySAR_N
I
Hardware pin for BodySAR
detection.
When it is High, No TX
power backoff (default).
When it is Low, TX power
backoff.
VIH
1.26
-
3.6
-
VIL
–0.3
-
0.3
26
GPS_DISABL
E#
I
GPS disable function
When it is High, GPS
function is determined by
software AT command.
When it is Low, GPS is
turned off.
VIH
1.26
-
3.6
-
VIL
–0.3
-
0.3
27
Ground
PI
Ground
-
-
0
-
-
28
Reserved
-
Reserved for future use,
please keep it not
connected in the host side.
-
-
-
-
-

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Description of the Application Interfaces
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Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
29
NC
-
Not Connected
-
-
-
-
-
30
USIM_RESET
O
USIM Reset
VOH
0.7 x
USIM
_PW
R
-
3.3
USIM_PW
R=1.8 V or
3.0 V
VOL
0
-
0.2 x
USIM
_PW
R
31
NC
-
Not Connected
-
-
-
-
-
32
USIM_CLK
O
USIM Clock
VOH
0.7 x
USIM
_PW
R
-
3.3
USIM_P
WR=1.8 V
or 3.0 V
VOL
0
-
0.2 x
USIM
_PW
R
33
Ground
PI
Ground
-
-
0
-
-
34
USIM_DATA
I/O
USIM DATA
VOH
0.7 x
USIM
_PW
R
-
3.3
USIM_PW
R=1.8 V or
3.0 V
VOL
0
-
0.2 x
USIM
_PW
R
VIH
0.7 x
USIM
_PW
R
-
3.3
VIL
0
-
0.2 x
USIM
_PW
R
35
NC
-
Not Connected
-
-
-
-
-
36
USIM_PWR
PO
USIM POWER
-
1.75
1.8
1.98
USIM_PW
R=1.8 V
-
2.75
3
3.3
USIM_PW
R=3.0 V
37
NC
-
Not Connected
-
-
-
-
-

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Description of the Application Interfaces
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Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
38
NC
-
Not Connected
-
-
-
-
-
39
Ground
PI
Ground
-
-
0
-
-
40
I2C_SCL
I/O
I2C clock, slave.
VIH
1.26
1.8
2.1
The
current
firmware
does not
support
this
function.
VIL
–0.3
-
0.63
41
NC
-
Not Connected
-
-
-
-
-
42
I2C_SDA
I/O
I2C data, slave.
VOH
1.35
1.8
-
The
current
firmware
does not
support
this
function.
VOL
0
-
0.45
VIH
1.26
1.8
2.1
VIL
–0.3
-
0.63
43
NC
-
Not Connected
-
-
-
-
-
44
I2C_IRQ
I
Interrupt signal to wake up
the module.
VIH
1.26
1.8
2.1
The
current
firmware
does not
support
this
function.
VIL
–0.3
-
0.63
45
Ground
PI
Ground
-
-
0
-
-
46
SYSCLK
O
System clock output for
external GNSS module.
VOH
1.6
1.8
-
The
current
firmware
does not
support
this
function.
VOL
0
-
0.45
47
NC
-
Not Connected
-
-
-
-
-
48
TX_BLANKIN
G
O
TX blanking signal for
external GNSS module.
VOH
1.6
1.8
-
The
current
firmware
does not
support
this
function.
VOL
0
-
0.45
49
NC
-
Not Connected
-
-
-
-
-
50
NC
-
Not Connected
-
-
-
-
-

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Description of the Application Interfaces
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Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
51
Ground
PI
Ground
-
-
0
-
-
52
NC
-
Not Connected
-
-
-
-
-
53
NC
-
Not Connected
-
-
-
-
-
54
NC
-
Not Connected
-
-
-
-
-
55
NC
-
Not Connected
-
-
-
-
-
56
NC
-
Not Connected
-
-
-
-
-
57
Ground
PI
Ground
-
-
0
-
-
58
NC
-
Not Connected
-
-
-
-
-
59
ANTCTL0
O
Tunable antenna control
signal, bit 0.
It is a push-pull type GPIO.
VOH
1.37
1.8
2.1
-
VOL
0
-
0.45
-
60
COEX3
I/O
For coexistence.
VOH
1.35
1.8
1.9
The
current
firmware
does not
support
this
function.
VOL
0
-
0.45
VIH
1.26
1.8
2.1
VIL
–0.3
-
0.63
61
ANTCTL1
O
Tunable antenna control
signal, bit 1.
It is a push-pull type GPIO.
VOH
1.37
1.8
2.1
-
VOL
0
-
0.45
-
62
COEX_UART_
RXD
I/O
UART transmit signal from
other wireless coexistence
solution to the module.
VOH
1.35
1.8
1.9
-
VOL
0
-
0.45
-
VIH
1.26
1.8
2.1
-
VIL
–0.3
-
0.63
-
63
ANTCTL2
O
Tunable antenna control
signal, bit 2.
It is a push-pull type GPIO.
VOH
1.37
1.8
2.1
-
VOL
0
-
0.45
-
64
COEX_UART_
TXD
I/O
UART transmit signal from
the module to other
wireless coexistence
solution.
VOH
1.35
1.8
1.9
-
VOL
0
-
0.45
-
VIH
1.26
1.8
2.1
-
VIL
–0.3
-
0.63
-
65
ANTCTL3
O
Tunable antenna control
signal, bit 3.
It is a push-pull type GPIO.
VOH
1.37
1.8
2.1
-
VOL
0
-
0.45
-

HUAWEI ME906s LTE M.2 Module
Hardware Guide
Description of the Application Interfaces
Issue 05 (2019-03-25)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
18
Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
66
USIM_DET
I
USIM hot swap detection
pin.
Rising edge for insertion;
falling edge for removal.
When it is High, USIM is
present.
When it is Low, USIM is
absent.
VIH
1.26
1.8
2.1
The
module is
pulled up
inside.
VIL
–0.3
-
0.3
67
RESET#
I
System reset, active low.
VIH
1.26
-
2.1
The
module is
pulled up
inside.
VIL
–0.3
-
0.3
68
NC
-
Not Connected
-
-
-
-
-
69
CONFIG_1
O
Connected to Ground
internally.
-
-
0
-
The
module is
configured
as WWAN-
SSIC 0.
70
3.3V
PI
Power supply
-
3.135
3.3
4.4
-
71
Ground
PI
Ground
-
-
0
-
-
72
3.3V
PI
Power supply
-
3.135
3.3
4.4
-
73
Ground
PI
Ground
-
-
0
-
-
74
3.3V
PI
Power supply
-
3.135
3.3
4.4
-
75
CONFIG_2
O
Connected to Ground
internally.
-
-
0
-
The
module is
configured
as WWAN-
SSIC 0.
Iindicates pins for digital signal input; Oindicates pins for digital signal output; PI indicates
power input pins; PO indicates power output pins.
VIL: Low-level Input voltage; VIH: High-level Input voltage; VOL: Low-level Output voltage; VOH:
High-level Output voltage.
The NC pins are not connected, therefore, before you deal with these pins, please refer to
the corresponding hardware guide.
The Reserved pins are internally connected to the module. Therefore, these pins should
not be used, otherwise they may cause problems. Please contact with us for more details
about this information.

HUAWEI ME906s LTE M.2 Module
Hardware Guide
Description of the Application Interfaces
Issue 05 (2019-03-25)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
19
3.3 Power Interface
3.3.1 Overview
The power supply part of the ME906s module contains:
3.3V pin for the power supply
USIM_PWR pin for USIM card power output
Table 3-2 lists the definitions of the pins on the power supply interface.
Table 3-2 Definitions of the pins on the power supply interface
Pin No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
2, 4, 70, 72, 74
3.3V
PI
Power supply
-
3.135
3.3
4.4
-
36
USIM_PWR
PO
USIM POWER
-
1.75
1.8
1.98
USIM_PW
R=1.8 V
-
2.75
3
3.3
USIM_PW
R=3.0 V
3, 5, 11, 27,
33, 39, 45, 51,
57, 71, 73
Ground
PI
Ground
-
-
0
-
-
3.3.2 Power Supply 3.3V Interface
The ME906s module power is supplied through the 3.3V pins and the voltage ranges
from 3.135 V to 4.4 V (typical value is 3.3 V). The ME906s provides 5 power pins and
11 GND pins. To ensure that the ME906s module works normally, all the pins must be
connected. The M.2 connector pin is defined as that should support 500 mA/Pin
continuously.
When the ME906s module works at GSM mode, the module transmits at the
maximum power, the transient peak current may reach 2.5 [email protected] V. In this case, the
power pin voltage will drop. Make sure that the voltage does not drop below 3.135 V
in any case.
The traces of the power supply should be as short and wide as possible. It is
recommended that at least one 220 μF capacitance is added onto the 3.3V power
rails and as close to the M.2 connector as possible. Customers can reduce the
capacitance if it can be guaranteed that the 3.3V pin does not drop below 3.135 V in
any case.
Figure 3-2 shows the recommended power circuit of ME906s module.

HUAWEI ME906s LTE M.2 Module
Hardware Guide
Description of the Application Interfaces
Issue 05 (2019-03-25)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
20
Figure 3-2 Recommended power circuit
3.135 V is the minimum voltage supplied to ME906s by the host, and 3.3V pin must never be
under 3.135 V in any case, which is shown as the following figure.
If the customer wants to power cycle ME906s, the 3.3V pin must stay below 1.8 V for
more than 100 ms. Figure 3-3 shows the power supply timing sequence between
power cycling.
Module
(Modem)
3.3V
+
3.3V
330 pF 100 nF 1 μF 22 μF 220 μF
Time
3.135V
3.3V
4.4V
Voltage
Do not drop below 3.135 V during 2G Tx.
The maximum current may be 2.5 [email protected] V.