Huawei MU709Gs-8 User manual

Copyright © Huawei Technologies Co., Ltd. 2012.
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Some features of the product and its accessories described herein rely on the software
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may not exactly match the product or its accessories you purchase.
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Contents
Getting to Know the MU709...........................................................................................................................1
PCB Design............................................................................................................................................................2
Assembly................................................................................................................................................................3

1
Thank you for purchasing HUAWEI MU709Gs-8 HSPA+ LGA
Module (hereinafter referred to as the MU709)
Note:
This manual briefly describes the preparation, the process for PCB Design, Assembly
and safety precautions.
You are recommended to read the manual before using the MU709.
Getting to Know the MU709
The package of the LGA module is 145 pin LGA with a dimension of 30 mm × 30 mm ×
2.27 mm. It is applied to the user interface board, and can be used as a wireless terminal
in a network environment.

2
PCB Design
PCB Pad Design
To achieve assembly yields and solder joints of high reliability, it is recommended that
the PCB pad size be designed as follows: the sizes of the solder pads on customers'
PCBs are the same as those of the module's solder pads for the high production
efficiency and high reliability of solder joints. For details, see the following figure:

3
Requirements on PCB Layout
To reduce deformation, a thickness of at least 1.0 mm is recommended.
Other devices must be located more than 3 mm (5 mm recommended) away from the
LGA module. The minimum distance between the LGA module and the PCB edge is 0.5
mm.
When the PCB layout is double sided, it is recommended that the LGA module be
placed on the second side for assembly; so as to avoid module dropped from PCB or
component (located in module) re-melding defects caused by uneven weight.
Design of Solder Mask
The PCB pad design can be solder mask defined (SMD), or non-solder mask defined
(NSMD).NSMD is recommended. In addition, the solder mask of the NSMD pad design
is larger than the pad so the reliability of the solder joint can be improved.
The solder mask must be 100 µm to150 µm larger than the pad, that is, the single side
of the solder mask must be 50 µm to 75 µm larger than the pad. The specific size
depends on the processing capability of the PCB manufacturer.
Assembly
Stencil Design
It is recommended that the stencil for the LGA module be 0.15 mm in thickness. For the
stencil design, see the following figure：

4
0.6

5
Reflow Profile
For the soldering temperature of the LGA module, see the following figure.
Reflow profile
Reflow parameters
Temperature Zone
Time
Key Parameter
Preheat zone (40°C–150°C)
60s–120s
Heating rate:
0.5°C/s–2°C/s

6
Soak zone
(150°C–200°C)
(t1–t2): 60s–120s
Heating rate: < 1.0°C/s
Reflow zone (> 217°C)
(t3–t4): 30s–90s
Peak reflow
temperature:
230°C–250°C
Cooling zone
Cooling rate: 1°C/s ≤ Slope ≤ 4°C/s