Huawei Me60 series Guide

HUAWEI ME60 Multiservice Control Gateway

V600R005C00

Hardware Description

Issue 02

Date 2012-11-15

HUAWEI TECHNOLOGIES CO., LTD.

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consent of Huawei Technologies Co., Ltd.

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and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.

All other trademarks and trade names mentioned in this document are the property of their respective holders.

Notice

The purchased products, services and features are stipulated by the contract made between Huawei and the

customer. All or part of the products, services and features described in this document may not be within the

purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information,

and recommendations in this document are provided "AS IS" without warranties, guarantees or representations

of any kind, either express or implied.

The information in this document is subject to change without notice. Every effort has been made in the

preparation of this document to ensure accuracy of the contents, but all statements, information, and

recommendations in this document do not constitute a warranty of any kind, express or implied.

Huawei Technologies Co., Ltd.

Address: Huawei Industrial Base

Bantian, Longgang

Shenzhen 518129

People's Republic of China

Website: http://www.huawei.com

Email: [email protected]

Issue 02 (2012-11-15) Huawei Proprietary and Confidential

About This Document

Purpose

This document describes the contents, related version, intended audience, conventions, and

update history of the HUAWEI ME60 Multiservice Control Gateway Hardware Description.

Related Versions

The following table lists the product versions related to this document.

Product Name Version

HUAWEI ME60 Multiservice

Control Gateway

V600R005C00SPCa00

Intended Audience

The intended audience of this document are:

lCommissioning Engineers

lData Configuration Engineers

lNetwork Monitoring Engineers

lSystem Maintenance Engineers

Symbol Conventions

The symbols used in this document are described in the following table. They are defined as

follows.

Symbol Description

Indicates a hazard with a high level of risk, which if

not avoided, will result in death or serious injury.

HUAWEI ME60 Multiservice Control Gateway

Hardware Description About This Document

Issue 02 (2012-11-15) Huawei Proprietary and Confidential

Symbol Description

Indicates a hazard with a medium or low level of

risk, which if not avoided, could result in minor or

moderate injury.

Indicates a potentially hazardous situation, which if

not avoided, could result in equipment damage, data

loss, performance degradation, or unexpected

results.

Indicates a tip that may help you solve a problem or

save time.

Provides additional information to emphasize or

supplement important points of the main text.

Changes in Issue 02 (2012-11-15)

The second commercial release.

Changes in Issue 01 (2012-08-15)

Initial commercial release. This document has the following updates compare with

V600R003C05:

Change Types Board Name Description

New ME0D00MPUD71 Main Processing Unit D2

New ME0DBSUA1020 8-port OC-3c/STM-1 ATM

SFP interface BSU

New ME0MBSUF2121 Flexible Card Broadband

Service Unit E(BSUF-21-E,2

sub-slots)

New ME0D0EEGFE20 20-Port 1000Base-X-SFP

Broadband Service Unit

Integrated(BSUI-21)

New ME0D0L2XXE20 2-Port 10GBase WAN/LAN-

XFP Broadband Service Unit

Integrated(BSUI-21)

New ME0DEBGE1X20 1-Port 10GBase WAN/LAN-

XFP+10-Port 1000Base-X-

SFP Broadband Service Unit

Integrated(BSUI-21)

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Change Types Board Name Description

New ME0D0EFGFB50 24-Port 100/1000Base-X-

SFP Broadband Service Unit

Integrated(BSUI-22)

New ME0D0L2XXB50 2-Port 10GBase WAN/LAN-

XFP Broadband Service Unit

Integrated(BSUI-22)

New ME0DE1XEBG50 1-Port 10GBase WAN/LAN-

XFP+12-Port 100/1000Base-

X-SFP Broadband Service

Unit Integrated(BSUI-22)

New ME0D0L2XXB70 2-Port 10GBase WAN/LAN-

XFP Multi Service Unit

Integrated(MSUI-21)

New ME0D0EKGFE70 40-Port 100/1000Base-SFP

Broadband Service Unit

Integrated(BSUI-40)

New ME0D0L4XXE70 4-Port 10GBase LAN/WAN-

XFP Broadband Service Unit

Integrated(BSUI-40)

New ME0DL2XEEG7E 2-Port 10GBase LAN/WAN-

XFP+20-Port 100/1000Base-

SFP Broadband Service Unit

Integrated(BSUI-40)

New ME0D0L4XXB50 4-Port 10GBase WAN/LAN-

XFP Broadband Service Unit

Integrated(BSUI-41)

New ME0D0EKGFE50 40-Port 100/1000Base-X-

SFP Broadband Service Unit

Integrated(BSUI-41)

New ME0DL2XEEG50 2-Port 10GBase WAN/LAN-

XFP+20-Port 100/1000Base-

X-SFP Broadband Service

Unit Integrated(BSUI-41)

New ME0D0L4XXB70 4-Port 10GBase LAN/WAN-

XFP Multi Service Unit

Integrated(MSUI-40)

New OSN010002 High Speed

Transceiver,CFP,10*10Gb/s

(1550nm Band),103.125Gb/

s,-2.8dBm~3.5dBm,-8.8dB

m,LC straight,SMF,OMA

Optical Power,10km

HUAWEI ME60 Multiservice Control Gateway

Hardware Description About This Document

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Change Types Board Name Description

New OSN010001 High Speed

Transceiver,CFP,

1295/1300/1304/1309nm,

103.125Gbps,-4.3dBm,

4.5dBm,-8.6dBm,LC,SMF,

10km

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Hardware Description About This Document

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Contents

About This Document.....................................................................................................................ii

1 Product Overview..........................................................................................................................1

1.1 Overview............................................................................................................................................................2

2 ME60-X16 Chassis Overview.......................................................................................................4

2.1 Overview............................................................................................................................................................5

2.1.1 System Overview.......................................................................................................................................5

2.1.2 System Architecture..................................................................................................................................6

2.1.3 System Features.........................................................................................................................................6

2.1.4 Components of the ME60-X16..................................................................................................................7

2.1.5 Slot Layout on the ME60-X16..................................................................................................................8

2.1.6 System Configuration................................................................................................................................9

2.2 Power Supply System.......................................................................................................................................10

2.2.1 Architecture of the Power Supply System...............................................................................................10

2.2.2 Distributed Architecture of the System...................................................................................................10

2.2.3 DC Power Supply System.......................................................................................................................11

2.2.4 AC Power Supply System.......................................................................................................................14

2.3 Heat Dissipation System...................................................................................................................................16

2.3.1 System Air Channel.................................................................................................................................16

2.3.2 Air Intake Vent........................................................................................................................................17

2.3.3 Fan Module..............................................................................................................................................17

2.3.4 Air Filter..................................................................................................................................................19

2.3.5 Fan Speed Adjustment.............................................................................................................................19

2.4 Switching Network...........................................................................................................................................20

2.4.1 Introduction to the Switching Network...................................................................................................20

2.4.2 Switch Fabric Unit B...............................................................................................................................21

2.4.3 40Gbps Switch Fabric Unit B..................................................................................................................23

2.5 Control Plane....................................................................................................................................................24

2.5.1 Introduction to the Control Plane............................................................................................................24

2.5.2 Main Processing Unit B4.........................................................................................................................25

2.6 Physical Specifications.....................................................................................................................................30

2.6.1 Chassis Specifications.............................................................................................................................30

2.6.2 Board Specifications................................................................................................................................32

HUAWEI ME60 Multiservice Control Gateway

Hardware Description Contents

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3 ME60-X8 Chassis Overview.......................................................................................................35

3.1 Overview..........................................................................................................................................................36

3.1.1 System Overview.....................................................................................................................................36

3.1.2 System Architecture................................................................................................................................36

3.1.3 System Features.......................................................................................................................................37

3.1.4 Components of the ME60-X8..................................................................................................................38

3.1.5 Slot Layout on the ME60-X8..................................................................................................................39

3.1.6 System Configuration..............................................................................................................................40

3.2 Power Supply System.......................................................................................................................................41

3.2.1 Architecture of the Power Supply System...............................................................................................41

3.2.2 Distributed Architecture of the System...................................................................................................41

3.2.3 DC Power Supply System.......................................................................................................................42

3.2.4 AC Power Supply System.......................................................................................................................44

3.3 Heat Dissipation System...................................................................................................................................46

3.3.1 System Air Channel.................................................................................................................................46

3.3.2 Air Intake Vent........................................................................................................................................47

3.3.3 Fan Module..............................................................................................................................................47

3.3.4 Air Filter..................................................................................................................................................48

3.3.5 Fan Speed Adjustment.............................................................................................................................48

3.4 Switching Network...........................................................................................................................................49

3.4.1 Introduction to the Switching Network...................................................................................................49

3.4.2 200Gbps Switch Fabric Unit C(SFUI-200-C).........................................................................................50

3.4.3 40Gbps Switch Fabric Unit C..................................................................................................................52

3.5 Control Plane....................................................................................................................................................53

3.5.1 Introduction to the Control Plane............................................................................................................53

3.5.2 Switch and Route Processing Unit A5....................................................................................................54

3.5.3 Switch and Route Processing Unit A4....................................................................................................59

3.6 Physical Specifications.....................................................................................................................................65

3.6.1 Chassis Specification...............................................................................................................................65

3.6.2 Board Specifications................................................................................................................................66

4 ME60-X3 Chassis Overview.......................................................................................................70

4.1 Overview..........................................................................................................................................................71

4.1.1 System Overview.....................................................................................................................................71

4.1.2 System Features.......................................................................................................................................72

4.1.3 Components of the ME60-X3..................................................................................................................72

4.1.4 Slot Layout on the ME60-X3..................................................................................................................74

4.1.5 System Configuration .............................................................................................................................74

4.2 Power Supply System.......................................................................................................................................75

4.2.1 Architecture of the Power Supply System...............................................................................................75

4.2.2 Diagram of the Power Supply System.....................................................................................................75

4.2.3 DC Power Supply System.......................................................................................................................76

4.2.4 AC Power Supply System(EPW30B-48A).............................................................................................77

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4.3 Heat Dissipation System...................................................................................................................................78

4.3.1 System Air Channel.................................................................................................................................78

4.3.2 Air Intake Vent........................................................................................................................................79

4.3.3 Fan Module..............................................................................................................................................80

4.3.4 Air Filter..................................................................................................................................................81

4.3.5 Fan Speed Adjustment.............................................................................................................................81

4.4 Control Plane....................................................................................................................................................82

4.4.1 Introduction to the Control Plane............................................................................................................82

4.4.2 Main Processing Unit D2(ME0D00MPUD71).......................................................................................83

4.5 Physical Specifications.....................................................................................................................................87

4.5.1 Chassis Specifications.............................................................................................................................87

4.5.2 Board Specifications................................................................................................................................88

5 ME60-16 Chassis Overview.......................................................................................................91

5.1 Product Overview.............................................................................................................................................92

5.1.1 Device Structure......................................................................................................................................92

5.1.2 System Configuration..............................................................................................................................95

5.2 Power Supply....................................................................................................................................................95

5.2.1 DC Power Supply Module.......................................................................................................................96

5.2.2 AC Power Supply Module.....................................................................................................................100

5.3 Heat Dissipation System.................................................................................................................................102

5.3.1 Appearance of a Fan Module.................................................................................................................103

5.3.2 Front Panel.............................................................................................................................................104

5.3.3 Air Filter................................................................................................................................................105

5.3.4 Functions of the FCB.............................................................................................................................106

5.3.5 Technical Parameters.............................................................................................................................106

5.4 LCD Module...................................................................................................................................................107

5.4.1 Front Panel.............................................................................................................................................107

5.4.2 Display Mode........................................................................................................................................108

5.4.3 Display Contents....................................................................................................................................109

5.4.4 Technical Parameters.............................................................................................................................115

5.5 SFU(ME0D00SFUG20).................................................................................................................................116

5.5.1 Overview...............................................................................................................................................116

5.5.2 Features and Functions..........................................................................................................................117

5.5.3 Panel......................................................................................................................................................117

5.5.4 Interface Attributes................................................................................................................................118

5.5.5 Technical Specifications........................................................................................................................118

5.6 MPU................................................................................................................................................................119

5.6.1 Overview...............................................................................................................................................119

5.6.2 Features and Functions..........................................................................................................................119

5.6.3 Panel......................................................................................................................................................120

5.6.4 Interface Attributes................................................................................................................................122

5.6.5 Technical Specifications........................................................................................................................124

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5.7 Physical Specifications...................................................................................................................................125

5.7.1 Chassis Specifications...........................................................................................................................125

5.7.2 Board Specifications..............................................................................................................................126

6 ME60-8 Chassis Overview....................................................................................................... 129

6.1 Overview........................................................................................................................................................130

6.1.1 Device Structure....................................................................................................................................130

6.1.2 System Configuration............................................................................................................................132

6.2 Power Supply..................................................................................................................................................133

6.2.1 DC Power Supply Module.....................................................................................................................134

6.2.2 AC Power Supply Module.....................................................................................................................137

6.3 Heat Dissipation System.................................................................................................................................139

6.3.1 Appearance of the Fan Module.............................................................................................................140

6.3.2 Front Panel.............................................................................................................................................141

6.3.3 Air Filter................................................................................................................................................142

6.3.4 Functions of the FCB.............................................................................................................................142

6.3.5 Technical Parameters.............................................................................................................................143

6.4 SFU(ME01SFUB0)........................................................................................................................................143

6.4.1 Overview...............................................................................................................................................144

6.4.2 Features and Functions..........................................................................................................................144

6.4.3 Panel......................................................................................................................................................144

6.4.4 Technical Specifications........................................................................................................................145

6.5 SRU................................................................................................................................................................146

6.5.1 Overview...............................................................................................................................................146

6.5.2 Features and Functions..........................................................................................................................146

6.5.3 Panel......................................................................................................................................................147

6.5.4 Interface Attributes................................................................................................................................150

6.5.5 Technical Specifications........................................................................................................................151

6.6 Physical Specifications...................................................................................................................................152

6.6.1 Chassis Specifications...........................................................................................................................152

6.6.2 Board Specifications..............................................................................................................................153

7 Boards.......................................................................................................................................... 155

7.1 ME60-X16 Board Specifications....................................................................................................................157

7.2 ME60-X8 Board Specifications......................................................................................................................159

7.3 ME60-X3 Board Specifications......................................................................................................................162

7.4 ME60-16 Board Specifications......................................................................................................................164

7.5 ME60-8 Board Specifications........................................................................................................................166

7.6 Versatile Service Process Unit C (SPUC)......................................................................................................168

7.7 VSU................................................................................................................................................................170

7.7.1 Board Overview.....................................................................................................................................171

7.7.2 Applicable Scenario...............................................................................................................................171

7.7.3 Functions and Features..........................................................................................................................173

7.7.4 Panel......................................................................................................................................................173

HUAWEI ME60 Multiservice Control Gateway

Hardware Description Contents

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