
Table of Contents
Chapter 1 General Information ................................................................ 1
1.1 In roduc ion .............................................................................................. 2
1.2 Fea ures ................................................................................................... 2
1.3 Packing Lis .............................................................................................. 3
1.4 Op ional Accessories ............................................................................... 3
1.5 Specifica ions ........................................................................................... 4
1.6 Produc View ............................................................................................ 6
1.7 Dimensions .............................................................................................. 9
Chapter 2 Hardware Configuration ........................................................ 10
2.1 Ins alla ions ............................................................................................ 11
2.1.1 HDD Ins alla ion ....................................................................... 11
2.1.2 M.2 Card Ins alla ion ................................................................ 12
2.1.3 Memory Ins alla ion.................................................................. 13
2.1.4 WiFi / 3G / 4G An enna Ins alla ion .......................................... 14
2.1.5 Side Bracke Ins alla ion .......................................................... 14
2.1.6 Pinou for COM Por s, DC Power & Digi al I/O Connec ors ...... 15
2.2 Se ing he Jumpers ............................................................................... 17
2.3 Jumper & Connec or Loca ions on he Mo herboard .............................. 18
2.4 Jumpers Quick Reference ...................................................................... 19
2.4.1 Clear CMOS Da a (JP2) ........................................................ 19
2.4.2 EDP Panel Power Selec ion (JP2) ........................................... 20
2.4.3 LVDS Panel Power / Brigh ness Selec ions (JP3 / JP5) ........... 21
2.4.4 EDP / LVDS Selec ion (JP4) .................................................... 22
2.5 Connec ors Quick Reference ................................................................. 23
2.5.1 COM1 RS-232/422/485 Por (CN9) ......................................... 24
2.5.2 Amplifier Connec or (J1) .......................................................... 25
2.5.3 Audio Connec or (J3) ............................................................... 25
2.5.4 SATA HDD Power Connec or (J5) ........................................... 26
2.5.5 SMBUS Connec or (J10) ......................................................... 26
2.5.6 Fron Panel Connec or (J9)...................................................... 27
2.5.7 USB 2.0 Connec or (J6) ........................................................... 28
2.5.8 Ba ery Connec or (J16) ........................................................ 28
2.5.9 COM2, COM3, COM4 RS-232 Por s (J20, J21, J22) ............... 29
2.5.10 DC Power Inpu Connec or (J18) .......................................... 29
2.5.11 Digi al I/O Connec or (J17) ...................................................... 30
2.5.12 LCD Backligh Connec or (J15) ............................................... 30