IBASE Technology ASB200-919 User manual

ASB200-919
Fanless System with
3.5” Disk-Size SBC System
User’s Manual
Version 1.0a
(February 2022)

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Copyright
© 2022 IBASE Technology, Inc. All righ s reserved.
No par of his publica ion may be reproduced, copied, s ored in a re rieval sys em, ransla ed
in o any language or ransmi ed in any form or by any means, elec ronic, mechanical,
pho ocopying, or o herwise, wi hou he prior wri en consen of IBASE Technology, Inc.
(hereinaf er referred o as “IBASE”).
Disclaimer
IBASE reserves he righ o make changes and improvemen s o he produc s described in his
documen wi hou prior no ice. Every effor has been made o ensure he informa ion in he
documen is correc ; however, IBASE does no guaran ee his documen is error-free.
IBASE assumes no liabili y for inciden al or consequen ial damages arising from
misapplica ion or inabili y o use he produc or he informa ion con ained herein, nor for any
infringemen s of righ s of hird par ies, which may resul from i s use.
Trademarks
All he rademarks, regis ra ions and brands men ioned herein are used for iden ifica ion
purposes only and may be rademarks and/or regis ered rademarks of heir respec ive
owners.

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Compliance
This produc has passed CE es s for environmen al specifica ions and limi s. This
produc is in accordance wi h he direc ives of he Union European (EU). If users
modify and/or ins all o her devices in his equipmen , he CE conformi y declara ion
may no longer apply.
This produc has been es ed and found o comply wi h he limi s for a Class B device,
pursuan o Par 15 of he FCC Rules. These limi s are designed o provide
reasonable pro ec ion agains harmful in erference in a residen ial ins alla ion. This
equipmen genera es, uses and can radia e radio frequency energy and, if no
ins alled and used in accordance wi h manufac urer’s ins ruc ions, may cause harmful
in erference o radio communica ions.
EEE
This produc mus no be disposed of as normal household was e, in
accordance wi h he EU direc ive of for was e elec rical and elec ronic
equipmen (WEEE - 2012/19/EU). Ins ead, i should be disposed of by
re urning i o a municipal recycling collec ion poin . Check local
regula ions for disposal of elec ronic produc s.
Green IBASE
This produc is complian wi h he curren RoHS res ric ions and
prohibi s use of he following subs ances in concen ra ions exceeding
0.1% by weigh (1000 ppm) excep for cadmium, limi ed o 0.01% by
weigh (100 ppm).
• Lead (Pb)
• Mercury (Hg)
• Cadmium (Cd)
• Hexavalen chromium (Cr6+)
• Polybromina ed biphenyls (PBB)
• Polybromina ed diphenyl e her (PBDE)

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Important Safety Information
Carefully read he precau ions before using he device.
Environmental conditions:
 Lay he device horizon ally on a s able and solid surface in case he device may
fall, causing serious damage.
 Leave plen y of space around he device and do no block he openings for
ven ila ion. NEVER DROP OR INSERT ANY OBJECTS OF ANY KIND INTO THE
VENTIILATION OPENINGS.
 Slo s and openings on he chassis are for ven ila ion. Do no block or cover hese
openings. Make sure you leave plen y of space around he device for ven ila ion.
NEVER INSERT OBJECTS OF ANY KIND INTO THE VENTILATION
OPENINGS.
 Use his produc in environmen s wi h ambien empera ures -20˚C ~ 60˚C for
SSD, and 0˚C ~ 45˚C for HDD.
 DO NOT LEAVE THIS DEVICE IN AN ENVIRONMENT WHERE THE STORAGE
TEMPERATURE MAY GO BELOW -20˚C OR ABOVE 80˚C. This could damage
he device. The device mus be used in a con rolled environmen .
Care for your IBASE products:
 Before cleaning he device, urn i off and unplug all cables such as power in case
a small amoun of elec rical curren may s ill flow.
 Use neu ral cleaning agen s or dilu ed alcohol o clean he device chassis wi h a
clo h. Then wipe he chassis wi h a dry clo h.
 Vacuum he dus wi h a compu er vacuum cleaner o preven he air ven or slo s
from being clogged.
ARNING
Attention during use:
 Do no place heavy objec s on he op of he device.
 Opera e his device from he ype of power indica ed on he marking label. If you
are no sure of he ype of power available, consul your dis ribu or or local power
company.
 Do no walk on he power cord or allow any hing o res on i .
 If you use an ex ension cord, make sure ha he o al ampere ra ing of he
produc plugged in o he ex ension cord does no exceed i s limi s.
Avoid Disassembly
Do no disassemble, repair or make any modifica ion o he device. Disassembly,
modifica ion, or any a emp a repair could genera e hazards and cause damage o
he device, even bodily injury or proper y damage, and will void any warran y.

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CAUTION
Danger of explosion if in ernal li hium-ion ba ery is replaced by an incorrec ype.
Replace only wi h he same or equivalen ype recommended by he manufac urer.
Dispose of used ba eries according o he manufac urer’s ins ruc ions.
arranty Policy
 IBASE standard products:
IBASE offers a 24-mon h (2-year) warran y from he da e of shipmen . If he
da e of shipmen canno be ascer ained, he produc serial numbers can be
used o de ermine he approxima e shipping da e.
 3rd-party parts:
12-mon h (1-year) warran y from delivery for he 3rd-par y par s ha are no
manufac ured by IBASE, such as CPU, memory, HDD, power adap er, panel
and ouchscreen.
＊ PRODUCTS, HOWEVER, THAT FAILS DUE TO MISUSE, ACCIDENT,
IMPROPER INSTALLATION OR UNAUTHORIZED REPAIR SHALL BE
TREATED AS OUT OF WARRANTY AND CUSTOMERS SHALL BE BILLED
FOR REPAIR AND SHIPPING CHARGES.
Technical Support & Services
1. Visi he IBASE websi e a www.ibase.com. w o find he la es informa ion abou
he produc .
2. If you need any fur her assis ance from your dis ribu or or sales represen a ive,
prepare he following informa ion of your produc and elabora e upon he
problem.
 Produc model name
 Produc serial number
 De ailed descrip ion of he problem
 The error messages in ex or in screensho s if here is any
 The arrangemen of he peripherals
 Sof ware in use (such as OS and applica ion sof ware, including he version
numbers)
3. If repair service is required, you can download he RMA form a
h p://www.ibase.com. w/english/Suppor s/RMAService/. Fill ou he form and
con ac your dis ribu or or sales represen a ive.

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Table of Contents
Chapter 1 General Information ................................................................ 1
1.1 In roduc ion .............................................................................................. 2
1.2 Fea ures ................................................................................................... 2
1.3 Packing Lis .............................................................................................. 3
1.4 Op ional Accessories ............................................................................... 3
1.5 Specifica ions ........................................................................................... 4
1.6 Produc View ............................................................................................ 6
1.7 Dimensions .............................................................................................. 9
Chapter 2 Hardware Configuration ........................................................ 10
2.1 Ins alla ions ............................................................................................ 11
2.1.1 HDD Ins alla ion ....................................................................... 11
2.1.2 M.2 Card Ins alla ion ................................................................ 12
2.1.3 Memory Ins alla ion.................................................................. 13
2.1.4 WiFi / 3G / 4G An enna Ins alla ion .......................................... 14
2.1.5 Side Bracke Ins alla ion .......................................................... 14
2.1.6 Pinou for COM Por s, DC Power & Digi al I/O Connec ors ...... 15
2.2 Se ing he Jumpers ............................................................................... 17
2.3 Jumper & Connec or Loca ions on he Mo herboard .............................. 18
2.4 Jumpers Quick Reference ...................................................................... 19
2.4.1 Clear CMOS Da a (JP2) ........................................................ 19
2.4.2 EDP Panel Power Selec ion (JP2) ........................................... 20
2.4.3 LVDS Panel Power / Brigh ness Selec ions (JP3 / JP5) ........... 21
2.4.4 EDP / LVDS Selec ion (JP4) .................................................... 22
2.5 Connec ors Quick Reference ................................................................. 23
2.5.1 COM1 RS-232/422/485 Por (CN9) ......................................... 24
2.5.2 Amplifier Connec or (J1) .......................................................... 25
2.5.3 Audio Connec or (J3) ............................................................... 25
2.5.4 SATA HDD Power Connec or (J5) ........................................... 26
2.5.5 SMBUS Connec or (J10) ......................................................... 26
2.5.6 Fron Panel Connec or (J9)...................................................... 27
2.5.7 USB 2.0 Connec or (J6) ........................................................... 28
2.5.8 Ba ery Connec or (J16) ........................................................ 28
2.5.9 COM2, COM3, COM4 RS-232 Por s (J20, J21, J22) ............... 29
2.5.10 DC Power Inpu Connec or (J18) .......................................... 29
2.5.11 Digi al I/O Connec or (J17) ...................................................... 30
2.5.12 LCD Backligh Connec or (J15) ............................................... 30

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2.5.13 LVDS Connec or (J14, J13) ..................................................... 31
2.5.14 CPU Fan Connec or (CPU_FAN1) ........................................... 31
2.5.15 EDP Connec or (CN3) ............................................................. 32
Chapter 3 Driver Installation .................................................................. 33
3.1 In roduc ion ............................................................................................ 34
3.2 In el® Chipse Sof ware Ins alla ion U ili y ............................................... 34
3.3 Graphics Driver Ins alla ion .................................................................... 35
3.4 HD Audio Driver Ins alla ion ................................................................... 36
3.5 LAN Driver Ins alla ion ........................................................................... 37
3.6 In el® Managemen Engine Driver Ins alla ion......................................... 39
Chapter 4 BIOS Setup ............................................................................. 41
4.1 In roduc ion ............................................................................................ 42
4.2 BIOS Se up ............................................................................................ 42
4.3 Main Se ings ......................................................................................... 43
4.4 Advanced Se ings ................................................................................. 44
4.5 Chipse Se ings ..................................................................................... 60
4.6 Securi y Se ings .................................................................................... 65
4.7 Boo Se ings.......................................................................................... 66
4.8 Save & Exi Se ings ............................................................................... 67
Appendix........................................................................................................ 68
A. I/O Por Address Map ............................................................................. 69
B. In errup Reques Lines (IRQ) ................................................................ 71
C. Digi al I/O Sample Code ......................................................................... 72
D. Wa chdog Timer Configura ion ............................................................... 76

1
Chapter 1
General Information
The informa ion provided in his chap er includes:
 Fea ures
 Packing Lis
 Op ional Accessories
 Specifica ions
 Produc View
 Dimensions

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1.1 Introduction
The ASB200-919 is mini embedded sys em based on he In el® 8 h Gen.
Core™ and Celeron processors and he IBASE IB919 series 3.5” disk-size
SBC ha suppor s wo DDR4 memory slo s wi h a capaci y of 32GB. The
compac and fanless design makes i sui able for smar re ail, ranspor a ion,
heal hcare, and smar fac ory applica ions even in large field deploymen s. I is
equipped wi h wo DisplayPor (DP & Type C), wo Gigabi LAN por s, and wo
M.2 slo s (M2280 & E2230) for NVMe drives and CNVi wireless connec ivi y.
1.2 Features
 Fanless sys em wi h IBASE 3.5” disk-size SBC
 Onboard In el® 8 h Gen. Core™ i7/i5/i3 U-series processor
 2 x DisplayPor (1 x USB Type C (USB 3.1) / DP)
 2 x RJ-45 GbE
 4 x USB 3.1 por s
 1 x DB9 (COM #1 for RS232/422/485 jumperless selec )
 Inpu DC Vol age: +12~ +24V