Inspur TS860M5 User manual

Inspur Server User Manual
TS860M5

© Copyright Inspur 2018. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means
without prior written consent of Inspur.
The information in this manual is subject to change without notice.
Inspur is the registered trademark of Inspur. All the other trademarks or registered
trademarks mentioned in this manual are the property of their respective holders.
Edion: 1.1
June 28, 2019
Description:
1. The product specification chapter (Chapter 2) is updated.

Abstract
This manual contains technical information such as specifications, hardware operations,
software configuration, fault diagnosis, etc. that are relevant to the maintenance and
operation of this server.
It is recommended that server installation, configuration, and maintenance is performed by
experienced technicians only.
Target Audience
This manual is intended for:
●Technical support engineers
●Product maintenance engineers
●Technicians
Warnings:
This manual introduces the TS860M5 server’s technical features, system installaon and
setup, which will help the user to understand how best to ulize the server and all its
funconalies.
1.For your safety, please do not disassemble the server’s components arbitrarily. Please do
not extend conguraon or connect other peripheral devices arbitrarily. If needed, please
contact Inspur for our support and guidance.
2.Before disassembling the server’s components, please be sure to disconnect all the power
cords connected to the server.
3.BIOS and BMC setup is a signicant factor in correctly conguring your server. If there
are no special requirements, it is suggested to use the Default Values and not alter the
parameter sengs arbitrarily.
4.Please install the product-compable operang system and use the driver provided by
Inspur. If you use an incompable operang system or non-Inspur driver, it may cause
compability issues and aect the normal use of the product, Inspur will not assume any
responsibility or liability.
Inspur is not responsible for any damages, including loss of prots, loss of informaon,
interrupon of business, personal injury, and/or any damage or consequenal damage
without limitaon, incurred before, during, or aer the use of our products.

Contents
1 Safety Instructions......................................................................................................................... 1
2 Product Specification .................................................................................................................... 5
2.1 Introduction................................................................................................................................ 5
2.2 Features and Specifications........................................................................................................ 6
3 Component Identification ............................................................................................................. 8
3.1 Front Panel Components ........................................................................................................... 8
3.2 Rear Panel Components ............................................................................................................. 9
3.3 Motherboard Components......................................................................................................... 11
3.4 Motherboard Jumper Introduction ............................................................................................ 14
4 Operations..................................................................................................................................... 15
4.1 Power up the Server................................................................................................................... 15
4.2 Power down the Server.............................................................................................................. 15
4.3 Extend the Server from the Rack................................................................................................ 15
4.4 Remove the Access Panel........................................................................................................... 16
4.5 Remove the Compute Node ...................................................................................................... 16
4.6 Remove the IO Module .............................................................................................................. 17
4.7 Install the Access Panel .............................................................................................................. 18
5 Setup ............................................................................................................................................. 19
5.1 Optimum Environment............................................................................................................... 19
5.2 Rack Warnings ............................................................................................................................ 21
5.3 Identifying the Contents of the Server Shipping Carton.............................................................22
5.4 Installing Hardware Options ....................................................................................................... 22
5.5 Installing the Server into the Rack.............................................................................................. 22
5.6 Installing the Operating System.................................................................................................. 23
6 Hardware Options Installation....................................................................................................... 24

6.1 Introduction................................................................................................................................ 24
6.2 Processor Option........................................................................................................................ 24
6.3 Memory Option.......................................................................................................................... 26
6.4 Hot-plug HDD Option ................................................................................................................. 27
6.5 Hot-plug PCIE Card Option.........................................................................................................28
6.6 Non-hot Plug PCIE Card Option .................................................................................................. 30
6.7 Redundant Hot-plug Power Supply Option ................................................................................30
7 Cabling........................................................................................................................................... 32
7.1 Signal Line................................................................................................................................... 32
7.2 Power Cord................................................................................................................................. 33
8 BIOS Setup..................................................................................................................................... 35
8.1 Login to BIOS Interface............................................................................................................... 35
8.2 BIOS Parameter Description ....................................................................................................... 37
8.3 Firmware Update........................................................................................................................ 74
9 BMC Settings ................................................................................................................................ 77
9.1 Introduction................................................................................................................................ 77
9.2 Functional Modules.................................................................................................................... 78
9.3 Web Interface Introduction ........................................................................................................ 79
9.4 Storage ....................................................................................................................................... 85
9.5 Remote Control .......................................................................................................................... 85
9.6 Power and Fan............................................................................................................................ 86
9.7 BMC Settings .............................................................................................................................. 88
9.8 Logs ............................................................................................................................................ 92
9.9 Fault Diagnosis............................................................................................................................ 94
9.10 Administration.......................................................................................................................... 95
9.11 Service & Protocol .................................................................................................................... 99
9.12 Users......................................................................................................................................... 100
9.13 BMC Firmware Update ............................................................................................................. 101
9.14 Redfish...................................................................................................................................... 103

9.15 Command Line Function Introduction...................................................................................... 107
9.16 Time Zone Table ....................................................................................................................... 113
10 Common Faults, Diagnosis and ................................................................................................... 116
10.1 Hardware Problems.................................................................................................................. 116
10.2 Software Problems ................................................................................................................... 120
11 Battery Replacement................................................................................................................... 122
12 Regulatory Compliance Notices................................................................................................... 123
12.1 Regulatory Compliance Identification Numbers....................................................................... 123
12.2 Federal Communications Commission Notice.......................................................................... 123
12.3 Cables ....................................................................................................................................... 124
12.4 European Union Regulatory Notice.......................................................................................... 124
12.5 Disposal of Waste Equipment by Users in the European ......................................................... 124
12.6 Korean Notice........................................................................................................................... 125
12.7 Chinese Notice.......................................................................................................................... 125
12.8 Battery Replacement Notice .................................................................................................... 125
13 Electrostatic Discharge ................................................................................................................ 127
13.1 Preventing Electrostatic Discharge ........................................................................................... 127
13.2 Grounding Methods to Prevent Electrostatic Discharge ..........................................................127
14 Warranty..................................................................................................................................... 128
14.1 Introduction.............................................................................................................................. 128
14.2 Warranty Service ...................................................................................................................... 128
14.3 Warranty Exclusions ................................................................................................................. 129

1
Safety Introduction
1 Safety Instructions
WARNING: Please be advised to follow the instructions below for safety. Failure to do so
could result to potential dangers that may cause property loss, personal injury or death.
1. The power supplies in the system may produce high voltages and energy hazards that
may cause personal injury. For your safety, please do not attempt to remove the cover
of the system to remove or replace any component without assistance provided by
Inspur. Only service technicians trained by Inspur are authorized to remove the cover of
the host, and to remove and replace internal components.
2. Please connect the equipment to the appropriate power supply. Use only power
supplies with the correct voltage and electrical specifications according to the label. To
protect your equipment from damages caused by a momentary spike or plunge of the
voltage, please use relevant voltage stabilizing equipment, or uninterruptible power
supplies.
3. If you must use an extension cable, please use a three-core cable with properly
grounded plugs. Observe extension cable ratings. Ensure that the total rating of all
equipment plugged into the extension cable does not exceed 80 percent of the ratings
limit for the extension cable.
4. Please be sure to use the power supply components that come with the server, such as
power lines, power socket (if provided with the server) etc. For your safety, please do
not replace power cables or plugs randomly.
5. To prevent electric shock dangers caused by leakage in the system, please make sure
that the power cables of the system and peripheral equipment are correctly connected
to the earthed/grounded power socket. Please connect the three-core power line plug
to the three-core AC power socket that is well earthed and easy to access. Be sure
to use earthing /grounding pin of power lines and do not use the patch plug or the
earthing/grounding pin unplugged with cables. In the case that the earthing/grounding
conductors are not installed and it is uncertain whether there are appropriate earthing/
grounding protections, please do not use or attempt to operate the equipment. Contact
and consult an electrician.
6. Please do not push any objects into the openings of the system. Doing so may cause
fire or electric shock.

2
7. Please place the system far away from the cooling plate and heat sources, and be sure
not to block the air vents.
8. Please be sure not to scatter food or liquid in the system or on other components, and
do not use the product in humid or dusty environments.
9. Using an incompatible battery may cause explosion. When battery replacement is
required, please consult the manufacturer first, and choose batteries of the same or
equivalent type. Do not disassemble, crush, puncture the batteries or make the external
connection point short circuit, and do not expose them in the environment over 60°C.
Never throw batteries into fire or water. Please do not attempt to open or repair the
batteries. Dispose of used batteries according to instructions. For battery recycling,
please contact the local waste recycling center.
10. Before installing equipment into the rack, please install all front and side stabilizers on
the independent rack first. Please install the front stabilizers first, if connecting with
other racks. Please install stabilizers before installing equipment into the rack. Failure to
install the corresponding stabilizers before installing equipment into the rack may cause
the cabinet to tip over, possibly resulting to severe injury. After installing the equipment
and other components into the rack, only one component can be pulled out from the
rack through its sliding part at one time. Pulling out several components at the same
time may cause the rack to turn over, resulting to serious personal injury.
11. A minimum of two people are required to safely move a rack. The racks are extremely
awkward and heavy, moving them without adequate, trained personnel could result in
severe injury or death.
12. It is prohibited to directly short-circuit the copper busbar. Please do not touch the
copper busbar when the rack is powered on.
13. This is Class A product, and may cause radio interference. In such case, users may need
to take necessary measures to mitigate the interference.
14. The equipment is intended for installation in a Restricted Access Location.
Note: The following considerations may help avoid the occurrence of problems that could
damage the components or cause data loss, etc.
1. In the event of the following, please unplug the power line plug from the power socket
and contact Inspur’s customer service department:

3
Safety Introduction
1) The power cables, extension cables or power plugs are damaged.
2) The products get wet.
3) The products have fallen or have been damaged.
4) Other objects have fallen into the products.
5) The products do not or are unable to function normally even when attempting to
operate according to the instructions.
2. If the system becomes wet or damp, please follow these steps:
1) Power off the equipment, disconnect them with the power socket, wait for 10 to 20
seconds, and then open the host cover.
2) Move the equipment to a well-ventilated place to dry the system at least for 24 hours
and make sure that the system is fully dried.
3) Close the host cover, reconnect the system to the power socket, and then power on.
4) In case of operation failure or other abnormal situations, please contact Inspur and get
technical support.
3. Pay attention to the position of system cables and power cables-avoid placing wires in
high foot traffic locations. Please do not place objects on the cables.
4. Before removing the host cover, and/or touching the internal components, please
allow for the equipment to cool first. To avoid damaging the mainboard, please power
off the system and wait for five seconds, and then remove the components from the
mainboard and/or disconnect the peripheral device from the system. Please remember
that only service technicians trained by Inspur are authorized to remove the cover of
the host, and to remove and replace internal components.
5. If there is modem, telecom or LAN options installed in the equipment, please pay
attention to the followings:
1) In the case of thunder and lightning, please do not connect or use the modem.
2) Never connect or use the modem in a damp environment.
3) Never insert the modem or telephone cables into the socket of network interface
controller (NIC).
4) Before unpacking the product package, installing internal components, touching
uninsulated cables or jacks of the modem, please disconnect the modem cables.
6. In order to prevent electrostatic discharge from damaging the electronic components in
the equipment, please pay attention to the followings:
1) Please remove any static electricity on your body before dismounting or touching any

4
electronic component in the equipment, to prevent the static electricity from conducting
itself to the sensitive components. You may remove the static electricity on the body by
touching the metal earthing objects (such as the unpainted metal surface on the rack).
2) Please do not take electrostatic sensitive components that are not ready to be installed
for application out of the antistatic package materials.
3) While working, please touch the earthing conductor or the unpainted metal surface on
the cabinet regularly to remove any static electricity from the body that may damage
the internal components.
7. Upon receiving the proper authorization from Inspur and dismounting the internal
components, please pay attention to the following:
1) Switch the system power supply off and disconnect the cables, including all connections
of the system. When disconnecting the cables, please hold the connector of the cables
and slowly pull the plugs out. Never pull on the cables.
2) The products need to completely cool down before dismounting the host cover or
touching the internal components.
3) During the dismounting process, avoid making large movement ranges to prevent
damage to the components or scratching arms.
4) Handle components and plug-in cards with care. Please do not touch the components
or connection points on the plug-in cards. When handling the plug-in cards or
components, firmly grab the edges of the plug-in cards and components, and/or their
metal fixed supports.
8. During the process of rack installation and application, please pay attention to the
followings:
1) After the rack installation is finished, please ensure that the stabilizers have been fixed
to the rack and supported to ground, and the weight of the rack is firm on ground.
2) Always load from the bottom up, and load the heaviest items first.
3) When pulling out the components from the rack, apply slight force to keep the rack balanced.
4) When pressing down the release latch and the rail of components is sliding, please be
careful; as the sliding may hurt your fingers.
5) Do not overload the AC power supply branch circuits in the rack. The total load of the
rack should not exceed 80% of the ratings of the branch circuits.
6) Ensure that components in the rack have good ventilation conditions.
7) When repairing components in the rack, never step on any other components.

5
Product Specication
2 Product Specification
2.1 Introduction
Inspur TS860M5 is a 4U, eight-socket rack server, which is designed on the basis of the
new generation of Intel® Xeon® scalable processor. This product maintains the high quality
and high reliability of Inspur servers. Compared with the previous 8-socket products, the
performance has been greatly improved:
●
High computing performance: The computing performance is 30% higher than that of the
predecessor, and it has 1.5 times of memory bandwidth and 3 times of storage capacity.
It fully meets the requirements of key applications, such as large-scale transaction
database, virtualization integration, business intelligence analysis, large-scale ERP, and
high performance.
●
Flexible local storage: The storage capacity is increased to three times as compared
with the previous generation. The system supports a maximum of 24 3.5/2.5-inch hot-
plug hard drives and supports SATA/SAS/SSD, with a maximum of 12 NVME hard drives.
The system has two built-in SATA or PCIE X2 interface M.2 hard drives, and supports
42/60/80/110 physical specifications.
●
Multi-dimension fault diagnosis: The system is equipped with an OLED display, which
can be used to view server asset information, view and set IP addresses, monitor
the total power consumption and ambient temperature, and display fault codes. The
processor and memory offline light path diagnostics technology can quickly locate the
core fault components off-line. The embedded oscilloscope technology can quickly
identify the abnormal behavior of hardware underlying key signals. The black-box log and
analysis technology can analyze the specific reason of system software failures. Remote
XDP technology can remotely enter the register to analyze and locate issues. Multi-
dimensional fault diagnosis methods from the underlying hardware to the upper software
to human-computer interaction can greatly reduce the downtime.
●
Comprehensive fault-tolerant design: The RAS features of the entire system exceed 80
items, implementing a full-module fault-tolerant design, which is ideal for mission critical
applications with high reliability requirements. The PCIE external card supports single-
card hot plug operation, with up to 12 PCIE external cards. The BIOS ROM supports
physical module redundancy. The BMC supports dual-image redundancy. It can optionally

6
support global clock redundancy and seamless switch of the system clock source. The
power module supports Active-Active and Active-Standby redundancy modes, enabling
millisecond-level switch.
2.2 Features and Specifications
Processor
Processor Type Intel® Purley Skylake 81xx & 61xx series scalable processors
Intel® Purley Cascade Lake 82xx & 62xx series scalable processors
Chipset
Chipset Type Intel® Lewisburg C624/C627
Memory
Memory Type ECC Registered DDR4, RDIMM, LRDIMM, NVDIMM
Memory Slot Qty. 96
Total Memory Capacity Supports up to 12TB (128GB per memory)
I/O
USB
Front: 2 USB 3.0 ports
Rear: 2 USB 3.0 ports
Internal: 4 USB 3.0 ports (two for each compute node)
VGA Front: 1 VGA port
Rear: 1 VGA port
Mngt Port Single paron: 1 independent IPMI port
Dual paron: 2 independent IPMI ports
Serial Port Front: 1 RJ45 port
Display
Controller Type Integrated in the chip Aspeed2500
SAS
SAS3.0 Backplane Supports hot-plug SAS/SATA/SSD/NVME disks
NIC
NIC Controller Intel Ethernet Connecon X722
Management
Management Chip It integrates 1 independent 1000Mbps network interface, special for IPMI
remote management.
PCIE
PCI Expansion Slot
1. Full-height IO:
Supports 8 PCIE3.0 slots (support GPU) + 2 dedicated RAID card slots
2. Half-height IO:
Supports 12 PCIE3.0 slots + 2 dedicated RAID card slots
OCP
OCP Slot Supports up to 2 OCP cards (Each compute node supports 1 card)
Hard Drive
Hard Drive Type SAS, SATA, SSD, NVME, SATA M.2 and PCIE M.2

7
Product Specication
External Storage Drive
Opcal Drive Supports external USB drive
Power
Specicaon
Supports 800W/1300W/1600W and above output power;
Up to 4 power modules;
Supports 2+1/2+2/3+1 redundancy depending on the conguraon
Power Input Please refer to the power input on the nameplate label of the host.
Physical
External Dimensions of
Packing box 722 width × 368 height × 1168 depth (unit: mm)
Size of Host Machine 448 width × 175.5 height × 800 depth (unit: mm)
Product Weight
Full conguraon (Maximum CPUs, Memories, Hard Drives, PSUs and GPUs):
Net weight: 75kg
Gross weight: 80kg (Gross weight includes: Host + Packing Box + Rails +
Accessory Box)
Environmental
Operang Temperature 0℃-40℃
Storage & Transportaon
Temperature -40℃-55℃
Operang Humidity 20％-90％ relave humidity
Storage & Transportaon
Humidity 20％-93％(40℃) relave humidity

8
3 Component Identification
3.1 Front Panel Components
Front View
Item Descripon
1 VGA
2 USB3.0 (x2)
3 RJ45 connector
4 HDD module 1 (supports NVME)
5Upper paron control buons
(only available in dual-paron mode)
6Power buon
7UID LED & buon
8Reset buon
9 System status LED
10 KVM switch buon
11 LED module
12 HDD module2
● HDD LEDs

9
Component Identication
Item Descripon Status & Interpretaon
1Acvity status LED Steady green: Normal
Flashing green: Read and write acvity
2 Fault alarm LED
Steady red: An HDD failure occurs
Steady blue: HDD posioning
Flashing blue: RAID rebuilding
3.2 Rear Panel Components
Rear View – Single Partition, Dual Compute Nodes + Half-height IO Module
Rear View – Single Partition, Dual Compute Nodes + Full-height IO Module
Item Descripon
1 PSU0
2 PSU2
3 PSU3
4 PSU1
5 Compute node1 (slave node)
6 Compute node0 (master node)

10
Item Descripon
7COM
8UID LED & buon
9 IPMI
10 8-socket interconnecon module
11 OCP0 (supports PHY)
12 OCP1
13 USB3.0
14 VGA
15 PCIE0_CPU4 - PCIE2_CPU4
16 PCIE3_CPU5 - PCIE5_CPU5
17 PCIE6_CPU1 - PCIE11_CPU1
18 PCIE0_CPU4 - PCIE1_CPU4
19 PCIE2_CPU5 - PCIE3_CPU5
20 PCIE4_CPU1 - PCIE7_CPU1
Rear View – Single Partition, Single Compute Node
Rear View – Dual Partitions

11
Component Identication
3.3 Motherboard Components
CPU Board
Item Descripon
1 DIMMs_CPU1
2 CPU1
3 DIMMs_CPU0
4 CPU0
5 DIMMs_CPU2
6 CPU2
7 OCPA connector
8 OCPC connector
9 OCPB connector
10 DIMMs_CPU3
11 CPU3
12 PCH connector
13 M.2 riser card connector

12
Half-height IO Board
Item Descripon
1 PCIE0_CPU4 - PCIE2_CPU4
2 PCIE3_CPU5 - PCIE5_CPU5
3 PCIE6_CPU1 - PCIE11_CPU1
4 Intrusion switch connector
5HDD_BP1 management port
(lower HDD BP)
6HDD_BP0 management port
(upper HDD BP)
7 KVM_UI connector
8HDD_BP1 power connector
(lower HDD BP)
9HDD_BP0 power connector
(upper HDD BP)
10 Raid card slot0_CPU0
11 Raid card slot1_CPU4
12 OLED connector
13 CTL_UI connector

13
Component Identication
Full-height IO Board
Item Descripon
1 CTL_UI connector
2 OLED connector
3 Raid card slot0_CPU0
4 Raid card slot1_CPU4
5 PCIE_Riser0 - GPU power connector0
6 PCIE_Riser0 - GPU power connector1
7 PCIE_Riser0_CPU4\CPU5
8 PCIE_Riser1_CPU1
9 PCIE_Riser1 - GPU power connector1
10 PCIE_Riser1 - GPU power connector0
11 HDD_BP0 power connector
(upper HDD BP)
12 Intrusion switch connector
13 HDD_BP1 management port
(lower HDD BP)
14 HDD_BP0 management port
(upper HDD BP)
15 KVM_UI connector
16 HDD_BP1 power connector
(lower HDD BP)

14
3.4 Motherboard Jumper Introduction
Item Descripon Funcon
CLR_CMOS CMOS clear jumper Short-circuit Pin2/4, restore to normal status; short-circuit Pin4/6, clear
CMOS.
Note:
The jumper pins are located on the PCH board. It is required to shut down the system, as
well as disconnect the power supply during CMOS clearing. Hold for 5 seconds after short-
circuiting Pin4/6, and then short-circuit Pin2 and Pin4 (the default status) of CLR_CMOS
jumper with a jumper cap, to restore to its original status.