Inspur NF5448A6 Quick reference guide

Inspur Server NF5448A6
White Paper
Document Version: V1.0
Release Date: June 15, 2022

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1
Foreword
Abstract
This document describes the NF5448A6 server's appearance, features, performance
parameters, and software and hardware compatibility of components, providing a profound
understanding of NF5448A6.
Target Audience
This manual is intended for:
Pre-sales engineers of Inspur
Pre-sales engineers of channel partners
Enterprise pre-sales engineers of customers
Symbol Conventions
The symbols that may be found in this document are defined as follows.
Symbol
Description
A potential for serious injury, or even death if not properly
handled.
A potential for minor or moderate injury if not properly handled.
A potential loss of data or damage to equipment if not properly
handled.
Operations or information that requires special attention to
ensure successful installation or configuration.
Supplementary description of manual information.
Revision History
Version
Date
Description of Changes
V1.0
2022/06/15
Initial release

2
Table of Contents
1Product Overview............................................................................................... 4
2Features............................................................................................................. 5
2.1 Ultra-high Computing Performance.......................................................................... 5
2.2 Availability and Serviceability ................................................................................... 5
2.3 Manageability and Security ...................................................................................... 6
2.4 Energy Efficiency...................................................................................................... 6
3System Layout.................................................................................................... 7
4System Architecture ........................................................................................... 8
4.1 Motherboard System Architecture............................................................................ 8
4.2 System Architecture ................................................................................................. 9
5Hardware Description....................................................................................... 10
5.1 Front Panel............................................................................................................. 10
5.1.1 Appearance................................................................................................. 10
5.1.2 LED & Button .............................................................................................. 10
5.1.3 Ports............................................................................................................ 11
5.2 Rear Panel.............................................................................................................. 12
5.2.1 Appearance................................................................................................. 12
5.2.2 LED & Button .............................................................................................. 13
5.2.3 Ports............................................................................................................ 15
5.3 Processor ............................................................................................................... 15
5.4 Memory................................................................................................................... 16
5.4.1 DDR4 DIMM................................................................................................ 16
5.5 Storage................................................................................................................... 22
5.5.1 Drive Codes ................................................................................................ 22
5.5.2 Drive LED.................................................................................................... 22
5.5.3 RAID Controller Card .................................................................................. 23
5.6 I/O Expansion......................................................................................................... 23
5.6.1 PCIe Card ................................................................................................... 23
5.6.2 PCIe Slot..................................................................................................... 24
5.6.3 PCIe Slot Description.................................................................................. 26
5.7 Power Supply ......................................................................................................... 26
5.8 Fans........................................................................................................................ 27
5.9 Single Board........................................................................................................... 28
5.9.1 Motherboard................................................................................................ 28
5.9.2 Drive Backplane.......................................................................................... 29
6Product Specifications...................................................................................... 31
6.1 Technical Specifications......................................................................................... 31
6.2 Environmental Specifications ................................................................................. 33
6.3 Physical Specifications........................................................................................... 35
7Software and Hardware Compatibility............................................................... 36
7.1 Operating System................................................................................................... 36
7.2 Compatibility of Commodity of Commodity ............................................................ 36
7.2.1 CPU Specifications ..................................................................................... 36
7.2.2 Memory Specifications................................................................................ 37
7.2.3 Storage Specifications ................................................................................ 37
7.2.4 SAS Card/RAID Controller Card Specifications.......................................... 37
7.2.5 NIC Specifications....................................................................................... 38
7.2.6HCA Card Specifications............................................................................. 38
7.2.7 GPU Specifications ..................................................................................... 39

3
7.2.8 Power Supply Specifications....................................................................... 39
8Regulatory Information ..................................................................................... 40
8.1 Security................................................................................................................... 40
8.1.1 General Statement...................................................................................... 40
8.1.2 Personal Security........................................................................................ 40
8.1.3 Equipment Safety........................................................................................ 42
8.1.4 Precautions for Moving the Equipment....................................................... 42
8.1.5 Weight Limit for Handling by a Single Person ............................................ 43
8.2 Maintenance and Warranty .................................................................................... 43
9System Management........................................................................................ 44
9.1 Intelligent Management System ISBMC................................................................. 44
9.2 Inspur Physical Infrastructure Manager (ISPIM) .................................................... 46
9.3 Inspur Server Intelligent Boot (ISIB)....................................................................... 47
10 Certification ...................................................................................................... 49
11 Appendix A....................................................................................................... 50
11.1 Operating Temperature and Specification Limits................................................... 50
11.2 Model...................................................................................................................... 51
11.3 RAS Features......................................................................................................... 51
11.4 Sensor List.............................................................................................................. 51
12 Appendix B Terms............................................................................................ 53
12.1 A - E........................................................................................................................ 53
12.2 F - J......................................................................................................................... 53
12.3 K - O ....................................................................................................................... 53
12.4 P - T........................................................................................................................ 54
12.5 U - Z........................................................................................................................ 54
13 Appendix C Abbreviations ................................................................................ 55
13.1 A - E........................................................................................................................ 55
13.2 F - J......................................................................................................................... 56
13.3 K - O ....................................................................................................................... 57
13.4 P - T........................................................................................................................ 58
13.5 U - Z........................................................................................................................ 60

4
1Product Overview
Inspur NF5448A6 is an AI server featuring light-load AI training and high-performance
computing (HPC) for training and inference scenarios. The server uses a more balanced
combination of topology and computing power to provide various HPC and AI workloads
with ultimate performance and an ultra-high data throughput. It is widely applicable to
scientific computing, computer vision, voice recognition, biological research, weather
forecasting, and various AI and HPC scenarios. NF5448A6 adopts the cutting-edge
NVIDIA NVLink interconnect architecture, which enables P2P data exchange between
any two of the 4 NVIDIA SXM4 A100 Tensor Core 80 GB GPUs at a bandwidth of up to
600 GB/s in a 4U space. With 2 AMD EPYC 7003 series PCIe 4.0 CPUs, together with
the XGMI-2 bus interconnect design, this server provides top-level general-purpose
computing performance. A 4U chassis and fully redundant power supply design enable
NF5448A6 to be widely applied to data center environments, and make it especially
suitable for mounting to cabinets with limited power consumption. Besides, NF5448A6
adopts a more flexible cluster deployment scheme for integration with both hardware and
applications. Moreover, the 54V_VR power supply offers higher power efficiency. The
layered and zoned cooling channels and an intelligent PID control strategy ensure
optimal cooling performance. NF5448A6 enables AI and HPC users to efficiently build AI
infrastructures and development environments with high computing performance and low
deployment and operational costs.
For detailed model information of NF5448A6, refer to 11.2 Model.
Figure 1-1 NF5448A6

5
2Features
2.1Ultra-high Computing Performance
NF5448A6 provides the AI computing performance of 2.5 petaFLOPS per unit, which
is 75 - 150 times higher than that of a traditional 2-socket CPU server.
Based on 1 NVIDIA HGX A100 4-GPU Baseboard that is equipped with 4 SXM4
A100 80 GB GPUs, it supports P2P interconnection between GPUs at a total
bandwidth of up to 600 GB/s in a standard 4U space.
Supports 2 AMD®EPYC™Milan CPUs, with each processor supporting up to 64
cores, a max Turbo frequency of 3.7 GHz, an L3 cache of 256 MB, and 4 XGMI-2
interconnected links, offering unrivaled processing performance.
Supports up to 32 DDR4 ECC DIMMs (3,200 MT/s, RDIMM,) in 16 memory channels
to deliver superior speed, high availability, and a memory capacity up to 2 TB.
Supports up to 4 hot-swap NVMe SSDs, 6 enterprise-grade internal M.2 SSDs, and
4 SATA/SAS SSDs to maximize the data transfer speed of internal storage.
Supports up to 5 high-speed networks (100/200 Gbps) that support remote direct
memory access (RDMA), providing high-speed expansion channels for AI clusters.
2.2Availability and Serviceability
Supports hot-swap SAS/SATA/NVMe drives. SAS/SATA drives can be configured to
RAID level 0/1/1E/10/5/50/6/60 supported by different RAID controller cards, with
RAID cache as well as power failure protection enabled by the super-capacitor
module.
An SSD is much more reliable than a traditional HDD, enabling the system to run for
a longer time.
The UID/Health LEDs on the panel, the plug-in Bluetooth app management module,
and the ISBMC Web management interface indicate the statuses of key components
and guide technicians to quickly find the components that have failed or are at risk of
failure, thus simplifying maintenance, speeding up troubleshooting, and improving
system availability.
The rear panel provides the management interface for direct connection to ISBMC to
support near-end O&M and improve O&M efficiency of ISBMC.
Provides 4 hot-swap PSUs with 2+2 redundancy; and provides 6 hot-swap fan
modules with N+1 redundancy to improve overall system availability.
The onboard BMC module (ISBMC) monitors system parameters constantly and
triggers alarms, so O&M personnel can restore the system and minimize system
downtime.
Memory online diagnosis helps to mark the specific location of each faulty DIMM on
the motherboard, so that maintenance personnel can quickly determine the DIMM
needing maintenance, improving maintenance efficiency.
For international warranty information, refer to Warranty Policy.

6
2.3Manageability and Security
The ISBMC management module integrated on the server can be used to monitor
the operating status of the system and enable the remote management of the
system.
Supports the network controller sideband interface (NC-SI) feature that supports the
reuse of the management network port and service network port. The NC-SI feature
is disabled by default and can be enabled/disabled through the BIOS or the ISBMC
intelligent management system.
Integrates industry-standard Unified Extensible Firmware Interface (UEFI) to improve
the efficiency of setup, configuration, and update and simplifies error handling.
Trusted Platform Module (TPM 2.0) provides advanced encryption functions.
The firmware update mechanism based on digital signatures prevents unauthorized
firmware updates.
UEFI Secure Boot protects the system from malicious bootloaders.
Hierarchical BIOS password protection ensures the security of system boot and
management.
BIOS Secure Flash and BIOS Lock Enable (BLE) reduce attacks from malicious
software on BIOS Flash regions.
BMC Secure Boot protects BMC from malicious tampering.
Flexible BMC access control policies improve BMC management security.
The service network port of the NC-SI feature supports the following configurations:
Any network port for the FLEX I/O card that can be bound to the server and the
standard PCIe NIC that supports the NC-SI feature.
Supports the enable/disable function and configuration of Virtual Local Area
Network ID (VLAN ID). VLAN ID is disabled by default and its default value is 0.
Supports both IPv4 and IPv6 addresses. The information that can be configured
includes IP address, subnet mask, default gateway, and prefix length of IPv6
address.
2.4Energy Efficiency
Equipped with 80 PLUS Platinum level PSUs (3,000 W) with power efficiency up to
94% at a load of 50%.
Offers 2+2 redundant and integrated AC/DC power supplies for optimized power
conversion efficiency.
Efficient single-board voltage regulator down (VRD) PSU reduces power loss due to
DC-DC conversion.
Supports intelligent fan speed control and intelligent CPU frequency scaling to
conserve energy.
A fully-optimized cooling design and energy-efficient cooling fans reduce power
consumption of the fans.

7
3System Layout
Figure 3-1 System Layout
1
Motherboard
8
Power Backplanes
2
Air Duct
9
I/O Box A
3
Fan Backplane
10
Switch Board
4
Top Cover
11
GPU Box
5
I/O Box B
12
Chassis
6
PSUs
13
PCIe Module
7
Fans
14
Drives

8
4System Architecture
4.1 Motherboard System Architecture
Figure 4-1 NF5448A6 System Architecture
Supports 2 AMD®Milan®processors with a TDP of up to 280 W.
Supports 32 DIMMs.
Processors are interconnected through 4 xGMI-2 buses at a transmit rate of up to 16
GT/s.
Supports up to 5 PCIe 4.0 expansion slots, with the front panel supporting 1 and the
rear I/O box supporting 4.
The Mezz RAID controller card is connected to CPU1 through the PCIe bus, and is
connected to the drive backplane through the SAS signal cable. Multiple local
storage specifications are supported through different drive backplanes.
Motherboard supports 2 USB 3.0 ports and 1 TF card through CPU0.
The motherboard integrates an AST2500 management chip and supports an
external Video Graphics Array (VGA) port, management network port, serial port,
and TF card.
CPU0
xGMI 0
xGMI 1
xGMI 2
xGMI 3
iMC0
iMC1
iMC2
iMC3
xGMI 16GT/s
DDR4 CH-A
DDR4 CH-B
DDR4 CH-C
DDR4 CH-D
DDR4 CH-E
DDR4 CH-F
DDR4 CH-G
DDR4 CH-H
PE2 PE1
PE3 PE0
WAFL
Slimline x8
V/T(2)
Slimline x8
V/T(3)
Slimline x8
V/T(1)
Slimline x8
V/T(0)
PCIe 4.0 x8
xGMI 2
xGMI 3
xGMI 0
xGMI 1
xGMI 16GT/s
xGMI 16GT/s
xGMI 16GT/s
WAFL(PCIe 2.0 x1)
SPI
PCIe x1
BMC
AST2500
WAFL
SYS SPI
SPI
MUX
CPU1
iMC0
iMC1
iMC2
iMC3
DDR4 CH-A
DDR4 CH-B
DDR4 CH-C
DDR4 CH-D
DDR4 CH-E
DDR4 CH-F
DDR4 CH-F
DDR4 CH-G
Slimline x8
V/T(2)
Slimline x8
V/T(3)
Slimline x8
V/T(1)
Slimline x8
V/T(0)
PE2 PE1
PE0PE3
BMC
SPI
BIOS
Flash
SPI
BMC
Main
Flash
SPI
MAC2
RGMII
MDI
MGMT
RJ45 UART5 UART to
RS-232
Debug
COM
port
TPM
I2C(APML)
USB2.0 x1
Front VGA
Front 2x
USB3.0 CPLD I2C
LPC
FRU Temp
Sensor
I2C
VR PCIe
Endpoints
MiniSAS HD
V/T(1)
MiniSAS HD
V/T(0)
A0-1
A0-1A2-3B0-1B2-3
To PCIe
Switch
Board
for GPU
To PCIe
Switch
Board
for GPU
To PCIe
Switch
Board
for GPU
To PCIe
Switch
Board
for GPU
A0
A0-1A2-3B0-1B2-3
TF
Slot
TF
Slot
USB2.0 x1
HDT
conn
SW
RGB
MAC1
SDIO
CTL
SDIO
2X4
PWR Conn P12V_HDD
P5V_HDD
2X5
SIG Conn
EAR BD
Conn-2
FP_CTL + PWR BTN
2X4
PWR Conn
2X5
SIG Conn
x4
NVME/SATA
BP x2
x2
x2
B0-1
4-pin
header
USB3.0
Redriver
USB2.0 x2
PHY8211E
J24
J25 J22
J23 J3
J4 J26
J27
J98
Sideband
4-pins conn
J99
J94
Reserved
J143
J82
J83
J132
J43
BMC
Backup
Flash
For RAID card
(SAS3508),
SAS/SATA3 to x4
NVMe/SATA BP
SWITCH
Board
2X4
PWR Conn
2X5
PWR Conn
PDB
Module
PDB
Module
x2
x3
Max Power:600 x3
=1800W
PCIe 4.0 x8
PCIe 4.0 x8 Slimline x8
V/T(5)
Slimline x8
V/T(4)
J28
J29
B2-3 A1
Slimline x8
V/T(6)
J35
Cable from
J28
PCIe 4.0 x8 OCP2.0
Conn A
Option 1:
Option 2:
J28 cable to J35
then go on board to
OCP conn A
J36
P3V3_AUX_HDD
2X7
PWR Conn
For test convenience, only need
12V power supply ,Seer PDB,
and 2x7 power cable
Cable from
Seer PDB
Slimline x8
V/T(5)
J39
J2 Cable
J28,J29
&
J98,J99
To x4
NVMe/
SATA BP
A2-3
Slimline x8
V/T(4)
J30
Cable
J1
Std. PCIe x16 Slot
PCIe Riser
M.2 Riser
X8 Gold finger
M.2 Slot A
M.2 Slot B
J102 J101
PCIe 4.0 x4 /
SATA x1 PCIe 4.0 x4 /
SATA x1
24PIN
NCSI
CON NCSI
J125
Transformer
30PIN
LAN
CON
MGMT
RJ45
Cable J75
(Front RJ45)
J77
Rear RJ45
MDI
LAN
NI
PWR CON
PWR CON
(MB)
Power Cable
12V
VR
12V
3.3V
12V
J85
J5
2x PCIe 4.0 x4
2x PCIe 4.0 x4
Switch
Retimer
NVIDIA Redstone (4x A100 GPU)
Switch
Retimer
Switch
Retimer
Switch
Retimer
Riser

9
4.2 System Architecture
NF5448A6 uses a balanced CPU-GPU connection topology.
Figure 4-2 NF5448A6 System Architecture
The uplink bandwidth of CPU-to-GPU connections is provided via 4 PCIe 4.0 x16 cards.
This greatly increases the bandwidth for data communication between CPUs and GPUs
to prevent bottlenecks in AI training involving a large amount of data. NVIDIA®NVLink
3.0 is supported between GPUs, with up to 600 GB/s of P2P interconnection bandwidth.
The NVLink™full-interconnection topology reduces latency in case of data sharing
among multiple GPUs, thereby providing more efficient computing performance.

10
5 Hardware Description
5.1Front Panel
5.1.1 Appearance
Figure 5-1 Front Panel
1
Power Button and LED
2
UID LED and Button
3
System Reset Button
4
System Status LED
5 - 12
Drives (0 - 7)
13 - 14
USB 3.0 Slots
15
VGA Port
16
MB BMC Debug Serial Port
17
PCIe 4.0 x16 Slot
18
GPU Box
5.1.2 LED & Button
Figure 5-2 LEDs and Buttons on the Front Panel

11
1
Power Button and LED
2
UID LED and Button
3
System Reset Button
4
System Status LED
1. LED and Button Description
Table 5-1 Description of LEDs and Buttons on the Front Panel
Item
LED & Button
Description
1
Power Button and LED
Green = Power-on state
Orange = Standby state
Long press to force a system shutdown
2
UID/BMC RST
Button/LED
Turn on/off UID (Blue = UID is turned on)
Long press the button for 6 s to reset the BMC
system
3
System Reset Button
Short press to force a system reset
4
System Status LED
Off = Normal
Solid Red = A power failure occurs
Flashing red = Power state is abnormal
5.1.3 Ports
1. Port Location
Figure 5-2 Ports on the Front Panel
1
MB BMC Debug Serial Port
2
VGA Port
3
USB 3.0 Port
4
USB 3.0 Port

12
2. Port Description
Table 5-2 Description of Ports on the Front Panel
Port
Type
Quantity
Description
BMC Debug
Serial Port
Headphone
jack
1
Captures BMC logs and uses the BMC
debugging function.
The serial port uses a standard 3.5 mm
jack with a default baud rate of 115,200
bit/s.
VGA Port
DB15
1
Connects a display terminal, for example,
a monitor or keyboard, video and mouse
(KVM), to the system.
USB Port
USB 3.0
2
Connects a USB 3.0 device to the
system.
When using an external USB device, the
maximum current supported by the USB
device connected is 0.9 A.
Make sure the USB device is in good
condition or it may cause the server to
work abnormally.
5.2Rear Panel
5.2.1 Appearance
Figure 5-3 Rear Panel
1
PSU0
2
PSU1
3
Fans (0 - 5)
4
PSU2
5
PSU3
6
I/O Box A

13
7
BMC Management Network
Port
8
UID Button and LED
9
I/O Box B
5.2.2 LED & Button
Figure 5-4 LEDs on the Rear Panel
1234
7
5678
1
PSU LED
2
Fan Power LED
3
Fan Status LED
4
UID LED/BMC Reset Button
5
Data Transmit Rate LED of
Switch Board BMC
Management Network Port
6
Connection Status LED of
Switch Board BMC
Management Network Port
7
Data Transmit Rate LED of
Motherboard BMC
Management Network Port
8
Connection Status LED of
Motherboard BMC
Management Network Port
1. LED and Button Description
Table 5-3 Description of LEDs on the Rear Panel
Icon
LED
Description
N/A
PSU LED
Solid green = Normal
Off = No AC power to PSU
Solid amber = A shutdown has occurred due to a
PSU critical event
Flashing amber at 1 Hz = PSU continues operating
after a warning event has occurred
Flashing green at a rate of 1 Hz = PSU is
unplugged, but has AC input

14
Icon
LED
Description
Flashing green at 0.33 Hz (on for 2 seconds and off
for 1 second) = PSU operating in cold redundant
and sleep mode
Flashing green at 2 Hz = PSU operating in firmware
update mode
N/A
Fan Power LED
Green = Normal
Off = Fan failure
Fan Status LED
Off = Normal
Solid Red = Fan failure
UID LED/BMC
Reset Button
The UID LED is used to locate the device to be
operated.
Off = Device not located.
Solid blue = Device located.
Flashing blue = Device being remotely operated.
Turn the LED on or off either by manually pressing the UID button or
through ISBMC remote control.
Long press the UID button for over 6 s to reset the
BMC.
N/A
Data Transmit Rate
LED of
Management
Network Port
Off = Network is not connected.
Solid green = Network is connected at the speed of
1,000 Mbps.
Solid orange = Network is connected at the speed
of 100 Mbps or 10 Mbps.
N/A
Connection Status
LED of
Management
Network Port
Off = Network is not connected.
Solid green = Network connection status is normal.
Flashing green = There is network data
transmission

15
5.2.3 Ports
1. Port Location
Figure 5-5 Ports on the Rear Panel
123
1
PSU Connector
2
Switch Board BMC
Management Network Port
3
Motherboard BMC
Management Network Port
2. Port Description
Table 5-4 Description of Ports on the Rear Panel
Port
Type
Quantity
Description
PSU Connector
N/A
4
Connected through a power cable. User
can optionally configure the PSUs as
required.
Description
Make sure that the rated power of the PSU
is greater than the rated power of the
server when selecting a PSU.
Switch Board
BMC
Management
Network Port
RJ45
1
ISBMC management network port to
manage the switch board.
It is a Gigabit Ethernet port of 100/1,000 Mbps (self-
adaptive).
Motherboard
BMC
Management
Network Port
RJ45
1
ISBMC management network port to
manage the server.
It is a Gigabit Ethernet port of 100/1,000 Mbps (self-
adaptive).
5.3Processor
Supports 2 processors to install in CPU0 and CPU1 respectively.
The processors configured in the same server must be of the same model.

16
For specific system options, consult your local Inspur sales representative or refer to
Compatibility of Commodity.
Figure 5-6 Processor Location
5.4Memory
5.4.1 DDR4 DIMM
1. DIMM Identification
To determine the characteristics of a DIMM, refer to the label attached on the DIMM and
the illustrations and tables below.
Figure 5-7 DIMM Identification

17
Item
Description
Example
1
Capacity
16 GB
32 GB
64 GB
 128 GB
256 GB
2
Rank(s)
1R = Single rank
2R = Dual rank
2S2R = 3DS 2Hi 2 rank
4DR = DDP 4 rank
4R = Quad rank
3
Data width of DRAM
 x4 = 4 bits
x8 = 8 bits
4
DIMM slot type
PC4 = DDR4
5
Maximum memory speed
 2,933 MT/s
3,200 MT/s
6
CAS latency time
SDP chip based
 V = CAS 19-19-19
 Y = CAS 21-21-21
 AA = CAS 22-22-22
3DS chip based
 V = CAS 22-19-19
 Y = CAS 24-21-21
 AA = CAS 26-22-22
7
DIMM type
R = RDIMM
L = LRDIMM
2. Memory Subsystem Architecture
NF5448A6 provides 32 DIMM slots with 8 internal memory channels per processor.
Install DIMMs in the slots of active DIMM channels first. DIMMs in the standby channels
cannot be used normally if no DIMMs are installed in the active channels.
Table 5-5 Channel Composition