Intel Q9450 - Core 2 Quad Quad-Core Processor Guide

Document Number: 315594-013
Intel®Core™2 Extreme Quad-
Core Processor and Intel®Core™2
Quad Processor
Thermal and Mechanical Design Guidelines
Supporting:
Intel®Core™2 Extreme quad-core processor QX6000Δ
series at 775_VR_CONFIG_05B
Intel®Core™2 Quad processor Q6000Δseries at 105 W
Intel®Core™2 Quad processor Q6000Δseries at 95 W
Intel®Core™2 Extreme Processor QX9000

 series at
775_VR_CONFIG_05B
Intel®Core™2 Quad processor Q9000

 and Q9000S

series
Intel®Core™2 Quad processor Q8000

and Q8000S

series
August 2009

2 Thermal and Mechanical Design Guidelines
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The Intel®Core™2 Extreme quad-core processor QX6000 series, Intel®Core™2 Extreme Processor QX9000 series, Intel®
Core™2 Quad processor Q9000, Q9000S, Q8000, and Q8000S series and Intel®Core™2 Quad processor Q6000 Δseries may
contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current
characterized errata are available on request.
∆Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor
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Copyright © 2006–2009 Intel Corporation. All rights reserved.

Thermal and Mechanical Design Guidelines 3
Contents
1Introduction ...................................................................................................11
1.1 Document Goals and Scope ...................................................................11
1.1.1 Importance of Thermal Management ..........................................11
1.1.2 Document Goals......................................................................11
1.1.3 Document Scope .....................................................................12
1.2 References ..........................................................................................13
1.3 Definition of Terms ...............................................................................14
2Processor Thermal/Mechanical Information .........................................................17
2.1 Mechanical Requirements ......................................................................17
2.1.1 Processor Package...................................................................17
2.1.2 Heatsink Attach ......................................................................19
2.1.2.1 General Guidelines....................................................19
2.1.2.2 Heatsink Clip Load Requirement..................................19
2.1.2.3 Additional Guidelines.................................................20
2.2 Thermal Requirements ..........................................................................20
2.2.1 Processor Case Temperature .....................................................20
2.2.2 Thermal Profile .......................................................................21
2.2.3 TCONTROL..................................................................................23
2.3 Heatsink Design Considerations..............................................................24
2.3.1 Heatsink Size..........................................................................25
2.3.2 Heatsink Mass.........................................................................25
2.3.3 Package IHS Flatness...............................................................26
2.3.4 Thermal Interface Material........................................................26
2.4 System Thermal Solution Considerations .................................................27
2.4.1 Chassis Thermal Design Capabilities...........................................27
2.4.2 Improving Chassis Thermal Performance ....................................27
2.4.3 Summary ...............................................................................28
2.5 System Integration Considerations..........................................................28
3Thermal Metrology ..........................................................................................29
3.1 Characterizing Cooling Performance Requirements ....................................29
3.1.1 Example ................................................................................31
3.2 Processor Thermal Solution Performance Assessment ................................31
3.3 Local Ambient Temperature Measurement Guidelines.................................32
3.4 Processor Case Temperature Measurement Guidelines ...............................34
4Thermal Management Logic and Thermal Monitor Feature .....................................35
4.1 Processor Power Dissipation...................................................................35
4.2 Thermal Monitor Implementation ............................................................35
4.2.1 PROCHOT# Signal ...................................................................36
4.2.2 Thermal Control Circuit ............................................................36
4.2.2.1 Thermal Monitor .......................................................36
4.2.2.2 Thermal Monitor 2 (TM2) ...........................................37
4.2.3 Operation and Configuration .....................................................38
4.2.4 On-Demand Mode ...................................................................39

4 Thermal and Mechanical Design Guidelines
4.2.5 System Considerations.............................................................39
4.2.6 Operating System and Application Software Considerations ...........40
4.2.7 THERMTRIP# Signal.................................................................40
4.2.8 Cooling System Failure Warning ................................................40
4.2.9 Digital Thermal Sensor.............................................................41
4.2.10 Platform Environmental Control Interface (PECI)..........................42
5Intel®Thermal/Mechanical Reference Design Information .....................................43
5.1 ATX Reference Design Requirements .......................................................43
5.2 Validation Results for Reference Design ...................................................45
5.2.1 Heatsink Performance ..............................................................45
5.2.2 Acoustics ...............................................................................46
5.2.3 Altitude..................................................................................47
5.2.4 Reference Heatsink Thermal Validation .......................................47
5.2.5 Fan Performance for Active Heatsink Thermal Solution..................48
5.3 Environmental Reliability Testing ............................................................49
5.3.1 Structural Reliability Testing .....................................................49
5.3.1.1 Random Vibration Test Procedure................................49
5.3.1.2 Shock Test Procedure ................................................49
5.3.1.2.1 Recommended Test Sequence ...............................50
5.3.1.2.2 Post-Test Pass Criteria.............................................50
5.3.2 Power Cycling .........................................................................51
5.3.3 Recommended BIOS/Processor/Memory Test Procedures ..............51
5.4 Material and Recycling Requirements ......................................................51
5.5 Safety Requirements ............................................................................52
5.6 Geometric Envelope for Intel®Reference ATX Thermal Mechanical Design ....52
5.7 Reference Attach Mechanism..................................................................53
5.7.1 Structural Design Strategy........................................................53
5.7.2 Mechanical Interface to the Reference Attach Mechanism ..............54
6Intel®Quiet System Technology (Intel®QST) .....................................................57
6.1 Intel®Quiet System Technology Algorithm...............................................57
6.1.1 Output Weighting Matrix ..........................................................58
6.1.2 Proportional-Integral-Derivative (PID) ........................................58
6.2 Board and System Implementation of Intel®Quiet System Technology .......60
6.3 Intel®QST Configuration and Tuning.......................................................62
6.4 Fan Hub Thermistor and Intel®QST ........................................................62
Appendix A LGA775 Socket Heatsink Loading ......................................................................63
A.1 LGA775 Socket Heatsink Considerations ..................................................63
A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel®
Reference Design .................................................................................63
A.2.1 Heatsink Preload Requirement Limitations...................................63
A.2.2 Motherboard Deflection Metric Definition.....................................64
A.2.3 Board Deflection Limits ............................................................65
A.2.4 Board Deflection Metric Implementation Example.........................66
A.2.5 Additional Considerations .........................................................67
A.2.5.1 Motherboard Stiffening Considerations .........................68
A.3 Heatsink Selection Guidelines.................................................................68
Appendix B Heatsink Clip Load Metrology............................................................................69
B.1 Overview ............................................................................................69

Thermal and Mechanical Design Guidelines 5
B.2 Test Preparation...................................................................................69
B.2.1 Heatsink Preparation................................................................69
B.2.2 Typical Test Equipment ............................................................72
B.3 Test Procedure Examples.......................................................................72
B.3.1 Time-Zero, Room Temperature Preload Measurement...................73
B.3.2 Preload Degradation under Bake Conditions ................................73
Appendix C Thermal Interface Management.........................................................................75
C.1 Bond Line Management .........................................................................75
C.2 Interface Material Area..........................................................................75
C.3 Interface Material Performance...............................................................75
Appendix D Case Temperature Reference Metrology..............................................................77
D.1 Objective and Scope .............................................................................77
D.2 Supporting Test Equipment....................................................................77
D.3 Thermal calibration and controls.............................................................78
D.4 IHS Groove .........................................................................................79
D.5 Thermocouple Attach Procedure .............................................................84
D.5.1 Thermocouple Conditioning and Preparation ................................84
D.5.2 Thermocouple Attachment to the IHS.........................................85
D.5.3 Solder Process ........................................................................90
D.5.4 Cleaning and Completion of Thermocouple Installation..................93
D.6 Thermocouple Wire Management ............................................................96
Appendix E Balanced Technology Extended (BTX) System Thermal Considerations....................99
Appendix F Mechanical Drawings ..................................................................................... 103
Appendix G Intel®Enabled Reference Solution Information .................................................. 123

6 Thermal and Mechanical Design Guidelines
Figures Figure 1. Package IHS Load Areas .....................................................................17
Figure 2. Processor Case Temperature Measurement Location ...............................21
Figure 3. Example Thermal Profile .....................................................................23
Figure 4. Processor Thermal Characterization Parameter Relationships....................30
Figure 5. Locations for Measuring Local Ambient Temperature, Active Heatsink ........33
Figure 6. Locations for Measuring Local Ambient Temperature, Passive Heatsink ......33
Figure 7. Thermal Monitor Control .....................................................................37
Figure 8. Thermal Monitor 2 Frequency and Voltage Ordering ................................38
Figure 9. TCONTROL for Digital Thermometer ..........................................................41
Figure 10. Intel®RCFH-4 Reference Design - Exploded View .................................43
Figure 11. Intel D60188-001 Reference Design ─Exploded View............................44
Figure 12. Bottom View of Copper Core Applied by TC-1996 Grease .......................45
Figure 13. Random Vibration PSD......................................................................49
Figure 14. Shock Acceleration Curve ..................................................................50
Figure 15. Upward Board Deflection During Shock ...............................................53
Figure 16. Reference Clip/Heatsink Assembly ......................................................54
Figure 17. Critical Parameters for Interfacing to Reference Clip..............................55
Figure 18. Critical Core Dimension.....................................................................55
Figure 19. Intel®Quiet System Technology Overview ...........................................58
Figure 20. PID Controller Fundamentals .............................................................59
Figure 21. Intel®Quiet System Technology Platform Requirements ........................60
Figure 22. Example Acoustic Fan Speed Control Implementation............................61
Figure 23. Digital Thermal Sensor and Thermistor................................................62
Figure 24. Board Deflection Definition ................................................................65
Figure 25. Example: Defining Heatsink Preload Meeting Board Deflection Limit ........67
Figure 26. Load Cell Installation in Machined Heatsink Base Pocket (Bottom View) ...70
Figure 27. Load Cell Installation in Machined Heatsink Base Pocket (Side View)........71
Figure 28. Preload Test Configuration.................................................................71
Figure 29. Omega Thermocouple.......................................................................78
Figure 30. 775-LAND LGA Package Reference Groove Drawing at 6 o’clock Exit ........80
Figure 31. 775-LAND LGA Package Reference Groove Drawing at 3 o’clock Exit
(Old Drawing)..................................................................................81
Figure 32. IHS Groove at 6 o’clock Exit on the 775-LAND LGA Package ...................83
Figure 33. IHS Groove Orientation at 6 o’clock Exit Relative to the LGA775 Socket ...83
Figure 34. Inspection of Insulation on Thermocouple............................................84
Figure 35. Bending the Tip of the Thermocouple ..................................................85
Figure 36. Securing Thermocouple Wires with Kapton* Tape Prior to Attach ............85
Figure 37. Thermocouple Bead Placement...........................................................86
Figure 38. Position Bead on the Groove Step.......................................................87
Figure 39. Detailed Thermocouple Bead Placement ..............................................87
Figure 40. Third Tape Installation ......................................................................88
Figure 41. Measuring Resistance between Thermocouple and IHS ..........................88
Figure 42. Applying Flux to the Thermocouple Bead .............................................89
Figure 43. Cutting Solder .................................................................................89
Figure 44. Positioning Solder on IHS..................................................................90
Figure 45. Solder Station Setup ........................................................................91
Figure 46. View Through Lens at Solder Station...................................................92
Figure 47. Moving Solder back onto Thermocouple Bead ....................................... 92
Figure 48. Removing Excess Solder ...................................................................93
Figure 49. Thermocouple Placed into Groove.......................................................94
Figure 50. Removing Excess Solder ...................................................................94
Figure 51. Filling Groove with Adhesive ..............................................................95

Thermal and Mechanical Design Guidelines 7
Figure 52. Application of Accelerant ...................................................................95
Figure 53. Removing Excess Adhesive from IHS ..................................................95
Figure 54. Finished Thermocouple Installation .....................................................96
Figure 55. Thermocouple Wire Management........................................................97
Figure 56. System Airflow Illustration with System Monitor Point Area Identified .... 100
Figure 57. Thermal Sensor Location Illustration ................................................. 101
Figure 58. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 1.................................. 104
Figure 59. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 2.................................. 105
Figure 60. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 3.................................. 106
Figure 61. Balanced Technology Extended (BTX) Thermal Module Keep Out
Volumetric – Sheet 1 ...................................................................... 107
Figure 62. Balanced Technology Extended (BTX) Thermal Module Keep Out
Volumetric – Sheet 2 ...................................................................... 108
Figure 63. Balanced Technology Extended (BTX) Thermal Module Keep Out
Volumetric – Sheet 3 ...................................................................... 109
Figure 64. Balanced Technology Extended (BTX) Thermal Module Keep Out
Volumetric – Sheet 4 ...................................................................... 110
Figure 65. Balanced Technology Extended (BTX) Thermal Module Keep Out
Volumetric – Sheet 5 ...................................................................... 111
Figure 66. ATX Reference Clip – Sheet 1........................................................... 112
Figure 67. ATX Reference Clip - Sheet 2 ........................................................... 113
Figure 68. Reference Fastener - Sheet 1........................................................... 114
Figure 69. Reference Fastener - Sheet 2........................................................... 115
Figure 70. Reference Fastener - Sheet 3........................................................... 116
Figure 71. Reference Fastener - Sheet 4........................................................... 117
Figure 72. Intel®RCFH4 Reference Solution Assembly........................................ 118
Figure 73. Intel®RCFH4 Reference Solution Assembly - Page 2 ........................... 119
Figure 74. Intel®D60188-001 Reference Solution Assembly................................ 120
Figure 75. Intel®D60188-001 Reference Solution Heatsink ................................. 121

8 Thermal and Mechanical Design Guidelines
Tables Table 1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions...............27
Table 2. Heatsink Inlet Temperature of Intel®Boxed Processor thermal solutions .....27
Table 3. ATX Reference Heatsink Performance (RCFH-4) for 775_VR_CONFIG 05B
Processors .........................................................................................45
Table 4. ATX Reference Heatsink Performance (D60188-001) for Listed
Processors at 95 W..............................................................................46
Table 5. Acoustic Results for ATX Reference Heatsink (RCFH-4) .............................46
Table 6. Acoustic Results for ATX Reference Heatsink (D60188-001) ......................46
Table 7. Fan Electrical Performance Requirements ...............................................48
Table 8. Board Deflection Configuration Definitions ..............................................64
Table 9. Typical Test Equipment........................................................................72
Table 10. Intel®Representative Contact for Licensing Information of RCFH-4
and BTX......................................................................................... 123
Table 11. RCFH-4 Reference Thermal Solution Providers ..................................... 123
Table 12. D60188-001 Reference Thermal Solution Providers .............................. 124
Table 13. Balanced Technology Extended (BTX) Thermal Solution Providers .......... 124

Thermal and Mechanical Design Guidelines 9
Revision History
Revision
Number Description Date
-001 Initial Release. November
2006
-002 Added specifications for Intel®Core™2 Quad Processor
Q6600
January 2007
-003 Updated QX6800 series at the 775_VR_CONFIG_05B
thermal information
Updated Q6000 series at 105 W thermal information
Updated TC attach procedure for the new groove direction
Added Q6000 series at 95 W thermal information
Added D60188-001 reference design
July 2007
-004 Added Q6600 at 95 W. July 2007
-005 Added QX6800 August 2007
-006 Added Intel®Core™2 Extreme processor QX9650
Removed Legacy Fan Speed Control appendix.
November
2007
-007 Added Intel®Core™2 Quad processors Q9550, Q9450, and
Q9300
January 2008
-008 Added Intel®Core™2 Quad processors Q9650 and Q9400 August 2008
-009 Added Intel®Core™2 Quad processors Q8200 August 2008
-010 Added Intel®Core™2 Quad processors Q8300 December 2008
-011 Added Intel®Core™2 Quad processor Q9000S and Q8000s
series – Q9550S, Q9400S, and Q8200S
January 2008
-012 Added Intel®Core™2 Quad processor Q8400 and Q8400S April 2009
-013 Added Intel®Core™2 Quad processor Q9505 and Q9505S August 2009
§

10 Thermal and Mechanical Design Guidelines