Table of Contents
1. INTRODUCTION ............................................................................................................................................8
1.1 Purpose .............................................................................................................................................................8
1.2 Overview ...........................................................................................................................................................8
1.3 List of Acronyms................................................................................................................................................8
1.4 Terminlogy Description...................................................................................................................................10
1.5 References ......................................................................................................................................................10
2. ARCHITECTURE AND DESIGN....................................................................................................................... 11
2.1 i.MX 8M Mini SODIMM Development Platform Block Diagram.....................................................................11
2.2 i.MX 8M Mini SODIMM Development Platform Features..............................................................................12
2.3 SODIMM Edge Connector ...............................................................................................................................14
2.4 Serial Interface Features.................................................................................................................................26
2.4.1 Debug UART ................................................................................................................................................26
2.4.2 Data UART Header ......................................................................................................................................27
2.5 Communication Features................................................................................................................................28
2.5.1 10/100/1000Mbps Ethernet -1 ...................................................................................................................28
2.5.2 10/100/1000 Mbps Ethernet-2 (Optional)..................................................................................................29
2.5.3 USB2.0 Device .............................................................................................................................................30
2.5.4 USB2.0 Host.................................................................................................................................................31
2.5.5 MicroSD Slot................................................................................................................................................32
2.6 High Speed Interfaces.....................................................................................................................................33
2.6.1 Mini PCIe Port..............................................................................................................................................33
2.7 Audio/Video Features.....................................................................................................................................36
2.7.1 Audio IN/OUT Jack ......................................................................................................................................36
2.8 Additional Features.........................................................................................................................................37
2.8.1 MIPI CSI Camera Connector ........................................................................................................................37
2.8.2 MIPI DSI Display Interface Connector..........................................................................................................39
2.8.3 Boot Mode Switch .......................................................................................................................................41
2.8.4 Reset Switch ................................................................................................................................................42
2.8.5 Power On/Off Switch...................................................................................................................................42
2.8.6 JTAG Header................................................................................................................................................43
2.8.7 RTC Coin Cell Holder....................................................................................................................................45
2.9 Expansion Header ...........................................................................................................................................46
2.10 GPIO Header....................................................................................................................................................47
3. TECHNICAL SPECIFICATION.......................................................................................................................... 49
3.1 Electrical Characteristics .................................................................................................................................49
3.1.1 Power Input Requirement ...........................................................................................................................49
3.2 Environmental Characteristics........................................................................................................................51
3.2.1 Environmental Specification........................................................................................................................51
3.2.2 RoHS Compliance ........................................................................................................................................51
3.2.3 Electrostatic Discharge................................................................................................................................51