iWave iW-RainboW-G27D User manual

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i.MX 8 QM/QP Qseven Development Platform Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
iW-RainboW-G27D
i.MX8 QuadMax/QuadPlus
Qseven Development Platform
Hardware User Guide

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i.MX 8 QM/QP Qseven Development Platform Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
Document Revision History
Document Number
iW-PRGMZ-UM-01-R1.0-REL1.0-Hardware-i.MX8-DevKit
Revision
Date
Description
1.0
18th Jan 2022
Official Release Version
PROPRIETARY NOTICE: This document contains proprietary material for the sole use of the intended recipient(s). Do
not read this document if you are not the intended recipient. Any review, use, distribution or disclosure by others is
strictly prohibited. If you are not the intended recipient (or authorized to receive for the recipient), you are hereby
notified that any disclosure, copying distribution or use of any of the information contained within this document is
STRICTLY PROHIBITED. Thank you. “iWave Systems Tech. Pvt. Ltd.”

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Disclaimer
iWave Systems reserves the right to change details in this publication including but not limited to any Product
specification without notice.
No warranty of accuracy is given concerning the contents of the information contained in this publication. To the
extent permitted by law no liability (including liability to any person by reason of negligence) will be accepted by iWave
Systems, its subsidiaries or employees for any direct or indirect loss or damage caused by omissions from or
inaccuracies in this document.
CPU and other major components used in this product may have several silicon errata associated with it. Under no
circumstances, iWave Systems shall be liable for the silicon errata and associated issues.
Trademarks
All registered trademarks, product names mentioned in this publication are the property of their respective owners
and used for identification purposes only.
Certification
iWave Systems Technologies Pvt. Ltd. is an ISO 9001:2015 Certified Company.
Warranty & RMA
Warranty support for Hardware: 1 Year from iWave or iWave's EMS partner.
For warranty terms, go through the below web link,
http://www.iwavesystems.com/support/warranty.html
For Return Merchandise Authorization (RMA), go through the below web link,
http://www.iwavesystems.com/support/rma.html
Technical Support
iWave Systems technical support team is committed to provide the best possible support for our customers so that
our Hardware and Software can be easily migrated and used.
For assistance, contact our Technical Support team at,
Email : [e-mail]
Website : www.iwavesystems.com
Address : iWave Systems Technologies Pvt. Ltd.
# 7/B, 29th Main, BTM Layout 2nd Stage,
Bengaluru, Karnataka,
India –560076

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i.MX 8 QM/QP Qseven Development Platform Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
Table of Contents
1. INTRODUCTION ............................................................................................................................................8
1.1 PURPOSE.............................................................................................................................................................. 8
1.2 OVERVIEW ........................................................................................................................................................... 8
1.3 LIST OF ACRONYMS................................................................................................................................................ 8
1.4 TERMINOLOGY DESCRIPTION .................................................................................................................................10
1.5 REFERENCES ....................................................................................................................................................... 10
2. ARCHITECTURE AND DESIGN....................................................................................................................... 11
2.1 I .MX 8QM/QP QSEVEN DEVELOPMENT PLATFORM BLOCK DIAGRAM....................................................................... 11
2.2 I.MX 8QM/QP QSEVEN DEVELOPMENT PLATFORM FEATURES .................................................................................12
2.3 QSEVEN MXM CONNECTOR .................................................................................................................................14
2.3.1 Qseven PCB Edge Connector Pin Assignment..............................................................................................15
2.4 SERIAL INTERFACE FEATURES .................................................................................................................................32
2.4.1 Debug UART Interface.................................................................................................................................32
2.4.2 Data UART Interface ...................................................................................................................................33
2.5 HIGH SPEED INTERFACE FEATURES .........................................................................................................................34
2.5.1 PCIe Interface ..............................................................................................................................................34
2.5.2 M.2 SATA Interface .....................................................................................................................................36
2.5.3 Nano SIM Connecter: - ................................................................................................................................41
2.5.4 USB3.0 Host Interface .................................................................................................................................42
2.6 COMMUNICATION INTERFACE FEATURES .................................................................................................................43
2.6.1 Gigabit Ethernet Interface...........................................................................................................................43
2.6.2 USB2.0 OTG Interface..................................................................................................................................44
2.6.3 SDIO Interface .............................................................................................................................................45
2.6.4 CAN Interface ..............................................................................................................................................46
2.7 AUDIO/VIDEO FEATURES ......................................................................................................................................47
2.7.1 HDMI Interface............................................................................................................................................47
2.7.2 Display Port Interface..................................................................................................................................48
2.7.3 I2S Audio Interface......................................................................................................................................49
2.7.4 7” LCD with Capacitive Touch .....................................................................................................................50
2.7.5 LVDS Port with Resistive Touch ...................................................................................................................53
2.8 ADDITIONAL FEATURES.........................................................................................................................................55
2.8.1 SPI Flash ......................................................................................................................................................55
2.8.2 RTC Coin Cell Holder....................................................................................................................................55
2.8.3 Fan Header..................................................................................................................................................56
2.8.4 JTAG Header (Optional)...............................................................................................................................57
2.8.5 USB2.0 Header ............................................................................................................................................58
2.9 ON BOARD SWITCHES ..........................................................................................................................................59
2.9.1 Power ON/OFF Switch.................................................................................................................................59
2.9.2 Reset Switch ................................................................................................................................................60
2.9.3 Board Configuration Switch ........................................................................................................................61
2.1 SOM EXPANSION CONNECTORS ............................................................................................................................63

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2.2 POWER AND IO HEADERS .....................................................................................................................................64
2.3 CARRIER BOARD EXPANSION CONNECTORS.............................................................................................................. 65
3. TECHNICAL SPECIFICATION.......................................................................................................................... 74
3.1 POWER INPUT REQUIREMENT................................................................................................................................74
3.2 POWER OUTPUT SPECIFICATION.............................................................................................................................75
3.3 ENVIRONMENTAL CHARACTERISTICS .......................................................................................................................76
3.3.1 Environmental Specification........................................................................................................................76
3.3.2 RoHS Compliance ........................................................................................................................................76
3.3.3 Electrostatic Discharge................................................................................................................................76
3.4 MECHANICAL CHARACTERISTICS............................................................................................................................. 77
3.4.1 i.MX 8 QM/QP Qseven Carrier Board Mechanical Dimensions...................................................................77
3.4.2 Guidelines to insert the Qseven SOM into Carrier Board............................................................................79
4. ORDERING INFORMATION .......................................................................................................................... 80

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List of Figures
FIGURE 1: I.MX 8QM/QP QSEVEN DEVELOPMENT PLATFORM BLOCK DIAGRAM............................................................................ 11
FIGURE 2: QSEVEN MXM CONNECTOR............................................................................................................................................. 14
FIGURE 3: DEBUG UART PORT ......................................................................................................................................................... 32
FIGURE 4: DATA UART HEADER ...................................................................................................................................................... 33
FIGURE 5: M.2 PCIE CONNECTOR ..................................................................................................................................................... 34
FIGURE 6: M.2 SATA CONNECTOR ................................................................................................................................................... 37
FIGURE 7: NANO SIM CONNECTOR .................................................................................................................................................... 41
FIGURE 8: USB3.0 HOST ................................................................................................................................................................... 42
FIGURE 9: RJ45 MAGJACK................................................................................................................................................................. 43
FIGURE 10: USB2.0 OTG.................................................................................................................................................................. 44
FIGURE 11:STANDARD SD CONNECTOR ............................................................................................................................................ 45
FIGURE 12: CAN HEADER................................................................................................................................................................. 46
FIGURE 13: HDMI OUTPUT ............................................................................................................................................................... 47
FIGURE 14: DISPLAY PORT................................................................................................................................................................. 48
FIGURE 15: AUDIO JACK.................................................................................................................................................................... 49
FIGURE 16: 7” RGB LCD CONNECTOR.............................................................................................................................................. 50
FIGURE 17: CAPACITIVE TOUCH CONNECTOR .................................................................................................................................... 52
FIGURE 18: LVDS DISPLAY CONNECTOR.......................................................................................................................................... 53
FIGURE 19: RTC BATTERY HOLDER.................................................................................................................................................. 55
FIGURE 20: FAN HEADER................................................................................................................................................................... 56
FIGURE 21: JTAG HEADER................................................................................................................................................................ 57
FIGURE 22: USB2.0 HEADER............................................................................................................................................................. 58
FIGURE 23: POWER ON/OFF SWITCH................................................................................................................................................ 59
FIGURE 24: RESET SWITCH................................................................................................................................................................ 60
FIGURE 25: BOARD CONFIGURATION SWITCH ................................................................................................................................... 61
FIGURE 26: SOM EXPANSION CONNECTORS ..................................................................................................................................... 63
FIGURE 27: CARRIER BOARD EXPANSION CONNECTORS ................................................................................................................... 66
FIGURE 28: POWER JACK................................................................................................................................................................... 74
FIGURE 29: MECHANICAL DIMENSIONS OF I.MX 8QM/QP QSEVEN CARRIER BOARD-TOP VIEW.................................................... 77
FIGURE 30: MECHANICAL DIMENSIONS OF I.MX 8QM/QP QSEVEN CARRIER BOARD-BOTTOM VIEW ............................................ 78
FIGURE 31: MECHANICAL DIMENSIONS OF I.MX 8QM/QP QSEVEN CARRIER BOARD -SIDE VIEW.................................................. 79
FIGURE 32: SOM INSERTION GUIDELINE........................................................................................................................................... 79

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List of Tables
TABLE 1: ACRONYMS &ABBREVIATIONS ........................................................................................................................................... 8
TABLE 2: TERMINOLOGY................................................................................................................................................................... 10
TABLE 3: QSEVEN PCB EDGE CONNECTOR PIN ASSIGNMENT........................................................................................................... 15
TABLE 4: DATA UART HEADER PINOUT........................................................................................................................................... 33
TABLE 5: M.2 PCIE CONNECTOR PINOUT.......................................................................................................................................... 34
TABLE 6: M.2 SATA CONNECTOR PINOUT........................................................................................................................................ 37
TABLE 7: NANO SIM CONNECTOR PINOUT.......................................................................................................................................... 41
TABLE 8: CAN HEADER PINOUT ....................................................................................................................................................... 46
TABLE 9: 7” RGB LCD CONNECTOR PINOUTS.................................................................................................................................. 51
TABLE 10: CAPACITIVE TOUCH CONNECTOR PINOUTS....................................................................................................................... 52
TABLE 11: LVDS CONNECTOR PINOUT............................................................................................................................................. 53
TABLE 12: FAN HEADER PIN OUT...................................................................................................................................................... 56
TABLE 13: USB2.0 HEADER.............................................................................................................................................................. 58
TABLE 14: BOARD CONFIGURATION SWITCH .................................................................................................................................... 62
TABLE 15:CARRIER EXPANSION CONNECTOR1PIN OUT .................................................................................................................. 66
TABLE 16: CARRIER EXPANSION CONNECTOR 1PIN OUT.................................................................................................................. 70
TABLE 17: POWER INPUT REQUIREMENT........................................................................................................................................... 75
TABLE 18: POWER OUTPUT SPECIFICATION....................................................................................................................................... 75
TABLE 19: ENVIRONMENTAL SPECIFICATION .................................................................................................................................... 76
TABLE 20: ORDERABLE PRODUCT PART NUMBERS........................................................................................................................... 80

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1. INTRODUCTION
1.1 Purpose
This document is the Hardware User Guide for the i.MX 8 QM/QP Qseven V2.1 Development platform “iW-RainboW-
G27D” based on the NXP’s i.MX8 Application processor. This board is fully supported by iWave Systems Technologies
Pvt. Ltd. This Guide provides detailed information on the overall design and usage of the i.MX 8 QM/QP based Qseven
development platform from a Hardware Systems perspective. Complete information about the i.MX 8 QM/QP Qseven
SOM is explained in another document “iW-RainboW-G27M_i.MX8QM_QP_Qseven_SOM-HardwareUserGuide”.
1.2 Overview
The Qseven V2.1 concept is an off-the-shelf, multi-vendor, Computer-On-Module that integrates all the core
components of a common PC and is mounted onto an application specific carrier board.
iW-RainboW-G27D Development Platform comes with Qseven V2.1 Generic Carrier, i.MX 8 QM/QP based Qseven V2.1
SOM. The development board can be used for quick prototyping of various applications targeted by the i.MX8
processor. With 120mmx120mm Nano ITX size, Qseven carrier board is highly packed with all the necessary on-board
connectors to validate the Qseven features of i.MX 8 QM/QP Qseven SOM.
1.3 List of Acronyms
The following acronyms will be used throughout this document.
Table 1: Acronyms & Abbreviations
Acronyms
Abbreviations
CAN
Controller Area Network
CMOS
Complementary Metal-Oxide Semiconductor
CPU
Central Processing Unit
CSI
Camera Serial Interface
DP
Display Port
DSI
Display Serial Interface
eMMC
Enhanced Multi Media Card
GB
Giga Byte
Gbps
Gigabits per sec
GPIO
General Purpose Input Output
HDMI
High-Definition Multimedia Interface
Hz
Hertz
I2C
Inter-Integrated Circuit
I2S
Inter-IC Sound
IC
Integrated Circuit
LVDS
Low Voltage Differential Signalling

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Acronyms
Abbreviations
MIPI
Mobile Industry Processor Interface
MLB
Media Local Bus
MXM
Mobile PCI Express Module
PCB
Printed Circuit Board
PCIe
Peripheral Component Interconnect Express
RoHS
Restriction of Hazardous Substances
RTC
Real Time Clock
SATA
Serial Advanced Technology Attachment
SD
Secure Digital
SOM
System On Module
TBD
To Be Defined
UART
Universal Asynchronous Receiver/Transmitter
USB
Universal Serial Bus
USB OTG
USB On The Go
V
Voltage

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1.4 Terminology Description
In this document, wherever Signal Type is mentioned, below terminology is used.
Table 2: Terminology
Terminology
Description
I
Input Signal
O
Output Signal
IO
Bidirectional Input/output Signal
CMOS
Complementary Metal Oxide Semiconductor Signal
DIFF
Differential Signal
LVDS
Low Voltage Differential Signal
GBE
Gigabit Ethernet Media Dependent Interface differential pair signals
USB HS
Universal Serial Bus High Speed differential pair signals
USB SS
Universal Serial Bus Super Speed differential pair signals
MIPI
Mobile Industry Processor Interface signals
HDMI
High-Definition Multimedia Interface Differential Signal
DP
Display Port Differential Signal
OD
Open Drain Signal
OC
Open Collector Signal
Power
Power Pin
PU
Pull Up
PD
Pull Down
NA
Not Applicable
NC
Not Connected
Note: Signal Type does not include internal pull-ups or pull-downs implemented by the chip vendors and only includes
the pull-ups or pull-downs implemented On- Qseven SOM.
1.5 References
•IMX8QMAEC_Revx.pdf
•iMX8QM_RM_Rev_x.pdf
•Qseven® Specification Version 2.1
•Qseven® Design Guide 2.0

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2. ARCHITECTURE AND DESIGN
This section provides detailed information about the i.MX 8 QM/QP Qseven SOM features and Hardware architecture
with high level block diagram.
2.1 I .MX 8 QM/QP Qseven Development Platform Block Diagram
Figure 1: i.MX 8 QM/QP Qseven Development Platform Block Diagram

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2.2 i.MX 8 QM/QP Qseven Development Platform Features
The NXP’s i.MX8 QM/QP Qseven carrier board supports the following features to validate the NXP’s i.MX8 QM/QP
Qseven SOM Edge connector interface.
Serial Interface Features
•Debug UART through USB Micro AB Connector
•Data UART x 1 Port through Header
High Speed Interface Features
•M.2 PCIe connector
•M.2 SATA Connector
•USB 3.0 Host x 2 Port through USB 3.0 Type A Connector1
Communication Features
•10/100/1000Mbps Ethernet through RJ45MagJack
•USB 2.0 Host x 1 Port through Type A Connector (Dual stack USB 3.0 - Top)
•USB 2.0 OTG x 1 Port through Micro AB Connector
•SDHC/SDIO (4bit) x 1 Port through Standard SD Connector
•CAN x 1 Port Through Header
Audio/Video Features
•I2S Audio Codec with 3.5mm Audio IN and OUT jack
•HDMI X 1 Port through Type A Connector
•DP x 1 Port Through Type A Connecter2(Optional Shared With HDMI)
•7’’ RGB Display Connector through LVDS to RGB Transmitter with Capacitive Touch
•2nd LVDS Port display Connector
Additional Features
•SPI Flash
•RTC Coin Cell holder
•Buzzer
•Fan Header
•20 - Pin JTAG Header
On Board Switches
•Power ON/OFF Switch
•Board Configuration Switch
•Reset Switch

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Carrier board Expansion Connector: 1
•MIPI_DSI x 2
•HDMI_RX x1
•CAN x 2
•ENET x1
Carrier board Expansion Connector: 2
•LVDS_0 x 1
•SNVS_TAMPER X1
•MLB x1
•SPI X 1
•USB 2.0 x 1
•USB 3.0 x 1
•QSPI x 1
•ESAI x 1
General Specification
•Power Supply : 12V, 2A Power Input Jack
•Temperature Supported : 0°C to +60°C
•Form Factor : 120mm X 120mm Nano ITX
1.Either USB 2.0 in Mini PCIe connector or USB 3.0 Type A TOP connector can be supported at a time. Anyone can be
selected using on Board Switches.

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2.3 Qseven MXM Connector
The i.MX 8 QM/QP Qseven carrier board supports 230Pin Qseven MXM Edge mating connector for Qseven SOM
attachment. This standard 230-pin robust connector is capable of handling high-speed serialized signals and can be
used for size constrained embedded applications. This Qseven MXM connector (J13) is physically located at the top of
the board as shown below.
Figure 2: Qseven MXM Connector

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2.3.1 Qseven PCB Edge Connector Pin Assignment
Table 3: Qseven PCB Edge Connector Pin Assignment
Pin
No.
Qseven MXM
Connector Pin
Name
Signal Name
CPU Ball
Name/
Pin Number
Signal Type/
Termination
Description
1
GND
GND
NA
Power
Ground.
2
GND
GND
NA
Power
Ground.
3
GBE_MDI3-
GBE0_MDI3-
NA
IO, DIFF
Gigabit Ethernet MDI differential
pair 3 negative.
4
GBE_MDI2-
GBE0_MDI2-
NA
IO, DIFF
Gigabit Ethernet MDI differential
pair 2 negative.
5
GBE_MDI3+
GBE0_MDI3+
NA
IO, DIFF
Gigabit Ethernet MDI differential
pair 3 positive.
6
GBE_MDI2+
GBE0_MDI2+
NA
IO, DIFF
Gigabit Ethernet MDI differential
pair 2 positive.
7
GBE_LINK100#
GBE0_LINK100#
NA
I, 3.3V CMOS
100Mbps Ethernet link status LED.
8
GBE_LINK1000#
GBE0_LINK1000#
NA
I, 3.3V CMOS
Gigabit Ethernet link status LED
9
GBE_MDI1-
GBE0_MDI1-
NA
IO, DIFF
Gigabit Ethernet MDI differential
pair 1 negative.
10
GBE_MDI0-
GBE0_MDI0-
NA
IO, DIFF
Gigabit Ethernet MDI differential
pair 0 negative.
11
GBE_MDI1+
GBE0_MDI1+
NA
IO, DIFF
Gigabit Ethernet MDI differential
pair 1 positive.
12
GBE_MDI0+
GBE0_MDI0+
NA
IO, DIFF
Gigabit Ethernet MDI differential
pair 0 positive.
13
GBE_LINK#
GPHY_LINK_LED
NA
I, 3.3V CMOS
Gigabit Ethernet link status LED. -
This pin is connected to indication
LED D24
14
GBE_ACT#
GBE0_LINK_ACT#
NA
I, 3.3V CMOS
Gigabit Ethernet Activity status LED.
15
GBE_CTREF
VPHY0_DVDDL
NA
Power
Power for the Centre Tap of Mack
Jack connector
16
SUS_S5#
SUS_S5_Q7
NA
I, 3.3V CMOS
/10K PU
S5 State.
This pin is connected to indication
LED D16.
17
WAKE#
WAKE#(GPIO3_04)
SPI0_SDI/
BA5
O, 3.3V CMOS
This pin is connected to Push button
(SW5) in carrier board.
18
SUS_S3#
SUS_S3_Q7
NA
I, 3.3V
CMOS/10K PU
S3 state.
This pin is connected to indication
LED D13.
.
19
SUS_STAT#
SUS_STAT_Q7(GPI
O2_05)
ESAI1_FST/
BF12
I, 3.3V
CMOS/10K PU
Suspend Status.

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Pin
No.
Qseven MXM
Connector Pin
Name
Signal Name
CPU Ball
Name/
Pin Number
Signal Type/
Termination
Description
This pin is connected to indication
LED D15.
20
PWRBTN#
PWRBTN#
ON_OFF_BUT
TON/
BE47
O, 3.3V
CMOS/10K PU
Power Button output.
This pin is connected to Push button
(SW3) in the carrier board used for
SOM On/Off control.
21
SLP_BTN#
GPII_1(GPIO0_04)
LSIO.GPIO0.I
O04/
AT48
O, 3.3V CMOS
This pin is connected to Push button
(SW7) in carrier board.
22
LID_BTN#
GPII_0(GPIO3_03)
SPI0_SDO/
AY6
I, 3.3V CMOS
This pin is connected from Config
Connecter(J12) 1st Pin with
Grounded 2nd pin.
23
GND
GND
NA
Power
Ground.
24
GND
GND
NA
Power
Ground.
Key
25
GND
GND
NA
Power
Ground.
26
PWGIN
PWGIN
NA
O, 5V CMOS/
10K PU
Power Good Output.
27
BATLOW#
GPII_2(GPIO0_05)
LSIO.GPIO0.I
O05/ AP46
I, 3.3V CMOS
This pin is connected from Config
Connecter (J12) 5th Pin with
Grounded 6th pin.
28
RSTBTN#
RSTBN
NA
O, 3.3V CMOS
Active low Reset button Output.
This pin is connected to Push button
SW4 in carrier board for reset
generation.
It’s Connected with JTAG
29
SATA0_TX+
PCIE_SATA0_TX0_P
PCIE_SATA0_
TX0_P/ B16
I, SATA
This pin is connected to M.2 SATA
Connector (J33) for SATA Channel0
Transmit differential pair positive.
30
SATA1_TX+
NC
NA
NC
NC in i.MX8 Qseven SOM.
This pin connected to 7pin SATA
Connector (J20) in carrier board.
(Optional)
31
SATA0_TX-
PCIE_SATA0_TX0_
N
PCIE_SATA0_
TX0_N/ C17
I, SATA
This pin connected to M.2 SATA
Connector (J33) for SATA Channel0
Transmit differential pair negative.
32
SATA1_TX-
NC
NA
NA
NC in i.MX8 Qseven SOM.
This pin connected to 7pin SATA
Connector (J20) in carrier board.
(Optional)

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Pin
No.
Qseven MXM
Connector Pin
Name
Signal Name
CPU Ball
Name/
Pin Number
Signal Type/
Termination
Description
33
SATA_ACT#
GPIO_SATA_ACT#(
GPIO1_18)
MIPI_DSI0_
GPIO0_00/B
D30
I, 3.3V CMOS
This pin connected from M.2 SATA
Connector (J33) for SATA Channel0
command Activity line. It’s
Connected with D9 Indicating LED
And Optionally Connected with J31
Command Activity Line
34
GND
GND
NA
Power
Ground.
35
SATA0_RX+
PCIE_SATA0_RX0_
P
PCIE_SATA0_
RX0_P/ A19
I, SATA
This pin connected to M.2 SATA
Connector (J33) for SATA Channel0
Receive differential pair positive.
36
SATA1_RX+
NC
NA
-
NC in i.MX8 Qseven SOM.
This pin connected to 7pin SATA
Connector (J20) in carrier board.
(optional)
37
SATA0_RX-
PCIE_SATA0_RX0_
N
PCIE_SATA0_
RX0_N/ B20
I, SATA
NC in i.MX8 Qseven SOM.
This pin connected to 22pin SATA
Connector (J25) for SATA Channel0
Receive differential pair negative.
38
SATA1_RX-
NC
NA
NA
NC in i.MX8 Qseven SOM.
This pin connected to 7pin SATA
Connector (J20) in carrier board.
(optional)
39
GND
GND
Power
Ground.
40
GND
GND
Power
Ground.
41
BIOS_DISABLE#/
BOOT_ALT#
NC
NA
NA
NC in i.MX8 Qseven SOM
This pin is connected from Config
Connecter (J12) 3rd Pin with
Grounded 4th pin.
42
SDIO_CLK#
uSDHC1_CLK
USDHC1_CLK
/J39
I, 3.3V CMOS
uSDHC1 Clock.
This pin is connected to SD/MMC
connector(J28)./Optionally
Connected With (J27) Micro Sd
43
SDIO_CD#
GPIO_SDC1_CD(GP
IO1_23)
MIPI_DSI1_G
PIO0_01
/BK24
O, 3.3V CMOS
uSDHC1 Card Detect.
This pin is connected from SD/MMC
connector(J28)/Optionally
Connected With (J27) Micro Sd
44
SDIO_LED
GPIO_SD1_LED(GPI
O3_06)
SPI0_CS1/
BA3
I, 3.3V CMOS
This pin is connected to Power I/O
Header (J3)

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Pin
No.
Qseven MXM
Connector Pin
Name
Signal Name
CPU Ball
Name/
Pin Number
Signal Type/
Termination
Description
45
SDIO_CMD
uSDHC1_CMD
USDHC1_CM
D /G41
IO,3.3VCMOS
uSDHC1 command.
This pin is connected to SD/MMC
connector(J28)./Optionally
Connected With (J27) Micro Sd
46
SDIO_WP
GPIO_SDC1_WP(G
PIO1_22)
MIPI_DSI1_G
PIO0_00/BM
24
O, 3.3V CMOS
uSDHC1 Write Protect.
This pin is connected to SD/MMC
connector(J28)./Optionally
Connected With (J27) Micro Sd
47
SDIO_PWR#
GPIO_SDC1_PWR_
EN(GPIO1_19)
MIPI_DSI0_G
PIO0_01/BD2
8
I, 3.3V CMOS/
10K PD
SD/MMC Interface Power Enable.
This pin is used control the power
input to the SD/MMC
connector.(J28),Optionally
Connected With (J27) Micro Sd
48
SDIO_DAT1
uSDHC1_DATA1
USDHC1_DAT
A1 /F38
IO, 3.3V CMOS
uSDHC1 Data1.
This pin is connected to SD/MMC
connector(J28).Optionally
Connected With (J27) Micro Sd
49
SDIO_DAT0
uSDHC1_DATA0
USDHC1_DAT
A0 /E37
IO, 3.3V CMOS
uSDHC1 Data0.
This pin is connected to SD/MMC
connector(J28).Optionally
Connected With (J27) Micro Sd
50
SDIO_DAT3
uSDHC1_DATA3
USDHC1_DAT
A3 /F40
IO, 3.3V CMOS
uSDHC1 Data3.
This pin is connected to SD/MMC
connector(J28).Optionally
Connected With (J27) Micro Sd
51
SDIO_DAT2
uSDHC1_DATA2
USDHC1_DAT
A2 /E39
IO, 3.3V CMOS
uSDHC1 Data2.
This pin is connected to SD/MMC
connector(J28).Optionally
Connected With (J27) Micro Sd
52
RSVD2/SDIO_D
AT5
NC
NA
NA
NC in i.MX8 Qseven SOM.
This pin is connected to SD/MMC
connector (J28) in carrier board.
53
RSVD3/SDIO_D
AT5
NC
NA
NA
NC in i.MX8 Qseven SOM.
This pin is connected to SD/MMC
connector (J28) in carrier board.
54
RSVD4/SDIO_D
AT7
NC
NA
NA
NC in i.MX8 Qseven SOM.
This pin is connected to SD/MMC
connector (J28) in carrier board.
55
RSVD5/SDIO_D
AT6
NC
NA
NA
NC in i.MX8 Qseven SOM.
This pin is connected to SD/MMC
connector (J28) in carrier board.

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i.MX 8 QM/QP Qseven Development Platform Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
Pin
No.
Qseven MXM
Connector Pin
Name
Signal Name
CPU Ball
Name/
Pin Number
Signal Type/
Termination
Description
56
USB_DRIVE_VB
US
USB_OTG1_PWR(G
PIO4_03)
USB_SS3_TC
0/ J9
I, 3.3V CMOS
USB OTG Power enable.
57
GND
GND
NA
Power
Ground.
58
GND
GND
NA
Power
Ground.
59
HDA_SYNC/
I2S_WS
SAI1_TXFS
SAI1_TXFS/
AV2
I, 3.3V CMOS
SSI Audio transmit frame
synchronization.
This pin is connected to I2S audio
codec.
60
SMB_CLK/
GP1_I2C_CLK
DMA_I2C1_SCL
DMA.I2C1.SC
L/ AY52
I, 3.3V OD
/2.2K PU
I2C1 clock.
This pin is connected to
Power IO Header (J24) 2nd Pin
, M.2 SATA, M.2 PCIe
61
HDA_RST#/
I2S_RST#
GPIO_RESET(GPIO1
_05)
LVDS0_GPIO
01/ BD40
I, 3.3V CMOS/
10K PU
This pin is connected to Capacitive
Touch Connector for touch reset
(J15).
62
SMB_DAT/
GP1_I2C_DAT
DMA_I2C1_SDA
DMA.I2C1.SD
A/ AV52
IO, 3.3V OD
I2C1 Data.
This pin is connected to
Power IO Header (J24) 4th Pin
,M.2 SATA,M.2 PCIe
63
HDA_BCLK/
I2S_CLK
SAI1_TXC
SAI1_TXC /
AU5
O, 3.3V CMOS
SSI Audio transmit clock.
This pin is connected from I2S audio
64
SMB_ALERT#
SMBUS_ALERT(GPI
O1_15)
LVDS1_I2C1_
SDA/BN35
O, 3.3V CMOS
NC in i.MX8 Qseven SOM.
M.2 Sata Connected(J33) /M.2 PCIe
Optional (J31)
65
HDA_SDI/
I2S_SDI
SAI1_RXD
SAI1_RXD/
AV4
O, 3.3V CMOS
SSI Audio Transmit Data.
This pin is connected from I2S audio
codec.
66
GP0_I2C_CLK
DMA_I2C2_SCL
DMA.I2C2.SC
L /BA53
I, 3.3V OD
I2C2 clock.
This pin is connected to IO Expander,
I2s Audio Codec, Capacitive Touch
67
HDA_SDO/
I2S_SDO
SAI1_TXD
SAI1_TXD /
AU1
I, 3.3V CMOS
SSI Audio Receive Data.
This pin is connected to I2S audio
codec.
68
GP0_I2C_DAT
DMA_I2C2_SDA
DMA.I2C2.SD
A / AY50
IO, 3.3V OD
I2C2 Data.
This pin is connected to IO Expander
,I2s Audio Codec, Capacitive Touch
69
THRM#
THRM#
NA
I, 3.3V CMOS
This pin is connected from Push
button (SW6) in carrier board.
70
WDTRIG#
Q7_WDTRIG_B
NA
I, 3.3V CMOS
This pin is connected to Power I/O
Header (J3) 11th Pin

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Page 20 of 81
i.MX 8 QM/QP Qseven Development Platform Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
Pin
No.
Qseven MXM
Connector Pin
Name
Signal Name
CPU Ball
Name/
Pin Number
Signal Type/
Termination
Description
71
THRMTRIP#
GPIO_THRMTRIP_
Q7(GPIO3_05)
SPI0_CS0
/BC1
O, 3.3V CMOS
Thermal trip.
This pin is connected to indication
LED D14
72
WDOUT
Q7_WDOG_B
NA
O, 3.3V CMOS
This pin is connected to Power I/O
Header (J3) 9th Pin
73
GND
GND
NA
Power
Ground.
74
GND
GND
NA
Power
Ground.
75
USB_P7-/
USB_SSTX0-
USB3_HUB1_TXM
NA
I, USB SS
USB3.0 Host Port0 Transmit
Differential pair negative.
This pin is connected to Dual stack
USB3.0 Type A connector (J22A)
bottom port.
76
USB_P6-/
USB_SSRX0-
USB3_HUB1_RXM
NA
O, USB SS
USB3.0 Host Port0 Receive
Differential pair negative.
This pin is connected to Dual stack
USB3.0 Type A connector (J22A)
bottom port.
77
USB_P7+/
USB_SSTX0+
USB3_HUB1_TXP
NA
I, USB SS
USB3.0 Host Port0 Transmit
Differential pair positive.
This pin is connected to Dual stack
USB3.0 Type A connector (J23A)
bottom port.
78
USB_P6+/
USB_SSRX0+
USB3_HUB1_RXP
NA
O, USB SS
USB3.0 Host Port0 Receive
Differential pair positive.
This pin is connected to Dual stack
USB3.0 Type A connector (J22A)
bottom port.
79
USB_6_7_OC#
NC
NA
NA
NC in i.MX8 Qseven SOM.
Over current sense signal for USB3.0
Host Port0.
This pin is connected from USB3.0
Host Port0 Over current indicator.
80
USB_4_5_OC#
NC
NA
NA
NC in i.MX8 Qseven SOM.
This pin is connected to USB3.0 Host
Port1 Over current indicator in
carrier board.
81
USB_P5- /
USB_SSTX2-
USB3_HUB3_TXM
NA
I, USB SS
This pin is connected to USB Switch
For M.2 Sata ,Optionally Connected
With M.2 PCIe