Kontron microETXexpress-SP User manual

If it‘s embedded, it‘s Kontron.
microETXexpress®-SP
Document Revision 1.12

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» Table of Contents «
1User Information............................................................................ 1
1.1 About This Document ...............................................................................................................1
1.2 Copyright Notice .....................................................................................................................1
1.3 Trademarks ............................................................................................................................1
1.4 Standards..............................................................................................................................1
1.5 Warranty ...............................................................................................................................2
1.6 Technical Support ...................................................................................................................2
2Introduction ................................................................................. 3
2.1 microETXexpress®-SP ..............................................................................................................3
2.2 Naming clarification ................................................................................................................3
2.3 Understanding microETXexpress®-SP functionality ........................................................................4
2.4 COM Express® Documentation ...................................................................................................4
2.5 COM Express® Benefits.............................................................................................................5
3Specification ................................................................................. 6
3.1 Functional Specification ...........................................................................................................6
3.1.1 Available Modules ..................................................................................................................8
3.2 Block Diagram ........................................................................................................................9
3.3 Mechanical Specification ........................................................................................................ 10
3.4 Electrical Specification ........................................................................................................... 11
3.4.1 Supply Voltage .................................................................................................................... 11
3.4.2 Supply Current (Windows XP SP3) ............................................................................................ 12
3.4.3 External RTC Battery ............................................................................................................. 12
3.5 Environmental Specification .................................................................................................... 13
3.6 MTBF .................................................................................................................................. 14
4microETXexpress®-SP COM Express® Connector ...................................15
4.1 Connector Locations .............................................................................................................. 15
4.2 Pinout List ........................................................................................................................... 16

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4.2.1 General Signal Description ..................................................................................................... 16
4.2.2 Connector X1A - Row A .......................................................................................................... 17
4.2.3 Connector X1A - Row B .......................................................................................................... 20
4.2.4 Connector X1B - Row C .......................................................................................................... 23
4.2.5 Connector X1B - Row D .......................................................................................................... 26
4.2.6 Onboard Connectors ............................................................................................................. 29
4.3 Signal Description ................................................................................................................. 30
4.3.1 PCIexpress.......................................................................................................................... 30
4.3.2 USB .................................................................................................................................. 31
4.3.3 SATA ................................................................................................................................. 33
4.3.4 Audio ................................................................................................................................ 34
4.3.5 Serial IRQ ........................................................................................................................... 34
4.3.6 Graphics Interface................................................................................................................ 35
4.3.7 Ethernet ............................................................................................................................ 37
4.3.8 LPC Bus.............................................................................................................................. 38
4.3.9 Power Control ..................................................................................................................... 41
4.3.10 Miscellaneous Circuits ........................................................................................................... 43
5Special Features............................................................................44
5.1 S5 Eco ................................................................................................................................ 44
5.2 Hyper Threading ................................................................................................................... 44
5.3 Speedstep Technology............................................................................................................ 45
5.4 SD-card Interface (SDIO) ........................................................................................................ 46
5.5 Watchdog ............................................................................................................................ 48
5.6 GPIO - General Purpose Input and Output ................................................................................... 48
5.7 Flash Backup Feature ............................................................................................................. 50
5.8 Fast I2C............................................................................................................................... 52
5.9 ACPI Suspend Modes and Resume Events .................................................................................... 53
6Design Consideration .....................................................................54
6.1 Thermal Management............................................................................................................. 54
6.2 Heatspreader Dimensions ....................................................................................................... 54
6.3 microETXexpress®-SP onboard fan connector.............................................................................. 55
6.3.1 Location and Pin-out of fan connector ...................................................................................... 55
6.3.2 BIOS Settings for fan control .................................................................................................. 56

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6.3.3 Electrical Characteristics........................................................................................................ 57
7System Ressources.........................................................................58
7.1 Interrupt Request (IRQ) Lines .................................................................................................. 58
7.1.1 In 8259 PIC mode................................................................................................................. 58
7.1.2 In APIC mode ...................................................................................................................... 59
7.2 Memory Area ........................................................................................................................ 60
7.3 I/O Address Map ................................................................................................................... 61
7.4 Peripheral Component Interconnect (PCI) Devices ........................................................................ 62
7.5 External I2C Bus #1................................................................................................................ 62
7.6 External I2C Bus #2................................................................................................................ 62
7.7 JILI I2C Bus ......................................................................................................................... 62
7.8 SDVO I2C Bus........................................................................................................................ 62
7.9 System Management (SM) Bus ................................................................................................. 63
7.10 K-Station / JIDA32 resources................................................................................................... 64
8BIOS Operation .............................................................................65
8.1 Determining the BIOS Version .................................................................................................. 65
8.2 Setup Guide ......................................................................................................................... 65
8.2.1 Start AMI® BIOS Setup Utility ................................................................................................. 65
8.3 BIOS Setup .......................................................................................................................... 67
8.3.1 Main Menu.......................................................................................................................... 67
8.3.2 Module Info ........................................................................................................................ 67
8.3.3 Advanced Menu ................................................................................................................... 69
8.3.4 PCI/PnP Settings.................................................................................................................. 99
8.3.5 Boot Settings .................................................................................................................... 100
8.3.6 Security Settings................................................................................................................ 102
8.3.7 Exit Options ...................................................................................................................... 104
9Appendix A: JIDA Standard............................................................ 105
9.1 JIDA Information ................................................................................................................ 105
10 Appendix B: Architecture Information..............................................106
10.1 Buses ............................................................................................................................... 106

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10.1.1 ISA, Standard PS/2 –Connectors........................................................................................... 106
10.1.2 PCI/104 ........................................................................................................................... 106
10.2 General PC Architecture ........................................................................................................ 106
10.3 Ports ................................................................................................................................ 107
10.3.1 RS-232 Serial .................................................................................................................... 107
10.3.2 Serial ATA......................................................................................................................... 107
10.3.3 USB ................................................................................................................................ 107
10.4 Programming ..................................................................................................................... 107
11 Appendix C: Document Revision History............................................108

microETXexpress®-SP / User Information
1
1User Information
1.1 About This Document
This document provides information about products from Kontron Embedded Modules GmbH and/or its subsidiaries.
No warranty of suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the
information in this document is accurate, the information contained within is supplied ―as-is‖ and is subject to
change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights
of third parties are concerned.
1.2 Copyright Notice
Copyright © 2003-2011 Kontron Embedded Modules GmbH
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval
system, or translated into any language or computer language, in any form or by any means (electronic, mechanical,
photocopying, recording, or otherwise), without the express written permission of Kontron Embedded Modules
GmbH.
DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Embedded Modules GmbH. Kontron is trademark or registered trademark of Kontron
AG.
1.3 Trademarks
The following lists the trademarks of components used in this board.
»IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.
»Microsoft is a registered trademark of Microsoft Corp.
»Intel is a registered trademark of Intel Corp.
»All other products and trademarks mentioned in this manual are trademarks of their respective owners.
1.4 Standards
Kontron Embedded Modules GmbH is certified to ISO 9000 standards.

microETXexpress®-SP / User Information
2
1.5 Warranty
This Kontron Embedded Modules GmbH product is warranted against defects in material and workmanship for the
warranty period from the date of shipment. During the warranty period, Kontron Embedded Modules GmbH will at its
discretion decide to repair or replace defective products.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.
The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, operation outside of the product‘s environmental specifications or improper
installation or maintenance.
Kontron Embedded Modules GmbH will not be responsible for any defects or damages to other products not supplied
by Kontron Embedded Modules GmbH that are caused by a faulty Kontron Embedded Modules GmbH product.
1.6 Technical Support
Technicians and engineers from Kontron are available for technical support. We are committed to making our product
easy to use and will help you use our products in your systems.
Please consult our Web site at http://www.kontron.com/support for the latest product documentation, utilities,
drivers and support contacts. Consult our customer section for the latest BIOS downloads, Product Change
Notifications and additional tools and software. This section is exclusively for registered Kontron customers and
accessible from product web page on www.kontron.com.
In any case you can always contact your board supplier for technical support.

microETXexpress®-SP / Introduction
3
2Introduction
2.1 microETXexpress®-SP
The Kontron microETXexpress®-SP Computer-on-Module is designed to extend the COM Express® specification to
include a small module format (95 x 95 mm) with the commonly used COM Express® Type 2 connector. This will enable
the development of energy-saving, high-end graphics devices based on the Intel® Atom™ processor (up to 1.6GHz)
and the Intel® System Controller Hub US15W without having to stray from the secure development path of utilizing
an established and future-proof industry standard.
The Kontron microETXexpress®-SP offers LVDS as well as more sophisticated graphics support with SDVO. SDVO
delivers additional video signals for DVI monitor outputs, SDTV and HDTV television outputs and TV tuner inputs that
greatly simplify system graphics design. This special feature makes this 95 x 95 mm Computer-on-Module ideal for
small mobile and extremely energy-efficient multimedia devices as well as for mobile test and measurement
applications. Other standard features of the microETXexpress-SP include: Gigabit Ethernet, Serial ATA, single-channel
LVDS and USB 2.0.
All Kontron microETXexpress® family modules are compatible with the COM Express® standard (Pin-out Type 2)
allowing for easy interchangeability and ensuring design scaleability and future migration paths.
The microETXexpress®-SP is a complete PC with standard interfaces including USB and additional options such as
sound capabilities, flat panel interface, Ethernet, etc.
2.2 Naming clarification
COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component. Interfaces will provide a smooth transition path from legacy parallel interfaces to
LVDS (Low Voltage Differential Signaling) interfaces. These include the PCI bus and parallel ATA and PCI Express and
Serial ATA.
»ETXexpress® modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm)
»microETXexpress® modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)
»nanoETXexpress modules are Kontron's COM Express® modules in the future mini form factor (55mm x
84mm)

microETXexpress®-SP / Introduction
4
2.3 Understanding microETXexpress®-SP functionality
All Kontron microETXexpress® and ETXexpress® modules contain two connectors; each of it has two rows. The primary
connector has two rows called Row A and Row B. The secondary connector has two rows called Row C and Row D. The
primary connector (Row A and Row B) feature the following legacy-free functionality:
»Ethernet
»Serial ATA (SATA)
»USB 2.0
»LVDS/VGA and dual display video
»Intel High Definition Audio (Azalia)
»LPC (low pin count) Bus
»PCIexpress
The secondary connector (Row C and Row D) provides support for the following buses and I/O:
»PCI Express
»PCI
»IDE
2.4 COM Express® Documentation
This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of microETXexpress®-SP. The other two references, which are available from your Kontron
Support or from PICMG®, include:
»The COM Express Specification defines the COM Express® module form factor, pinout, and signals. This
document is available from the PIGMG website by filling out the order form.
»The COM Express® Design Guide by PICMG serves as a general guide for baseboard design, with a focus on
maximum flexibility to accommodate a wide range of COM Express® modules.
Note: Some of the information contained within this product manual applies only to certain product revisions (CE:
xxx). If certain information applies to specific product revisions (CE: xxx) it will be stated. Please check the
product revision of your module to see if this information is applicable.

microETXexpress®-SP / Introduction
5
2.5 COM Express® Benefits
Computer on modules express (COM Express) modules in compact formfactor are very compact (95 x 95 mm), highly
integrated computers. All (micro)ETXexpress® modules feature a standardized form factor and a standardized
connector layout that carry a specified set of signals. Each microETXexpress module is based on connector type 2 of
the COM Express specification. This standardization allows designers to create a single-system baseboard that can
accept present and future (micro)ETXexpress® modules.
microETXexpress modules include common personal computer (PC) peripheral functions such as:
»Graphics
»USB ports
»Ethernet
»Sound
»IDE and SATA
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system‘s packaging.
A peripheral PCI bus can be implemented directly on the baseboard rather than on mechanically unwieldy expansion
cards. The ability to build a system on a single baseboard using the computer as one plug-in component simplifies
packaging, eliminates cabling, and significantly reduces system-level cost.
A single baseboard design can use a range of ETXexpress®, microETXexpress® and nanoETXexpress modules. This
flexibility can differentiate products at various price/performance points, or to design future proof systems that have
a built-in upgrade path. The modularity of a COM Express® solution also ensures against obsolescence as computer
technology evolves. A properly designed COM Express® baseboard can work with several successive generations of
COM Express® modules.
A COM Express® baseboard design offers many of the advantages of a custom, computer board design, but delivers
better obsolescence protection, greatly reduced engineering effort, and faster time to market.

microETXexpress®-SP / Specification
6
3Specification
3.1 Functional Specification
Processor: Intel® Atom™ Zxx
»CPU: 45nm Silverthorne Z510 (1.1 GHz) or Z530 (1.6 GHz)
»Cores: 1
»Bus Speed: 400 / 533 MHz
»Bus/Core Ratio: 11 / 12
»Cache: 32 kByte Instruction Cache + 24 kByte L1 Cache 512 kByte L2 Cache
»Features: Hyper-Threading Technology (Z530 only)
Intel® Virtualization Technology
Execute Disable Bit
Enhanced Intel® Speedstep Technology
C-States: C0, C1/C1E, C2/C2E, C3, C4/C4E, Intel Deep Power Down State C6
»Instruction Set: 32-bit
»Package: 13mm x 14mm PBGA441
»Max TDP: 2W
»Thermal Spec: 90°C
Chipset: Intel® System Controller Hub US15W (Poulsbo)
»Speed: 400 / 533 MHz FSB
»RAM: One DDR2 400/533MHz SO-DIMM Socket up to 2048MByte (8 chip configuration only)
»USB: 6 x USB 1.1/2.0 (1x USB Client) + 2 x USB 2.0 only
»Audio: Intel® High Definition Audio (24 bit / 96 kHz)
»PCI Express: 1 x PCIexpress x1 to COM Express® Lane #1
1 x PCIexpress x1 used onboard for PCIexpress Hub
»Max TDP: 2.3W
Integrated graphics Intel® GMA500
»Graphics Memory: up to 352 MByte with IEGD, up to 256MB with GMA
»Features: HDTV/HD capable, Decoder for MPEG2(HD) / H.264, DirectX®9.0c, OpenGL 2.0

microETXexpress®-SP / Specification
7
Display Interfaces
»CRT: VGA is not supported my the US15W System Controller Hub
»Flat Panel: Single Channel LVDS 18/24 Bit, resolution up to 1366 x 768 (WXGA), no dithering.
»Digital Display: Only SDVO supported on SDVO/PEG Interface on connector CD with resolution up to FullHD
1920x1080.
Storage
»IDE: Primary IDE (Master/Slave) from the US15W SCH with UDMA 100/66/33 support
»SATA: 2x Serial ATA supporting up to 3.0 GBit/s transfer rate (SIL 3132 PCIe2SATA Bridge)
»SATA Features: Boot, RAID0, RAID1, NCQ, Staggered Spinup, Port Multiplier
Onboard devices:
»Ethernet: Intel® 82574L (Hartwell), 10/100/1000 Mbit Ethernet (Max TDP 0.727W)
Features: WakeOnLAN, PXE Lanboot, Time Sync Protocol Indicator, Jumbo Frames
»TPM: Infineon SLB9635TT1 Trusted Platform Module 1.2 onboard
»Watchdog: integrated in onboard CPLD, possible delay: 1s, 5s, 10s, 30s, 1min, 5min, 10min, 15min
»PCI: PCIe-to-PCI Bridge PLX Technology PEX8112 (0.4W typical, 32bit/33MHz PCI 3.0)
»PCIe Switch: 8 Port PCIe Switch PLX Technology PEX8509 (1.2W typical, PCIe Gen1 with 2.5Gb/s, Link
Power Management L0-L3, Device Power Management D0-D3hot)
»Optional: 4 Port PCIe Switch PEX8505 (without support for PCIe Lane #2-4 on COMe connector)
Additional Interfaces:
»LPC: Yes
»SMBus: Yes
»I2C: Fast I2C (from US15W SCH)
»GPIO: 8 GPIO, 4 GPI and 4 GPO
»SDIO: 1x onboard miniSD Card Socket (US15W SDIO port #0)
1x SDIO port shared with GPIO signals (US15W SDIO port #1)
SD Card Specification 1.1
SDIO boot supported

microETXexpress®-SP / Specification
8
Power Management & Misc
»JIDA: Yes
»K-Station: Yes
»Bootlogo: Yes
»MARS: Yes, Charger & Manager Support
»HWM: Temperature Monitoring for CPU and Board Temperature (onboard W83L786 HWM)
HWM for external Winbond 83627
»Passive Cooling: Passive and Critical Trip Point
»ACPI: ACPI 1.0 / 2.0 / 3.0
»S-States: S0, S3, S4, S5
»Input Voltage: Single supply support with wide range input 8,5 V - 18 V
3.1.1 Available Modules
Part No
CPU
Features
36003-0000-11-1
Intel® Atom™ Z510 1.1GHz
US15W SCH
36003-0000-16-1
Intel® Atom™ Z530 1.6GHz
US15W SCH
36003-0000-11-4
Intel® Atom™ Z510 1.1GHz
US15W SCH with onboard miniSD socket (US version)
36003-0000-16-4
Intel® Atom™ Z530 1.6GHz
US15W SCH with onboard miniSD socket (US version)

microETXexpress®-SP / Specification
9
3.2 Block Diagram
GPIO
1x18/24bit LVDS
GPIO
SDIO #1
SDIO #0
DDR2 400/533MHz
SO-DIMM
Socket(J2)
microETXexpress®-SP
USB
5 x USB 1.1/2.0
1 x USB Client
2 x USB 2.0
HD Audio
SDIO
GPIO
Clock
Gen
I2C JIDA
EEPROM
PCIe2SATA
SIL3132
PwrCtrl / Battery
FSB 400/533
GBLAN
PCIe #1
Intel® SCH
System Controller Hub
Poulsbo US15W
GMA500
Graphics
Intel®
Atom™
(Silverthorne Z510, Z530)
SD/MMC Socket
(J4)
Connector AB
Connector CD
SDVO
PCIe
8 Port
Switch
PEX8509
PCIe #2 PCIe #1
PCIe #0 PCIe #0
PCIe #1
Intel® Hartwell
82574L PCIe #2
PCI
PCIe #3 PCIe2PCI
PEX8112
PCIe #4
SATA #0
SATA #1
PCIe #2-4
IDE
TPM
SLB9635TT
CPLD
BIOS
FWH
LPC
SMB
HWM
W83L786NG
RTC
(J1) Debug
Connector
(J5) FAN
Connector
(J3) JTAG
Connector
Switch
WD
I2C SMB LPC
PCIe #6
PCIe #5
PCIe #7
GPIO

microETXexpress®-SP / Specification
10
3.3 Mechanical Specification
Module Dimensions
»95 mm x 95 mm ±0.2 mm
Height on Top
»Maximum approx. 5 mm (without printed circuit board)
»Highest component: memory socket
»Height is depending upon optionally CPU cooler/heatpreader
Height on Bottom
»Maximum approx. 4.06 mm (without printed circuit board)
Mechanical Drawing

microETXexpress®-SP / Specification
11
All dimensions are shown in millimetres. Tolerances should be ± 0.25mm [±0.010"], unless otherwise noted. The
tolerances on the module connector locating peg holes (dimensions [16.50, 6.00]) should be ± 0.10mm [±0.004"].
The 220 pin connector shall be mounted on the backside of the PCB and is seen ―through‖ the board in this view. The 4
mounting holes shown in the drawing should use 6mm diameter pads and should have 2.7mm plated holes, for use
with 2.5mm hardware. The pads should be tied to the PCB ground plane. Gray circles represent the mechanical
mounting holes. Black circles represent the mounting holes required by the PICMG COM Express® standard.
Note: A complete SolidWorks eDrawing package is available at EMD Customer Section
http://emdcustomersection.kontron.com
3.4 Electrical Specification
3.4.1 Supply Voltage
»8.5 V to 18 V DC in single supply mode
»VCC + 5VSB ±5% in ATX mode (VCC > 5VSB)
Note: If a module is E1 rated and should be used in E1 temperature range the supply voltage must be 12V +- 5%!
Power Supply Risetime
»The input voltages shall increase from ≤10% of nominal to within the regulation ranges within 0.1ms to
20ms.
»There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point
following the ATX specification
Supply Voltage Ripple
»Maximum 100 mV peak to peak 0-20MHz

microETXexpress®-SP / Specification
12
3.4.2 Supply Current (Windows XP SP3)
The tested boards were mounted on a Kontron Evaluation Board with both a mouse and keyboard connected. The
power consumption tests were executed during Windows XP SP3 by using a tool to stress the CPU (100 % load). The
power measurements values were acquired after the units were subjected to a 15 minute full load test or had reached
a stable CPU core temperature of 90°C. To ensure a stable die temperature a corresponding heatsink was used to hold
the temperature under the critical trip point. All boards were equipped with 1024MB DDR SDRAM. The Modules were
tested using maximum CPU frequency. For more details refer to the Power Consumption diagrams available in the
Customer Section.
With Atom Z510 1,1GHz - 36003-0000-11-1:
Supply Current on 12V in
[A]
Supply Current on 5VSB
in [A]
Power Consumption
in [W]
WinXP SP3 –100% CPU Load
0.74
0.06
9.14
WinXP SP3 –Idle with EIST disabled
0.59
0.06
7.44
WinXP SP3 –Idle with EIST enabled
0.57
0.06
7.10
Power Off - S5
0
0.11
0.57
With Atom Z530 1,6GHz - 36003-0000-16-1:
Supply Current on 12V in
[A]
Supply Current on 5VSB
in [A]
Power Consumption
in [W]
WinXP SP3 –100% CPU Load
0.87
0.11
10.97
WinXP SP3 –Idle with EIST disabled
0.59
0.06
7.38
WinXP SP3 –Idle with EIST enabled
0.58
0.06
7.21
Power Off - S5
0
0.11
0.57
Note: It is difficult to test for all possible market applications. There may be an application that draws more power
from the CPU than the measured values provided in the table above. This should be taken into consideration
if your application functions at either extreme of the thermal specification. If this is the case improvements
to your thermal solution are recommended and the Kontron support team can be of assistance.
3.4.3 External RTC Battery
»Voltage range: 2.0V - 3.6V (typ. 3.0V)
»Maximum current: 3.5µA @ 3.0V

microETXexpress®-SP / Specification
13
3.5 Environmental Specification
Temperature
Operating: (with Kontron Embedded Modules GmbH heat-spreader plate assembly):
»Ambient temperature: 0 to +60 °C
»Maximum heatspreader-plate temperature: 0 to +60 °C (*)
»Non-operating: -30 to +85 °C
Note: *The maximum operating temperature with the heatspreader plate is the maximum measurable temperature
on any spot on the heatspreader‘s surface. You must maintain the temperature according to the above
specification.
Operating (without Kontron Embedded Modules GmbH heat-spreader plate assembly):
»Maximum operating temperature: 0 to +60 °C (**)
»Non operating: -30 to +85 °C
Note: **The maximum operating temperature is the maximum measurable temperature on any spot on a module‘s
surface. You must maintain the temperature according to the above specification.
Humidity
»Operating: 10% to 90% (non condensing)
»Non operating: 5% to 95% (non condensing)

microETXexpress®-SP / Specification
14
3.6 MTBF
The following MTBF (Mean Time Between Failure) values were calculated using a combination of manufacturers‘test
data, where available, and a Bellcore calculation for the remaining parts. The Bellcore calculation used is ―Method 1
Case 1‖. In that particular method the components are assumed to be operating at a 50% stress level in a 40°C
ambient environment and the system is assumed to have not been burned in. The component manufacturers‘data has
been used wherever possible. The manufacturer‘s data, when used, is specified at 50°C, so in that sense the following
results are slightly conservative. The MTBF values shown below are for a 40°C in an office or telecommunications
environment. Higher temperatures and other environmental stresses (extreme altitude, vibration, salt water
exposure, etc.) lower MTBF values.
»System MTBF (hours) : 191717 hours @ 40°C
Note: Fans provided by Kontron have 50,000-hour typical operating life. The above estimates assume a passive
heat sinking arrangement (no fan). Estimated RTC battery life (as opposed to battery failures) is not
accounted for in the above figures and needs to be considered separately. Battery life depends on both
temperature and operating conditions. When the Kontron unit has external power, the only battery drain is
from leakage paths.