Kontron nanoETXexpress-SP User manual

nanoETXexpress-SP
Document Revision 141
If it's embedded it's Kontron

» Table of Contents «
1 User Information.....................................................................................................................6
1.1 bout This Document...............................................................................................................6
1.2 Copyright Notice.....................................................................................................................6
1.3 Trademarks............................................................................................................................6
1.4 Standards..............................................................................................................................6
1.5 Warranty...............................................................................................................................6
1.6 Technical Support....................................................................................................................7
2 Introduction...........................................................................................................................8
2.1 Product Description.................................................................................................................8
2.2 Naming clarification................................................................................................................8
2.3 Understanding COM Express™ Functionality..................................................................................8
2.4 COM Express™ Documentation....................................................................................................9
2.5 COM Express™ Benefits.............................................................................................................9
3 Specification.........................................................................................................................11
3.1 vailable Modules of nanoETXexpress-SP....................................................................................11
3.2 Functional Specification..........................................................................................................12
3.3 Onboard SSD.........................................................................................................................14
3.4 System Memory.....................................................................................................................15
3.5 Block Diagram.......................................................................................................................16
3.6 Mechanical Specification.........................................................................................................17
3.6.1 Module Dimension.............................................................................................................17
3.6.2 Height on Top...................................................................................................................17
3.6.3 Height on Bottom..............................................................................................................17
3.6.4 Mechanical Drawing...........................................................................................................17
3.7 Electrical Specification...........................................................................................................18
3.7.1 Supply Voltage..................................................................................................................18
3.7.2 Power Supply Rise Time.......................................................................................................18
3.7.3 Supply Voltage Ripple.........................................................................................................18
3.7.4 Power Consumption...........................................................................................................18
3.8 Environmental Specification....................................................................................................19
3.8.1 Temperature.....................................................................................................................19
3.8.2 Humidity.........................................................................................................................19
3.9 MTBF...................................................................................................................................20
3.10 Pinout List...........................................................................................................................21
3.10.1 General Signal Description..................................................................................................21
3.10.2 Connector X1 Row .........................................................................................................22
3.10.3 Connector X1 Row B.........................................................................................................25
3.10.4 SDVO Connector J1801 (optional).........................................................................................28
3.10.5 XDP Connector J1400 (optional)...........................................................................................29
3.11 Signal Description.................................................................................................................30
3.11.1 PCIexpress x1 lanes...........................................................................................................30
3.11.2 USB................................................................................................................................30
3.11.3 S T ...............................................................................................................................31
3.11.4 udio..............................................................................................................................31
3.11.5 Serial IRQ........................................................................................................................32
3.11.6 Graphics Interface.............................................................................................................33
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nanoETXexpress-SP/
3.11.7 Ethernet....................................................................................................................35
3.11.8 LPC Bus.....................................................................................................................35
3.11.9 Power Control.............................................................................................................37
3.11.10 Miscellaneous Circuits...................................................................................................38
4 Special Features...............................................................................................................39
4.1 Watchdog Timer...............................................................................................................39
4.2 GPIO - General Purpose Input and Output..............................................................................40
4.3 Speedstep Technology.......................................................................................................42
4.4 Flash Backup Feature........................................................................................................43
4.5 Hyper Threading..............................................................................................................45
4.6 SD-card Interface (SDIO)...................................................................................................46
4.7 Fast I2C..........................................................................................................................47
4.8 CPI Suspend Modes and Resume Events...............................................................................48
5 Design Consideration........................................................................................................49
5.1.1 Thermal Management...................................................................................................49
5.1.2 Heatspreader..............................................................................................................49
6 System Ressources............................................................................................................50
6.1 Interrupt Request (IRQ) Lines.............................................................................................50
6.1.1 In 8259 PIC Mode.........................................................................................................50
6.1.2 In PIC mode..............................................................................................................51
6.2 Memory rea...................................................................................................................52
6.3 I/O ddress Map..............................................................................................................52
6.4 Peripheral Component Interconnect (PCI) Devices...................................................................53
6.5 Internal I2C Bus...............................................................................................................53
6.6 JILI I2C Bus....................................................................................................................53
6.7 SDVO I2C Bus...................................................................................................................53
6.8 System Management (SM) Bus............................................................................................54
6.9 K-Station / JID 32 resources..............................................................................................54
6.9.1 I2C...........................................................................................................................54
6.9.2 Storage.....................................................................................................................54
6.9.3 GPIO.........................................................................................................................54
6.9.4 Hardware Monitor........................................................................................................55
7 BIOS Operation................................................................................................................56
7.1 Determining the BIOS Version.............................................................................................56
7.2 Setup Guide....................................................................................................................56
7.2.1 Start MI® BIOS Setup Utility........................................................................................56
7.3 BIOS Setup.....................................................................................................................58
7.3.1 Main Menu.................................................................................................................58
7.3.2 Module Info................................................................................................................59
7.3.3 dvanced Menu...........................................................................................................62
7.3.4 dvanced PCI/PnP Settings............................................................................................80
7.3.5 Boot.........................................................................................................................81
7.3.6 Security.....................................................................................................................84
7.3.8 dvanced Chipset Settings.............................................................................................85
7.3.9 Exit Menu...................................................................................................................89
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nanoETXexpress-SP/User Information
8 Document Revision History.................................................................................................90
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nanoETXexpress-SP/User Information
1 User Information
1.1 About This Document
This document provides information about products from Kontron Embedded Modules GmbH and/or its subsidiaries.
No warranty of suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the
information in this document is accurate, the information contained within is supplied “as-is” and is subject to
change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights
of third parties are concerned.
1.2 Cop right Notice
Copyright © 2003-2010 Kontron Embedded Modules GmbH
ll rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval
system, or translated into any language or computer language, in any form or by any means (electronic, mechanical,
photocopying, recording, or otherwise), without the express written permission of Kontron Embedded Modules
GmbH.
DIMM-PC®, PIS ®, ETX®, ETXexpress®, microETXexpress™, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Embedded Modules GmbH. Kontron is trademark or registered trademark of Kontron
G.
1.3 Trademarks
The following lists the trademarks of components used in this board.
» IBM, XT, T, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.
» Microsoft is a registered trademark of Microsoft Corp.
» Intel is a registered trademark of Intel Corp.
» ll other products and trademarks mentioned in this manual are trademarks of their respective owners.
1.4 Standards
Kontron Embedded Modules GmbH is certified to ISO 9000 standards.
1.5 Warrant
This Kontron Embedded Modules GmbH product is warranted against defects in material and workmanship for the
warranty period from the date of shipment. During the warranty period, Kontron Embedded Modules GmbH will at its
discretion decide to repair or replace defective products.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.
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nanoETXexpress-SP/User Information
The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, operation outside of the product’s environmental specifications or improper
installation or maintenance.
Kontron Embedded Modules GmbH will not be responsible for any defects or damages to other products not supplied
by Kontron Embedded Modules GmbH that are caused by a faulty Kontron Embedded Modules GmbH product.
1.6 Technical Support
Technicians and engineers from Kontron Embedded Modules GmbH and/or its subsidiaries are available for technical
support. We are committed to making our product easy to use and will help you use our products in your systems.
Please consult our Web site at http://www.kontron.com/support for the latest product documentation, utilities,
drivers and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest
BIOS downloads, Product Change Notifications and additional tools and software. In any case you can always contact
your board supplier for technical support.
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nanoETXexpress-SP/Introduction
2 Introduction
2.1 Product Description
This credit card sized module is compatible to COM Express™ pin-out Type 1. On 55 mm x 84 mm footprint
nanoETXexpress-SP is a perfect fit for the next generation of low power, ultra-mobile applications that require energy
saving x86 processor performance, high-end graphics, PCI Express and Serial T combined with longer battery life.
These include handheld devices for medical or multi-media applications, small mobile data systems and a host of new
applications that have not previously been possible due to size or power consumption limitations. This new COM form
factor is 100 percent compatible with the COM.0 Type 1 with respect to connector location and pin definition. The
Kontron nanoETXexpress-SP COM is based on the highly-efficient Intel® tom™ Z5XX processor series and Intel®
System Controller Hub single chip that combines the memory controller, graphic engine and I/O in a single, space
saving chipset design. The nanoETXexpress-SP COM offers an unprecedented power consumption / performance ratio
for x86-based ultra-mobile designs. T he nanoETXexpress-SP with Flash and memory on-board supports 1 PCI Express
x1 Port (opt. 2 x1 if no onboard L N), Serial T , LVDS, optional SDVO and High Definition udio. 10/100/1000
Gigabit Ethernet is designed onboard for high connectivity and 8x USB provides fast and sufficient interfaces for
external peripherals.
2.2 Naming clarification
COM Express™ defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component. Interfaces will provide a smooth transition path from legacy parallel interfaces to
LVDS (Low Voltage Differential Signaling) interfaces. These include the PCI bus and parallel T and PCI Express and
Serial T .
» ETXexpress® modules are Kontron's COM Express™ modules in basic form factor (125mm x 95mm)
» microETXexpress® modules are Kontron's COM Express™ modules in compact form factor (95mm x 95mm)
» nanoETXexpress® modules are Kontron's COM Express™ modules in the future ultra form factor (55mm x
84mm)
2.3 Understanding COM Express™ Functionalit
ll Kontron microETXexpress® and ETXexpress® modules contain two connectors; each of it has two rows. The
primary connector has two rows called Row and Row B. The secondary connector has two rows called Row C and Row
D. On nanoETXexpress® modules only the primary connector Row and Row B is used.
The primary connector (Row and Row B) feature the following legacy-free functionality:
» Ethernet
» Serial T (S T )
» USB 2.0
» LVDS/VG and dual display video
» High Definition udio ( zalia)
» LPC (low pin count) Bus
» PCIexpress
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nanoETXexpress-SP/Introduction
2.4 COM Express™ Documentation
This product manual serves as one of three principal references for a COM Express™ design. It documents the
specifications and features of nanoETXexpress-SP. The other two references, which are available from your Kontron
Support or from PICMG®, include:
» The COM Express Specification defines the COM Express™ module form factor, pinout, and signals. This
document ist available from the PIGMG website by filling out the order form.
» The COM Express™ Design Guide by PICMG serves as a general guide for baseboard design, with a focus on
maximum flexibility to accommodate a wide range of COM Express™ modules.
Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.
2.5 COM Express™ Benefits
Computer on modules express (COM Express™) modules are very compact, highly integrated computers. ll
(nano/micro)ETXexpress® modules feature a standardized form factor and a standardized connector layout that carry
a specified set of signals. Each (nano/micro)ETXexpress® module is based on connector type 1 or 2 of the COM
Express™ specification. This standardization allows designers to create a single-system baseboard that can accept
present and future (nano/micro)ETXexpress® modules.
(nano/micro)ETXexpress® modules include common personal computer (PC) peripheral functions such as:
» Graphics
» USB ports
» Ethernet
» Sound
» S T
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.
peripheral PCI bus can be implemented directly on the baseboard rather than on mechanically unwieldy expansion
cards. The ability to build a system on a single baseboard using the computer as one plug-in component simplifies
packaging, eliminates cabling, and significantly reduces system-level cost.
single baseboard design can use a range of ETXexpress®, microETXexpress® and nanoETXexpress modules. This
flexibility can differentiate products at various price/performance points, or to design future proof systems that have
a built-in upgrade path. The modularity of a COM Express™ solution also ensures against obsolescence as computer
technology evolves. properly designed COM Express™ baseboard can work with several successive generations of
COM Express® modules.
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nanoETXexpress-SP/Introduction
COM Express™ baseboard design has many advantages of a custom, computer-board design but delivers better
obsolescence protection, greatly reduced engineering effort, and faster time to market.
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nanoETXexpress-SP/Specification
3 Specification
3.1 Available Modules of nanoETXexpress-SP
nanoETXexpress-SP is available in different variants to cover the demand of different performance, price and power.
The following table shows the different combinations of nanoETXexpress-SP
Product Number Intel® ATOM™ CPU Onboard DDR2 SDRAM Onboard Flash Drive Lan Controller
34001-5151-11-0 1,1GHz Z510 512MB 512MB no
34001-5151-11-1 1,1GHz Z510 512MB 512MB yes
34001-5151-11-1EXT 1,1GHz Z510 512MB 512MB yes
34001-5120-11-1 1,1GHz Z510 512MB 2GB yes
34001-1020-11-1 1,1GHz Z510 1GB 2GB yes
34001-5120-16-1 1,6GHz Z530 512MB 2GB yes
34001-1040-16-1 1,6GHz Z530 1GB 4GB yes
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nanoETXexpress-SP/Specification
3.2 Functional Specification
Processor: Intel® ATOM™
Processor Number
of Cores
Core Processor
Base
Frequenc
L2
Cache
Bus
Speed
VT-x HT Intel® 64 EIST Max TDP
Z510 1 45nm 1.1 GHz 512KB 400 MHz No No No Yes 2W
Z530 1 45nm 1.6 GHz 512KB 533 MHz Yes Yes No Yes 2,2W
Chipset: SCH US15W
Speed: 400/533 MHz
RAM: memory down up to 2GB Single Channel
USB. 2 x USB 2.0 (COM #4,#5)
5 x USB 1.1/2.0
USB Client: 1 x USB Client (COM #7)
Audio: HD udio
PCI Express: 1 PCIe X1
2 PCIe X1 without L N
Max TDP: 2.3W
Integrated graphics: Intel® GMA 500
max graphic memor (GMA driver): Intel® GM 500
max graphic memor (IEGD): 352MB
Graphics Core Render Clock: 200MHz
Memor Bandwidth (GB/s): 4.2
Pixel Pipelines: 4
DirectX / OpenGL: 9.0c / 2.0
Shader Model: 3.0
Hardware acceleration: H.264,MPEG2/4,VC1,WMV9
Displa Interfaces
CRT: VG is not supported by the US15W System Controller Hub
Flat Panel: Single Channel LVDS 18/24 Bit, resolution up to 1366 x 768 (WXG ), no dithering.
Digital Displa : Optional Serial DVO (SDVO) with resolution up to FullHD 1920 x 1080 is supported via 30pin
onboard flat foil connector or project based on COM Expresss connector
Storage
Flash Disk: Onboard SSD Flash drive up to 4GB (primary master)
SATA: 1xSerial T supporting 1.5Gbit/s (P T 2S T Bridge, primary slave)
Onboard devices:
Ethernetcontroller: Intel® 82574L (Hartwell) offers 10/100/1000 Mbit
Ethernetfeatures: WakeOnLan, PXE Lanboot, Time Sync Protocol Indicator, Jumbo Frames
TPM: Optional Trusted Platform Module 1.2
Watchdog: Integrated in onboard CPLD
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nanoETXexpress-SP/Specification
Additional Interfaces:
LPC: Yes
SMBus: Yes
I2C: Fast I2C (from US15W SCH
GPIO: 8 GPIO, 4 GPI and 4 GPO via JID 32 interface IO Port 0
SDIO: 1 x SDIO port (SD 1.1) shared with GPIO signals; SDIO boot supported with BIOS NOW1R113 or newer
Kontron Features
I2C support: Fast I2C
MARS support: Extended
JIDA / EAPI support: JID 16/32
K-Station: YES
JILI support: Extended
Flash Backup: R113
S5 Eco Mode: -
Darkboot / Bootlogo support: YES
Watchdog support: YES
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nanoETXexpress-SP/Specification
3.3 Onboard SSD
The nanoETXexpress-SP is equipped with an onboard commercial or industrial flash drive from 512MB up to 4 GB
capacity. The onboard flash drive is connected as the primary master device to the US15W P T interface through a
standard T /IDE bus interface. Basic features of the nanoETXexpress-SP onboard Flash Drive:
» up to PIO Mode 6
» up to multi word DM Mode 4
» up to ultra DM -4
» Build in ECC (Error Correction Code)
» Dynamic Wear Leveling
» Expanded Data Protection
The nanoETXexpress-SP is equipped with different commercial and industrial SSD flash types. Find the details
according to the module hardware revision below:
Series modules equipped with Intel® Atom™ Z510 CPU
34001-5151-11-0 34001-5151-11-0 34001-5151-11-1 34001-5151-11-1
Module HW
Revision
CE 1.0.x CE 1.1.x and newer CE 1.0.x CE 1.1.x and newer
Flash Size 512MB commercial 512MB industrial 512MB commercial 512MB industrial
Flash Part No. SST85LD0512T-120-
5C
SST85LD0512-60-RI SST85LD0512T-120-
5C
SST85LD0512-60-RI
NAND T pe SLC N ND SLC N ND SLC N ND SLC N ND
Host write C cles - 100M - 100M
Flash Erase C cles 100k 100k 100k 100k
Flash Temp Range
[°C]
0 to 70 -40 to 85 0 to 70 -40 to 85
Sustained Read
Speed
10 MB/s 17 MB/s 10 MB/s 17 MB/s
Sustained Write
Speed
5 MB/s 5 MB/s 5 MB/s 5 MB/s
Series modules equipped with Intel® Atom™ Z530 CPU
34001-5120-16-1 34001-5120-16-1 34001-1040-16-1 34001-1040-16-1
Module HW Revision CE 1.0.x CE 1.1.x and newer CE 1.0.x (Samples) CE 1.1.x and newer
Flash Size 2GB commercial 2GB industrial 4GB commercial 4GB industrial
Flash Part No. SST85LD1002L-60-
PC
SST85LD1002U-60RI SST85LD1004M-60-
PC
SST85LD1004T-60-
RI
N ND Type SLC N ND SLC N ND MLC N ND SLC N ND
Host write Cycles 10M 100M 10M 100M
Flash Erase Cycles 10k 100k 10k 100k
Flash Temp Range
[°C]
0 to 70 -40 to 85 0 to 70 -40 to 85
Sustained Read
Speed
23 MB/s 30 MB/s 30 MB/s 20 MB/s
Sustained Write
Speed
4 MB/s 20 MB/s 8 MB/s 20 MB/s
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nanoETXexpress-SP/Specification
3.4 S stem Memor
The nanoETXexpress-SP provides up to 2GB of DDR2 SDR M which is soldered on the module.
The total amount of memory available on the module is used for main memory and graphics memory. The Unified
Memory rchitecture (UM ) manages how the system shares memory between the graphics controller and the
processor.
The maximum supported memory configuration is 8 x 2Gbit (2GB). Usually modules are equipped with 8 x 1Gbit (1GB)
or 4 x 1Gbit (512MB mounted on bottom side of the PCB).
8 memory chips are only supported on hardware revision CE 4.x.x or newer. Former
hardware revisions supports up to 4x2Gbit (1GB) system memory.
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nanoETXexpress-SP/Specification
3.5 Block Diagram
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nanoETXexpress-SP/Specification
3.6 Mechanical Specification
3.6.1 Module Dimension
» Listenpunkt55mm x 84mm (±0.2mm)
3.6.2 Height on Top
» Maximum approx. 3.5mm (withouth printed circuit board)
» Height is depending on (optional) CPU cooler / heat spreader
3.6.3 Height on Bottom
» Maximum appporx. 3.5mm (without printed circuit board)
3.6.4 Mechanical Drawing
ll dimensions are shown in millimeters. Tolerances should be ± 0.25mm [±0.010“], unless otherwise noted. The
tolerances on the module connector locating peg holes (dimensions [16.50, 6.00]) should be ± 0.10mm [±0.004“].
The 220 pin module connector shall be mounted on the backside of the PCB and is seen “through” the board in this
view. The 4 mounting holes shown in the drawing should use 6mm diameter pads and should have 2.7mm plated
holes, for use with 2.5mm hardware. The pads should be tied to the PCB ground plane.
complete Solid Works eDrawing package is available at Kontron’s EMD Customer Section
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nanoETXexpress-SP/Specification
3.7 Electrical Specification
3.7.1 Suppl Voltage
nominal Voltage: 12V +/- 5%
Wide Range input: 4.75 - 14V
5V_Stb: 5V DC +/- 5%
If a module is E1 rated and should be used in E1 temperature range the supply voltage must
be 12V +- 5%!
3.7.2 Power Suppl Rise Time
» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.
» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point
following the TX specification
3.7.3 Suppl Voltage Ripple
» Maximum 100 mV peak to peak 0 – 20 MHz
3.7.4 Power Consumption
The maximum Power Consumption of the different nanoETXexpress-SP modules is 4.9 - 6.2W (100% CPU load; 90°C
CPU temperature). Further details with measurements and TDP values of the single variants can be found in our
customer section. Information there is available after registration.
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nanoETXexpress-SP/Specification
3.8 Environmental Specification
3.8.1 Temperature
With Kontron Embedded Modules GmbH heatspreader plate assembl
Operating:
» mbient temperature: 0 to +60 °C
» Maximum heatspreader-plate temperature: 0 to +60 °C
Non-operating: -30 to +85 °C
The maximum operating temperature with the heatspreader plate is the maximum
measurable temperature on any spot on the heatspreader’s surface. You must maintain the
temperature according to the above specification.
Without Kontron Embedded Modules GmbH heatspreader plate assembl
Operating:
» Maximum operating temperature: 0 to +60 °C)
Non operating: -30 to +85 °C
The maximum operating temperature is the maximum measurable temperature on any spot
on a module’s surface. You must maintain the temperature according to the above sp
ecification.
3.8.2 Humidit
» Operating: 10% to 90% (non condensing)
» Non operating: 5% to 95% (non condensing)
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nanoETXexpress-SP/Specification
3.9 MTBF
The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test
data, if the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts.
The calculation methode used is “Telcordia Method 1 Case 3” in a ground benign, controlled environment (GB,GC).
This particular method takes into account varying temperature and stress data and the system is assumed to have not
been burned in.
Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.
System MTBF (hours): 209423 @ 40°C
Fans usually shipped with Kontron Embedded Modules GmbH products have 50,000-hour
typical operating life. The above estimates assume no fan, but a passive heat sinking
arrangement Estimated RTC battery life (as opposed to battery failures) is not accounted
for in the above figures and need to be considered for separately. Battery life depends on
both temperature and operating conditions. When the Kontron unit has external power;
the only battery drain is from leakage paths.
Connector The pin outs for nanoETXexpress-SP Interface Connectors X1 and X1B are documented for convenient
reference. Please see the COM Express™ Specification and COM Express™ Design Guide for detailed, design-level
information.
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