Kontron COMe-cDC2 User manual

COMe-cDC2
Document Revision 130
www.kontron.com

» Table of Contents «
1User Information..................................................................................6
1.1 About This Document.................................................................................................................... 6
1. Copyright Notice.......................................................................................................................... 6
1.3 Trademarks................................................................................................................................. 6
1.4 Standards................................................................................................................................... 6
1.5 Warranty.................................................................................................................................... 7
1.6 Technical Support......................................................................................................................... 7
Introduction........................................................................................8
.1 Product Description...................................................................................................................... 8
. Naming clarification..................................................................................................................... 8
.3 Understanding COM Express® Functionality.......................................................................................8
.4 COM Express® Documentation.........................................................................................................9
.5 COM Express® Benefits.................................................................................................................. 9
3Product Specification..........................................................................10
3.1 Modules & Accessories................................................................................................................. 10
3. Functional Specification............................................................................................................... 1
3.3 Block Diagram............................................................................................................................ 15
3.4 Electrical Specification................................................................................................................ 16
3.4.1 Supply Voltage........................................................................................................................... 16
3.4. Power Supply Rise Time................................................................................................................ 16
3.4.3 Supply Voltage Ripple.................................................................................................................. 16
3.4.4 Power Consumption..................................................................................................................... 16
3.4.5 ATX Mode.................................................................................................................................. 17
3.4.6 Single Supply Mode.....................................................................................................................17
3.5 Power Control............................................................................................................................ 18
3.6 Environmental Specification......................................................................................................... 19
3.6.1 Temperature Specification............................................................................................................19
3.6. Humidity................................................................................................................................... 19
3.7 Standards and Certifications......................................................................................................... 0
3.8 MTBF........................................................................................................................................
3.9 Mechanical Specification.............................................................................................................. 3
3.10 Thermal Management.................................................................................................................. 4
3.11 Heatspreader............................................................................................................................. 4
3.1 Onboard Fan Connector................................................................................................................ 5
3.1 .1 Electrical Characteristics.............................................................................................................. 6
4Features and Interfaces....................................................................... 7
4.1 Onboard SSD.............................................................................................................................. 7
4. S5 Eco Mode.............................................................................................................................. 8
4.3 LPC.......................................................................................................................................... 9
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COMe-cDC /
4.4 LPC boot................................................................................................................................... 30
4.5 M.A.R.S.................................................................................................................................... 31
4.6 Fast I C.................................................................................................................................... 3
4.7 JIDA16 and JIDA3 ..................................................................................................................... 33
4.8 K-Station 1................................................................................................................................ 34
4.9 K-Station & API Resources for JIDA3 .............................................................................................. 35
4.9.1 I C.......................................................................................................................................... 35
4.9. Storage.................................................................................................................................... 35
4.9.3 GPIO........................................................................................................................................ 35
4.9.4 Hardware Monitor....................................................................................................................... 35
4.10 API Ressources for Board Driver..................................................................................................... 35
4.10.1 I C.......................................................................................................................................... 35
4.10. Storage.................................................................................................................................... 36
4.10.3 GPIO........................................................................................................................................ 36
4.10.4 Onboard Hardware Monitor...........................................................................................................36
4.10.5 SIO Winbond 836 7DHGP............................................................................................................. 36
4.10.6 SIO Winbond 836 7HG................................................................................................................. 37
4.11 GPIO - General Purpose Input and Output.........................................................................................38
4.1 Dual Staged Watchdog Timer.........................................................................................................39
4.13 Flash Backup Feature................................................................................................................... 40
4.14 Speedstep Technology................................................................................................................. 4
4.15 C-States.................................................................................................................................... 43
4.16 Hyper Threading......................................................................................................................... 44
4.17 ACPI Suspend Modes and Resume Events..........................................................................................45
5System Ressources..............................................................................46
5.1 Interrupt Request (IRQ) Lines........................................................................................................ 46
5.1.1 In 8 59 PIC Mode........................................................................................................................ 46
5.1. In APIC mode............................................................................................................................. 47
5. Direct Memory Access (DMA) Channels.............................................................................................47
5.3 Memory Area.............................................................................................................................. 47
5.4 I/O Address Map.........................................................................................................................48
5.5 External Inter-IC (I C) Bus............................................................................................................48
5.6 System Management (SM) Bus....................................................................................................... 48
5.7 JILI I C Bus............................................................................................................................... 48
6Connectors........................................................................................49
6.1 Connector Location.....................................................................................................................49
6. Pinout List................................................................................................................................ 50
6. .1 General Signal Description............................................................................................................ 50
6. . Connector X1A Row A................................................................................................................... 51
6. .3 Connector X1A Row B...................................................................................................................53
6. .4 Connector X1B Row C................................................................................................................... 55
6. .5 Connector X1B Row D................................................................................................................... 57
7BIOS Operation...................................................................................59
7.1 Determining the BIOS Version.......................................................................................................59
7. BIOS Update.............................................................................................................................. 59
7.3 Setup Guide............................................................................................................................... 60
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COMe-cDC /
7.3.1 Start AMI® BIOS Setup Utility....................................................................................................... 60
7.4 BIOS Setup................................................................................................................................ 6
7.4.1 Main Menu................................................................................................................................ 6
7.4. Module Info............................................................................................................................... 63
7.4.3 Advanced Menu.......................................................................................................................... 65
7.4.4 PCIPnP Menu.............................................................................................................................. 86
7.4.5 Boot........................................................................................................................................ 87
7.4.6 Security.................................................................................................................................... 89
7.4.7 Chipset..................................................................................................................................... 90
7.4.8 Exit Menu.................................................................................................................................. 96
5

COMe-cDC / User Information
1 User Information
1.1 About This Document
This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.
1.2 Copyright Notice
Copyright © 003- 01 Kontron Europe GmbH
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Europe GmbH.
DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.
1.3 Trademarks
The following lists the trademarks of components used in this board.
» IBM, XT, AT, PS/ and Personal System/ are trademarks of International Business Machines Corp.
» Microsoft is a registered trademark of Microsoft Corp.
» Intel is a registered trademark of Intel Corp.
» All other products and trademarks mentioned in this manual are trademarks of their respective owners.
1.4 Standards
Kontron Europe GmbH is certified to ISO 9000 standards.
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COMe-cDC / User Information
1.5 arranty
This Kontron Europe GmbH product is warranted against defects in material and workmanship for the warranty period
from the date of shipment. During the warranty period, Kontron Europe GmbH will at its discretion decide to repair or
replace defective products.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.
The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, operation outside of the product’s environmental specifications or improper
installation or maintenance.
Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron
Europe GmbH that are caused by a faulty Kontron Europe GmbH product.
1.6 Technical Support
Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are
committed to making our product easy to use and will help you use our products in your systems.
Please consult our Web site at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.
7

COMe-cDC / Introduction
2 Introduction
2.1 Product Description
The COMe-cDC brings latest 45 nm performance generations of Intel® Atom™ N 70 processor with 1.6 GHz and the
Intel® 945GSE and ICH7M chipset to a compact 95 x 95 mm module.
Kontron’s new high-efficient power-off state S5 Eco enables ACPI features and lowest power-consumption in soft-off
state – less than 1 mA. Compared to the regular S5 state this means a reduction by at least factor 00! Battery uptime
therefore goes up dramatically.
Like all COM Express® compact modules, it is compatible to the COM Express® basic. Therefore, upgrading existing carrier
boards originally designed for COM Express® basic gets easy and minimizes redesign efforts.
2.2 Naming clarification
COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.
» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (1 5mm x 95mm), formerly known
as ETXexpress®
» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm), formerly known
as microETXexpress®
» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm), formerly known as
nanoETXexpress
The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames ( ) and
the pin-out type (#) followed by the CPU Name.
2.3 Understanding COM Express® Functionality
All Kontron COM Express® basic and compact modules contain two 0pin connectors; each of it has two rows called Row
A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out type:
Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6
HD Audio 1x 1x 1x 1x
Gbit Ethernet 1x 1x 1x 1x
Serial ATA 4x 4x 4x 4x
Parallel ATA - - 1x -
PCI - - 1x -
PCI Express x1 6x 6x 6x 8x
PCI Express x16 (PEG) - - 1x 1x
USB Client 1x 1x - -
USB 2.0 8x 8x 8x 8x
USB 3.0 - x - 4x
VGA 1x - 1x 1x
LVDS Dual Channel Single Channel Dual Channel Dual Channel
DP++ (SDVO/DP/HDMI/DVI) 1x optional 1x 3x shared with PEG 3x
LPC 1x 1x 1x 1x
External SMB 1x 1x 1x 1x
External I2C 1x 1x 1x 1x
GPIO 8x 8x 8x 8x
SDIO 1x optional 1x optional - -
UART (2-wire COM) - x - x
FAN PWM out - 1x - 1x
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COMe-cDC / Introduction
2.4 COM Express® Documentation
This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of COMe-cDC . Additional references are are available from your Kontron Support or from
PICMG®:
» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document
is available from the PIGMG website by filling out the order form.
» The COM Express® Design Guide by PICMG serves as a general guide for baseboard design, with a focus on maximum
flexibility to accommodate a wide range of COM Express® modules.
Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.
2.5 COM Express® Benefits
COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout that carry a specified set of signals. Each COM is based on
the COM Express® specification. This standardization allows designers to create a single-system baseboard that can
accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.
A single baseboard design can use a range of COM Express® modules with different size and pin-out. This flexibility can
differentiate products at various price/performance points, or to design future proof systems that have a built-in upgrade
path. The modularity of a COM Express® solution also ensures against obsolescence as computer technology evolves. A
properly designed COM Express® baseboard can work with several successive generations of COM Express® modules.
A COM Express® baseboard design has many advantages of a custom, computer-board design but delivers better
obsolescence protection, greatly reduced engineering effort, and faster time to market.
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COMe-cDC / Product Specification
3 Product Specification
3.1 Modules & Accessories
The COM Express® compact sized Computer-on-Module COMe-cDC (UNP1) follows pin-out Type and is compatible to
PICMG specification COM.0 Rev 1.0. The COMe-cDC based on Intel's Navy Pear platform is available in different variants:
Commercial grade modules (0°C to 60°C operating)
Product Number Product Name Processor Chipset and Features
36005-0000-16- COMe-cDC N 70 Intel® Atom™ N 70 DDR , 945GSE
36005-0040-16- COMe-cDC N 70 4GB Intel® Atom™ N 70 DDR , 945GSE, 4GB SSD
Extended temperature modules (E1, -25°C to +75°C operating)
Product Number Product Name Processor Chipset and Features
36005-0000-16- EXT COMe-cDC N 70 E1 Intel® Atom™ N 70 DDR , 945GSE, E1
36005-0040-16- EXT COMe-cDC N 70 4GB E1 Intel® Atom™ N 70 DDR , 945GSE, 4GB SSD, E1
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COMe-cDC / Product Specification
Accessories
Product Number Carrier Boards
3810 -0000-00-1 COM Express® Reference Carrier Type (8mm COMe connector)
38104-0000-00-0 COM Express® Eval Carrier Type (Niles Canyon, 5mm COMe connector)
38104-0000-00-1 COM Express® Eval Carrier Type (Topanga Canyon, 5mm COMe connector)
Product Number Memory
97011-51 0-08-0 DDR -800 SODIMM / 51 MB
97011-10 4-08-0 DDR -800 SODIMM / 1GB
97011- 048-08-0 DDR -800 SODIMM / GB
97011-51 0-08- DDR -800 SODIMM / 51 MB E
97011-10 4-08- DDR -800 SODIMM / 1GB E
97011- 048-08- DDR -800 SODIMM / GB E
Product Number Cooling & Mounting
36005-0000-99-0 HSP COMe-cDC thread
36005-0000-99-1 HSP COMe-cDC through
36005-0000-99-0C01 HSK COMe-cDC active thread
36005-0000-99-0CO HSK COMe-cDC passive thread
36099-0000-99-0 COMe Active Uni Cooler (for CPUs up to 0W TDP)
36099-0000-99-1 COMe Passive Uni Cooler (for CPUs up to 10W TDP)
38017-0000-00-0 COMe Mount KIT 8mm 1set
38017-0000-00-5 COMe Mount KIT 5mm 1set
38017-0100-00-0 COMe Mount KIT 8mm 100sets
38017-0100-00-5 COMe Mount KIT 5mm 100sets
Product Number Adapter & Cables
9-5000-035 ADA-LVDS-DVI 18bit (LVDS to DVI converter)
96079-0000-00-0 KAB-HSP 00mm (Cable adapter to connect a standard FAN to the module)
96079-0000-00-1 KAB-HSP 40mm (Cable adapter to connect a standard FAN to the module)
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COMe-cDC / Product Specification
3.2 Functional Specification
Processor
The 45nm Intel® ATOM™ (Diamondville) CPU with x mm package size (PBGA437 socket) supports:
» Intel® Hyper-Threading Technology (HTT)
» Enhanced Intel SpeedStep® Technology (EIST)
» Thermal Monitoring Technologies
» Idle States (C-States)
» Execute Disable Bit
CPU specifications
» Intel® ATOM™
» Codename: Diamondville
» L -Cache: 51 kB
» FSB: 533MHz
» Instruction set: 3 bit
Memory
Sockets 1x DDR SO-DIMM
Memory Type DDR -400/533
Maximum Size GB
Technology Single Channel
Chipset
The Intel® 945GSE Chipset (Codename Calistoga) combined with the Intel® 8 801GBM (ICH7M) Southbridge supports:
» PCI Express Revision 1.0
» USB .0
» Integrated Graphics with dual display
Graphics Core
The integrated Intel® GMA950 (Gen3.5) supports:
Graphics Core Render Clock 166MHz
Execution Units / Pixel Pipelines 4
Max Graphics Memory 56MB
GF Memory Bandwidth (GB/s) 10.7
GF Memory Technology DVMT 3.0
API (Direct /OpenGL) 9.0c / 1.4
Shader Model .0
Hardware accelerated Video -
Independent/Simultaneous Displays
Display Port -
HDCP support -
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COMe-cDC / Product Specification
Monitor output
CRT max Resolution 048x1536
TV out: YES
LVDS
LVDS Bits/Pixel 1x18 / x18
LVDS Bits/Pixel with dithering -
LVDS max Resolution: 1600x1 00
PWM Backlight Control: YES
Supported Panel Data: JILI /JILI3/EDID/DID
Display Interfaces
Discrete Graphics -
Digital Display Interface DDI1 SDVOB
Digital Display Interface DDI2 -
Digital Display Interface DDI3 -
Maximum Resolution on DDI 19 0x1 00
Storage
onboard SSD 51 MB to 8GB SLC (PATA)
SD Card support -
IDE Interface 1x PATA 100
Serial-ATA x SATA 1.5Gb/s
SATA AHCI NCQ, HotPlug, Staggered Spinup
SATA RAID -
Variants with onboard SSD flash do not support external IDE due to the missing signals
PDIAG# and DASP# master/slave capabilities on COM Express® connector
Connectivity
USB 8x USB .0
USB Client -
PCI PCI Rev .3 (33MHz/3.3V)
PCI External Masters 4
PCI Express 3x PCIe x1 Gen1
Max PCI Express 4x PCIe x1 without LAN
PCI Express x2/x4 configuration NO
Ethernet 10/100/1000 Mbit
Ethernet controller Intel® 8 574L (Hartwell)
Ethernet
The Intel® 8 574L (Hartwell) ethernet supports:
» Jumbo Frames
» Time Sync Protocol Indicator
» WOL (Wake On LAN)
» PXE (Preboot eXecution Environment)
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COMe-cDC / Product Specification
Misc Interfaces and Features
Audio AC97 / HD Audio
Onboard Hardware Monitor ON Semi ADT7475
Trusted Platform Module Infineon TPM 1. SLB9635TT
Miscellaneous -
Kontron Features
External I2C Bus Fast I C, MultiMaster capable
M.A.R.S. support YES
Embedded API JIDA16 / JIDA3 / PICMG EAPI
Custom BIOS Settings / Flash Backup YES
Watchdog support Dual Staged
Power Features
Singly Supply Support YES
Supply Voltage 8.5V - 18V
ACPI ACPI .0
S-States S0, S3, S4, S5
S5 Eco Mode YES
Misc Power Management DPST .3
Power Consumption and Performance
Full Load Power Consumption 10W
Kontron Performance Index 1714
Kontron Performance/Watt 17
Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics
and Memory performance are available in Application Note KEMAP054 at EMD Customer
Section.
Supported Operating Systems
The COMe-cDC currently supports:
» Microsoft Windows CE 6.0
» Microsoft Windows XP embedded
» Microsoft Windows XP x86
» Microsoft Windows 7 x86
» Microsoft Windows Embedded Standard 7 x86 (WES7)
» Linux
» WindRiver VxWorks 6.6 - 6.8
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COMe-cDC / Product Specification
3.3 Block Diagram
15

COMe-cDC / Product Specification
3.4 Electrical Specification
3.4.1 Supply Voltage
Following supply voltage is specified at the COM Express® connector:
VCC: 8.5V - 18V
Standby: 5V DC +/- 5%
RTC: .5V - 3.3V
- 5V Standby voltage is not mandatory for operation.
- Extended Temperature (E1) variants are validated for 1 V supply only
3.4.2 Power Supply Rise Time
» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 0ms.
» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point
following the ATX specification
3.4.3 Supply Voltage Ripple
» Maximum 100 mV peak to peak 0 – 0 MHz
3.4.4 Power Consumption
The maximum Power Consumption of the different COMe-cDC variants is 10W (100% CPU load on all cores; 90°C CPU
temperature). Further information with detailed measurements are available in Application Note KEMAP054 available on
EMD Customer Section. Information there is available after registration.
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COMe-cDC / Product Specification
3.4.5 ATX Mode
By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to
enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal
which is generated by SUS_S3# via inversion. VCC can be 8.5V - 18V in ATX Mode. On Computer-on-Modules supporting a
wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB).
State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC
G3 x x 0V x 0V
S5 high low 5V high 0V
S5 S0 →PWRBTN Event low high →5V high low →0 V VCC →
S0 high high 5V low VCC
3.4.6 Single Supply Mode
In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically
when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in
this mode and VCC can be 8.5V - 18V.
To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not
supported in Single Supply Mode.
State PWRBTN# PWR_OK V5_StdBy VCC
G3 x x x 0
G3 S0 →high open / high x connecting VCC
S5 high open / high x VCC
S5 S0 →PWRBTN Event open / high x reconnecting VCC
Signals marked with “x” are not important for the specific power state. There is no
difference if connected or open.
All ground pins have to be tied to the ground plane of the carrier board.
17

COMe-cDC / Product Specification
3.5 Power Control
Power Supply
The COMe-cDC supports a power input from 8.5V - 18V. The supply voltage is applied through the VCC pins (VCC) of the
module connector.
Power Button (PWRBTN#)
The power button (Pin B1 ) is available through the module connector described in the pinout list. To start the module via
Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).
Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).
Power Good (PWR_OK)
The COMe-cDC provides an external input for a power-good signal (Pin B 4). The implementation of this subsystem
complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on
the module.
Reset Button (SYS_RESET#)
The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in
reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.
Modules with Intel® Chipset and active Management Engine does not allow to hold the
module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will
reboot the module automatically
SM-Bus Alert (SMB_ALERT#)
With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if
BIOS switch “After Power Fail” is set to “Stay Off”.
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COMe-cDC / Product Specification
3.6 Environmental Specification
3.6.1 Temperature Specification
General Specification Operating Non-operating
Commercial grade 0°C to +60°C -30°C to +85°C
Extended (E1) - 5°C to +75°C -30°C to +85°C
Industrial grade (E ) -40°C to +85°C -40°C to +85°C
Standard modules are available for commercial grade temperature range. Please see
chapter Product Specification for available variants for extended or industrial temperate
grade
With Kontron heatspreader plate assembly
The operating temperature defines two requirements:
» the maximum ambient temperature with ambient being the air surrounding the module.
» the maximum measurable temperature on any spot on the heatspreader's surface
Without Kontron heatspreader plate assembly
The operating temperature is the maximum measurable temperature on any spot on the module's surface.
3.6.2 Humidity
» Operating: 10% to 90% (non condensing)
» Non operating: 5% to 95% (non condensing)
19

COMe-cDC / Product Specification
3.7 Standards and Certifications
RoHS
The COMe-cDC2 is compliant to the directive 00 /95/EC on the restriction of the use of certain hazardous substances
(RoHS) in electrical and electronic equipment.
CE marking
The COMe-cDC2 is CE marked according to Low Voltage Directive 006/95/EC – Test standard EN60950
Component Recognition UL 60950-1
The COM Express® compact form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc.
Representative samples of this component have been evaluated by UL and meet applicable UL requirements.
UL Listings:
» NWGQ .E304 78
» NWGQ8.E304 78
WEEE Directive
WEEE Directive 00 /96/EC is not applicable for Computer-on-Modules.
Conformal Coating
Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please
contact your local sales or support for further details.
20