Kontron COMe-cEL6 User manual


USER GUIDE
www.kontron.com
COMe-cEL6
User Guide, Rev.1.2
Doc. ID: 1068 2881

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
COME
-CEL6 - USER GUIDE
Disclaimer
Kontron would like to point out that the information contained in this user guide may be subject to alteration,
particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee on
the part of Kontron with respect to technical processes described in the user guide or any product characteristics set
out in the user guide. Kontron assumes no responsibility or liability for the use of the described product(s), conveys no
license or title under any patent, copyright or mask work rights to these products and makes no representations or
warranties that these products are free from patent, copyright or mask work right infringement unless otherwise
specified. Applications that are described in this user guide are for illustration purposes only. Kontron makes no
representation or warranty that such application will be suitable for the specified use without further testing or
modification. Kontron expressly informs the user that this user guide only contains a general description of processes
and instructions which may not be applicable in every individual case. In cases of doubt, please contact Kontron.
This user guide is protected by copyright. All rights are reserved by Kontron. No part of this document may be
reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer
language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the
express written permission of Kontron. Kontron points out that the information contained in this user guide is
constantly being updated in line with the technical alterations and improvements made by Kontron to the products and
thus this user guide only reflects the technical status of the products by Kontron at the time of publishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
©2021 by Kontron Europe GmbH
Kontron Europe GmbH
Gutenbergstraße 2
85737 Ismaning
Germany
www.kontron.com

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Intended Use
THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE
OR RESALE FOR THE OPERATION OF NUCLEAR FACILITIES, THE NAVIGATION, CONTROL OR
COMMUNICATION SYSTEMS FOR AIRCRAFT OR OTHER TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE
SUPPORT OR LIFE SUSTAINING APPLICATIONS, WEAPONS SYSTEMS, OR ANY OTHER APPLICATION IN A
HAZARDOUS ENVIRONMENT, OR REQUIRING FAIL-SAFE PERFORMANCE, OR IN WHICH THE FAILURE OF
PRODUCTS COULD LEAD DIRECTLY TO DEATH, PERSONAL INJURY, OR SEVERE PHYSICAL OR
ENVIRONMENTAL DAMAGE (COLLECTIVELY, "HIGH RISK APPLICATIONS").
You understand and agree that your use of Kontron devices as a component in High Risk Applications is entirely at
your risk. To minimize the risks associated with your products and applications, you should provide adequate design
and operating safeguards. You are solely responsible for compliance with all legal, regulatory, safety, and security
related requirements concerning your products. You are responsible to ensure that your systems (and any Kontron
hardware or software components incorporated in your systems) meet all applicable requirements. Unless otherwise
stated in the product documentation, the Kontron device is not provided with error-tolerance capabilities and cannot
therefore be deemed as being engineered, manufactured or setup to be compliant for implementation or for resale as
device in High Risk Applications. All application and safety related information in this document (including application
descriptions, suggested safety measures, suggested Kontron products, and other materials) is provided for reference
only.
You find the most recent version of the “General Safety Instructions“ online in the download
area of this product.
This product is not suited for storage or operation in corrosive environments, in particular
under exposure to sulfur and chlorine and their compounds. For information on how to
harden electronics and mechanics against these stress conditions, contact Kontron Support.

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Revision History
Revision Brief Description of Changes Date of Issue Author
1.0 Initial Version 2021-July-23 CW
1.1 Added Tjuntion temperature range to Table 5: Processor
Specification
2021-Sept-09 CW
1.2 Update GPIO 2022-Jul-29 CW
Terms and Conditions
Kontron warrants products in accordance with defined regional warranty periods. For more information about
warranty compliance and conformity, and the warranty period in your region, visit http://www.kontron.com/terms-
and-conditions.
Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and Purchase Order Terms
& Conditions. Visit http://www.kontron.com/terms-and-conditions.
For contact information, refer to the corporate offices contact information on the last page of this user guide or visit
our website CONTACT US.
Customer Support
Find Kontron contacts by visiting: https://www.kontron.com/support-and-services/kontron-europe-and-
asia/support/contact-support
Customer Service
As a trusted technology innovator and global solutions provider, Kontron extends its embedded market strengths into
a services portfolio allowing companies to break the barriers of traditional product lifecycles. Proven product expertise
coupled with collaborative and highly-experienced support enables Kontron to provide exceptional peace of mind to
build and maintain successful products.
For more details on Kontron’s service offerings such as: enhanced repair services, extended warranty, Kontron
training academy, and more visit https://www.kontron.com/support-and-services/kontron-europe-and-
asia/services.
Customer Comments
If you have any difficulties using this user guide, discover an error, or just want to provide some feedback, contact
https://www.kontron.com/support-and-services/kontron-europe-and-asia/support/contact-support. Detail any
errors you find. We will correct the errors or problems as soon as possible and post the revised user guide on our
website.

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Symbols
The following symbols may be used in this user guide.
DANGER indicates a hazardous situation which, if not avoided,
will result in death or serious injury.
WARNING indicates a hazardous situation which, if not avoided,
could result in death or serious injury.
NOTICE indicates a property damage message.
CAUTION indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury.
Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60
V) when touching
products or parts of products. Failure to observe the precautions indicated and/or prescribed
by the law may endanger your life/health and/or result in damage to your material.
ESD Sensitive Device!
This symbol and title inform that the electronic boards and their components are sensitive to
static electricity. Care must therefore be taken during all handling operations and inspections
of this product in order to ensure product integrity at all times.
HOT Surface!
Do NOT touch! Allow to cool before servicing.
Laser!
This symbol inform of the risk of exposure to laser beam and light emitting devices (LEDs)
from an electrical device. Eye protection per manufacturer notice shall review before
servicing.
This symbol indicates general information about the product and the user guide.
This symbol also indicates detail information about the specific product configuration.
This symbol precedes helpful hints and tips for daily use.

COMe-cEL6 – User Guide, Rev.1.2
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For Your Safety
Your new Kontron product was developed and tested carefully to provide all features necessary to ensure its
compliance with electrical safety requirements. It was also designed for a long fault-free life. However, the life
expectancy of your product can be drastically reduced by improper treatment during unpacking and installation.
Therefore, in the interest of your own safety and of the correct operation of your new Kontron product, you are
requested to conform with the following guidelines.
High Voltage Safety Instructions
As a precaution and in case of danger, the power connector must be easily accessible. The power connector is the
product’s main disconnect device.
Warning
All operations on this product must be carried out by sufficiently skilled personnel only.
Electric Shock!
Before installing a non hot-swappable Kontron product into a system always ensure that
your mains power is switched off. This also applies to the installation of piggybacks. Serious
electrical shock hazards can exist during all installation, repair, and maintenance operations
on this product. Therefore, always unplug the power cable and any other cables which
provide external voltages before performing any work on this product.
Earth ground connection to vehicle’s chassis or a central grounding point shall remain
connected. The earth ground cable shall be the last cable to be disconnected or the first
cable to be connected when performing installation or removal procedures on this product.
Special Handling and Unpacking Instruction
ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. Therefore, care
must be taken during all handling operations and inspections of this product, in order to
ensure product integrity at all times.
Handling and operation of the product is permitted only for trained personnel within a work
place that is access controlled. Follow the “General Safety Instructions” supplied with the
product.
Do not handle this product out of its protective enclosure while it is not used for operational purposes unless it is
otherwise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations. Where a safe work station is not
guaranteed, it is important for the user to be electrically discharged before touching the product with his/her hands
or tools. This is most easily done by touching a metal part of your system housing.
It is particularly important to observe standard anti-static precautions when changing piggybacks, ROM devices,
jumper settings etc. If the product contains batteries for RTC or memory backup, ensure that the product is not placed
on conductive surfaces, including anti-static plastics or sponges. They can cause short circuits and damage the
batteries or conductive circuits on the product.

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Lithium Battery Precautions
If your product is equipped with a lithium battery, take the following precautions when replacing the battery.
Danger of explosion if the battery is replaced incorrectly.
Replace only with same or equivalent battery type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer’s instructions.
General Instructions on Usage
In order to maintain Kontron’s product warranty, this product must not be altered or modified in any way. Changes or
modifications to the product, that are not explicitly approved by Kontron and described in this user guide or received
from Kontron Support as a special handling instruction, will void your warranty.
This product should only be installed in or connected to systems that fulfill all necessary technical and specific
environmental requirements. This also applies to the operational temperature range of the specific board version
that must not be exceeded. If batteries are present, their temperature restrictions must be taken into account.
In performing all necessary installation and application operations, only follow the instructions supplied by the
present user guide.
Keep all the original packaging material for future storage or warranty shipments. If it is necessary to store or ship
the product then re-pack it in the same manner as it was delivered.
Special care is necessary when handling or unpacking the product. See Special Handling and Unpacking Instruction.
Quality and Environmental Management
Kontron aims to deliver reliable high-end products designed and built for quality, and aims to complying with
environmental laws, regulations, and other environmentally oriented requirements. For more information regarding
Kontron’s quality and environmental responsibilities, visit http://www.kontron.com/about-kontron/corporate-
responsibility/quality-management.
Disposal and Recycling
Kontron’s products are manufactured to satisfy environmental protection requirements where possible. Many of the
components used are capable of being recycled. Final disposal of this product after its service life must be
accomplished in accordance with applicable country, state, or local laws or regulations.
WEEE Compliance
The Waste Electrical and Electronic Equipment (WEEE) Directive aims to:
Reduce waste arising from electrical and electronic equipment (EEE)
Make producers of EEE responsible for the environmental impact of their products, especially when the product
become waste
Encourage separate collection and subsequent treatment, reuse, recovery, recycling and sound environmental
disposal of EEE
Improve the environmental performance of all those involved during the lifecycle of EEE
Environmental protection is a high priority with Kontron.
Kontron follows the WEEE directive
You are encouraged to return our products for proper disposal.

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Table of Contents
Symbols.................................................................................................................................................................................................................6
For Your Safety ...................................................................................................................................................................................................7
High Voltage Safety Instructions ..................................................................................................................................................................7
Special Handling and Unpacking Instruction ............................................................................................................................................7
Lithium Battery Precautions.......................................................................................................................................................................... 8
General Instructions on Usage..................................................................................................................................................................... 8
Quality and Environmental Management................................................................................................................................................ 8
Disposal and Recycling.................................................................................................................................................................................... 8
WEEE Compliance.............................................................................................................................................................................................. 8
Table of Contents...............................................................................................................................................................................................9
List of Tables ......................................................................................................................................................................................................11
List of Figures....................................................................................................................................................................................................12
1/ Introduction .........................................................................................................................................................................................13
1.1. Product Description...................................................................................................................................................................................13
1.2. Product Naming Clarification ................................................................................................................................................................14
1.3. COM Express® Documentation.............................................................................................................................................................15
1.4. COM Express® Functionality .................................................................................................................................................................15
1.5. COM Express® Benefits...........................................................................................................................................................................15
2/ Product Specification .......................................................................................................................................................................16
2.1. Module Variants ........................................................................................................................................................................................16
2.1.1. Commercial Grade Modules (0°C to +60°C)...................................................................................................................................16
2.1.2. Industrial Temperature Grade Modules (E2, -40°C to +85°C) ................................................................................................16
2.2. Accessories.................................................................................................................................................................................................16
2.3. Functional Specification.........................................................................................................................................................................18
2.3.1. Block Diagram.........................................................................................................................................................................................18
2.3.2. Processors...............................................................................................................................................................................................18
2.3.3. Platform Controller Hub (PCH)........................................................................................................................................................20
2.3.4. System Memory ...................................................................................................................................................................................20
2.3.5. Graphics (LVDS or eDP, DP++)...........................................................................................................................................................21
2.3.6. HD Audio...................................................................................................................................................................................................21
2.3.7. PCI Express Lanes [0-5] .....................................................................................................................................................................22
2.3.8. USB............................................................................................................................................................................................................22
2.3.9. SATA .........................................................................................................................................................................................................23
2.3.10. Ethernet LAN........................................................................................................................................................................................23
2.3.11. COMe High-speed Serial Interfaces Overview ..........................................................................................................................24
2.3.12. Storage...................................................................................................................................................................................................24
2.3.13. BIOS/Software ....................................................................................................................................................................................24
2.3.14. Additional Features........................................................................................................................................................................... 25
2.4. Electrical Specification ..........................................................................................................................................................................26
2.4.1. Power Supply Specification ..............................................................................................................................................................26
2.4.2. Power Management ........................................................................................................................................................................... 27
2.4.3. Power Supply Modes..........................................................................................................................................................................28
2.5. Thermal Management ...........................................................................................................................................................................30
2.5.1. Heatspreader Plate Assembly and Metal Heat Slug.................................................................................................................30
2.5.2. Active/Passive Cooling Solutions...................................................................................................................................................30
2.5.3. Operating with Kontron Heatspreader Plate Assembly..........................................................................................................30
2.5.4. Operating without Kontron Heatspreader Plate (HSP) Assembly.......................................................................................30

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2.5.5. Temperature Sensors..........................................................................................................................................................................31
2.5.6. On-board Fan Connector ...................................................................................................................................................................32
2.6. Environmental Specification................................................................................................................................................................ 32
2.7. Standards and Certifications ............................................................................................................................................................... 33
2.7.1. MTBF .........................................................................................................................................................................................................33
2.8. Mechanical Specification...................................................................................................................................................................... 35
2.8.1. Module Dimensions ............................................................................................................................................................................. 35
2.8.2. Module Height.......................................................................................................................................................................................36
2.8.3. Metal Heat Slug Dimensions............................................................................................................................................................ 37
3/ Features and Interfaces .................................................................................................................................................................38
3.1. ACPI Power States....................................................................................................................................................................................38
3.2. eMMC Flash Memory (option) ............................................................................................................................................................38
3.3. eSPI Mode (option)..................................................................................................................................................................................38
3.4. Fast I2C .......................................................................................................................................................................................................39
3.5. GPIO..............................................................................................................................................................................................................39
3.6. Hardware Monitor (HWM)....................................................................................................................................................................39
3.7. LPC ................................................................................................................................................................................................................40
3.8. Intel® PSE ...................................................................................................................................................................................................40
3.9. Intel® TCC ...................................................................................................................................................................................................40
3.10. Real Time Clock (RTC) ..........................................................................................................................................................................40
3.11. SDIO (option) .............................................................................................................................................................................................41
3.12. Serial Peripheral Interface (SPI).........................................................................................................................................................41
3.12.1. SPI Boot ...................................................................................................................................................................................................41
3.12.2. Booting the SPI Flash Chip...............................................................................................................................................................42
3.12.3. External SPI Flash Boot on Modules with Intel® Management Engine............................................................................42
3.13. TPM 2.0......................................................................................................................................................................................................42
3.14. UART (option)..........................................................................................................................................................................................43
3.15. Watchdog Timer (WTD) Dual Stage.................................................................................................................................................43
3.15.1. Watchdog Timer Signal.....................................................................................................................................................................43
4/ System Resources ............................................................................................................................................................................44
4.1. I2C Bus .........................................................................................................................................................................................................44
4.2. System Management (SM) Bus..........................................................................................................................................................44
5/ COMe Interface Connector.............................................................................................................................................................45
5.1. Connecting COMe Interface Connector to Carrier Board ............................................................................................................45
5.2. X1A and X1B Signals ................................................................................................................................................................................46
5.3. COMe Interface Connectors (X1A, X1B) Pin Assignment ............................................................................................................. 47
5.3.1. Connector X1A Row A1 - A110 ............................................................................................................................................................47
5.3.2. Connector X1A Row B1 – B110...........................................................................................................................................................50
5.3.3. Connector X1B Row C1 – C110 ........................................................................................................................................................... 53
5.3.4. Connector X1B Row D1 – D110 .......................................................................................................................................................... 56
6/ UEFI BIOS..............................................................................................................................................................................................59
6.1. Starting the uEFI BIOS.............................................................................................................................................................................59
6.2. Navigating the uEFI BIOS....................................................................................................................................................................... 59
6.3. Getting Help...............................................................................................................................................................................................60
6.4. Setup Menus.............................................................................................................................................................................................60
6.4.1. Main Setup Menu...................................................................................................................................................................................61
6.4.2. Advanced Setup Menu .......................................................................................................................................................................62
6.4.3. Chipset Setup Menu.............................................................................................................................................................................77
6.4.4. Security Setup Menu ..........................................................................................................................................................................89

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6.4.5. Boot Setup Menu...................................................................................................................................................................................91
6.4.6. Save and Exit Setup Menu ................................................................................................................................................................92
6.5. The uEFI Shell............................................................................................................................................................................................93
6.5.1. Entering the uEFI Shell ........................................................................................................................................................................93
6.5.2. Exiting the uEFI Shell...........................................................................................................................................................................93
6.6. uEFI Shell Scripting .................................................................................................................................................................................94
6.6.1. Startup Scripting...................................................................................................................................................................................94
6.6.2. Create a Startup Script.......................................................................................................................................................................94
6.6.3. Example of Startup Scripts...............................................................................................................................................................94
6.7. Firmware Update.....................................................................................................................................................................................95
7/ Technical Support.............................................................................................................................................................................96
7.1. Returning Defective Merchandise ......................................................................................................................................................96
8/ Warranty .............................................................................................................................................................................................. 97
8.1. Limitation/Exemption from Warranty Obligation ........................................................................................................................ 97
List of Acronyms .............................................................................................................................................................................................98
About Kontron ..................................................................................................................................................................................................99
List of Tables
Table 1: Type 6 and COMe-cEL6 Functionality........................................................................................................................................15
Table 2: Product Number for Commercial Grade Modules (0°C to +60°C operating)................................................................16
Table 3: Product Number for Industrial Grade Modules (-40°C to +85°C operating)................................................................16
Table 4: Accessories........................................................................................................................................................................................16
Table 5: Processor Specification .................................................................................................................................................................19
Table 6: COMe-cEL6 Electrical Specification..........................................................................................................................................26
Table 7: Power Supply Control Settings .................................................................................................................................................. 27
Table 8: ATX Mode Settings.........................................................................................................................................................................28
Table 9: Single Power Supply Mode Settings.........................................................................................................................................29
Table 10: Heatspreader Temperature Specification............................................................................................................................30
Table 11: Fan Connector (3-Pin) Pin Assignment ..................................................................................................................................32
Table 12: Temperature Grades and Humidity Specification..............................................................................................................32
Table 13: Standards and Certifications..................................................................................................................................................... 33
Table 14: MTBF Values...................................................................................................................................................................................33
Table 15: Supported Power States Function...........................................................................................................................................38
Table 16: SPI Boot Pin Configuration..........................................................................................................................................................41
Table 17: Supported SPI Boot Flash Types for 8-WSOIC Package....................................................................................................41
Table 18: Dual Staged Watchdog Timer- Time-Out Events...............................................................................................................43
Table 19: I2C Bus Port Address....................................................................................................................................................................44
Table 20: SMBus Address.............................................................................................................................................................................44
Table 21: General Signal Description.........................................................................................................................................................46
Table 22: Connector X1A Row A1 to A110 Pin Assignment.................................................................................................................. 47
Table 23: Connector X1A Row B1 to B110 Pin Assignment.................................................................................................................. 50
Table 24: Connectors X1B Row C1 to C110 ............................................................................................................................................... 53
Table 25: Connector X1A Row D1 – D110................................................................................................................................................... 56
Table 26: Navigation Hot Keys Available in the Legend Bar.............................................................................................................. 59
Table 27: Main Setup Menu...........................................................................................................................................................................61
Table 28: Advanced Setup menu Sub-screens and Functions.........................................................................................................62
Table 29: Chipset Setup Menu Sub-screens and Functions...............................................................................................................77
Table 30: Security Setup Menu Sub-screens and Functions ............................................................................................................89
Table 31: Boot Setup Menu Sub-screens and Functions.....................................................................................................................91
Table 32: Save and Exit Setup Menu Sub-screens and Functions .................................................................................................. 92
Table 33: List of Acronyms...........................................................................................................................................................................98

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List of Figures
Figure 1: COMe-cEL6 Front Side...................................................................................................................................................................13
Figure 2: COMe-cEL6 Bottom Side..............................................................................................................................................................14
Figure 3: Block Diagram COMe-cEL6..........................................................................................................................................................18
Figure 4: Module Temperature Sensors...................................................................................................................................................31
Figure 5: Fan Connector 3-Pin.....................................................................................................................................................................32
Figure 6: MTBF De-rating Values ...............................................................................................................................................................34
Figure 7: Module Dimensions Top Side .................................................................................................................................................... 35
Figure 8: Module Dimensions Bottom Side.............................................................................................................................................36
Figure 9: Module and Carrier Height .........................................................................................................................................................36
Figure 10: Metal Heat Slug Dimensions.................................................................................................................................................... 37
Figure 11: COMe Interface Connector ........................................................................................................................................................45
Figure 12: Setup menu Selection Bar.........................................................................................................................................................60
Figure 13: Main Setup Menu Screen ...........................................................................................................................................................61
Figure 14: Advanced Setup Menu Screen.................................................................................................................................................62
Figure 15: Chipset Setup Menu .....................................................................................................................................................................77
Figure 16: Security Setup Menu...................................................................................................................................................................89
Figure 17: Boot Setup Menu Screen ............................................................................................................................................................91
Figure 18: Save and Exit Setup Menu Screen..........................................................................................................................................92

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1/ Introduction
This user guide describes the COMe-cEL6 module made by Kontron and focuses on describing the modules special
features. Kontron recommends users to study this user guide before powering on the module.
1.1. Product Description
The COMe-cEL6 is small form factor COM Express® type 6 Computer-On-Module designed for flexible
implementation within multiple embedded industrial environments. The COMe-cEL6 is based on the Intel® Multi Chip
Package (MCP) Atom™, Pentium® and Celeron® processors with an integrated PCH to combine increased efficiency
and performance with TDP as low as 6 W and no more than 12 W, and with Intel’s® extensive HD Graphics capabilities.
Key COMe-cEL6 features are:
Intel® Multi Chip Package series of Atom™, Pentium® and Celeron® processors
Small form-factor COM Express® Compact, Type 6 pinout, compatible with PICMG COM.0 Rev. 3.0 spec
Up to 64 GByte DDR4
High-speed connectivity 6x PCI Express, 1x 1 Gb Ethernet, up to 4x USB 3.1 Gen 2 + 6x USB 2.0 and 2x SATA Gen 3
Support for Industrial and commercial temperature grade environments
Figure 1: COMe-cEL6 Front Side
1 Multi-Chip Package (MCP)
22x SODIMM
3eMMC
4 CPLD/FPGA
54x mounting points for standoffs
2
1
5
5
5
3
4
5

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Figure 2: COMe-cEL6 Bottom Side
1 COMe Interface connector X1A
2COMe Interface Connector X1B
3 3-pin fan connector
1.2. Product Naming Clarification
COM Express® defines a Computer-On-Module (COM), with all the components necessary for a bootable host
computer, packaged as a super component. The product name for Kontron COM Express® Computer-On-Modules
consists of:
Industry standard short form
COMe-
Module form factor
b = basic (125mm x 95mm)
c = compact (95mm x 95mm)
m = mini (84mm x 55mm)
Processor family identifier
EL
Pinout type
Type 10
Type 7
Type 6
Available temperature variants
Commercial
Extended (E1)
Industrial (E2)
Screened industrial (E2S)
Processor Identifier
Chipset identifier (if assembled)
Memory size
Memory module (#G)/eMMC pseudo SLC memory (#S)
3
2
1

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1.3. COM Express® Documentation
The COM Express® specification defines the COM Express® module form factor, pinout and signals. For COM Express®
specification information, visit the PCI Industrial Computer Manufacturers Group (PICMG®) website.
1.4. COM Express® Functionality
All Kontron COM Express® Compact modules contains two 220-pin connectors containing two rows. The COM
Express® mini Computer-On-Module (COM) features the following maximum amount of interfaces according to the
PICMG module pinout type.
Table 1: Type 6 and COMe-cEL6 Functionality
Feature Type 6 COMe-cEL6
HD Audio 1x 1x
Gbit Ethernet 1x 1x 1 GbE (option 2.5 GbE)
Serial ATA Gen3 4x 2x
PCI Express x 1 8x Up to 6x
PCI Express x16 (PEG) 1x
USB Client 1x 1x (option)
USB 4x USB 3.0/2.0
4x USB 2.0
2x USB 3.1 Gen 2/USB 2.0
6x USB 2.0
Option: 4 USB 3.1 /USB 2.0 + 4x USB 2.0
LVDS (eDP) 2x / Dual channel 1x LVDS dual channel with 24-bit (eDP overlay)
DP/HDMI/DVI 3x 2x (DP++ and HDMI)
SPI 1x 1x
LPC /eSPI 1x 1x (overlay to eSPI with hardware assembly)
External SMB 1x 1x
External I2C 1x 1x
GPIO 8x 8x GPIO
UART (2-wire COM) 2x 2x
TPM 2.0 1x 1x
FAN PWM out 1x 1x
1.5. COM Express® Benefits
COM Express® defines a Computer-On-Module (COM), with all the components necessary for a bootable host
computer, packaged as a highly integrated computer. All Kontron COM Express® modules are very compact and
feature a standardized form factor and a standardized connector layout that carry a specified set of signals. Each
COM module is based on the COM Express® specification. This standardization allows designers to create a single-
system carrier board that can accept present and future COM Express® modules.
The carrier board designer can optimize exactly how each of these functions implements physically. Designers can
place connectors precisely where needed for the application, on a carrier board optimally designed to fit a system’s
packaging.
A single carrier board design can use a range of COM Express® modules with different sizes and pinouts. This
flexibility differentiates products at various price and performance points and provides a built-in upgrade path when
designing future-proof systems. The modularity of a COM Express® solution also ensures against obsolescence when
computer technology evolves. A properly designed COM Express® carrier board can work with several successive
generations of COM Express® modules.
A COM Express® carrier board design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market

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2/ Product Specification
2.1. Module Variants
The COMe-cEL6 is available in different processor, memory and temperature variants to cover demands in
performance, price and power. The following tables list the module variants for the commercial and industrial
temperature grades.
2.1.1. Commercial Grade Modules (0°C to +60°C)
Table 2: Product Number for Commercial Grade Modules (0°C to +60°C operating)
Part Number Product Name Description
360033-0000-N1-2 COMe-cEL6 N6211 COM Express® compact pin-out type 6 with Intel®
Celeron® N6211, 2 core, 1.2GHz, GPY115 LAN,
commercial temperature
360033-0000-J2-4 COMe-cEL6 J6426 COM Express® compact pin-out type 6 with Intel®
Pentium® J6426, 4 core, 2.0GHz, GPY115 LAN,
commercial temperature
2.1.2. Industrial Temperature Grade Modules (E2, -40°C to +85°C)
Table 3: Product Number for Industrial Grade Modules (-40°C to +85°C operating)
Part Number Product Name Description
36034-0000-R1-2 COMe-cEL6 E2 x6212RE COM Express® compact pin-out type 6 with Intel®
Atom® x6212RE, 2 core, 1.2GHz, GPY115 LAN,
industrial temperature
36034-0000-R1-4 COMe-cEL6 E2 x6414RE COM Express® compact pin-out type 6 with Intel®
Atom® x6414RE, 4 core, 1.5GHz, GPY115 LAN,
industrial temperature
36034-0000-R2-4 COMe-cEL6 E2 x6425RE COM Express® compact pin-out type 6 with Intel®
Atom® x6425RE, 4 core, 1.9GHz, GPY115 LAN,
industrial temperature
2.2. Accessories
The accessories are modules specific, COMe-type 6 specific, or general COMe accessories. For more information, visit
the COMe-cEL6 web page or contact your local Kontron Sales Representative or Kontron Inside Sales.
Table 4: Accessories
Part Number Carrier Description
38115-0000-00-0 COMe Ref. Carrier-i T 6 COM Express® Reference Carrier Type 6 for
industrial temperature
38106-0000-00-5 COMe Eval Carrier2 T 6 COM Express® Eval Carrier2 Type 6 with 5mm
COMe connector

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Part Number Cooling Description
36034-0000-99-0 HSP COMe-cEL6 (E2) THREAD Heatspreader for COMe-cEL6 commercial and E2,
threaded mounting holes
36034-0000-99-1 HSP COMe-cEL6 (E2) THROUGH Heatspreader for COMe-cEL6 commercial and E2,
through holes
36099-0000-99-0 COMe Active Uni Cooler
(w/o HSP)
COM Express® Universal Active Cooler for
Heatspreader Mounting (87x78x14.3mm) (for CPU's
<20W)
36099-0000-99-1 COMe Passive Uni Cooler
(w/o HSP)
COM Express® Universal Passive Cooler for
Heatspreader Mounting (87x78x14.3mm) (for CPU's
<10W)
36099-0000-99-3 COMe Passive Uni Cooler Slim
(w/o HSP)
COM Express® Universal Active Cooler for
Heatspreader Mounting (87x78x14.3mm) (for CPU's
<20W)
Part Number Fan Cable Description
96079-0000-00-0 KAB-HSP 200 mm Cable adapter to connect fan to module
(COMe Basis/Compact/Mini)
96079-0000-00-2 KAB-HSP 40 mm Cable adapter to connect fan to module
(COMe Basis/Compact/Mini)
Part Number System Memory Description
97020-0432-CEL6 DDR4-3200 SODIMM 4GB_CEL6 Memory for Computer-on-Module; min.
specification: DDR4-3200, 4GB, 260P, 1600MHz,
PC4-3200 SODIMM
97020-0832-CEL6 DDR4-3200 SODIMM 8GB_CEL6 Memory for Computer-on-Module; min.
specification: DDR4-3200, 8GB, 260P, 1600MHz,
PC4-3200 SODIMM
97020-1632-CEL6 DDR4-3200 SODIMM 16GB_CEL6 Memory for Computer-on-Module; min.
specification: DDR4-3200, 16GB, 260P, 1600MHz,
PC4-3200 SODIMM
97020-3232-CEL6 DDR4-3200 SODIMM 32GB_CEL6 Memory for Computer-on-Module; min.
specification: DDR4-3200, 32GB, 260P, 1600MHz,
PC4-3200 SODIMM
97021-0432-CEL6 DDR4-3200 SODIMM 4GB E2_CEL6 Memory for Computer-on-Module; min.
specification: DDR4-3200, 4GB, 260P, 1600MHz,
PC4-3200 SODIMM
97021-0832-CEL6 DDR4-3200 SODIMM 8GB E2_CEL6 Memory for Computer-on-Module; min.
specification: DDR4-3200, 8GB, 260P, 1600MHz,
PC4-3200 SODIMM, industrial temperature
97021-1632-CEL6 DDR4-3200 SODIMM 16GB E2_CEL6 Memory for Computer-on-Module; min.
specification: DDR4-3200, 16GB, 260P, 1600MHz,
PC4-3200 SODIMM, industrial temperature
97021-3232-CEL6 DDR4-3200 SODIMM 32GB E2_CEL6 Memory for Computer-on-Module; min.
specification: DDR4-3200, 32GB, 260P, 1600MHz,
PC4-3200 SODIMM, industrial temperature

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2.3. Functional Specification
2.3.1. Block Diagram
Figure 3: Block Diagram COMe-cEL6
2nd SPI
BIOS Flash
2x
CAN
GP
SPI
RSVD
PCIe #5
USB #7
(OTG)
eDP
SGMII
DDR4 3200 MT/s
SODIMM
USBSS #0
(USB 3.0)
LVDS
PwrCtrl
SysMgmt
SDIO
eSPI
SPI
DP++
DDI2 DP++
DDI1
PCIe #0-4
LAN
SATA0
SATA1
HDA
eMMC
Intel Atom® x6000E,
Pentium® and
Celeron® Series
Connector Option
Standard
component
eMMC
VCC
5VSB
HWM
COM Express® connector CD – Pin-out Type 6
DDR4 3200 MT/s
SODIMM
Intel
GPY115
(GPY215)
microSD
Socket
PWM
FAN1
I2C
SMB
LID
Sleep
LVDS
GPIO
Embedded Controller
HWM
CPU FAN0
Power sequencing
Watchdog
eSPI2I2C
I2C
EEPROM
Gen11
iGFX
SPI
BIOS Flash
GPIO
Ctrl
Mgmt
GPIO Buffer
eDP2LVDS
COM Express® connector AB – Pin-out Type 6
USB #0-7
(USB 2.0)
USB 3.1
(HSIO: #0,1)
USB 2.0
(Host)
TPM 2.0
SATA
(HSIO #10,11)
TPM
USBSS #1-3
(USB 3.0)
USB Hub
USBSS #1
(USB 3.0)
LAN
(HSIO #7)
PCIe
#0-4
(HSIO: #2-6
SATA
alternatively
conf. as
GbE GbE
Misc
Signals
LPC
(eSPI)
2x
UART
PCIe #5
(HSIO: #8)
VBAT
USB 2.0
OTG
SER0
SER1
2.3.2. Processors
The COMe-cEL6 is based on the Intel® series of Multi Chip Package (MCP) Atom™ X6000E series, Pentium® and
Celeron® processors, with a Platform Controller Hub (PCH) on the same package (compact Type 3 BGA 35 mm x
24 mm package).
The processor variants support the following technologies:
Intel® 64 Architecture
Intel® Gen 11 GFX graphics
Intel® Programmable Service Engine (PSE)
Intel® Virtualization Technology (VT-2/VT-x) with extended pages and (VT-d) for directed I/O
Real time computing with Intel Time Coordinated Computing (TCC)
Thermal Management with Intel® Thermal Monitor (TM1 and TM2)
Power Management with Intel® Speed Shift Technology
Security with Intel® Boot Guard device protection, Secure Key and Intel® AES NI

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The following table lists the specification of the COMe-cEL6 processor variants.
Table 5: Processor Specification
Intel® Celeron® Pentium® Celeron® Pentium®
J6413 J6426 N6211 N6415
# of Cores 4 4 2 4
# of Threads 4 4 2 4
Cache 1.5 MByte 1.5 MByte 1.5 MByte 1.5 MByte
Base Frequency 1.8 GHz 2.0 GHz 1.2 GHz 1.2 GHz
Turbo Frequency (Max.) 3.0 GHz 3.0 GHz 3.0 GHz 3.0 GHz
Graphic Gen 11 16 EU 32 EU 16 EU 16 EU
Thermal Design Power
(TDP)
10 W 10 W 6.5 W 6.5 W
Memory Types DDR4-3200 DDR4-3200 DDR4-3200 DDR4-3200
Memory Channels
(Max.)
2 2 2 2
Memory Size (Max.) 64 GB 64 GB 64 GB 64 GB
ECC Memory No No No No
PCIe Revision 3.0 3.0 3.0 3.0
PCIe Express
Configurations
6 x1+
1 x2 + 4 x1
2 x2+2 x1
1x4 + 2x1
6 x1+
1 x2 + 4 x1
2 x2+2 x1
1x4 + 2x1
6 x1+
1 x2 + 4 x1
2 x2+2 x1
1x4 + 2x1
6 x1+
1 x2 + 4 x1
2 x2+2 x1
1x4 + 2x1
Max. # PCIe Lanes 6 6 6 6
Premium IO Intel® PSE Intel® PSE Intel® PSE Intel® PSE
Use Condition PC Client PC Client PC Client PC Client
Tjunction Min. 0°C
+105°C[2]
0°C
+105°C[2]
0°C
+105°C[2]
0°C
+105°C[2]
Max.
Intel® Atom™ Atom® Atom® Atom™ Atom™ Atom™
X6211E X6413E X6425E X6212RE X6414RE X6425RE
# of Cores 2 4 4 2 4 4
# of Threads 2 4 4 2 4 4
Cache 1.5 MByte 1.5 MByte 1.5 MByte 1.5 MByte 1.5 MByte 1.5 MByte
Base Frequency 1.3 GHz 1.5 GHz 2.0 GHz 1.2 GHz 1.5 GHz 1.9 GHz
Turbo Frequency (Max.) 3.0 GHz 3.0 GHz 3.0 GHz
Graphic Gen 16 EU 16 EU 32 EU 16 EU 16 EU 32 EU
Thermal Design Power
(TDP)
6 W 9 W 12 W 6 W 9 W 12 W
Memory Types DDR4-3200 DDR4-3200 DDR4-3200 DDR4-3200 DDR4-3200 DDR4-3200
Memory Channels
(Max.)
2 2 2 2 2 2
Memory Size (Max.) 64 GB 64 GB 64 GB 64 GB 64 GB 64 GB
ECC Memory In band In band In band In band In band In band
PCIe Revision 3.0 3.0 3.0 3.0 3.0 3.0
PCIe Express
Configurations
6 x1+
1 x2 + 4 x1
2 x2+2 x1
1x4 + 2x1
6 x1+
1 x2 + 4 x1
2 x2+2 x1
1x4 + 2x
6 x1+
1 x2 + 4 x1
2 x2+2 x1
1x4 + 2x1
6 x1+
1 x2 + 4 x1
2 x2+2 x1
1x4 + 2x1
6
x1+
1 x2 + 4 x1
2 x2+2 x1
1x4 + 2x1
6 x1+
1 x2 + 4 x1
2 x2+2 x1
1x4 + 2x1

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Intel® Atom™ Atom® Atom® Atom™ Atom™ Atom™
X6211E X6413E X6425E X6212RE X6414RE X6425RE
Max. # PCIe Lanes 6 6 6 6 6 6
Premium IO Intel® PSE Intel® PSE Intel® PSE Intel®PSE/TSN
Intel® TCC
Intel®PSE/TSN
Intel® TCC
Intel®PSE/TSN
Intel® TCC
Use Condition Embedded Embedded Embedded Industrial[1] Industrial[1] Industrial[1]
Tjunction Min. -40°C
+105°C[2]
-40°C
+105°C[2]
-40°C
+105°C[2]
-40°C
+110°C[2]
-40°C
+110°C[2]
-40°C
+110°C[2]
Max.
[1] Recommendation for 24/7 applications.
[2] PC Client CPU: with Tjunction limits the max. temperature range during operation is +-70°C starting from boot time
temperature
Embedded / Industrial CPU: within Tjunction limits the max. temperature range during operation is +-90°C starting
from boot time temperature
The behavior is described in Intel document #636112 as DTR = Dynamic Temperature Range. For more information
or a higher DTR-value, contact Kontron Support.
The features specified in Table 5: Processor Specification may not be compatible with the
COMe-cEL6 features. For specific COMe-cEL6 features, see the relevant section in
Chapter 2.3: Functional Specification.
2.3.3. Platform Controller Hub (PCH)
The COMe-cEL6’s Multi Chip Package (MCP) includes an integrated Platform Controller Hub (PCH).
2.3.4. System Memory
The COMe-cEL6 supports up to 64 GByte with DDR4-3200 in two SODIMM sockets.
The following table lists specific system memory features:
Memory Sockets 2x DDR4-3200 SODIMM
Memory Densities 4 GByte, 8 GByte and 16 GByte and 32 GByte (unbuffered)
Memory Channels 2
Memory Capacity (Max.) 64 GByte (2x 32 GByte)
Maximum Speed 3200 MT/s
ECC [1] In band ECC
[1] In band ECC improves safety and reliability by providing ECC protection to specific regions of the physical memory.
Out of band ECC is not supported.
The two SODIMM memory sockets are located on the top side of the module where socket one is 4 mm height and
socket two is 8 mm high. Each socket may be populated with a DDR4 DIMM module mounted horizontally.
In general, memory modules have a much lower longevity than embedded motherboards, and therefore the EOL of
the memory modules may occur several times during the lifetime of the motherboard. Kontron guarantees to
maintain memory modules by replacing EOL memory modules with another qualified similar module.
Kontron recommends using Kontron memory modules for prototype system(s) in order to prove the stability of the
system and as a reference.