Laird DVK-BT900-S Series Quick setup guide

DVK-BT900-Sx Development Kit
Hardware Integration Guide
Version 1.0
DVK-BT900-SA, DVK-BT900-SC
Laird Technologies
Americas: [phone]
Europe: [phone]
Hong Kong: [phone]
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth

BT900 Development Kit
Version 0.3
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
2
Laird Technologies
Americas: [phone]
Europe: [phone]
Hong Kong: [phone] x026
REVISION HISTORY
Revision
Date
Changes
1.0
07 Nov 2014
Initial version

BT900 Development Kit
Version 0.3
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
3
Laird Technologies
Americas: [phone]
Europe: [phone]
Hong Kong: [phone] x026
CONTENTS
Contents ...............................................................................................................................................................3
1Laird DVK-BT900-Sx Development Kit ...........................................................................................................4
2Overview .........................................................................................................................................................4
2.1 Introduction ..............................................................................................................................................4
2.2 Package Contents......................................................................................................................................4
3DVK-BT900–Main Development Board.........................................................................................................5
3.1 Key Features..............................................................................................................................................5
3.2 Understanding the Development Board......................................................................................................6
4Functional Blocks ............................................................................................................................................8
4.1 Power Supply ............................................................................................................................................8
4.2 Reset Button..............................................................................................................................................9
4.3 4-Wire UART Serial Interface......................................................................................................................9
4.3.1 UART Mapping .............................................................................................................................9
4.3.2 UART Interface Driven by USB .......................................................................................................9
4.3.3 UART Interface Driven by External Source....................................................................................10
4.4 nAutoRUN Pin and Operating Modes.......................................................................................................11
4.5 OTA (Over the Air) smart BASIC application download .............................................................................12
4.6 VSP (Virtual Serial Port) connection to Host device....................................................................................12
5Software ........................................................................................................................................................13
6Breakout Connector Pinouts ........................................................................................................................14
6.1 JP2, JP3, JP4, JP5 SIO (Special Input / Output Sockets) Breakout Connectors...........................................14
6.1.1 JP2 ............................................................................................................................................. 14
6.1.2 JP3 ............................................................................................................................................. 15
6.1.3 JP4 ............................................................................................................................................. 16
6.1.4 JP5 BT-Wi-Fi Coexistence ............................................................................................................16
6.2 Additional Peripherals / Sensors ...............................................................................................................16
6.2.1 Buzzer ........................................................................................................................................17
6.2.2 Temperature Sensor....................................................................................................................18
6.2.3 Trim Potentiometer.....................................................................................................................19
6.2.4 Push Buttons and LEDs................................................................................................................20
6.2.5 I2C device...................................................................................................................................21
6.2.6 SPI device ...................................................................................................................................21
7Other Features ..............................................................................................................................................22
7.1 Current Consumption Measurement........................................................................................................22
8Additional Documentation ..........................................................................................................................24

BT900 Development Kit
Version 0.3
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
4
Laird Technologies
Americas: [phone]
Europe: [phone]
Hong Kong: [phone] x026
1LAIRD DVK-BT900-SX DEVELOPMENT KIT
Part number: DVK-BT900-SA / DVK-BT900-SC
Applicable to the following module part numbers:
BT900-SA Intelligent BTv4.0 Dual Mode Module featuring smart BASIC (internal antenna)
BT900-SC Intelligent BTv4.0 Dual Mode Module featuring smart BASIC (u.FL connector)
2OVERVIEW
The Laird DVK-BT900 development kit provides a platform for rapid wireless connectivity prototyping, providing
multiple options for the development of Classic Bluetooth and Bluetooth Low Energy (BLE) applications.
This manual is for Rev. 01 and later of the development PCB and relates to DVK-BT900-V01 and later on the
silkscreen of the PCB motherboard itself. The complete functionality of the development kit hardware requires the
use of Laird BT900 series smart BASIC runtime engine FW version v9.1.2.0 or greater.
2.1 Introduction
The development kit is designed to support the rapid development of applications and software for the BT900 series
of BT / BLE modules featuring Laird’s innovative event driven programming language – smart BASIC. More
information regarding this product series (including a detailed module User’s Manual and smart BASIC user guide) is
available on the Laird’s BT900 product pages.
2.2 Package Contents
All kits contain the following items:
Development
Board
The development board has the required BT900 module already soldered onto it and exposes
all the various hardware interfaces available.
Power Option
USB cable –Type A to mini type B. The cable also provides serial communications via the FTDI
USB –RS232 converter chip on the development board.
Pin Headers x 4
Supplied to allow simple connection to SIO lines via the through hole plated areas JP2, JP3,
JP4 and JP5. The headers are 2 x 5 way and are 2.54 mm pitch.
Jumper Pin
Cables x 6
Supplied to allow simple connection to the various pin headers for prototyping purposes.
Web link Card
Provides links to additional information including the BT900 user manual, firmware, Laird
BT900 mobile apps, terminal utilities, schematics, quick start guides, and firmware release
notes.

BT900 Development Kit
Version 0.3
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
5
Laird Technologies
Americas: [phone]
Europe: [phone]
Hong Kong: [phone] x026
3DVK-BT900–MAIN DEVELOPMENT BOARD
This section describes the BT900 development board hardware. The BT900 development board is delivered with the
BT900 series module loaded with integrated smart BASIC runtime engine FW but no onboard smart BASIC
application; because of this, it starts up in AT command mode by default.
smart BASIC applications are simple and easy to develop for any BT / BLE application. Sample smart BASIC
applications are available to download from the Laird’s BT900 product pages or via the Technical Support Site
https://laird-ews-support.desk.com/
The BT900 development board is a universal development tool to highlight the capabilities of the BT900 module. The
development kit is supplied in a default configuration which should be suitable for multiple experimentation options.
It also offers a number micro-DIP switches that help isolate on-board sensors and UART from the BT900 module to
create different configurations. This allows you to test different operating scenarios.
The development board allows the BT900 series module to physically connect to a PC via the supplied USB cable for
development purposes. The development board provides USB-to-Virtual COM port conversion through a FTDI chip –
part number FT232R. Any Windows PC (XP or later) should auto-install the necessary drivers; if your PC cannot locate
the drivers, you can download them from http://www.ftdichip.com/Drivers/VCP.htm
3.1 Key Features
The BT900 development board has the following features:
BT900 series module soldered on-board.
Power supply options for powering development board from:
-USB
-external DC supply
-AAA batteries (3xAAA battery holder fitted on underside of development board)
Regulated 3.3 V for powering the BT900 module. Optional regulated 1.8 V for powering the BT900 module.
NOTE: 1.8V operation not supported in BT900 module smart BASIC runtime engine FW v9.1.2.0.
USB to UART bridge (FTDI chip).
BT900 UART can be interfaced to:
-USB (PC) using the USB-UART bridge
-External UART source (using IO break-out connector when development board powered from DC jack)
Current measuring (for BT900 module only) options:
-Pin header (Ammeter)
-Current shunt monitor IC (volt meter or oscilloscope)
-Series resistor for differential measurement (oscilloscope)
IO break-out (four 2x5-pin 2.54mm pitch headers) connectors interface for plugging-in external
modules/sensors, and accessing all interfaces of the BT900 module [UART, SPI, I2C, SIO (DIO or AIN (ADCs)),
PWM, FREQ].
Two Buttons and two LEDs for user interaction.
Two on-board sensors (analogue output): Temperature and Trim Pot.
One buzzer.
One on-board SPI sensor/device (serial Eeprom).
One on-board I2C sensor /device (RTC chip).
Micro DIP switches that allow the on-board sensors, LED’s (and USB UART FTDI bridge) to be disconnected
from BT900 module.

BT900 Development Kit
Version 0.3
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
6
Laird Technologies
Americas: [phone]
Europe: [phone]
Hong Kong: [phone] x026
External 32.768 kHz crystal oscillator (for Laird use or future use). Not required for use with BT900 and
therefore is disabled by jumper fitted on CON6.
 smart BASIC runtime engine FW upgrade capability:
-Via UART (using the FTDI USB-UART).
 smart BASIC application script loading capability:
-Via UART (using the FTDI USB-UART).
-Via OTA (Over the Air)
3.2 Understanding the Development Board
Figure 1: BT900 development board
FTDI-FT232R
JP5 BT-WiFi
coexist pins
DIP Switch
CON14
DIP Switch CON13
Buzzer
BZ1
DC Jack
Input CN1
DC/USB
Power Source
Switch SW4
USB CON4
BT900-Sx
Module
LED2
LED1
DIP Switch
CON15
Button 2
SW3
Button1
SW1
Reset SW2
CON17
DIP Switch
CON12
Current
Measure

BT900 Development Kit
Version 0.3
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
7
Laird Technologies
Americas: [phone]
Europe: [phone]
Hong Kong: [phone] x026
Important! To ensure correct ‘out of the box’ configuration, the BT900 development board must be set
according to Figure 2.
Figure 2: Correct development board settings
Note: nAutoRUN jumper must be placed on
pins 2 and 3 as shown.
Note: Disable Temp Sensor
and Trim Pot for lowest
power consumption by
setting to OFF position.
Note: Jumper is fitted
over two pins of
CON1

BT900 Development Kit
Version 0.3
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
8
Laird Technologies
Americas: [phone]
Europe: [phone]
Hong Kong: [phone] x026
4FUNCTIONAL BLOCKS
The development board is formed from the following major functional blocks:
4.1 Power Supply
Figure 3: BT900 devboard power supply
The development board can be powered from 4.5-5.5 V supply (into DC jack connector CN1), 3 AAA batteries
(holder J7 mounted on underside of board), or from the USB (type mini-B connector or CON4). The power source fed
into DC jack (CN1) or 3 AAA batteries (J7) is combined together through diodes (diode-OR) and fed to the SW4
switch that allows selection of power source between either USB or the DC jack/AAA.
The 5V from the USB or the DC jack/AAA batteries is regulated down to 3.3V with an on-board regulator on the
development board.
The CON17 default is to select regulated 3.3V.
Note: The development board has a 1.8V regulator for the possibility of powering the BT900 module from a
1.8V rail (by changing the CON17 position). BT900 1.8V operation is not supported in the current
firmware (v9.1.2.0).
The development board’s 3.3V regulator provides power to the BLE module and USB UART bridge interface as well as
to sensors on the development board.
Switch Positions
Development Board Power Source
SW4
CON17 select BT900 Power source
USB (CON4)
Position USB
Position 3.3V always
(for 3.3V operation)
DC jack (CN1) or AAA battery (J7).Note 1
Position DC
Position 3.3V always
(for 3.3V operation)
Note 1: The development board is powered from DC jack (or AAA batteries) when an external UART source is
to be interfaced to BT900 module (using breakout connector JP5).
On the development board, the power domain:
VCC_BT supplies the BT900 series module only. Current measuring block on development board only
measures the current into power domain VCC_BT and VREG_IN_HV, VDD_PADS (when the BT900 is powered
by 3.3V (CON17 in the 3.3V position).
VREG_IN_HV, VDD_PADS supplies the BT900 module (BT radio chip section) only.
VCC_IO_UART supplies the FTDI chip IO and all other sensors and circuitry.

BT900 Development Kit
Version 0.3
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
9
Laird Technologies
Americas: [phone]
Europe: [phone]
Hong Kong: [phone] x026
VCC_IO is wired to the header connectors (JP2, JP3, JP4, JP5) via R29 and can be used to power external
devices sensors.
4.2 Reset Button
The development board has a reset button (SW2). The reset is active low (SW2 pushed down). To view its location,
refer to Error! Reference source not found..
4.3 4-Wire UART Serial Interface
The development board provides access to the BT900 module 4-wire UART interface (TX, RX, CTS, RTS) either
through USB (via U9 FTDI USB-UART convertor chip) or through a breakout header connector J10. Refer to Figure 4.
Note: BT900 module provides 4-wire UART interface on the HW and the other four signals (DTR, DSR, DCD, RI)
which are low bandwidth signals can be implemented in a smart BASIC application, using any spare digital
SIO pins.
4.3.1 UART Mapping
UART connection on the BT900 series module and FTDI IC are shown in table below. Refer to Figure 4 to see how the
BT900 series module UART is mapped to the breakout header connector (J10).
Table 1: UART mapping
BT900 SIO
BT900 Default function
FTDI IC UART
SIO.1
UART_TX (output)
USB_RX
SIO.0
UART_RX (input)
USB_TX
SIO.2
UART_RTS (output)
USB_CTS
SIO.3
UART_CTS (input)
USB_RTS
Additional SIO pins are also routed to the FTDI chip via a switch block. For example, the nAutoRUN input pin on the
module can be driven by the DTR output pin of the FTDI chip. This allows testing the $autorun$ application on boot.
4.3.2 UART Interface Driven by USB
USB Connector. The development kit provides a USB Type mini-B connector (CON4) which allows connection
to any USB host device. The connector optionally supplies power to the development kit and the USB signals
are connected to a USB to serial convertor device (FT232R), when SW4 is set to ‘USB’ position.
USB –UART. The development kit is fitted with a (U9) FTDI FT232R USB to UART converter which provides
USB-to-Virtual COM port on any Windows PC (XP or later). Upon connection, Windows auto-installs the
required drivers. For more details and driver downloads, visit http://www.ftdichip.com/Products/FT232R.htm.
UART interface driven by USB FTDI chip. In normal operation, the BT900 UART interface is driven by the FTDI
FT232R USB to UART converter in the development board. This is used for the BT900 series module smart
BASIC runtime engine FW upgrade or to load smart BASIC application script.

BT900 Development Kit
Version 0.3
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
10
Laird Technologies
Americas: [phone]
Europe: [phone]
Hong Kong: [phone] x026
4.3.3 UART Interface Driven by External Source
UART interface driven by external UART source. The BT900 module UART interface (TX, RX, CTS, RTS) is
presented at a 2.54 mm (0.1”) pitch header (J10). To allow the BT900 UART interface to be driven from the
breakout header connector (J10):
-The development board must be powered from a DC jack (CN1) or AAA batteries (J7) and switch SW4
must be in DC position.
-The FTDI device must be held in reset which is achieved automatically by removal of USB cable or SW4 is in
the DC position.
-Micro-DIP switch CON13 allows the four BT900 UART pins to be physically isolated as well from USB-UART
FTDI device. Physical micro-DIP switch body has text “ON”on the closed side. By default, CON13 is closed.
Figure 4: USB to UART Interface and Header to UART interface
J10 pin-out is designed to be used with an external FTDI USB to UART TTL (3.3V) convertor cables:
http://www.ftdichip.com/Products/Cables/USBTTLSerial.htm
E.g. FTDI manufacturer part number for cable: TTL-232R-3V3

BT900 Development Kit
Version 0.3
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
11
Laird Technologies
Americas: [phone]
Europe: [phone]
Hong Kong: [phone] x026
Figure 5: J10 wiring to match FTDI USB to UART cable (TTL-232R-3V3 cable)
4.4 nAutoRUN Pin and Operating Modes
On the development board USB_DTR output (FTDI chip U9) from PC is wired to BT900 module pin 3 (nAutoRUN).
Note: smart BASIC runtime engine FW checks for the status of nAutoRUN during power-up or reset. The
nAutoRUN pin detects if the BT900 module should power up into Interactive/Development Mode (3.3 V)
or Self-contained Run Mode (0V). The module enters Self-contained Run Mode if the nAutoRUN pin is at
0V and an $autorun$ application exists in the modules file system, then the smart BASIC runtime engine
FW executes the smart BASIC application script automatically; hence the name Self-contained Run mode .
The nAutoRUN pin inhibits the automatic launch $autorun$ application on power-up. Tying nAutoRUN to 3.3V
inhibits the $autorun$ application from running. The J6 3-pin header allows a jumper to be fitted to select between
the two operating modes.
Note: Micro DIP switch CON12 pin2-6 must be open when using J6 3-pin header to select nAutoRUN function.
Table 2: BT900 nAutoRUN pin
nAutoRUN
pin
BT900 Operating Mode
Interactive/
Development Mode
Self-contained Run
Mode
Circuit
J6 jumper
position
SIO_1
SIO_0
SIO_3
SIO_2
FTDI (USB to TTL 232 Cable)
GND
VCC_IO
J10
NOPOP (PIN HEADER,2.54mm 1X6P)
1
1
2
2
3
3
4
4
5
5
6
6
R72
(NOPOP) 0R
GND
RTS
VCC
RX
TX
CTS
GND
USB_CTS
VCC
USB_TX
USB_RX
USB_RTS
GND
R48
10K
R58
10K
VCC_IO_UART
USB cable plugged in: J6 Pin2-3 default
nAutoRUN: J6 Pin2-1
PIN HEADER,2.0mm 1X3P,
J6
1
12
23
3
nAutoRUN

BT900 Development Kit
Version 0.3
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
12
Laird Technologies
Americas: [phone]
Europe: [phone]
Hong Kong: [phone] x026
Micro DIP switch CON12 allows the 4 x UART signals from the FTDI chip (USB_DSR, USB_DTR, USB_DCD, USB_RI) to
be disconnected from reaching the BT900. By default the DIP switch is open.
Since BT900 nAutoRUN pin 3 is connected to PC FTDI USB_DTR line, the Micro DIP switch:
CON12 (pin 2-6) must be CLOSED (in ON position) to allow the PC (using uWTerminal) to control nAutoRUN
(pin 3 on BT900); with no jumper fitted to J6 (see Figure 6).
CON12 (pin 2-6) must be OPEN to allow nAutoRUN (pin3 on BT900) to be controlled by J6 (with jumper fitted
to J6 pin 1-2) to select nAutoRUN (Figure 7).
Figure 6: Micro DIP switch CON12 closed (nAutoRUN controlled by PC)
Note: The additional lines of the DIP switch CON12 are not currently utilised and need to remain open, as shown
in Figure 6.
Figure 7: Micro DIP switch CON12 open (nAutoRUN controlled by J6 jumper on pin 1-2)
4.5 OTA (Over the Air) smart BASIC application download
It is possible to download smart BASIC applications over the air to the BT900. To enable this feature, SIO_19 must
be pulled low to GND externally (on power up).
On the development board, header connector JP4-pin 8 brings out the BT900 SIO_19; JP4-pin 9 brings out GND.
To pull BT900 SIO_19 low (to GND), connect JP4-pin 8 (SIO_19) to JP4-pin 9 (GND) by fitting a fly-lead between these
pins.
Refer to latest FW release (v1.9.2.0) documentation and smart BASIC user manual for details. Additionally, Laird has
authored an Application Note explaining how to download applications over the air. All of these materials are
available in the documentation tab of the BT900 product page at www.lairdtech.com/products/BT900-Series.
4.6 VSP (Virtual Serial Port) connection to Host device
VSP allows the remote wireless device to bridge to the host device UART that is connected to the BT900 UART.
SIO_19 pin must be pulled low externally to GND (on power up) to enable the VSP (Virtual Serial Port over BLE) for
connection to the host device.
Refer to latest FW release (v1.9.2.0) documentation and smart BASIC user manual) for details.
nAutoRUN
nAutoRUN

BT900 Development Kit
Version 0.3
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
13
Laird Technologies
Americas: [phone]
Europe: [phone]
Hong Kong: [phone] x026
5SOFTWARE
The development board connects the BT900 module to a virtual COM port of a PC or other device. From a PC, you
can communicate with the module using Laird’s UW Terminal application (version 6.51 or newer).
UW Terminal is a terminal emulation application capable of running on Windows 98, ME, 2000, XP, Windows 7, and
Windows 8 operating systems. It was developed specifically to aid development and testing of Laird modules. It
allows connection to serial devices using any combination of the communications parameters listed in Table 5-1.
Table 5-1: Communication Parameters
COM Port:
1 to 255
Baud rate:
1200 to 921,600
Note: Baud rate default is 115200.
Parity:
None, Odd, Even
Data Bits:
8
Stop Bits:
1 or 2
Handshaking:
None or CTS/RTS
Note: Baud rates higher than 115200 depend on the COM port capabilities of the host PC and may require an
external USB –RS232 adapter or PCMCIA card.
The benefits of using UW Terminal include:
Continually displayed status of DSR, CTS, DCD, and RI
Direct control of DTR on the host PC via a check box
Direct control of RTS, if CTS / RTS Handshaking is disabled when UWTerminal is launched
Sending of BREAK signals
BASIC tab provides standalone testing and development of smart BASIC ** applications and allows
UWTerminal operation to be automated.
The BASIC embedded into UWTerminal, since version 6.20, shares the same core functionality as the BT900
series module.
Additional built-in features (right click in Terminal tab screen) to accelerate development including Automation
and various XCompile / Load / Run options for downloading smart BASIC applications into the BT900.
Note: Full details on smart BASIC are available in the smart BASIC User Manual available for download at the
Laird website. This document also includes a basic introduction to the UW terminal program.
Tip: If the module returns a four hex digit error code: In UwTerminal, select those four digits, right-click, and
select Lookup Selected ErrorCode. A description of the error is printed on screen.

BT900 Development Kit
Version 0.3
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
14
Laird Technologies
Americas: [phone]
Europe: [phone]
Hong Kong: [phone] x026
6BREAKOUT CONNECTOR PINOUTS
6.1 JP2, JP3, JP4, JP5 SIO (Special Input / Output Sockets) Breakout Connectors
Access to all 28 BT900 series module signal pins (SIO’s = signal Input /Output) is available on four connectors JP2, JP3,
JP4, JP5 (2.54 mm pitch 2x5 headers).
Note: The BT900 module signal pins designation SIO (Signal Input /Output).
The default type is DIO (Digital Input or Output) or UART (on fixed pins)
The alternate type is either AIN (Analog Input ADC), I2C, SPI, DIO (on fixed pins), PWM or FREQ and WKUP or
Ext Interrupt
Alternate function is selectable in smart BASIC application
DIO or AIN functionality is selected using the GpioSetFunc() function in smart BASIC
AIN configuration selected using GpioSetFunc() function
I2C, UART, SPI controlled by xxxOPEN() functions in smart BASIC
SIO_0 to SIO_3 are DIO by default when $autorun$ app runs on power up
These breakout connectors can interface to a wide array of sensors with the BT900 function user configurable by
smart BASIC application script from the default function (DIO, UART) to alternate functions (AIN (ADC), I2C, SPI, DIO,
PWM or FREQ and WKUP or Ext Interrupt). The BT900 development kit incorporates additional connectors and cables
inside the box, to enable simple, hassle-free testing of the multiple interfaces.
Figure 8: Breakout board connectors
6.1.1 JP2
In the smart BASIC application code written to use sensors on the development board (including the Temperature
sensor (U1), Trim Pot(VR9), Buzzer (BZ1), LED1, LED2, Button1 (SW1, and Button2 (SW3), I2C device (U13), SPI device
(U12), the SIO pins direction and type (that these sensors are connected to, SIO_21, SIO_20, SIO_12, SIO_17, SIO_18,
SIO_13, SIO_20, SIO_10, SIO_12, SIO_6 to SIO_9 respectively) must be set in the smart BASIC application to override
the defaults in the BT900 firmware.
VCC_IO
SIO_20
RTC_ALARM
GND
SIO_13
nAutoRUNSIO_5
SIO_4 SIO_3
PIN HEADER,2.54mm,2X5P,
JP2
1
122
3
344
5
566
7
788
9
910 10 SIO_21
VCC_IO
SIO_13
SIO_12
SIO_10
SIO_8
SIO_11
SIO_7
SIO_9
GND
SIO_6 VCC_IO
PIN HEADER,2.54mm,2X5P,
JP3
1
122
3
344
5
566
7
788
9
910 10
nRESET PIN HEADER,2.54mm,2X5P,
JP4
1
122
3
344
5
566
7
788
9
910 10
SIO_17
SIO_18 SIO_19
SIO_20
VCC_IO
GND
VCC_IO
SWDIO
SWDCLK
SIO_15
BT_NC
PIN HEADER,2.54mm,2X5P,
JP5
1
122
3
344
5
566
7
788
9
910 10
BT_NC
BT_NC
WLAN_ACTIVE
BT_ACTIVE
VCC_IO
GND
VCC_IO
BT_PRIORITY
BT_NC

BT900 Development Kit
Version 0.3
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
15
Laird Technologies
Americas: [phone]
Europe: [phone]
Hong Kong: [phone] x026
JP2
Pin
Pin
Designation
Default
Function1
Alternate
Function
Default
Direction2
Comment
1
RTC_ALARM
Signal output from I2C device
2
SIO_13
DIO
PWM or
FREQ
Input
Input for BUTTON1 (SW1) on DVK via
CON7 (fit 2-pin jumper on CON7).
3
SIO_20
DIO
AIN or
WKUP1 or
Ext Interrupt
Input
Input for BUTTON2 (SW3) on DVK via
CON8 (fit 2-pin jumper on CON8).
Connects to Analogue device (Trim Pot)
on DVK, via CON14.
4
VCC_IO
Output only
Do not inject DC voltage into this pin.
5
SIO_4
DIO
Input
UART_DTR (via CON12) on DVK
6
UART_CTS
UART
SIO_3 or
WKUP4 or
Ext Interrupt
Input
7
SIO_5
DIO
Ext Interrupt
Input
UART_DCD (via CON12) on DVK
8
nAutoRUN
DIO
Input only
UART_DSR (via CON12) on DVK
9
GND
10
SIO_21
DIO
AIN
Input
Connects to Analogue device (Temp
Sensor) on DVK, via CON14.
1
DIO: Digital Input or Output
2
Default Direction In BT900 module smart BASIC runtime engine FW
6.1.2 JP3
JP3 pin
Pin
Designation
Default
Function1
Alternate
Function
Default
Direction2
Comment
1
SIO_6
DIO
SPI_MISO
Input
Connects to SPI device (RTC chip) on DVK, via
CON16.
2
VCC_IO
Output
only
Do not inject DC voltage into this pin.
3
SIO_8
DIO
Input
UART_RI (via CON12) on DVK.
SPI_CS output connects to SPI device (Eeprom
chip) on DVK, via CON16.
4
SIO_7
DIO
SPI_MOSI
Input
SPI_MOSI is an output in SPI master mode.
Connects to SPI device (Eeprom chip) on DVK,
via CON16.
5
SIO_10
DIO
I2C_SDA
Input
Connects to I2C device on DVK, via CON15.
6
SIO_9
DIO
SPI_CLK
Input
SPI_CLK is an output in SPI master mode.
Connects to SPI device (Eeprom chip) on DVK,
via CON16.
7
SIO_12
DIO
PWM or FREQ
Input
Connects to BUZZER output on DVK, via
CON15.
8
SIO_11
DIO
I2C_SCL
Input
Connects to I2C device (RTC chip) on DVK,
via CON15.
9
GND
10
SIO_13
DIO
PWM or FREQ
Input
Input for BUTTON1 (SW1) on DVK via CON7
(fit 2-pin jumper on CON7).
1
DIO: Digital Input or Output
2
Default Direction In BT900 module smart BASIC runtime engine FW

BT900 Development Kit
Version 0.3
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
16
Laird Technologies
Americas: [phone]
Europe: [phone]
Hong Kong: [phone] x026
6.1.3 JP4
JP4 Pin
Pin
Designation
Default
Function1
Alternate
Function
Default
Direction2
Comment
1
nRESET
Input
Input for button SW2 on DVK. Push
to reset BT900.
2
VCC_IO
Output
only
Do not inject DC voltage into this pin.
3
SIO_15
DIO
Input
4
SIO_14
DIO
*****
Input
5
SIO_17
DIO
PWM or
FREQ
Input
Connects to LED1 on DVK via CON14
6
SIO_16
DIO
*****
Input
7
SIO_18
Input
Connects to LED2 on DVK via CON14
8
SIO_19
DIO
VSP
Input
Pull to GND to enter VSP mode. Use
jumper lead to connect to GND.
9
GND
10
SIO_20
DIO
AIN or
WKUP1 or
Ext Interrupt
Input
Input for BUTTON2 (SW3) on DVK via
CON8 (fit 2-pin jumper on CON8).
Connects to Analogue device (Trim
Pot) on DVK, via CON14.
1
DIO: Digital Input or Output
2
Default Direction In BT900 module smart BASIC runtime engine FW
6.1.4 JP5 BT-Wi-Fi Coexistence
JP5 Pin
Pin
Designation
Default
Function1
Alternate
Function
Default
Direction2
Comment
1
WLAN_ACTIVE
DIO
Input
Also called WLAN_DENY
2
VCC_IO
Output only
3
BT_ACTIVE
DIO
Output
4
BT_PRIORITY
DIO
Output
Also called BT_STATUS
5
BT_NC
NC
DO NOT CONNECT
6
BT_NC
NC
DO NOT CONNECT
7
BT_NC
NC
DO NOT CONNECT
8
BT_NC
NC
DO NOT CONNECT
9
GND
10
NC
NC
1
DIO: Digital Input or Output
2
Default Direction In BT900 module smart BASIC runtime engine FW
6.2 Additional Peripherals / Sensors
The BT900 development board provides for simple and hassle free connectivity to a wide range of sensors, but also
includes several on-board sensors and options to enable a developer to test functionality straight out of the box.
The additional peripherals and sensors on the development board can be isolated by micro-DIP switches CON14,
CON15 and CON16.

BT900 Development Kit
Version 0.3
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
17
Laird Technologies
Americas: [phone]
Europe: [phone]
Hong Kong: [phone] x026
Figure 9: BT900 Development Board
6.2.1 Buzzer
SIO_10
SIO_11
RTC_SDA
RTC_SCL SIO_12Buzzer
CON15
DIP SW,SMD/180d
1
2
3
4
5
6
7
8
R12
0R
Buzzer
-
+
BZ1
3Vp-p,2KHz
1
1
2
2
GND
Figure 10: Buzzer
DIP switch CON14
Temperature sensor
(U1)
Trim Pot
(VR9)
I2C Sensor Device
(U13), RTC Chip
SPI sensor Device
(U12), Eeprom
DIP Switch CON15 DIP SwitchCON16
Buzzer (SP1)

BT900 Development Kit
Version 0.3
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
18
Laird Technologies
Americas: [phone]
Europe: [phone]
Hong Kong: [phone] x026
The buzzer (BZ1) ACTC SMD PIEZO BUZZER part number APD-1203-PQ1 can be disconnected from BT900 module by
micro-DIP switch CON15. Physical micro-DIP switch body has text “ON” on the closed side.
To drive the buzzer, configure SIO_12 as a digital output using smart BASIC GpioSetFunc(12,2,0) and then, for
example, write a 0 followed by a 1 to SIO_12 repeatedly in a loop.
Sample smart BASIC applications are available from a Laird FAE, or refer to bzt.buzzer.test.sb in the smart BASIC
sample application library on BT900 product pages at: https://github.com/LairdCP/BT900-Applications
6.2.2 Temperature Sensor
Figure 11: Temperature sensor
The temperature sensor (U1) can be disconnected from BT900 module by micro-DIP switch CON14. Physical
micro-DIP switch body has text “ON” on the closed side.
The temperature sensor (U1) can be disconnected from supply rail by cutting the solder bridge SB1.
The development board on-board temperature sensor (TI LM20BIM7 www.ti.com/lit/ds/symlink/lm20.pdf) has an
Analogue output that is connected to BT900 module pin SIO_21; but since the LM20BIM7 has an analogue output,
the BT900 module SIO_21 digital pin (DIO) must be configured as AIN analogue input (ADC). To configure the
SIO_21 pin from DIO pin to Alternate function AIN, see file “ts.temperature.sensor.sb” in the smart BASIC sample
application library on BT900 product pages at: https://github.com/LairdCP/BT900-Applications
Key specifications of the LM20BIM7:
Output type
Analogue output
Accuracy at 30ºC
±1.5ºC ±4ºC (max)
Accuracy at 40ºC to +85ºC
approx. ±2.5ºC ±5ºC (max)
Power supply voltage range
+2.4 V to 5.5 V
Current Drain
10 uA (max)
Output impedance
160 Ohms (max)
LM20BIM7 datasheet states Temperature (T) to Voltage output (Vo) relationship approximated as a linear equation
(for temperature range of -40ºC to +85ºC):
Vo(mV) = -11.79mV/ºC x T + 1858.3
Table 2 gives calculated Vo versus temperature:
SB1
Solderbridge
1
122
C2
0.1uF,16V
R59
NOPOP (0R)
C1
0.1uF,16V
VCC_3V3
U1
2.4V,10uA,-55dC~+130dC
V+
4
GND
5
Vo 3
GND 2
NC 1
Temp_Sens
VCC_IO
R5
NOPOP (4.7K)
R4
470R
GND GND GND GND

BT900 Development Kit
Version 0.3
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
19
Laird Technologies
Americas: [phone]
Europe: [phone]
Hong Kong: [phone] x026
Table 2: Vo vs. Temperature
Temperature (T)
Typical Vo
+80ºC
+924.7mV
+70ºC
+1041.4mV
+60ºC
+1158.1mV
+50ºC
+1274.8mV
+40ºC
+1391.5mV
+30ºC
+1508.2mV
+20ºC
+1624.9mV
+10ºC
+1741.6mV
+0ºC
+1858.2mV
-10ºC
+1975.0mV
-20ºC
+2091.7mV
-30ºC
+2208.4mV
6.2.3 Trim Potentiometer
The Trim Potentiometer is located in the middle of the development board to the right hand side of the coin cell
holder. It is labelled ‘Trim Pot’ on the silkscreen.
Figure 12: Trim Potentiometer
The Trim Potentiometer (VR9) can be disconnected from BT900 series module by micro-DIP switch CON14. Physical
micro-DIP switch body has text “ON” on the closed side.
The Trim Potentiometer (VR9) can be disconnected from supply rail by cutting the solder bridge SB2.
The Trim Potentiometer generates a voltage range of 0 V to ~0.9 V at C3 (CON14 pin4), see file tpt.trimpot.test.sb in
the smart BASIC sample application library on BT900 product pages at:
https://github.com/LairdCP/BT900-Applications

BT900 Development Kit
Version 0.3
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
20
Laird Technologies
Americas: [phone]
Europe: [phone]
Hong Kong: [phone] x026
6.2.4 Push Buttons and LEDs
Figure 13: Push buttons and LEDs
The two push buttons and two LEDs on the DVK-BT900-V01 are connected to dedicated SIOs of the BT900 module.
Part
SIO
Button 1 (SW1)
SIO_13
Button 2 (SW3)
SIO_20
LED 1 (LED1)
SIO_17
LED 2 (LED2)
SIO_18
If SIO_18 and SIO_19 are needed elsewhere, the LEDs can be disconnected by micro-DIP switch CON15. Physical
micro-DIP switch body has text “ON” on the closed side.
The buttons have external pull-up resistor, so to use the buttons the SIO_13 and SIO_20 pins must be configured as
an input (with internal pull-up resistor enabled or disabled). Refer to the smart BASIC application example
“btn.button.led.test.sb” in the smart BASIC sample application library on BT900 product pages at:
https://github.com/LairdCP/BT900-Applications
The LEDs are active high, meaning that writing a logical one (“1”) to the output pin illuminates the LED.
One example of when push buttons can be used is when a smart BASIC application is written to simulate a generic
data profile. Push buttons can then be pressed to increment or decrement, such as a heart rate.
SIO_18
CON14
DIP SW,SMD/180d
1
2
3
4
5
6
7
8
LED1
LED2
Trim_Pot
Temp_Sens SIO_21
SIO_20
SIO_17
GND
LED1
LED1
LED1
Blue,0603
12
R23
1K
GND
LED2
R27
1K
LED2
LED2
Blue,0603
12
BUTTON1
PIN HEADER,2.0mm 1X2P,
CON7 1
1
2
2
SW1
TACT SW,SMD/180d
1
1
2
233
44
GND
VCC_IO
R67
10K
SIO_13
R73
150R
C40
0.1uF,16V
GND
GND
C41
0.1uF,16V
SW3
TACT SW,SMD/180d
1
1
2
233
44
R74
150R
PIN HEADER,2.0mm 1X2P,
CON8 1
1
2
2
BUTTON2
GND
SIO_20
R68
10K
VCC_IO