LG LG-E510 User manual
Internal Use Only
Service Manual
LG-E510
Date: September, 2011 / Issue 1.0
- 2 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION..................................................................... 3
1.1 Purpose ........................................................................................................3
1.2 Regulatory Information.........................................................................3
1.3 Abbreviations.............................................................................................5
2. PERFORMANCE...................................................................... 7
2.1 Product Name............................................................................................7
2.2 Supporting Standard..............................................................................7
2.3 Main Parts : GSM Solution.....................................................................7
2.4 HW Features ...............................................................................................8
2.5 SW Features............................................................................................. 10
2.6 HW SPEC. ................................................................................................. 13
3. TECHNICAL BRIEF................................................................ 19
3.1 GENERAL DESCRIPTION...................................................................... 19
3.2 GSM MODE .............................................................................................. 21
3.3 UMTS MODE............................................................................................ 23
3.4 GPS RECEIVER.......................................................................................... 26
3.5 LO GENERATION and DISTRIBUTION CIRCUIT............................ 26
3.6 OFF-CHIP RF COMPONENTS............................................................. 27
3.7 Digital Baseband(DBB/MSM7227T)............................................... 31
3.8 Hardware Architecture........................................................................ 32
3.9 Subsystem (MSM7227T)..................................................................... 34
3.10 Power Block........................................................................................... 37
3.11 External memory interface............................................................. 42
3.12 H/W Sub System.................................................................................. 44
3.13 Audio and sound ................................................................................ 51
3.14 Display..................................................................................................... 57
3.15 Camera Interface (5M Auto Focus).............................................. 59
3.16 Compass Sensor.................................................................................. 60
3.17 Motion Sensor...................................................................................... 61
3.18 Proximity Sensor................................................................................. 62
3.19 Vibrators (DC Motor).......................................................................... 63
3.20 Main Features....................................................................................... 64
4. TROUBLE SHOOTING .......................................................... 68
4.1 RF Component....................................................................................... 68
4.2 SIGNAL PATH ........................................................................................... 69
4.3 Checking TCXO Block........................................................................... 72
4.4 Checking FEM Block............................................................................. 74
4.5 Checking WCDMA Block .................................................................... 76
4.6 Checking GSM Block............................................................................ 87
4.7 GPS/WIFI/BT RF Component ............................................................ 95
4.8 GPS/WIFI/BT SIGNAL PATH ................................................................ 97
4.9 GPS/WIFI/BT Trouble shooting ........................................................ 98
4.10 Power ONTrouble Shooting.........................................................103
4.11 Charging Trouble shooting...........................................................106
4.12 3M AF Camera Trouble Shooting...............................................108
4.13 Main LCD Trouble Shooting .........................................................112
4.14 Proximity Sensor on/off Trouble Shooting.............................114
4.15 Motion Sensor on/offTrouble Shooting.................................116
4.16 Compass Sensor on/off Trouble Shooting .............................118
4.17 DC Motor Trouble Shooting.........................................................120
4.18 Audio Troble........................................................................................122
5. DOWNLOAD.......................................................................136
6. BLOCK DIAGRAM...............................................................155
7. CIRCUIT DIAGRAM ............................................................162
8. BGA PIN MAP ....................................................................171
9. PCB LAYOUT.......................................................................175
10. CALIBRATION...................................................................178
10.1 General Description.........................................................................178
10.2 Requirement.......................................................................................178
10.3 Setup for RF calibration..................................................................179
10.4 Tachyon Software Installation .....................................................179
10.5 Tachyon Start......................................................................................180
10.6 Overview of RF Calibration...........................................................185
11. HIDDEN MENU.................................................................189
12. EXPLODED VIEW & REPLACEMENT PART LIST .............195
12.1 EXPLODED VIEW................................................................................195
12.2 Replacement Parts...........................................................................196
12.3 Accessory.............................................................................................218
- 3 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
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1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features
of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud associated
with your telecommunications system. System users are responsible for programming and configuring the
equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune
from the above case but will prevent unauthorized use of common carrier telecommunication service of
facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that
result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair
can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the
telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore,
note that unauthorized alternations or repair may affect the regulatory status of the system and may void
any remaining warranty.
1. INTRODUCTION
- 4 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
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E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such as
the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards. • When
repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.
• Use a suitable, grounded soldering iron. • Keep sensitive parts in these protective packages until these are
used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as described.
- 5 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
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1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Electrical Erasable Programmable Read-Only MemoryEEPROM
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RatioBER
BasebandBB
Automatic Power ControlAPC
1. INTRODUCTION
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