Preliminary Specification Number : SP-1SJ-295
2 / 24
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
TABLE OF CONTENTS
1. Features ···················································································································· 3
2. Part Number ·············································································································· 3
3.Certification info ········································································································· 3
3.1. Radio Certification ································································································ 3
4.Dimensions, Marking and Terminal Configurations ························································· 4
5.Label Information ······································································································· 9
6.Absolute Maximum Ratings·························································································· 9
7.Operating Condition ···································································································· 9
8.Electrical Characteristics ····························································································10
8.1. FSK Transceiver Specification ···············································································10
8.2. LoRa Transceiver Specification ··············································································10
8.3. Low power mode current······················································································· 11
9.Power Sequences········································································································ 11
10. Recommend Land Pattern ···························································································12
11.Tape and Reel Packing································································································13
11.1.
11.2.
11.3.
11.4.
Dimension of Tape ······························································································13
Dimensions of Reel ···························································································· 13
Taping Diagrams ······························································································14
Leader and Tail Tape ························································································· 14
12.Notice·······················································································································16
12.1.
12.2.
12.3.
12.4.
Storage Conditions ···························································································· 16
Handling Conditions ························································································· 16
Standard PCB Design (Land Pattern and Dimensions) ··········································· 16
Notice for Chip Placer : ······················································································ 16
12.5. Soldering Conditions：······················································································ 16
12.6.
12.7.
12.8.
Cleaning : ········································································································ 17
Operational Environment Conditions : ································································· 17
Input Power Capacity : ······················································································ 17
13.Regulatory Statements ·······························································································18
