Murata LBAA0QB1SJ User manual

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LoRa Module User Manual
MP Part Number:
LBAA0QB1SJ
(This user manual is preliminary. Please contact your Murata support for
the latest formal revision.)

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TABLE OF CONTENTS
1. Features ···················································································································· 3
2. Part Number ·············································································································· 3
3.Certification info ········································································································· 3
3.1. Radio Certification ································································································ 3
4.Dimensions, Marking and Terminal Configurations ························································· 4
5.Label Information ······································································································· 9
6.Absolute Maximum Ratings·························································································· 9
7.Operating Condition ···································································································· 9
8.Electrical Characteristics ····························································································10
8.1. FSK Transceiver Specification ···············································································10
8.2. LoRa Transceiver Specification ··············································································10
8.3. Low power mode current······················································································· 11
9.Power Sequences········································································································ 11
10. Recommend Land Pattern ···························································································12
11.Tape and Reel Packing································································································13
11.1.
11.2.
11.3.
11.4.
Dimension of Tape ······························································································13
Dimensions of Reel ···························································································· 13
Taping Diagrams ······························································································14
Leader and Tail Tape ························································································· 14
12.Notice·······················································································································16
12.1.
12.2.
12.3.
12.4.
Storage Conditions ···························································································· 16
Handling Conditions ························································································· 16
Standard PCB Design (Land Pattern and Dimensions) ··········································· 16
Notice for Chip Placer : ······················································································ 16
12.5. Soldering Conditions：······················································································ 16
12.6.
12.7.
12.8.
Cleaning : ········································································································ 17
Operational Environment Conditions : ································································· 17
Input Power Capacity : ······················································································ 17
13.Regulatory Statements ·······························································································18

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1. Features
Interfaces : UART, I2C, USB, SPI
Main ICs : STM32L, SX1262
Reference Clocks : Integrated 32MHz clock (TCXO with frequency error=±3.0
ppm) and 32.768KHz clock (frequency error=±20 ppm)
Module Size : 10.0 mm x 8.0 mm x 1.60 max mm.
Weight : 0.28g (Typ.)
Package : Resin mold
RoHS : This module is compliant with the RoHS directive
2. Part Number
Ordering Part Number
Description
LBAA0QB1SJ-295TEMP
Engineering sample
LBAA0QB1SJ-295EVK
Evaluation board
LBAA0QB1SJ
MP P/N
3.Certification info
3.1. Radio Certification
USA/Canada
FCC ID VPYLB1SJ
IC 772C-LB1SJ
Transmitting Channel Frequency Allocation:
125KHz LoRa: 902.3~914.9MHz, channel space 200KHz
500KHz LoRa: 903.0~914.2MHz, channel space 1.6MHz

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4.Dimensions, Marking and Terminal Configurations
Table 1 Dimension (Unit: mm)
Mark
Dimension
Mark
Dimension
Mark
Dimension
L
10.0±0.2
W
8.0±0.2
T
1.60 max
a1
0.4±0.1
a2
0.4±0.1
a3
1.0±0.1
b1
0.2±0.15
b2
1.3±0.15
b3
2.3±0.15
b4
0.2±0.15
b5
0.3±0.15
b6
2.0±0.15
b7
2.5±0.15
c1
0.7±0.1
c2
0.7±0.1
c3
1.0±0.1
e1
0.3±0.1
e2
0.3±0.1
e3
0.5±0.1
e4
0.5±0.1

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Terminal Configurations
Table 2 Terminal Configurations
Pin NO.
Terminal Name
Type
Connection to
Description
IC terminal
1
GND
Ground
-
Ground
2
VREG
O
SX1262_VREG
Regulated output voltage from internal
regulator LDO/DC-DC
3
DCDC_SW
O
SX1262_DCC_SW
DC-DC Switcher Output
4
GND
Ground
-
Ground
5
VDD_RF
Power
SX1262_VBAT / VDD_IN
Power supply for RF IC
6
GND
Ground
-
Ground
7
VDD_MCU
Power
SX1262_VBAT_IO,STM32L0
72_VDD / VDDA / VREF+
Power supply for MCU and RF IC
8
GND
Ground
-
Ground
9
PB2
I/O
STM32L072_PB2
GPIO mode:PB2

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LPTIM1_OUT
I2C3_SMBA
10
PA7
I/O
STM32L072_PA7
GPIO mode:PA7
SPI1_MOSI
COMP2_OUT
ADC_IN7
11
PA6
I/O
STM32L072_PA6
GPIO mode:PA6
SPI1_MISO
LPUART1_CTS
COMP1_OUT
ADC_IN6
12
GND
Ground
-
Ground
13
PA4
I/O
STM32L072_PA4
GPIO mode:PA4
SPI1_NSS
UART2_CK
COMP1_INM/COMP2_INM
ADC_IN4
DAC_OUT1
14
PA5
I/O
STM32L072_PA5
GPIO mode:PA5
SPI1_SCK
CMP2_INM
COMP1_INM/COMP2_INM
ADC_IN5
DAC_OUT2
15
PA3
I/O
STM32L072_PA3
GPIO mode:PA3
ADC_IN3
USART2_RX
LPUART1_RX
COMP2_INP
16
PA2
I/O
STM32L072_PA2
GPIO mode:PA2
ADC_IN2
USART2_TX
LPUART1_TX
COMP2_OUT/COMP2_INM
17
PA0
I/O
STM32L072_PA0
GPIO mode:PA0
ADC_IN0
USART2_CTS
USART4_TX
COMP1_OUT/COMP1_INM
18
PA1
I/O
STM32L072_PA1
GPIO mode:PA1
ADC_IN1
USART2_RTS
USART4_RX
COMP1_INP
19
MCU_nRST
I
STM32L072_nRST
Reset for MCU
20
PB9
I/O
STM32L072_PB9
GPIO mode: PB9
I2C1_SDA
SPI2_NSS

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I2S2_WS
21
PB8
I/O
STM32L072_PB8
GPIO mode:PB8
I2C1_SCL
22
GND
Ground
-
Ground
23
ANT
A, I/O
-
Transmit / Receive antenna
24
GND
Ground
-
Ground
25
GND
Ground
-
Ground
26
MCU_BOOT0
I
STM32L072_BOOT0
BOOT0 for MCU
27
PB5
I/O
STM32L072_PB5
GPIO mode:PB5
LPTIM1_IN1
SPI1_MOSI
I2C1_SMBA
USART1_CK
USART5_RTS
COMP2_INP
28
PB3
I/O
STM32L072_PB3
GPIO mode:PB3
COMP2_INM
SPI1_CLK
USART1_RTS
USART5_TX
29
PB4
I/O
STM32L072_PB4
GPIO mode:PB4
COMP2_INP
SPI1_MISO
USART1_CTS
USART5_RX
I2C3_SDA
30
PB6
I/O
STM32L072_PB6
GPIO mode:PB6
I2C1_SCL
USART1_TX
LPTIM1_ETR
COMP2_INP
31
PB7
I/O
STM32L072_PB7
GPIO mode:PB7
I2C1_SDA
USART1_RX
LPTIM1_IN2
USART4_CTS
COMP2_INP
VREF_PVD_IN
32
PA14
I/O
STM32L072_PA14
GPIO mode:PA14
SWCLK
USART2_TX
LPUART1_TX
33
PA13
I/O
STM32L072_PA13
GPIO mode:PA13
SWDIO
USB_OE
LPUART1_RX
34
GND
Ground
-
Ground

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35
VDD_USB
Power
STM32L072_VDD_USB
Power supply for MCU USB Interface
36
PA12
I/O
STM32L072_PA12
GPIO mode:PA12(power supply by
VDD_USB)
USB_DP
SPI1_MOSI
USART1_RTS
COMP2_OUT
37
PA11
I/O
STM32L072_PA11
GPIO mode:PA11(power supply by
VDD_USB)
USB_DM
SPI1_MISO
USART1_CST
COMP1_OUT
38
GND
Ground
-
Ground
39
PA10
I/O
STM32L072_PA10
GPIO mode:PA10
USART1_RX
I2C1_SDA
40
PA9
I/O
STM32L072_PA9
GPIO mode:PA9
USART1_TX
I2C1_SCL
I2C3_SMBA
MCO
41
PA8
I/O
STM32L072_PA8
GPIO mode:PA8
MCO
USB_CRS_SYNC
USART1_CK
I2C3_SCL
42
PB10
I/O
STM32L072_PB10
GPIO mode:PB10
LPUART1_TX/LPUART1_RX
SPI2_SCK
I2C2_SCL
43
PB11
I/O
STM32L072_PB11
GPIO mode:PB11
LPUART1_RX/ LPUART1_TX
I2C2_SDA
44
GND
Ground
-
Ground
45~56
GND
Ground
-
Ground
Notes: GPIO pins are to be left OPEN if not used.

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5.Label Information
6.Absolute Maximum Ratings
Table 3 Maximum ratings
Parameters
Min
Typ
Max
Unit
Storage Temperature
-40
25
+85
degC
Input RF Level
-
-
10
dBm
Supply Voltage
VDD_RF, VDD_MCU, VDD_USB
-0.3
-
3.9
V
7.Operating Condition
Table 4 Operating specification
Parameters
Min
Typ
Max
Unit
Operating Temperature
-40
25
+85
degC
Supply
Voltage
VDD_RF, VDD_MCU
2.0
-
3.6
V
VDD_USB (USB peripheral used) (1)
3.0
-
3.6
V
VDD_USB(USB peripheral not used) (1)
VDD_MCU_min
VDD_MCU
VDD_MCU_max
V
(1) VDD_USB must respect the following conditions:
- When VDD_MCU is powered on (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than VDD_MCU.
- When VDD_MCU is powered down (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than
VDD_MCU.
- In operating mode, VDD_USB could be lower or higher than VDD_MCU.
- If the USB is not used, VDD_USB must be tied to VDD_MCU to be able to use PA11 and PA12 as standard I/O.

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8.Electrical Characteristics
8.1. FSK Transceiver Specification
Conditions:
Supply voltage =3.3 V, Temperature = 25 °C, TCXO = 32 MHz, FRF =868MHz, all RF impedances matched,
transmit mode output power defined in 50 Ohm load, FSK BER = 0.1%, 2-level FSK modulation without
pre-filtering, BR = 4.8 kb/s, FDA= 5 kHz, BW_F = 19.5 kHz double-sided, unless otherwise specified.
Note: FSK transmission is only available in the EU868 band.
FSK Receive Specification
Symbol
Description
Conditions
Min
Typ
Max
Unit
RXS_2FB
Sensitivity 2-FSK, RX
Boosted, Split RF path for
RX and TX
BR_F = 4.8 kb/s, FDA = 5 kHz,
BW_F = 19.5 kHz
-117
dBm
FSK Transmit Specification
Symbol
Description
Conditions
Min
Typ
Max
Unit
TXOP
Power setting = 22 dBm
868MHZ Band
21.5
dBm
IDDTX
Power setting = 22 dBm
868MHZ Band
118
mA
8.2. LoRa Transceiver Specification
Conditions:
The table below gives the electrical specifications for the transceiver operating with LoRaTM modulation.
Following conditions apply unless otherwise specified: Supply voltage = 3.3 V, Temperature = 25 °C, TCXO = 32
MHz, FRF =868/915 MHz, all RF impedances matched, transmit mode output power defined in 50 Ohm load, Error
Correction Code (EC) = 4/5, Packet Error Rate (PER)= 1%, CRC on payload enabled, Payload length = 10 bytes.
LoRa Receive Specification
Symbol
Description
Conditions
Min
Typ
Max
Unit
IDDRX
Receive mode, DC-DC
mode used, RX Boosted,
868MHZ Band
15.5(1)
mA
915MHz Band
15.5(1)
mA
IDDRX
Receive mode, LDO
mode used, RX Boosted
868MHZ Band
20.0(1)
mA
915MHz Band
20.0(1)
mA
RXS_LB
(125KHz)
Sensitivity Lora,
RX Boosted, Split RF
path for RX and TX.
125KHz bandwidth
SF = 7
-124
dBm
SF = 12
-137
dBm
RXS_LB
(250KHz)
Sensitivity Lora,
RX Boosted, Split RF
path for RX and TX.
250KHz bandwidth
SF = 7
-121
dBm
SF = 12
-134
dBm
(1) IDDRX is tested under test FW, and MCU is not in sleep mode.
LoRa Transmit Specification
Symbol
Description
Conditions
Min
Typ
Max
Unit
TXOP
TXOP setting = 22 dBm
868MHZ Band
21.5
dBm
915MHZ Band
21.2
dBm
IDDTX
TXOP setting = 22 dBm
868MHZ Band
118
mA
915MHZ Band
109
mA

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8.3. Low power mode current
Conditions: Power supply=3.3 V, Temperature=25 °C;
Description
Min
Typ
Max
Unit
STM32L072 in stop mode with RTC (Real Time Clock)
SX1262 in cold start sleep mode1
1.3
uA
STM32L072 in stop mode with RTC (Real Time Clock)
SX1262 in warm start sleep mode without RC64K(64kHz RC oscillator)2
2.0
uA
STM32L072 in stop mode with RTC (Real Time Clock)
SX1262 in warm start sleep mode with RC64K(64kHz RC oscillator)2
2.5
uA
1. Cold start is equivalent to device at POR or when the device is waking up from sleep mode with all blocks OFF.
2. Warm start is only happening when device is waking up from sleep mode with its configuration retained.
9.Power Sequences
9.1 Power Up Sequence

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10.Recommend Land Pattern
Notes：
1. Dimension unit is millimeter (Angle unit is degree).
2. This land pattern is for reference only.
Consult your manufacturing group to ensure your company's manufacturing guidelines are met.
3. Thermal vias in the land pattern of the exposed pad shall be connected to a system ground
plane. Failure to do so may compromise the thermal and/or functional performance of the
device.
4. Square package-dimension apply in both "X" and "Y" directions.

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11.Tape and Reel Packing
11.1. Dimension of Tape
(unit: mm)
11.2. Dimensions of Reel
2.0±0.1
1.75±0.1
0.30±0.05
16.0±0.1
11.5±0.1
10.5±0.05
1.5+0.1/-0.0
24.0+0.3/-0.1
feeding direction
4.0±0.1 *1
8.4±0.05
1.5+0.1/-0.0
1.75±0.05
W1
W2
R80
R135
R5
5
22
φ10
120°
φ330±2
φ80±1
φ13±0.2
Label
Reel inside width W1: 25.5±1.0
Reel outside width W2: 29.5±1.0
Unit: mm

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11.3. Taping Diagrams
[1] Feeding Hole :As specified in (1)
[2] Hole for chip :As specified in (1)
[3] Cover tape : 62μMin thickness
[4] Base tape :As specified in (1)
11.4. Leader and Tail Tape
Feeding Hole
Chip
Feeding Direction
[2]
[3]
[4]
[3] [1]
40 to 200mm
(No components)
Components
No components
Feeding direction
Leader tape
(Cover tape alone)
150mm min.
250mm min.
Tail tape

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- The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
- The cover tape and base tape are not adhered at no components area for 250mm Min.
- Tear off strength against pulling of cover tape: 5N Min.
- Packaging unit : 1000 pcs/ reel
- Material
Base tape : Plastic
Reel : Plastic
Cover tape, cavity tape and reel are made the anti-static processing.
- Peeling of force: 1.3N max. in the direction of peeling as shown below.
- Packaging (Humidity proof Packing)
Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant
and the humidity indicator.
165 to 180 °
0.7 N max.
Base tape
Cover tape
1.3 N max.
湿度
イ ン ジケ－タ
乾燥剤
表示ラ べル
防湿梱包袋
表示ラ ベル
Label
Label
Desiccant
Humidity
Indicator
Anti-humidity
Plastic Bag

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12.Notice
12.1. Storage Conditions
Please use this product within 6month after receipt.
- The product shall be stored without opening the packing under the ambient temperature from 5 to
35 °C and humidity from 20 ~70 %RH.
(Packing materials, in particular, may be deformed at the temperature over 40 °C)
- The product left more than 6months after reception, it needs to be confirmed the solderbility before
used.
- The product shall be stored in non-corrosive gas (CL2, NH3, SO2, NOx, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp
object and dropping the product, shall not be applied in order not to damage the packing materials.
This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020)
- After the packing opened, the product shall be stored at <30 °C / <60 %RH and the product shall be
used within 168 hours.
- When the color of the indicator in the packing changed, the product shall be baked before soldering.
Baking condition: 125 +5/-0 °C, 24 hours, 1 time
The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and
Cover Tape) are not heat-resistant.
12.2. Handling Conditions
Be careful in handling or transporting products because excessive stress or mechanical shock may
break products.
Handle with care if products may have cracks or damages on their terminals, the characteristics of
products may change. Do not touch products with bear hands that may result in poor solderability.
12.3. Standard PCB Design (Land Pattern and Dimensions)
All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.
The recommended land pattern and dimensions is as Murata's standard. The characteristics of products
may vary depending on the pattern drawing method, grounding method, land dimensions, land forming
method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the
characteristics in the actual set. When using non-standard lands, contact Murata beforehand.
12.4. Notice for Chip Placer :
When placing products on the PCB, products may be stressed and broken by uneven forces from a
worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to
follow the specifications for the maintenance of the chip placer being used. For the positioning of
products on the PCB, be aware that mechanical chucking may damage products.
12.5. Soldering Conditions：
The recommendation conditions of soldering are as in the following figure.
When products are immersed in solvent after mounting, pay special attention to maintain the
temperature difference within 100 °C. Soldering must be carried out by the above mentioned
conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C.
Contact Murata before use if concerning other soldering conditions.

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Murata Manufacturing Co., Ltd.
Reflow Soldering Standard Conditions (Example)
Please use the reflow within 2 times.
Use rosin Type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
12.6. Cleaning :
Since this Product is Moisture Sensitive, any cleaning is not permitted.
12.7. Operational Environment Conditions :
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the similar
conditions to the above-mentioned. However, if products are used under the following circumstances, it
may damage products and leakage of electricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas (CL2, NH3, SOx, NOx, etc.).
- In an atmosphere containing combustible and volatile gases.
- Dusty place.
- Direct sunlight place.
- Water splashing place.
- Humid place where water condenses.
- Freezing place.
If there are possibilities for products to be used under the preceding clause, consult with Murata before
actual use.
As it might be a cause of degradation or destruction to apply static electricity to products, do not apply
static electricity or excessive voltage while assembling and measuring.
12.8. Input Power Capacity :
Products shall be used in the input power capacity as specified in this specification.
Inform Murata beforehand, in case that the components are used beyond such input power capacity
range.
Within 120 s
Pre-heating
Time(s)
220 °C
Within 60s
Cooling down
Slowly
180 °C
150 °C
240 ~250 °C
Within 3 s

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Murata Manufacturing Co., Ltd.
13.Regulatory Statements
13.1 FCC Statements
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause undesired
operation.
Cet appareil est conforme à la section 15 des réglementations de la FCC. Le fonctionnement de
l’appareil est sujetaux deux conditions suivantes :
(1) cet appareil ne doit pas provoquer d’interférences néfastes, et
(2) cet appareil doit tolérer les interférences reçues, y compris celles qui risquent de provoquer un
fonctionnement indésirable.
Note: This product has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This product generates, uses, and can radiate
radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this product does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encouraged to try to
correct the interference by one or more of the following measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
Please take attention that changes or modification not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.
This equipment should be installed and operated with a minimum distance 20cm between the radiator
and your body
Cet équipement doit être installé et utilisé à une distance minimale de 20 cm entre le radiateur et votre
corps
When the FCC ID is not visible when the module is installed inside another device, then the outside of
the device into which the module is installed must also display a label referring to the enclosed module.
This exterior label can be use wording ”Contains transmitter module FCC ID: VPYLB1SJ”or “Contains
FCC ID: VPYLB1SJ”.

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Murata Manufacturing Co., Ltd.
13.2 IC Statements
13.3 General Statements
The module is limited to OEM installation ONLY.
The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or
install module.
Therefore, the final host product must be submitted to Murata for confirmation that the installation for the
module into the host is in compliance with regulations of FCC and IC Canada. Specially, if an antenna
other than the model documented in the Filing is used, a Class 2 Permissive Change must be filed with
the FCC.
Changes or modifications not expressly approved by the manufacturer could void the user’s authority to
operate the equipment.
The LoRa module is for use with external antenna ONLY.
The certified antennas include:
(1) PCB pattern Antenna with peak gain 1.0dBi.
(2) FlexibleAntenna (Molex: 2111400100) with peak gain 1.0dBi.
This module has been approved by FCC to operate with the antenna types with the maximum
permissible gain indicated. Antenna types not included in this list, having a gain greater than the
maximum gain indicated for that type, are strictly prohibited for use with this device.
ISED RSS Warning/ISED RF Exposure Statement
ISED RSS Warning:
This device complies with Innovation, Science and Economic Development Canada licence-exempt RSS
standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference,
and (2) this device must accept any interference, including interference that may cause undesired operation
of the device.
Le présent appareil est conforme aux CNR d'ISED applicables aux appareils radio exempts de licence.Le
L'exploitation est autorisée aux deux conditions suivantes:L'e
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement.
ISED RF exposure statement:
This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20cm between the radiator& your
body.This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
Le rayonnement de la classe b repecte ISED fixaient un environnement non contrôlés.Installation et mise en
œuvre de ce matériel devrait avec échangeur distance minimale entre 20 cm ton corps.Lanceurs ou ne
peuvent pas coexister cette antenne ou capteurs avec d’autres.
IC Label Instructions
The outside of final products that contains this module device must display a label referring to the enclosed
module. This exterior label can use wording such as:
“Contains Transmitter Module IC: 772C-LB1SJ" or “Contains IC: 772C-LB1SJ” Any similar wording that
expresses the same meaning may be used. l'extérieur des produits finals que contient ce module appareil
doit afficher une étiquette mentionnant le module de ci - jointe.cette étiquette peut utiliser un libellé tel
que:"contient du module IC: 772C-LB1SJ ou contient IC: 772C-LB1SJ toute formulation semblable qui
exprime la même signification peuvent être utilisés.

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Murata Manufacturing Co., Ltd.
CAUTION
PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS.
Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for
the specifications of our product when our product is mounted to your product.
All the items and parameters in this product specification/datasheet/catalog have been prescribed on the
premise that our product is used for the purpose, under the condition and in the environment specified in
this specification. You are requested not to use our product deviating from the condition and the
environment specified in this specification.
Please note that the only warranty that we provide regarding the products is its conformance to the
specifications provided herein. Accordingly, we shall not be responsible for any defects in products or
equipment incorporating such products, which are caused under the conditions other than those
specified in this specification.
WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR
IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR
PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL
PROPERTY RIGHTS.
The product shall not be used in any application listed below which requires especially high reliability for
the prevention of such defect as may directly cause damage to the third party's life, body or property. You
acknowledge and agree that, if you use our products in such applications, we will not be responsible for
any failure to meet such requirements.
Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL
CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT
LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH
APPLICATIONS.
- Aircraft equipment.
- Aerospace equipment
- Undersea equipment.
- Power plant control equipment
- Medical equipment.
- Transportation equipment (vehicles, trains, ships, elevator, etc.).
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
- Burning / explosion control equipment
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
We expressly prohibit you from analyzing, breaking, Reverse-Engineering, remodeling altering, and
reproducing our product. Our product cannot be used for the product which is prohibited from being
manufactured, used, and sold by the regulations and laws in the world.
We do not warrant or represent that any license, either express or implied, is granted under any our
patent right, copyright, mask work right, or our other intellectual property right relating to any combination,
machine, or process in which our products or services are used. Information provided by us regarding
third-party products or services does not constitute a license from us to use such products or services or
a warranty or endorsement thereof. Use of such information may require a license from a third party
under the patents or other intellectual property of the third party, or a license from us under our patents or
other intellectual property.
Please do not use our products, our technical information and other data provided by us for the purpose
of developing of mass-destruction weapons and the purpose of military use.
Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export
administration regulations", etc.
Please note that we may discontinue the manufacture of our products, due to reasons such as end of
supply of materials and/or components from our suppliers.
Customer acknowledges that Murata will, if requested by you, conduct a failure analysis for defect or
alleged defect of Products only at the level required for consumer grade Products, and thus such
analysis may not always be available or be in accordance with your request (for example, in cases
where the defect was caused by components in Products supplied to Murata from a third party).
By signing on specification sheet or approval sheet, you acknowledge that you are the legal
representative for your company and that you understand and accept the validity of the contents herein.
When you are not able to return the signed version of specification sheet or approval sheet within 90
days from receiving date of specification sheet or approval sheet, it shall be deemed to be your consent