Murata LBAD0ZZ1SE User manual

Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018
LBAD0ZZ1SE Data Sheet, v1.0, 10/05/2020 Page 1 of 26 www.murata.com
Features
•LTE Cat M1 –Class 3, up to 23dBm
•NB-IoT (NB1) Rel. 13
•STM32L462RE/Cortex M4 w/512KB Flash and 160 KB SRAM
•1MB on-board Serial Flash
•Dimension: 15.4 x 18.0 x 2.5 mm (max)
•Package: LGA
•SIM card: internal eSIM (WLCSP)
•Antenna configurations: U.FL antenna connection
•3GPP eDRX and PSM modes
•Power Consumption: enables up to 10-year battery life
•Support PSM and eDRX
•Operating temperature range: -40 °c to 85 °c
•OTA firmware upgrade
•Global Certifications: GCF and PTCRB
•IPv4/IPv6 stack with TCP and UDP protocol
•SSL/TLS
•LTE universal modem supports (low-band and mid-band):
•Low-band B5/B8/B12/B13/B14(CAT M1 Only)/B17/B18/B19/B20/B26/B28
•Mid-band B1/B2/B3/B4/B25
Benefits
•Certified as a host device for ease of integration with several different types of applications
•Quicker time to market (no additional carrier or regulatory certification)
•Less development time and costs for developer/device manufacturer in need of LTE Cat M1/NB-loT connectivity
•eSIM included in certification
•Build/Develop applications with the use of ST's vast set of software modules
•Availability of ST's Community and Development Forums
•Secure boot architecture and a robust hardware-based security framework
LBAD0ZZ1SE
LTE CAT
M1/NB-IoT
Module

Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018
LBAD0ZZ1SE Data Sheet, v1.0, 10/05/2020 Page 2 of 26 www.murata.com
Revision History
Revision
Date
Author
Change Description
1.0
10/05/2020
RF PD
Initial release

Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018
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Table of Contents
FEATURES............................................................................................................................................................................. 1
BENEFITS............................................................................................................................................................................... 1
REVISION HISTORY.............................................................................................................................................................. 2
TABLE OF CONTENTS ......................................................................................................................................................... 3
1BLOCK DIAGRAM......................................................................................................................................................... 0
2MODULE SPECIFICATIONS......................................................................................................................................... 0
3MECHANICAL SPECIFICATION .................................................................................................................................. 1
3.1 Module Dimensions....................................................................................................................................................1
3.2 Top and Side View.....................................................................................................................................................1
3.3 PCB Footprint Top View.............................................................................................................................................2
3.4 Pin Configuration........................................................................................................................................................3
4DC ELECTRICAL SPECIFICATION.............................................................................................................................. 6
4.1 Tx Output Power ........................................................................................................................................................6
4.2 Rx Sensitivity..............................................................................................................................................................6
5ENVIRONMENTAL SPECIFICATION ...........................................................................................................................6
5.1 Absolute Maximum Rating.........................................................................................................................................6
5.2 Recommended Operating Condition.......................................................................................................................... 6
5.3 Temperature Range...................................................................................................................................................6
6APPLICATION INFORMATION..................................................................................................................................... 7
6.1 Recommended PCB Landing Pattern........................................................................................................................7
6.2 External Antenna........................................................................................................................................................7
6.3 Development Kit and Reference Design....................................................................................................................7
7ASSEMBLY INFORMATION......................................................................................................................................... 8
8PACKAGING AND MARKING INFORMATION............................................................................................................ 9
8.1 Dimensions of Tape (Plastic tape).............................................................................................................................9
8.2 Dimensions of Reel.................................................................................................................................................... 9
8.3 Taping Diagrams......................................................................................................................................................10
8.4 Leader and Tail tape................................................................................................................................................11
8.5 Peeling Force...........................................................................................................................................................12
8.6 PACKAGE (Humidity proof Packaging) ...................................................................................................................12
8.7 Module Marking Information.....................................................................................................................................13
8.8 Moisture Sensitivity Level.........................................................................................................................................13
9REGULATORY INFORMATION..................................................................................................................................14
9.1 FCC Info...................................................................................................................................................................14
9.2 FCC Test Data .........................................................................................................................................................14
9.3 ISED Test Data ........................................................................................................................................................15
9.4 List of Applicable FCC Rules ...................................................................................................................................15
9.5 Labeling Requirements............................................................................................................................................16
9.6 Additional Testing Requirements.............................................................................................................................16
9.7 Test Modes...............................................................................................................................................................16
10 ROHS INFORMATION................................................................................................................................................. 17

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11 ORDERING INFORMATION........................................................................................................................................17
12 NOTICE ........................................................................................................................................................................18
12.1 Storage Conditions...................................................................................................................................................18
12.2 Handling Conditions.................................................................................................................................................18
12.3 Standard PCB Design (Land Pattern and Dimensions)...........................................................................................18
12.4 Notice for Chip Placer..............................................................................................................................................18
12.5 Operational Environment Conditions .......................................................................................................................18
12.6 Input Power Capacity...............................................................................................................................................19
13 PRECONDITIONS TO USE MURATA PRODUCTS ...................................................................................................20
14 REFERENCES.............................................................................................................................................................21
LIST OF FIGURES
Figure 1 Type 1SE Block Diagram..........................................................................................................................................0
Figure 3.1 Module Top and Side View (Unit: mm)..................................................................................................................1
Figure 3.2 Module Footprint Top View (Unit: mm)..................................................................................................................2
Figure 8.1 Reflow Profile.........................................................................................................................................................8
Figure 9.1 Tape Dimensions (Unit in mm) ..............................................................................................................................9
Figure 9.2 Reel Dimensions (Unit: mm)..................................................................................................................................9
Figure 9.3 Tape Diagram ......................................................................................................................................................10
Figure 9.4 Tape Leader and Tail...........................................................................................................................................11
Figure 9.5 Peeling Force Diagram........................................................................................................................................12
Figure 9.6 Packaging Diagram..............................................................................................................................................12
Figure 9.7 Module Marking Diagram.....................................................................................................................................13
LIST OF TABLES
Table 2-1 Module Specifications.............................................................................................................................................0
Table 3-1: Module Dimensions ...............................................................................................................................................1
Table 3-2 Pinouts....................................................................................................................................................................3
Table 4-1 Rx Sensitivity ..........................................................................................................................................................6
Table 5-1 Absolute Maximum Rating......................................................................................................................................6
Table 5-2 Recommended Operating Condition ......................................................................................................................6
Table 5-3 Temperature Range................................................................................................................................................6
Table 10-1 FCC Test Data....................................................................................................................................................14
Table 10-2 ISED Test Data...................................................................................................................................................15
Table 11-1 Ordering Information...........................................................................................................................................17

Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018
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1 Block Diagram
Figure 1 Type 1SE Block Diagram
2 Module Specifications
Table 2-1 Module Specifications
Part Number
LBAD0ZZ1SE
Connectivity
3GPP Release 13/Optimized for LTE Class 3 output power (+23 dBm)
Universal LTE (LB & MB)
Low-band: B5/B8/B12/B13/B14(CAT M1 Only)
/B17/B18/B19/B20/B26/B28
Mid-band: B1/B2/B3/B4/B25
GNSS
GPS and GLONASS
Voltage Input
3.3-5V
Antenna
Off board multi-band antenna
Dimension
15.4 x 18.0 x 2.5 mm (max)
Peripheral Interfaces
GPIO, ADC, I2C, PWM, SPI, UART
Operating Temp
-40° to 85° C

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3 Mechanical Specification
3.1 Module Dimensions
Table 3-1: Module Dimensions
Parameter
Typical
Unit
Dimension (L x W x H)
15.4 ±0.2mm x 18.0 ±0.2mm x 2.5 (max)
mm
3.2 Top and Side View
Figure 3.1 Module Top and Side View (Unit: mm)

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3.3 PCB Footprint Top View
Figure 3.2 Module Footprint Top View (Unit: mm)

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3.4 Pin Configuration
For further detail of the built-in STM32, please refer to the STM32L462CE STM32L462RE
STM32L462VE datasheet [1].
Table 3-2 Pinouts
Pin #
Pin Name
Type1SC
STM32L462
Type
Description
1
USART2_RTS
E6
I/O
PA1/USART2_RTS
2
USART2_RX
F6
I/O
PA3/USART2_RX
3
USART2_TX
G7
I/O
PA2/USART2_TX
4
USART2_CTS
H8
I/O
PA0/USART2_CTS
5
VDDA
F7
Power
ADC power; connect to VDD_1V8 if not used
6
VSSA
G8
Power
ADC GND
7
NRST
F8
Reset
Reset STM32
8
NC
No Connect
9
NC
No Connect
10
GPIO_EXTI7
E1
I/O
PC7/GPIO_EXTI7
11
NC_RST_IND
I/O
Reserved for internal usage and testing
12
NC
No Connect
13
NC
No Connect
14
NC
No Connect
15
NC
No Connect
16
RFT_UART2_CTS
21
I/O
Recovery UART_CTS
17
RFT_UART2_TX
22
I/O
Recovery UART_RX
18
RFT_UART2_RTS
74
I/O
Recovery UART_RTS
19
RFT_UART2_RX
20
I/O
Recovery UART_TX
20
NC
No Connect
21
NC
No Connect
22
NC
No Connect
23
RFT_UART1_RTS
43
I/O
Log UART_RTS
24
RFT_UART1_TX
46
I/O
Log UART_TX
25
RFT_UART1_RX
45
I/O
Log UART_RX
26
RFT_UART1_CTS
94
I/O
Log UART_CTS
27
NC
No Connect
28
GND
GND
GND
29
NC
No Connect
30
NC
No Connect
31
NC
No Connect
32
NC
No Connect
33
NC
No Connect
34
NC
No Connect
35
NC
No Connect

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Pin #
Pin Name
Type1SC
STM32L462
Type
Description
36
NC
No Connect
37
PMU_AT_IN
5
I
Connect to GND
38
NC
No Connect
39
NC
No Connect
40
NC
No Connect
41
NC
No Connect
42
GND
GND
43
VDD
Power
Power supply for Type1SE
44
VDD
Power
Power supply for Type1SE
45
VDD
Power
Power supply for Type1SE
46
GND
GND
GND
47
NC
No Connect
48
NC
No Connect
49
NC_SIM_CLK
69
I/O
SIM clock
50
NC_VSIM
8
O
SIM power supply
51
GND
GND
GND
52
NC_SIM_DETECT
70
I/O
SIM detect
53
NC_SIM_RST
68
I/O
SIM reset
54
PH1_OSC_OUT
E8
I/O
PH1/RCC_OSC_OUT
55
PH0_OSC_IN
D8
I/O
PH0/RCC_OSC_IN
56
NC
No Connect
57
NC_SIM_IO
11
I/O
SIM data
58
ADC1_IN1
D7
I/O
PC0/ADC1_IN1
59
ADC1_IN3
D6
I/O
PC2/ADC1_IN3
60
ADC1_IN2
D5
I/O
PC1/ADC1_IN2
61
ADC1_IN4
E7
I/O
PC3/ADC1_IN4
62
RTC_TAMP1
B8
I/O
PC13/RTC_TAMP1
63
BOOT0
B6
I/O
PH3/BOOT0
64
SF_EN
B5
I/O
PB6/SF_EN
65
RCC_MCO
E3
I/O
PA8/RCC_MCO
66
NC
No Connect
67
NC
No Connect
68
VDD_1V8
Power
Reserved for codec supply/MCU VBAT/MCU VDDA
69
I2C1_SDA
C6
I/O
PB9/I2C1_SDA
70
I2C1_SCL
A6
I/O
PB8/I2C1_SCL
71
VBAT
B7
Power
Backup supply; connect to VDD_1V8 if not used
72
SPI1_SCK
F5
I/O
PA5/SPI1_SCK
73
SPI1_MOSI
C5
I/O
PB5/SPI1_MOSI
74
SPI1_MISO
A4
I/O
PB4/SPI1_MISO/NJTRST
75
SPI1_NSS
A2
I/O
PA15/SPI1_NSS/JTDI

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Pin #
Pin Name
Type1SC
STM32L462
Type
Description
76
TIM2_CH2
B4
I/O
PB3/TIM2_CH2/JTDO/TRACESWO
77
NC
No Connect
78
NC
No Connect
79
GND
GND
GND
80
NC
No Connect
81
eSIM_SWP
I/O
SWP for NFC to ST33
82
NC
No Connect
83
NC
No Connect
84
VDDUSB
A1
Power
3.0 to 3.6 V supply for USB; connect to VDD_1V8 if not
used
85
SWCLK
C3
I/O
PA14/JTCK/SWCLK
86
SWDIO
C2
I/O
PA13/JTMS/SWDIO
87
USB_DP
D3
I/O
PA12/USB_DP
88
USB_DM
D2
I/O
PA11/USB_DM
89
USART1_RX
C1
I/O
PA10/USART1_RX
90
USART1_TX
D1
I/O
PA9/USART1_TX
91
TIM15_CH2
F1
I/O
PB15/TIM15_CH2
92
TIM15_CH1
G1
I/O
PB14/TIM15_CH1
93
TIM3_CH4
E2
I/O
PC9/TIM3_CH4
94
TIM3_CH1
F2
I/O
PC6/TIM3_CH1
95
QUADSPI_IO0
F4
I/O
PB1/QUADSPI_BK1_IO0
96
QUADSPI_CLK
H4
I/O
PB10/QUADSPI_CLK
97
QUADSPI_nCS
H3
I/O
PB11/QUADSPI_BK1_NCS; connect to 98 to use internal
serial flash
98
SF_nCS
I/O
Internal serial flash chip select
99
QUADSPI_IO1
H5
I/O
PB0/QUADSPI_BK1_IO1
100
QUADSPI_IO3
H6
I/O
PA6/QUADSPI_BK1_IO3
101
QUADSPI_IO2
E5
I/O
PA7/QUADSPI_BK1_IO2
102-
126
GND
GND
Ground

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4 DC Electrical Specification
4.1 Tx Output Power
The module is compliant to the 3GPP spec for release 13 and rated at a Class 3 device (23 dBm)
4.2 Rx Sensitivity
Table 4-1 Rx Sensitivity
Items
Contents
Min
Typ.
Max
Unit
Frequency Range
LB
703
960
MHz
MB
1710
2170
MHz
Rx Sensitivity
MCS5, BER<5%
-103
dBm
5 Environmental Specification
5.1 Absolute Maximum Rating
Table 5-1 Absolute Maximum Rating
Description
Min
Max
Unit
VDD
-0.3
6
V
PA Stability
6:1
VSWR
5.2 Recommended Operating Condition
Table 5-2 Recommended Operating Condition
Parameter
Min
Max
Unit
Operating Temperature Range
-40
85
°C
VDD
3.3
5.0
V
5.3 Temperature Range
Table 5-3 Temperature Range
Range
Note
Storage temperature range
-40 ºC –85 ºC
Storage and non-operational
Operating temperature range
-40 ºC –85 ºC
Module is fully functional†
-10 ºC –55 ºC
Module is fully functional†and
fully meets 3GPP specification
(†) Functional: the module is able to connect to PDN and transfer data.

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6 Application Information
6.1 Recommended PCB Landing Pattern
The recommended PCB landing pattern is the same as the module footprint, see Figure 3.2.
6.2 External Antenna
The Type 1SE module has a built-in standard u.FL RF connector. To select any external antenna please read the
regulatory information in section 9 Regulatory Information first. Make sure that you pick the antenna that covers the
correct frequency for the appropriate band and make sure 50-Ohm impedance matching.
6.3 Development Kit and Reference Design
The development kit of type 1SE module is jointly developed by Murata and ST Micro Semiconductor. The kit offered by
ST Micro Semiconductor. Please refer to ST Micro B-L462E-CELL1 Discovery Kit and related documents for detail [2].

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7 Assembly Information
The recommendation conditions of soldering are as in the following figure.
When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within
100 °C. Soldering must be carried out by the conditions mentioned above to prevent products from damage. Set up the
highest temperature of reflow within 260 °C. Contact Murata before use if concerning other soldering conditions.
Reflow soldering standard conditions
Figure 7.1 Reflow Profile
Please use the reflow within 2 times.
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
Since this Product is Moisture Sensitive, any cleaning is NOT permitted.

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8 Packaging and Marking Information
8.1 Dimensions of Tape (Plastic tape)
To be added
Figure 8.1 Tape Dimensions (Unit in mm)
8.2 Dimensions of Reel
Figure 8.2 Reel Dimensions (Unit: mm)

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8.3 Taping Diagrams
[1] Feeding Hole : As specified in (1)
[2] Hole for chip : As specified in (1)
[3] Cover tape : 62 um in thickness
[4] Base tape : As specified in (1)
Figure 8.3 Tape Diagram
Feeding Hole
Chip
Feeding Direction
Pin 1 Marking

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8.4 Leader and Tail tape
Figure 8.4 Tape Leader and Tail
The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user.
The cover tape and base tape are not adhered at none components area for 250 mm min.
Tear off strength against pulling of cover tape: 5 N min.
Packaging unit: 500 pcs./ reel
Material:
- Base tape : Plastic
- Reel : Plastic
- Cover tape, cavity tape and reel are made the anti-static processing.
Tail tape
(No components)
40 to 200mm
Components
No components
150mm min.
Leader tape
(Cover tape
alone)
250mm min.
Feeding
direction

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8.5 Peeling Force
1.3 N max. in the direction of peeling as shown below.
Figure 8.5 Peeling Force Diagram
8.6 PACKAGE (Humidity proof Packaging)
Figure 8.6 Packaging Diagram
Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity
indicator.
165 to 180 °
1.3 N max.
Base tape
Cover tape
湿度
イ ン ジケ－タ
乾燥剤
表示ラ べル
防湿梱包袋
表示ラ ベル
Label
Label
Desiccant
Humidity
Indicator
Anti-humidity
Plastic Bag

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8.7 Module Marking Information
Error! Reference source not found. shows the module marking. Dimensions are nominal, not absolute.
Figure 8.7 Module Marking Diagram
8.8 Moisture Sensitivity Level
The LBAD0ZZ1SE is planned to be qualified to moisture sensitivity level 4 (MSL4) in accordance with JEDEC J-STD-020.

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9 Regulatory Information
9.1 FCC Info
This device has Single Modular Approval. This device is approved for mobile and fixed use with respect to RF exposure
compliance and may only be marketed to OEM installers. The antenna(s) used for this transmitter, as described in this
filing, must be installed to provide a separation distance of at least 20 cm from all persons. Installers and end-users must
be provided with operating conditions for satisfying RF exposure compliance. Maximum permitted antenna gain including
cable loss should be determined from tables 8.1 and 8.2. Failure to follow these guidelines will result in radiated RF levels
that exceed FCC MPE limits
9.2 FCC Test Data
Table 9-1 FCC Test Data
Operation
Mode
Freq.
(MHz)
Operation
Distance
(cm)
Conducted
Average
output
power
(dBm)
Max. output
Power include
tolerance
(dBm)
Antenna
Gain
(dBi)
EIRP
(ERP)
Limit
(dBm)
Max.
output
Power
(mW)
Power
Density
(PD)
(mW/cm2)
PD Limit
(mW/cm2)
Allowable
Gain
according to
EIRP (dBi)
Allowable
Gain
according to
PD (dBi)
Max
Allowable
Gain (dBi)
Band 2 1850.7 20 22.80 23.00 10.20 33.00 2089.30 0.416 1.000 10.20 14.01 10.20
Band 4 1710.7 20 22.97 23.00 7.03 30.00 1006.93 0.200 1.000 7.03 14.01 7.03
Band 5 824.7 20 22.46 23.00 11.41 38.45 2762.20 0.550 0.550 15.99 11.41 11.41
Band 12 699.7 20 20.85 23.00 10.70 34.77 2343.53 0.466 0.466 13.92 10.70 10.70
Band 13 779.5 20 20.71 23.00 11.17 34.77 2610.81 0.520 0.520 14.06 11.17 11.17
Band 14 788.1 20 21.51 23.00 11.22 34.77 2639.61 0.525 0.525 13.26 11.22 11.22
Band 17 704.1 20 22.94 23.00 10.73 34.77 2358.27 0.469 0.469 11.83 10.73 10.73
Band 25 1850.7 20 21.11 23.00 11.89 33.00 3083.19 0.614 1.000 11.89 14.01 11.89
Band 26 814.7 20 20.85 23.00 11.36 38.45 2728.70 0.543 0.543 17.60 11.36 11.36
Operation
Mode
Freq.
(MHz)
Operation
Distance
(cm)
Conducted
Average
output
power
(dBm)
Max. output
Power include
tolerance
(dBm)
Antenna
Gain
(dBi)
EIRP
(ERP)
Limit
(dBm)
Max.
output
Power
(mW)
Power
Density
(PD)
(mW/cm2)
PD Limit
(mW/cm2)
Allowable
Gain
according to
EIRP (dBi)
Allowable
Gain
according to
PD (dBi)
Max
Allowable
Gain (dBi)
Band 2 1850.2 20 22.75 23.00 10.25 33.00 2113.49 0.421 1.000 10.25 14.01 10.25
Band 4 1710.2 20 22.92 23.00 7.08 30.00 1018.59 0.203 1.000 7.08 14.01 7.08
Band 5 824.2 20 22.46 23.00 11.41 38.45 2760.52 0.549 0.549 15.99 11.41 11.41
Band 12 699.2 20 23.49 24.00 9.70 34.77 2341.85 0.466 0.466 11.28 9.70 9.70
Band 13 777.2 20 23.43 24.00 10.15 34.77 2603.10 0.518 0.518 11.34 10.15 10.15
Band 17 704.2 20 23.55 24.00 9.73 34.77 2358.60 0.469 0.469 11.22 9.73 9.73
Band 25 1850.2 20 20.85 22.00 12.15 33.00 2600.16 0.518 1.000 12.15 15.01 12.15
Band 26 814.1 20 23.40 24.00 10.36 38.45 2726.69 0.543 0.543 15.05 10.36 10.36
FCC CAT M1
FCC NB IoT

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9.3 ISED Test Data
Table 9-2 ISED Test Data
9.4 List of Applicable FCC Rules
This module complies with below part 22, 24, 27 and 90 of the FCC Rules.
Part 22 Subpart H
Part 24 Subpart 24E
Part 27 Subpart B, C & L
Part 90 R & S
Operation
Mode
Freq.
(MHz)
Operation
Distance
(cm)
Conducted
Average
output
power
(dBm)
Max. output
Power include
tolerance
(dBm)
Antenna
Gain
(dBi)
EIRP
(ERP)
Limit
(dBm)
Max.
output
Power
(mW)
Power
Density
(PD)
(W/m2)
Limit
(W/m2)
Allowable
Gain
according to
EIRP (dBi)
Allowable
Gain
according to
PD (dBi)
Max
Allowable
Gain (dBi)
Band 2 1850.7 20 22.80 23.00 10.20 33.00 2089.30 4.159 4.477 10.20 10.52 10.20
Band 4 1710.7 20 22.97 23.00 7.03 30.00 1006.93 2.004 4.243 7.03 10.29 7.03
Band 5 824.7 20 22.46 23.00 8.12 38.45 1294.74 2.577 2.577 15.99 8.12 8.12
Band 12 699.7 20 20.85 23.00 7.63 34.77 1157.17 2.303 2.303 13.92 7.63 7.63
Band 13 779.5 20 20.71 23.00 7.95 34.77 1245.81 2.480 2.480 14.06 7.95 7.95
Band 17 704.1 20 22.94 23.00 7.65 34.77 1162.14 2.313 2.313 11.83 7.65 7.65
Band 25 1850.7 20 21.11 23.00 10.52 33.00 2249.48 4.477 4.477 11.89 10.52 10.52
Band 26 814.7 20 20.85 23.00 8.09 38.45 1283.99 2.556 2.556 17.60 8.09 8.09
Operation
Mode
Freq.
(MHz)
Operation
Distance
(cm)
Conducted
Average
output
power
(dBm)
Max. output
Power include
tolerance
(dBm)
Antenna
Gain
(dBi)
EIRP
(ERP)
Limit
(dBm)
Max.
output
Power
(mW)
Power
Density
(PD)
(W/m2)
Limit
(W/m2)
Allowable
Gain
according to
EIRP (dBi)
Allowable
Gain
according to
PD (dBi)
Max
Allowable
Gain (dBi)
Band 2 1850.2 20 22.75 23.00 10.25 33.00 2113.49 4.207 4.477 10.25 10.52 10.25
Band 4 1710.2 20 22.92 23.00 7.08 30.00 1018.59 2.027 4.242 7.08 10.29 7.08
Band 5 824.2 20 22.46 23.00 8.12 38.45 1294.20 2.576 2.576 15.99 8.12 8.12
Band 12 699.2 20 23.49 24.00 6.63 34.77 1156.61 2.302 2.302 11.28 6.63 6.63
Band 13 777.2 20 23.43 24.00 6.95 34.77 1243.30 2.475 2.475 11.34 6.95 6.95
Band 17 704.2 20 23.55 24.00 6.65 34.77 1162.25 2.313 2.313 11.22 6.65 6.65
Band 25 1850.2 20 20.85 22.00 11.52 33.00 2249.07 4.477 4.477 12.15 11.52 11.52
Band 26 814.1 20 23.40 24.00 7.08 38.45 1283.34 2.554 2.554 15.05 7.08 7.08
ISED CAT M1
ISED NB IoT