Murata SyChip SN3020 User manual

SyChip SN3020
IEEE802.15.4/ZigBee
Smart Energy Module
User Manual
and Datasheet
Version: 1.0
February 3, 2011
Confidential Information
Note: SyChip, Inc. reserves the right to make changes in specifications at anytime and without notice. The information
furnished in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Sychip for
its use, nor any infringements of patents or other rights of third parties resulting from its use. No license is generated
under any rights of SyChip or its supporters unless specifically agreed.

SyChip/Murata Confidential Page 2 of 26 SN3020 User Manual 1.0
Table of Contents
1SYSTEM DESCRIPTIONS.....................................................................................................................................4
1.1 APPLICATIONS ................................................................................................................................................... 4
1.2 MODULE SUMMARY .......................................................................................................................................... 4
1.3 BLOCK DIAGRAM .............................................................................................................................................. 5
1.4 ACRONYMS........................................................................................................................................................ 5
2MECHANICAL SPECIFICATIONS.....................................................................................................................6
2.1 MODULE DIMENSION ......................................................................................................................................... 6
2.2 MODULE TOP AND SIDE VIEW............................................................................................................................. 6
2.3 MODULE BOTTOM VIEW..................................................................................................................................... 7
2.4 DETAILED MECHANICAL DATA (TOP VIEW) ........................................................................................................ 8
2.5 MODULE PIN-OUT.............................................................................................................................................. 9
3DC ELECTRICAL SPECIFICATIONS..............................................................................................................12
3.1 TYPICAL POWER CONSUMPTION ...................................................................................................................... 12
3.2 DIGITAL IO SPECIFICATION ............................................................................................................................. 12
4RF SPECIFICATIONS..........................................................................................................................................13
5ENVIRONMENTAL SPECIFICATIONS...........................................................................................................14
5.1 ABSOLUTE MAXIMUM RATINGS ....................................................................................................................... 14
5.2 OPERATION CONDITIONS.................................................................................................................................. 14
6APPLICATION INFORMATION........................................................................................................................15
6.1 REFERENCE CONNECTION FOR UART HOST INTERFACE .................................................................................. 15
6.2 REFERENCE CONNECTION FOR THE SPI HOST INTERFACE ................................................................................ 16
6.3 RECOMMENDED HOST (CUSTOMER)CIRCUIT BOARD PCB PATTERN ................................................................ 17
6.4 HOST PCB LAYOUT RECOMMENDATIONS ........................................................................................................ 17
6.5 MODULE LOCATION......................................................................................................................................... 18
6.5.1 Location in x-y plane..................................................................................................................................19
6.5.2 Location in z-plane.....................................................................................................................................19
7ASSEMBLY INFORMATION .............................................................................................................................20
7.1 LEAD-FREE SOLDERING REFLOW PROFILE ........................................................................................................ 20
8PACKAGE INFORMATION ...............................................................................................................................21
8.1 TAPE AND REEL SPECIFICATION ....................................................................................................................... 21
8.2 MODULE MARKING .......................................................................................................................................... 22
9ORDERING INFORMATION .............................................................................................................................23
10 ROHS DECLARATION........................................................................................................................................23
11 REGULATORY INFORMATION.......................................................................................................................23
11.1 FCC NOTICE (USA) ........................................................................................................................................ 23
11.1.1 FCC Labeling Requirements.................................................................................................................24
11.1.2 RF Exposure..........................................................................................................................................24
11.2 IC NOTICE (CANADA)...................................................................................................................................... 25
11.3 CE NOTICE (EUROPE) ...................................................................................................................................... 25
12 TECHNICAL SUPPORT CONTACT .................................................................................................................26
13 REFERENCES.......................................................................................................................................................26

SyChip/Murata Confidential Page 3 of 26 SN3020 User Manual 1.0
List of Figures
FIGURE 1SN3020 MODULE BLOCK DIAGRAM ..................................................................................................................... 5
FIGURE 2MODULE TOP AND SIDE VIEW .............................................................................................................................. 6
FIGURE 3MODULE BOTTOM VIEW ...................................................................................................................................... 7
FIGURE 4DETAILED MECHANICAL DATA (TOP VIEW) .......................................................................................................... 8
FIGURE 5UART HOST INTERFACE REFERENCE DIAGRAM ................................................................................................. 15
FIGURE 6SPI HOST INTERFACE REFERENCE DIAGRAM ...................................................................................................... 16
FIGURE 7RECOMMENDED HOST (CUSTOMER)PCB PATTERN ............................................................................................ 17
FIGURE 8RECOMMENDED HOST CIRCUIT BOARD DESIGN UNDERNEATH THE MODULE .................................................... 18
FIGURE 9RECOMMENDED LOCATIONS IN XY-PLANE .......................................................................................................... 19
FIGURE 10 LOCATIONS NOT RECOMMENDED IN XY-PLANE ................................................................................................ 19
FIGURE 11 RECOMMENDED LOCATIONS IN Z-PLANE........................................................................................................... 19
FIGURE 12 LOCATIONS NOT RECOMMENDED IN XY-PLANE ................................................................................................ 19
FIGURE 13 REFLOW PROFILE PATTERN............................................................................................................................... 20
FIGURE 14 TAPE DIMENSIONS............................................................................................................................................. 21

SyChip/Murata Confidential Page 4 of 26 SN3020 User Manual 1.0
1 System Descriptions
1.1 Applications
SyChip’s SN3020 module is a standard-based wireless transceiver targeting the Smart Energy
market with low power consumption, high transmit power (20 dBm typ.) and high receiver
sensitivity (-103 dBm). It is based upon the IEEE 802.15.4 wireless network specification. The
module can be used to develop applications supporting the ZigBee PRO Smart Energy application
profile. The SN3020 module operates in the 2.4 GHz unlicensed ISM frequency band for
worldwide deployment.
1.2 Module Summary
•Dimensions: 27.20 x 14.75 x 2.90 mm3
•Ember EM357 high-performance, integrated ZigBee/802.15.4 chipset
•Supply voltage: 2.4V to 3.4V
•Data logging memory: 8 Mbits serial flash
•Security: 128-bit AES
•Antenna: on-module
•Host Interface: SPI, UART
•Meter interface: I2C, GPIO
•ADC ports: 6 x 14-bit
•RoHS compliant
•MSL JEDEC level 3

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1.3 Block Diagram
Figure 1 SN3020 Module Block Diagram
1.4 Acronyms
ADC Analog to Digital Converter
AMR Automatic Meter Reading
GPIO General-Purpose Input-Output
I2C Intelligent Interface Controller
ISM Industrial, Scientific and Medical
MAC Medium Access Control
MSL Moisture Sensitivity Level
PER Packet Error Rate
ROHS Restriction of Hazardous Substances
SPI Serial Peripheral Interface
UART Universal Asynchronous Receiver-Transmitter
WPAN Wireless Personal Area Network
Balun
Balun
EM357
(ZigBee IC)
Serial Flash
(
8Mbit
)
PA
LNA
LPF
Antenna
Switch
Connector
SPDT
XTAL
(24MHz)
VREG OUT
(
1.8V
)
GPIO I/F
SPI I/F
UART I/F
nRESET
JTAG

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2 Mechanical Specifications
2.1 Module Dimension
Parameter Typical Units
Dimension (LxWxH) 27.20 x 14.75 x 2.90 mm
Dimension tolerances (LxWxH) ±0.20 x ±0.20 x ±0.15 mm
2.2 Module top and side view
Figure 2 Module Top and Side View

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2.3 Module bottom view
Figure 3 Module Bottom View

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2.4 Detailed mechanical data (top view)
Pin 1 Pin 13
Pin 20
Pin 32
Figure 4 Detailed Mechanical Data (top view)

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2.5 Module Pin-out
Table 1 Module Connector Signal Description
Pin # Pin name I/O Description
1 GND - Ground
2 Reserved O
Internal serial flash on/off control (active low),
for debugging use only
3 PC4/JTMS I/O
Programmable I/O control available to the host,
or
JTAG mode select
4 PB0/IRQA I/O
Programmable I/O control available to the host,
or
an interrupt input
5 Reserved O
Internal serial flash nCS, for debugging use
only
6 PB6/ADC1/IRQB I/O
Programmable I/O control available to the host,
or
ADC input, or
an interrupt input
7 PC1/ADC3 I/O
Programmable I/O control available to the host,
or
an ADC input
8 SWCLK/JTCK I JTAG/Serial Wire debugging port clock
9 PC0/JRST/IRQD I/O
Programmable I/O control available to the host,
or
an interrupt input, or
the JTAG reset input
10 GND - Ground
11 PB5/ADC0 I/O
Programmable I/O control available to the host,
or
an ADC input
12 GND - Ground
13 GND - Ground
14 GND - Ground
15 GND - Ground

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Pin # Pin name I/O Description
16 Reserved I/O Not connected in SN3020.
17 GND - Ground
18 Reserved O
Used internally as the LNA on (active low), for
debugging use only
19 nRESET I Module reset signal (Internal pull-up)
20 GND - Ground
21 GND - Ground
22 PA3 I/O Programmable I/O control available to the host,
23 GND - Ground
24 PC6/OSC32B I/O
Programmable I/O control available to the host,
or
32.768kHZ crystal
25 PC7/OSC32A I/O
Programmable I/O control available to the host,
or
32.768kHz crystal
26 SC1SCLK/PB3 I/O
SPI port 1 clock, or
programmable I/O control available to the host,
27 Reserved O
Used internally as the serial flash MOSI, for
debugging use only
28 Reserved O
Used internally as the serial flash MISO, for
debugging use only
29 VBATT PI Module power supply
30 Reserved O
Used internally as the serial flash clock, for
debugging use only
31 PA4/ADC4 I/O
Programmable I/O control available to the host,
or ADC input
32 GND - Ground
33 PA5/ADC5/nBOOTMODE I/O
Programmable I/O control available to the host,
or
ADC input, or
Boot control, must be left open or pulled
high during the reset to enable the normal
firmware boot process.

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Pin # Pin name I/O Description
34 SC1MISO(s)/
SC1MOSI(m)/TXD/PB1/SC1SDA I/O
SPI port 1 MISO (slave)/ MOSI (master)
signal, UART TXD signal, I2C port 1 DATA
signal, or programmable I/O control
available to the host.
35 SC1MOSI(s)/
SC1MISO(m)/RXD/PB2/SC1SCL I/O
SPI port 1 MOSI (slave)/ MISO (master)
signal, UART RXD signal, I2C port 1 CLK
signal, or programmable I/O control
available to the host.
36 PC2/JTDO/SWO I/O
Programmable I/O control available to the host,
or
Serial Wire port OUTPUT signal, or
JTAG data out
37 SC1nSSEL/PB4 I/O
SPI port 1 slave select, or
programmable I/O control available to the host,
38 PC3/JTDI I/O
Programmable I/O control available to the host,
or
JTAG data in
39 GND - Ground
40 GND - Ground
41 GND - Ground
42 GND - Ground
43 GND - Ground
44 GND - Ground

SyChip/Murata Confidential Page 12 of 26 SN3020 User Manual 1.0
3 DC Electrical Specifications
3.1 Typical Power Consumption
Table 2 Typical Power Consumption
Values
Item Condition
Min Typ Max
Units
Sleep mode VCC = 3.0V, TAMB = 25°C
Internal RC oscillator on
Processor, radio, peripherals off
1.2 µA
Standby mode VCC = 3.0V, TAMB = 25°C
Processor on
Radio and peripherals off
12 mA
Receive mode VCC = 3.0V, TAMB = 25°C
Radio receive chain on
35 mA
Transmit mode
(+20dBm)
VCC = 3.0V, TAMB = 25°C
Radio transmit chain on
175 mA
Serial controller current For each controller at maximum
data rate
0.2 mA
General purpose timer
current
For each timer at maximum clock
rate
0.25 mA
General purpose ADC
current
At maximum sample rate, DMA
enabled
1.1 mA
3.2 Digital IO Specification
VCC = 3.0V, TAMB = 25°C, NORMAL MODE1unless otherwise stated
Table 3 Digital IO Specification
Values
Item Condition Symbol
Min Typ Max
Units
Input current for logic 0 IIL -0.5 µA
Input current for logic 1 IIH 0.5 µA
Low Schmitt switching
threshold
Schmitt input
threshold going
from high to low
VSWIL 0.42 x VCC 0.5 x VCC V
1NORMAL MODE as defined by Ember for EM357.

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High Schmitt switching
threshold
Schmitt input
threshold going
from low to high
VSWIH 0.62 x VCC 0.8 x VCC V
Output voltage for logic 0 IOL = 4mA (8mA)
for standard (high
current) pads
VOL 0 0.18 x VCC V
Output voltage for logic 1 IOH = 4mA
(8mA)for standard
(high current) pads
VOH 0.82 x VCC V
CC V
Output Source Current Standard current
pad IOHS 4 mA
Output Sink current Standard current
pad IOLS 4 mA
Output Source Current High current pad IOHH 8 mA
Output Sink current High current pad IOLH 8 mA
Total output current IOH + IOL 40 mA
4 RF Specifications
VCC = 3.0V, TAMB = 25°C, NORMAL MODE measured at 50Ωterminal load connected to the
RF connector
Table 4 RF Specifications
Parameter Min Typ Max Units
Frequency range 2400 2500 MHz
Receiver sensitivity -103 dBm
Maximum input signal level -20 dBm
Transmitter power at the maximum
setting 2 20 dBm
Adjacent channel rejection 24 dB
Alternate channel rejection 42 dB
Carrier frequency error -40 +40 ppm
2Ember RF output power programmed to -12 by emberSetRadioPower [2] or equivalent under NORMAL mode

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5 Environmental Specifications
5.1 Absolute maximum ratings
Table 5 Absolute Maximum Rating
Symbol Description Min Max Units
Top Operating temperature -40 85 °C
Tst Storage temperature -40 85 °C
Vbatt Power supply -0.3 3.6 V
RFin RF input power 10 dBm
MSL Moisture Sensitivity Level 3
RoHS Restriction of Hazardous Substances Compliant
5.2 Operation conditions
Table 6 Recommended Operating Conditions
Symbol Parameter Min Typ Max Units
Vbatt Power supply 2.4 3.0 3.43V
Top Operating temperature -40 85 °C
3This value is handled by Firmware to meet FCC regulation for modular approval.

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6 Application Information
6.1 Reference connection for UART host interface
Figure 5 illustrates the connections between SN3020 module and the host MCU via UART
interface. A level shifter may be needed if the host UART interface level does not match with
SN3020.
GPIO
RXD
TXD
Host uC
nRESET
TXD
RXD
SN3020
Power supply
Figure 5 UART Host Interface Reference Diagram

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6.2 Reference connection for the SPI host interface
Figure 6 illustrates the connections between SN3020 module and the host MCU via SPI interface.
GPIO
SCLK
SCS
MOSI
MISO
Host uC
nRESET
SC1SCLK
SC1nSSEL
SC1MOSI
SC1MISO
SN3020
Power supply
Figure 6 SPI Host Interface Reference Diagram

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6.3 Recommended host (customer) circuit board PCB pattern
Pin 1 Pin 13
Pin 20Pin 32
Figure 7 Recommended Host (customer) PCB Pattern
6.4 Host PCB layout recommendations
The SN3020 module has an onboard antenna therefore it requires some special host PCB layout
underneath the module such that the radio can achieve its best RF performance. Refer to Figure 8
for the requirements.

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Zone1
Zone2
Antenna
(Layer 1)
GND GND
GND GND
GND
GND
Figure 8 Recommended Host Circuit Board Design underneath the Module
Notes:
1. Due to the surface mount antenna on the module, the area in ‘Zone1’ on all layers of the
customer circuit board should be free of any metal objects. Specifically, there should be no
ground plane, traces, or metal shield case.
2. The area in ‘Zone2’ on the top layer of the customer circuit board should have ground only
with no signal traces.
6.5 Module Location
For optimum EIRP, customer is advised to use the recommended module location on their
respective PCB.

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6.5.1 Location in x-y plane
Antenna Connector
Antenna
Shield Case
No GND in this area (See Fig.8)
Figure 9 Recommended Locations in xy-plane
Figure 10 Locations Not Recommended in xy-plane
6.5.2 Location in z-plane
Antenna Connector Antenna
Metal
Module
Mother Board
Metal
Figure 11 Recommended Locations in z-plane
Metal
Metal
Metal
Figure 12 Locations Not Recommended in xy-plane

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7 Assembly Information
7.1 Lead-free soldering reflow profile
The lead-free solder reflow profile is recommended in the table & graph below. The profile is
used to attach the module to its host PCB.
The module is designed to withstand 2 reflows. Opposite side reflow is prohibited due to the
module weight.
Table 7 Reflow Profile Recommendation
Ramp up rate 3oC/second max
Maximum time maintained above 217oC 120 seconds
Peak temperature 250oC
Maximum time within 5oC of peak temperature 20 seconds
Ramp down rate 6oC/second max
Reflow Profile
0
50
100
150
200
250
Time, seconds
Temperature, C
Figure 13 Reflow Profile Pattern