Murata LBAD0ZZ1SE-743 User manual

Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018
LBAD0ZZ1SE Data Sheet, v1.2, 11/11/2021 Page 1 of 26 www.murata.com
Features
•LTE Cat M1 –Class 3, up to 23dBm
•NB-IoT (NB1) Rel. 13
•STM32L462RE/Cortex M4 w/512KB Flash and 160 KB SRAM
•1MB on-board Serial Flash
•Dimension: 15.4 x 18.0 x 2.5 mm (max)
•Package: LGA
•SIM card: internal eSIM (WLCSP)
•Antenna configurations: U.FL antenna connection
•3GPP eDRX and PSM modes
•Power Consumption: enables up to 10-year battery life
•Operating temperature range: -40 °c to 85 °c
•Global Certifications: GCF and PTCRB
•IPv4/IPv6 stack with TCP and UDP protocol
•SSL/TLS
•LTE universal modem supports (low-band and mid-band):
•Low-band B5/B8/B12/B13/B14(CAT M1 Only)/B17/B18/B19/B20/B26/B28
•Mid-band B1/B2/B3/B4/B25
Benefits
•Certified as a host device for ease of integration with several different types of applications.
•Quicker time to market (no additional carrier or regulatory certification).
•Less development time and costs for developer/device manufacturer in need of LTE Cat M1/NB-loT connectivity
•eSIM included in certification.
•Build/Develop applications with the use of ST's vast set of software modules.
•Availability of ST's Community and Development Forums.
Notice
•This module cannot be used in a smartphone or other wireless telephone or a tablet and any device that is capable of
providing a wireless hotspot for other devices, is capable of providing two-way voice communication.
LBAD0ZZ1SE
LTE CAT
M1/NB-IoT
Module

Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018
LBAD0ZZ1SE Data Sheet, v1.2, 11/11/2021 Page 2 of 26 www.murata.com
Revision History
Revision
Date
Author
Change Description
1.0
10/05/2020
RF PD
Initial release
1.1
02/25/2021
RF PD
Add Introduction section title and include block diagram, acronyms and
reference to this section.
1.2
11/11/2021
RF PD
Add Notice to Page1. Updated 7 Packaging and Marking Information

Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018
LBAD0ZZ1SE Data Sheet, v1.2, 11/11/2021 Page 3 of 26 www.murata.com
Table of Contents
FEATURES............................................................................................................................................................................. 1
BENEFITS............................................................................................................................................................................... 1
NOTICE................................................................................................................................................................................... 1
REVISION HISTORY.............................................................................................................................................................. 2
TABLE OF CONTENTS ......................................................................................................................................................... 3
1INTRODUCTION............................................................................................................................................................0
1.1 Scope......................................................................................................................................................................... 0
1.2 Block Diagram............................................................................................................................................................0
1.3 Acronyms ...................................................................................................................................................................1
1.4 Reference...................................................................................................................................................................1
2MECHANICAL SPECIFICATION .................................................................................................................................. 2
2.1 Module Dimensions....................................................................................................................................................2
2.2 Top and Side View.....................................................................................................................................................2
2.3 PCB Footprint Top View.............................................................................................................................................3
2.4 Pin Configuration........................................................................................................................................................4
3DC ELECTRICAL SPECIFICATION.............................................................................................................................. 7
3.1 Tx Output Power ........................................................................................................................................................7
3.2 Rx Sensitivity.............................................................................................................................................................. 7
4ENVIRONMENTAL SPECIFICATION ........................................................................................................................... 7
4.1 Absolute Maximum Rating.........................................................................................................................................7
4.2 Recommended Operating Condition..........................................................................................................................7
4.3 Temperature Range...................................................................................................................................................7
5APPLICATION INFORMATION..................................................................................................................................... 8
5.1 Recommended PCB Landing Pattern........................................................................................................................ 8
5.2 External Antenna........................................................................................................................................................ 8
5.3 Development Kit and Reference Design....................................................................................................................8
6ASSEMBLY INFORMATION......................................................................................................................................... 9
7PACKAGING AND MARKING INFORMATION..........................................................................................................10
7.1 Dimensions of Tape (Plastic tape)...........................................................................................................................10
7.2 Dimensions of Reel..................................................................................................................................................10
7.3 Taping Diagrams......................................................................................................................................................11
7.4 Leader and Tail tape................................................................................................................................................12
7.5 Peeling Force...........................................................................................................................................................13
7.6 PACKAGE (Humidity proof Packaging) ...................................................................................................................13
7.7 Module Marking Information.....................................................................................................................................14
7.8 Moisture Sensitivity Level.........................................................................................................................................14
8REGULATORY INFORMATION.................................................................................................................................. 15
8.1 FCC Info...................................................................................................................................................................15
8.2 FCC Test Data .........................................................................................................................................................15
8.3 ISED Test Data ........................................................................................................................................................16
8.4 List of Applicable FCC Rules ...................................................................................................................................16

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8.5 Labeling Requirements............................................................................................................................................17
8.6 Additional Testing Requirements.............................................................................................................................17
8.7 Test Modes...............................................................................................................................................................17
9ROHS INFORMATION.................................................................................................................................................18
10 ORDERING INFORMATION........................................................................................................................................ 18
11 NOTICE ........................................................................................................................................................................19
11.1 Storage Conditions...................................................................................................................................................19
11.2 Handling Conditions.................................................................................................................................................19
11.3 Standard PCB Design (Land Pattern and Dimensions)...........................................................................................19
11.4 Notice for Chip Placer..............................................................................................................................................19
11.5 Operational Environment Conditions .......................................................................................................................20
11.6 Input Power Capacity...............................................................................................................................................20
12 PRECONDITIONS TO USE MURATA PRODUCTS ................................................................................................... 21
LIST OF FIGURES
Figure 1 Type 1SE Block Diagram..........................................................................................................................................0
Figure 2.1 Module Top and Side View (Unit: mm)..................................................................................................................2
Figure 2.2 Module Footprint Top View (Unit: mm)..................................................................................................................3
Figure 6.1 Reflow Profile.........................................................................................................................................................9
Figure 7.1 Tape Dimensions (Unit in mm) ............................................................................................................................10
Figure 7.2 Reel Dimensions (Unit in mm).............................................................................................................................10
Figure 7.4 Tape Leader and Tail...........................................................................................................................................12
Figure 7.5 Peeling Force Diagram........................................................................................................................................13
Figure 7.6 Packaging Diagram..............................................................................................................................................13
Figure 7.7 Module Marking Diagram.....................................................................................................................................14
LIST OF TABLES
Table 1-1 Module Specifications.............................................................................................................................................0
Table 2-1: Module Dimensions ...............................................................................................................................................2
Table 2-2 Pinouts....................................................................................................................................................................4
Table 3-1 Rx Sensitivity ..........................................................................................................................................................7
Table 4-1 Absolute Maximum Rating......................................................................................................................................7
Table 4-2 Recommended Operating Condition ......................................................................................................................7
Table 4-3 Temperature Range................................................................................................................................................7
Table 8-1 FCC Test Data......................................................................................................................................................15
Table 8-2 ISED Test Data.....................................................................................................................................................16
Table 10-1 Ordering Information...........................................................................................................................................18

Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018
LBAD0ZZ1SE Data Sheet, v1.2, 11/11/2021 Page 0 of 26 www.murata.com
1 Introduction
1.1 Scope
This product is designed to meet 3GPP Rel-13 specifications.
Table 1-1 Module Specifications
Part Number
LBAD0ZZ1SE
Connectivity
3GPP Release 13/Optimized for LTE Class 3 output power (+23 dBm)
Universal LTE (LB & MB)
Low-band: B5/B8/B12/B13/B14(CAT M1 Only)
/B17/B18/B19/B20/B26/B28
Mid-band: B1/B2/B3/B4/B25
Voltage Input
3.3-5V
Antenna
Off board multi-band antenna
Dimension
15.4 x 18.0 x 2.5 mm (max)
Peripheral Interfaces
GPIO, ADC, I2C, PWM, SPI, UART
Operating Temp
-40° to 85° C
1.2 Block Diagram
Figure 1 Type 1SE Block Diagram

Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018
LBAD0ZZ1SE Data Sheet, v1.2, 11/11/2021 Page 1 of 26 www.murata.com
1.3 Acronyms
- LTE Long Term Evolution
- UART Universal Asynchronous Receiver Transmitter
- eUICC Embedded SIM (Subscriber Identity Module
- LGA Land Grid Array
- BB Baseband
- RFIC Radio Frequency Integrated Circuit
- LB Low Band (699 MHz to 915 MHz frequency range)
- MB Mid Band (1710 MHz to 2025 MHz frequency range)
- PSM Power Save Mode
- eDRX Extended Discontinuous Receive
1.4 Reference
[1] STMicroelectronics, STM32L462CE STM32L462RE STM32L462VE datasheet, May 2018.
[2] STMicroelectronics, B-L462E-CELL1 Discovery Kit for NB/M1 communication Discovery Board, UM2743, User
Manual

Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018
LBAD0ZZ1SE Data Sheet, v1.2, 11/11/2021 Page 2 of 26 www.murata.com
2 Mechanical Specification
2.1 Module Dimensions
Table 2-1: Module Dimensions
Parameter
Typical
Unit
Dimension (L x W x H)
15.4 ±0.2mm x 18.0 ±0.2mm x 2.5 (max)
mm
2.2 Top and Side View
Figure 2.1 Module Top and Side View (Unit: mm)

Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018
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2.3 PCB Footprint Top View
Figure 2.2 Module Footprint Top View (Unit: mm)
Tolerance
Subject
Tolerance(mm)
Product Outline
18.0 ±0.20 ×15.4 ±0.20
Peripheral pin size
0.60 ±0.10 ×0.30 ±0.10
Peripheral pin size（Corner）
0.60 ±0.10 ×0.55 ±0.10
Center pin size（except pin103）
0.80 ±0.10 ×0.80 ±0.10
Location between pin to pin
±0.10
Location between pin to PCB edge
±0.20

Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018
LBAD0ZZ1SE Data Sheet, v1.2, 11/11/2021 Page 4 of 26 www.murata.com
2.4 Pin Configuration
For further detail of the built-in STM32, please refer to the STM32L462CE STM32L462RE STM32L462VE datasheet [1].
Table 2-2 Pinouts
Pin #
Pin Name
STM32L462
Type
Description
1
USART2_RTS
E6
I/O
PA1/USART2_RTS
2
USART2_RX
F6
I/O
PA3/USART2_RX
3
USART2_TX
G7
I/O
PA2/USART2_TX
4
USART2_CTS
H8
I/O
PA0/USART2_CTS
5
VDDA
F7
Power
ADC power; connect to VDD_1V8 if not used
6
VSSA
G8
Power
ADC GND
7
NRST
F8
Reset
Reset STM32
8
NC
No Connect
9
NC
No Connect
10
GPIO_EXTI7
E1
I/O
PC7/GPIO_EXTI7
11
NC_RST_IND
I/O
Reserved for internal usage and testing
12
NC
No Connect
13
NC
No Connect
14
NC
No Connect
15
NC
No Connect
16
RFT_UART2_CTS
I
Recovery UART_CTS
17
RFT_UART2_TX
O
Recovery UART_RX
18
RFT_UART2_RTS
O
Recovery UART_RTS
19
RFT_UART2_RX
I
Recovery UART_TX
20
NC
No Connect
21
NC
No Connect
22
NC
No Connect
23
RFT_UART1_RTS
O
Log UART_RTS
24
RFT_UART1_TX
O
Log UART_TX
25
RFT_UART1_RX
I
Log UART_RX
26
RFT_UART1_CTS
I
Log UART_CTS
27
NC
No Connect
28
GND
GND
GND
29
NC
No Connect
30
NC
No Connect
31
NC
No Connect
32
NC
No Connect
33
NC
No Connect
34
NC
No Connect
35
NC
No Connect

Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018
LBAD0ZZ1SE Data Sheet, v1.2, 11/11/2021 Page 5 of 26 www.murata.com
Pin #
Pin Name
STM32L462
Type
Description
36
NC
No Connect
37
PMU_AT_IN
I
Connect to GND
38
NC
No Connect
39
NC
No Connect
40
NC
No Connect
41
NC
No Connect
42
GND
GND
43
VDD
Power
Power supply for Type1SE
44
VDD
Power
Power supply for Type1SE
45
VDD
Power
Power supply for Type1SE
46
GND
GND
GND
47
NC
No Connect
48
NC
No Connect
49
NC_SIM_CLK
O
SIM clock
50
NC_VSIM
O
SIM power supply
51
GND
GND
GND
52
NC_SIM_DETECT
I
SIM detect
53
NC_SIM_RST
O
SIM reset
54
PH1_OSC_OUT
E8
I/O
PH1/RCC_OSC_OUT
55
PH0_OSC_IN
D8
I/O
PH0/RCC_OSC_IN
56
NC
No Connect
57
NC_SIM_IO
I/O
SIM data
58
ADC1_IN1
D7
I/O
PC0/ADC1_IN1
59
ADC1_IN3
D6
I/O
PC2/ADC1_IN3
60
ADC1_IN2
D5
I/O
PC1/ADC1_IN2
61
ADC1_IN4
E7
I/O
PC3/ADC1_IN4
62
RTC_TAMP1
B8
I/O
PC13/RTC_TAMP1
63
BOOT0
B6
I/O
PH3/BOOT0
64
SF_EN
B5
I/O
PB6/SF_EN
65
RCC_MCO
E3
I/O
PA8/RCC_MCO
66
NC
No Connect
67
NC
No Connect
68
VDD_1V8
Power
Reserved for codec supply/MCU VBAT/MCU VDDA
69
I2C1_SDA
C6
I/O
PB9/I2C1_SDA
70
I2C1_SCL
A6
I/O
PB8/I2C1_SCL
71
VBAT
B7
Power
Backup supply; connect to VDD_1V8 if not used
72
SPI1_SCK
F5
I/O
PA5/SPI1_SCK
73
SPI1_MOSI
C5
I/O
PB5/SPI1_MOSI
74
SPI1_MISO
A4
I/O
PB4/SPI1_MISO/NJTRST
75
SPI1_NSS
A2
I/O
PA15/SPI1_NSS/JTDI