NXP Semiconductors PowerQUICC MPC8308_RDB User manual

©Micetek International Inc., 2009. All rights reserved.
Micetek International Inc.
User’s Guide
The MPC8308_RDB is a system featuring the
PowerQUICC™ processor, MPC8308. This low-cost,
high-performance system solution consists of a printed
circuit board (PCB) assembly plus a software board support
package (BSP) distributed in a CD image. This BSP enables
the fastest possible time-to-market for development or
integration of applications including printer engines,
broadband gateways, no-new-wires home adapters/access
points, and home automation boxes.
This document describes the hardware features of the board
including specifications, block diagram, connectors,
interfaces, and hardware straps. It also describes the board
settings and physical connections needed to boot the
MPC8308_RDB. Finally, it considers the software shipped
with the platform.
When you finish reading this document, you should:
• be familiar with the board layout
• understand the default board configuration and your
board configuration options
• know how to get started and boot the board
• know about the software and further documentation
that supports the board
Document Number: MPC8308RDBUG
Rev. 3, 03/2010
Contents
1 MPC8308_RDB Hardware . . . . . . . . . . . . . . . . . . . . . .3
2 Board-Level Functions . . . . . . . . . . . . . . . . . . . . . . . . .7
3 Connectors, Jumpers, Switches, and LEDs . . . . . . . . .19
4 MPC8308_RDB Board Configuration. . . . . . . . . . . . 26
5 Getting Started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
6 MPC8308_RDB Software . . . . . . . . . . . . . . . . . . . . . .33
7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
WARNING
This is a class A product. In a domestic
environment this product may cause radio
interference in which case the user may be
required to take adequate measures.
PowerQUICC™ MPC8308_RDB User’s
Guide

PowerQUICC™ MPC8308_RDB User’s Guide, Rev. 3
2Micetek International Inc.
Use this manual in conjunction with the following documents:
•MPC8308 PowerQUICC™ II Pro Integrated Communications Processor Family Reference
Manual (MPC8308RM)
•MPC8308 PowerQUICC II Pro Processor Hardware Specifications (MPC8308EC)
•Hardware and Layout Design Considerations for DDR Memory Interfaces (AN2582)
NOTE
The normal function of the product may be disturbed by strong
electromagnetic interference. If so, simply reset the product to resume
normal operation by following the instructions in the manual. If normal
function does not resume, use the product in another location.
This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These limits
are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This
equipment generates, uses, and can radiate radio frequency energy and, if
not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the
user will be required to correct the interference at his/her own expense.

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MPC8308_RDB Hardware
1 MPC8308_RDB Hardware
This section covers the features, block diagram, specifications, and mechanical data of the
MPC8308_RDB.
1.1 Features
• CPU: Freescale MPC8308 running at 400/133 MHz; CPU/coherent system bus (CSB)
• Memory subsystem:
— 128 MByte unbuffered DDR2 SDRAM discrete devices
— 8 MByte NOR flash single-chip memory
— 32 MByte NAND flash memory
— 256 Kbit M24256 serial EEPROM
• Interfaces:
— 10/100/1000 BaseT Ethernet ports:
– eTSEC1, RGMII: one 10/100/1000 BaseT RJ-45 interface using Realtek
™
RTL8211B
single port 10/100/1000 BaseT PHY
– eTSEC2, RGMII: five 10/100/1000 BaseT RJ-45 interfaces using Vitesse
™
VSC7385
5-port L2 Gigabit Ethernet switch
— USB 2.0 port:
– High-speed host/device/OTG USB interface using external ULPI PHY interface by SMSC
USB3300 USB PHY
— PCI Express:
– One mini PCI Express connector supporting half and full size mini PCI Express card
— eSDHC port:
– One SD card connector
— Dual UART ports:
– DUART interface: supports two UARTs up to 115200 bps for console display
— I2C
– I2C connected to Dallas
TM
DS1339 RTC with battery holder and Atmel
TM
AT24C08 Serial
EEPROM
• Freescale MC9S08QG8 MCU (20-MHz HCS08 CPU) for fan control and soft start
— Support for Low Power / Wake on LAN. This can be MCU controlled or logic
• Board Connectors:
— 4 pins Power Jack connector
— Dual RS-232C connectors
— JTAG / COP for debugging
— IEEE® Std. 1588™ signals for test and measurement
— 8 pins SPI header for future expansion
• Form factor:

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MPC8308_RDB Hardware
— Mini-ITX form factor (170 mm x 170 mm, or 6693 mils x 6693 mils)
• 6-layer PCB (4-layer signals, 2-layer power and ground) routing
• Certification
— CE (Class A) / FCC (Class A)
• Lead-Free (RoHS)
Figure 1 shows the MPC8308_RDB block diagram.
Figure 1. MPC8308_RDB Block Diagram
MPC8308
eTSEC2 Vitesse
L2 Switch
RGMII
ULPI SMSC
USB PHY
IEEE1588
eTSEC1 Realtek
PHY
Clock, pulse, etc.
USB
Dual
UART
USB
mini-AB
eSDHC SD card
System Clock
and USB Clock
128 Mbyte
DDR2
8 Mbyte
32-Bit DDR2
Bus
32 Mbyte 8/16-Bit Local
Bus
I
2
C Bus
Real-Time
Clock
Thermal
Sensor
GPIO
Header/
JTAG/COP
Header JTAG/COP
Power Supply
Header/
EEPROM
RGMII
IEEE1588 Test points
Clocks
PCIe
mini PCI
Express
Connector
Test points
SPI
Header
Vitesse
L2 Switch NAND Flash
NOR Flash

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MPC8308_RDB Hardware
1.2 Specifications
Table 1 lists the specifications of the MPC8308_RDB.
Table 1. MPC8308_RDB Specifications
Characteristics Specifications
Power requirements (without add-on card): Typical Maximum
12 V DC 0.5 A
5.0 V DC 1.5 A
Communication processor MPC8308 running @ 400 MHz
Addressing: Total address range
Flash memory (local bus)
DDR2 SDRAM
4 Gbyte (32 address lines)
8 Mbyte with one chip-select
128 Mbyte DDR2 SDRAM
Operating temperature 0
o
C to 70
o
C
Storage temperature –25
o
C to 85
o
C
Relative humidity 5% to 90% (noncondensing)
PCB dimensions:
Length
Width
Thickness
6693 mil
6693 mil
62 mil

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MPC8308_RDB Hardware
1.3 Mechanical Data
Figure 2 shows the MPC8308_RDB dimensions (in mil and [mm]). The board measures 170 mm ×170
mm (6693 mil × 6693 mil) for integration in a mini-ITX chassis.
Figure 2. Dimensions of the MPC8308_RDB

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Board-Level Functions
2 Board-Level Functions
The board-level functions includes reset, external interrupts, clock distribution, DDR SDRAM controller,
local bus controller, I
2
C interfaces, SD memory card interface, USB interface, eTSEC1 and eTSEC2
10/100/1000 BaseT interface, dual RS-232 ports, PCI Express, and COP/JTAG.
2.1 Reset and Reset Configurations
The MPC8308_RDB reset module generates a single reset to the MPC8308 and other peripherals on the
board. The reset unit provides power-on reset, hard reset, and soft reset signals in compliance with the
MPC8308 hardware specification. Figure 3 shows the reset circuitry. Notice the following:
• PORESET (Power-on reset) is generated by the Micrel MIC811 device. When MR is deasserted
and 3.3 V is ready, the MIC811 internal timeout guarantees a minimum reset active time of 150 ms
before PORESET is deasserted. This circuitry guarantees a 150 ms PORESET pulse width after
3.3 V reaches the right voltage level, and this meets the specification of the PORESET input of
MPC8308. Push button reset interfaces the MR signal with debounce capability to produce a
manual master PORESET
• PORESET (Power-on reset) is optionally generated by the MC9S08 MCU device by monitoring
the 3.3V voltage level
• HRESET (Hard reset) is generated either by the MPC8308 or the COP/JTAG port.
• COP/JTAG port reset provides convenient hard-reset capability for a COP/JTAG controller. The
HRESET line is available at the COP/JTAG port connector. The COP/JTAG controller can directly
generate the hard-reset signal by asserting this line low. The arrangement shown in Figure 3 allows
the COP to independently assert HRESET or TRST, while ensuring that the MPC8308 can drive
HRESET as well.

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Board-Level Functions
Figure 3. Reset Circuitry of the MPC8308
2.2 External Interrupts
Figure 4 shows the external interrupt circuitry to the MPC8308.
Figure 4. MPC8308 Interrupt Circuitry
Following are descriptions of the interrupt signals shown in Figure 4:
MIC811
MR
Push Button
GND
COP_HRESET
COP_TRST
PORESET
NAND FLASH
mini-PCIe
MPC8308_HRESET
Vitesse VSC7385
MC9S08
Optional MCU PORESET
RTL8211B PHYs
COP
MPC8308_TRST
MPC8308_PORESET
MPC8308
TSEC1_IRQ
(RTC_IRQ)
USB_IRQ
L2_IRQ0
L2_IRQ1
THERM_IRQ
IRQ1
IRQ3
IRQ4
(MCU_IRQ)
IRQ0

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Board-Level Functions
• All external interrupt signals are pulled up by 4.7 K resistors.
• MCU interrupt (MCU_IRQ), RTC interrupt (RTC_IRQ) and Thermal interrupt (THERM_IRQ).
The MCU and DS1339 RTC interrupts are ANDed the thermal interrupt. However, MCU interrupt
is the main function for this IRQ pin. RTC and thermal interrupt are optional so they are
disconnected from the AND gate by default.
• PHY interrupt (TSEC1_IRQ). The RTL8211B GBE PHY interrupt is connected to IRQ1 of the
MPC8308. Therefore, the system software can detect the status of the Ethernet link and the PHY
internal status.
• USB over current (USB_IRQ). The USB power supply have an over current detection circuit and
generate an interrupt when the current limit reaches (2A) or a thermal shutdown or under voltage
lockout (UVLO) condition occurs. It is connected to IRQ3 of the MPC8308.
• L2 Switch (VSC7385) interrupt (L2_IRQ1, L2_IRQ0). The L2 Switch (VSC7385) has two IRQs
that are ANDed together to generate an interrupt to the MPC8308E via the IRQ4 signal.

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Board-Level Functions
2.3 Clock Distribution
Figure 5 and Table 2 show the clock distribution on the MPC8308_RDB.
Figure 5. MPC8308_RDB Clock Scheme
MPC8308
DDR2 SDRAM
CLK
LCLKx
MCK1
MCK2
133 MHz
local bus
DLL
DDR
DLL
33.333 MHz
OSC
CLKIN
System
PLL
125MHz
OSC
TSEC2_GTX_CLK125
PCIE
CLK GEN
25MHz
OSC
SD_REF_CLK
SD_REF_CLK#
mini PCIe
Slot
PCIe/
Serdes
eTSEC2
ULPI USB
GND GND
24 MHz
Crystal
PHY
RTL8211B
GBE PHY
GND GND
25 MHz
Crystal
VSC7385
50MHz
VCXO
IEEE1588
DS1339
RTC
GND
32.768 kHz
Crystal
MC9S08
MCU
GND GND
32.768 kHz
Crystal
GND
Not use
125MHz
OSC
TSEC1_GTX_CLK125 eTSEC1
dotted line is optional which might not
be available
L2 Switch
25MHz
OSC