NXP Semiconductors RD9Z1-638BJBEVM User manual

UM11396
RD9Z1-638BJBEVM Reference Design
Rev. 1 — 15 April 2020 User manual
RD9Z1-638BJBEVM
Figure 1. RD9Z1-638BJBEVM
Important Notice
NXP provides the enclosed product(s) under the following conditions:
This reference design is intended for use of ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY. It is provided as a
sample IC pre-soldered to a printed circuit board to make it easier to access inputs, outputs, and supply terminals. This reference design
may be used with any development system or other source of I/O signals by simply connecting it to the host MCU or computer board via
off-the-shelf cables. Final device in an application will be heavily dependent on proper printed circuit board layout and heat sinking design
as well as attention to supply filtering, transient suppression, and I/O signal quality.
The goods provided may not be complete in terms of required design, marketing, and or manufacturing related protective considerations,
including product safety measures typically found in the end product incorporating the goods. Due to the open construction of the product,
it is the user's responsibility to take any and all appropriate precautions with regard to electrostatic discharge. In order to minimize risks
associated with the customers applications, adequate design and operating safeguards must be provided by the customer to minimize
inherent or procedural hazards. For any safety concerns, contact NXP sales and technical support services.
Should this reference design not meet the specifications indicated in the kit, it may be returned within 30 days from the date of delivery and
will be replaced by a new kit.
NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation or
guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the
application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or
incidental damages. Typical parameters can and do vary in different applications and actual performance may vary over time. All operating
parameters, including Typical, must be validated for each customer application by customer’s technical experts.
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for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or
for any other application in which the failure of the NXP product could create a situation where personal injury or death may occur.
Should the Buyer purchase or use NXP products for any such unintended or unauthorized application, the Buyer shall indemnify and hold
NXP and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and
reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or
unauthorized use, even if such claim alleges NXP was negligent regarding the design or manufacture of the part.

NXP Semiconductors UM11396
RD9Z1-638BJBEVM Reference Design
UM11396 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
User manual Rev. 1 — 15 April 2020
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1 Introduction
This user manual is intended for engineers who use the RD9Z1-638BJBEVM reference
design kit to analyze and test designs that are built around NXP's MM9Z1_638 intellegent
battery sensor device. The user manual provides all of the information required to use
the reference design kit, including connecting the hardware, installing the associated
software tools and configuring the evaluation environment.
2 Finding Kit Resources and Information on the NXP Web Site
NXP Semiconductors provides online resources for this evaluation board and its
supported devices on http://www.nxp.com.
The tool summary page for the RD9Z1-638BJBEVM reference design is at http://
www.nxp.com/RD9Z1-638BJBEVM. The tool summary page provides information related
to buying and using the reference design kit. The page contains the following tabs:
•Overview – A brief summary of the reference design kit and its capabilities
•Specifications – An overview of the technical and functional specifications for the kit
•Buy – Purchasing information and a review of the reference design kit contents
•Design Resources – All of the information and resources required by users who have
already purchased the RD9Z1-638BJBEVM reference design. This section includes:
–RD9Z1-638BJBEVM - Getting Started – Click on this link for information on setting up
the hardware, configuring the software and running an evaluation.
–Schematics – Click on this link to download a .pdf version of the RD9Z1-638BJBEVM
board schematics.
–Design Files/BOM – Click on this link to download the RD9Z1-638BJBEVM board Bill
of Materials, the Gerber files for the PCB assemblies and all of the design files for the
CodeWarrior projects provided as examples.
2.1 Collaborate in the NXP community
The NXP community is for sharing ideas and tips, asking and answering technical
questions and receiving input on various embedded design topics.
The NXP community is at http://community.nxp.com.
3 Getting Ready
Aside from the kit contents, working with the RD9Z1-638BJBEVM reference design
requires additional hardware and software installed on a Windows PC workstation.
3.1 Kit contents
The RD9Z1-638BJBEVM reference design kit contains the following items:
•Evaluation board in an antistatic bag
•10-pin high-voltage connector cable
•7-pin high-voltage connector cable
•5-pin high-voltage connector cable
•4-pin low-voltage connector cable
•Quick Start Guide

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RD9Z1-638BJBEVM Reference Design
UM11396 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
User manual Rev. 1 — 15 April 2020
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3.2 Additional hardware
In addition to the kit contents, the following hardware components are required to support
an evaluation.
•USB-enabled PC Workstation with Windows 7 or above
•Low-voltage DC power supply, 5 V to 12 V output with current limit set initially to 1.5 A
•High-voltage DC power supply, 0 V to 1000 V output
•Current load, 0 A to 500 A
•CAN card and cable (optional)
•PEmicro's Multilink Universal Debug Probe
3.3 Windows PC workstation
This evaluation board must be connected to a PC workstation running 32-bit and 64-bit
versions of Windows 7 or above.
3.4 Software
Using the RD9Z1-638BJBEVM board requires that the software listed below be
installed on the PC workstation. The reference design projects are available on the
RD9Z1-638BJBEVM tool summary page at http://www.nxp.com/RD9Z1-638BJBEVM.
•Codewarrior 10.2 or above
•The RD9Z1-638BJBEVM reference design projects
4 Getting to Know the Hardware
The RD9Z1-638BJBEVM reference design kit provides a platform for evaluating designs
that implement NXP’s MM9Z1_638 Battery Monitoring System device. It connects
to a power distribution unit (PDU) and enables voltage sensing, current sensing,
temperature sensing and diagnostics of the contactor status. The kit supports evaluations
in conjunction with a CAN network and is ideal for prototyping High-Voltage Battery
Junction Box (HV-BJB) systems.
4.1 RD9Z1-638BJBEVM features
•Power supply input from 5 VDC to 12 VDC
•Up to seven voltage sensing channels for high-voltage measurements
•One current sensing channel to measure charge current and discharge current
•One temperature sensing channel to measure shunt resistor temperature for calibration
•Integrated insulation resistance measurement
•One channel isolated CAN communication to BMU/VCU

NXP Semiconductors UM11396
RD9Z1-638BJBEVM Reference Design
UM11396 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
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4.2 Block diagram
aaa-037026
50 µΩ
NTC
Main_Neg
HV connector
HV connector
VSENSE0
VSENSE1
VSENSE2
F
G
H
VSENSE3
TX
RX
OPTO-MOS
OPTO-MOS
OPTO-MOS
PT
B1
PT
B
0
PT
B
3
PT
B
2
LDO REG
TJA1052I
VDDX
VDDX
VSUP +5 V/+12 V from BMU
GND from BMU
CAN_H
CAN_L
LINK-
VCC
VCC
GND
VCCA
AGND
DGND
I+
PTB4
PTB5
I-
HV connector
HV_BAT_PACK
LV connector
MM9Z1_638
Pre-charge
Pre-charge R
Main_Pos
PDU_FUSE
Charger_Pos Relay
D
A B C
E
·
·
·
·
·
·
LINK+
FC+/SC+
HV Domain LV DomainPUD/BDU
SYSTEM
OUTLINE
Figure 2. RD9Z1-638BJBEVM block diagram

NXP Semiconductors UM11396
RD9Z1-638BJBEVM Reference Design
UM11396 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
User manual Rev. 1 — 15 April 2020
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4.3 Board components
Figure 3. RD9Z1-638BJBEVM board components
Table 1. RD9Z1-638BJBEVM board components
No. Label Device Description Features
1 U1 MM9Z1_638 Intelligent
Battery
Sensor
•Wide range of battery current measurements;
On-chip temperature measurement
•Four battery voltage measurements with
internal resistor dividers; Up to five direct
voltage measurements for use with an external
resistor divider
•Measurement synchronization between voltage
channels and current channels
•Five external temperature sensor inputs with
an internal supply for external sensors
•Low-power modes with low-current operation
•Multiple wake-up sources: LIN, timer, high-
voltage input, external CAN interface, and
current threshold and integration
•Precision internal oscillator and connections for
external crystal
•LIN 2.2/ 2.1/ 2.0 protocol and physical interface
•msCAN protocol controller and supply
capability for 8 and 14 pin CAN interfaces
•MM9Z1_638: S12Z microcontroller
2 J6 High-voltage
connector 2
1x7 power
plug
connector
See Table 5

NXP Semiconductors UM11396
RD9Z1-638BJBEVM Reference Design
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User manual Rev. 1 — 15 April 2020
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No. Label Device Description Features
3 J8 High-voltage
connector 1
1x5 power
plug
connector
See Table 4
4 JP1 High-voltage
connector 3
1x10
power plug
connector
See Table 6
5 U46
−U50
Panasonic
AQV258HAX
MOSFET
relay
NA
6 T2 TI SN6501
QDBVRQ1
Push-
pull driver
for small
transformers
AEC-Q qualified
7 U5 TI 760390015 PMIC
transformer
driver
AEC-Q qualified
8 J7 Low-voltage
connector
1x4 power
plug
connector
See Table 3
9 L1 EPCOS/TDK
B82789C
0104N002
Power line
choke
AEC-Q qualified
10 U3 NXP
TJA1052IT/5Y
High-
speed CAN
transceiver
•Isolator and Transceiver integrated into a
single SO16 package, reducing board space
•ISO 11898-2:2003 compliant
•Flawless cooperation between the Isolator and
the Transceiver
–Fewer components improves reliability in
applications
–Guaranteed performance (eg. max loop
delay <220 ns)
•Electrical transient immunity of 45 kV/μs (typ)
•AEC-Q100 qualified
•Suitable for use in 12 V and 24 V systems;
compatible with 3 V to 5 V microcontrollers
•Bus common mode voltage (Vcm) = ±25 V
•Low Electro Magnetic Emission (EME) and
high Electro Magnetic Immunity (EMI)
•Dark green product (halogen free and
Restriction of Hazardous Substances (RoHS)
compliant)
11 TP89,
TP90,
TP91
NA Test points See Table 7
12 J1 Connector BDM
connector
Connector for PEMicro's Multilink Debug Probe
(See Table 2)
13 NA NA Shunt Current measurement shunt

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RD9Z1-638BJBEVM Reference Design
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4.4 Connectors
The RD9Z1-638BJBEVM board has five user-accessible connectors. Table 2 – Table 6
describe the pin functions for each connector.
Table 2. BDM Connector (J1)
Pin Signal name Description
J1_1 BKGD Connects to MM9Z1_638 BKGD pin to support background debug
communication
J1_2 Ground Low-voltage ground
J1_3 NC Not connected
J1_4 RESET Connects to MM9Z1_638 RESET pin
J1_5 NC Not connceted
J1_6 VDDX Connects to MM9Z1_638 VDDX pin for 5.0 V and External CAN
Supply
Table 3. Low-voltage connector (J7)
Pin Signal name Description
J7_1 CAN-H Connects to CAN communication cable
J7_2 CAN-L Connects to CAN communication cable
J7_3 +12V_LV Low-voltage power supply (5 V to 12 V)
J7_4 GND_LV Low-voltage ground
Table 4. High-voltage connector 1 (J8)
Pin Signal name Description
J8_1 Ground High-voltage ground
J8_2 NC Not connected
J8_3 NC Not connected
J8_4 NC Not connected
J8_5 Main Neg- Main negative contactor
Table 5. High-voltage connector 2 (J6)
Pin Signal name Description
J6_1 VSENSE2_HV High-voltage connection to MM9Z1_638 VSENSE2 precision battery
input pin
J6_2 NC Not connected
J6_3 NC Not connected
J6_4 VSENSE1_HV High-voltage connection to MM9Z1_638 VSENSE1 precision battery
input pin
J6_5 NC Not connected

NXP Semiconductors UM11396
RD9Z1-638BJBEVM Reference Design
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User manual Rev. 1 — 15 April 2020
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Pin Signal name Description
J6_6 NC Not connected
J6_7 VSENSE0_HV High-voltage connection to MM9Z1_638 VSENSE0 precision battery
input pin
Table 6. High-voltage connector 3 (JP1)
Pin Signal name Description
JP1_1 HV+ High-voltage pack+
JP1_2 NC Not connected
JP1_3 NC Not connected
JP1_4 PTB1_HV High-voltage connection to MM9Z1_638 PTB1 analog input and
general purpose I/O pin
JP1_5 NC Not connected
JP1_6 NC Not connected
JP1_7 PTB2_HV High-voltage connection to MM9Z1_638 PTB2 analog input and
general purpose I/O pin
JP1_8 NC Not connected
JP1_9 NC Not connected
JP1_10 PTB3_HV High-voltage connection to MM9Z1_638 PTB3 analog input and
general purpose I/O pin
4.5 Test points
The RD9Z1-638BJBEVM board has three test points. Table 7 describes the function of
each test point.
Table 7. Test points
Label Signal name Description
TP89 VSUP Test point for power supply connection. In conjunction with TP90,
serves as test point for power supply connected to MM9Z1_638
TP90 Ground Test point for ground connection. In conjunction with TP89, serves
as test point for ground connected to MM9Z1_638
TP91 PA3 Test point for connection to MM9Z1_638 PA3 general purpose port
A
4.6 Configuring the hardware for setup using the RD9Z1-638BJBEVM
board
This section describes how to configure the hardware required to use the
RD9Z1-638BJBEVM board in an evaluation environment.

NXP Semiconductors UM11396
RD9Z1-638BJBEVM Reference Design
UM11396 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
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Figure 4. Hardware configuration
4.6.1 Connecting to the battery junction box
Batteries are connected to the board by means of the metal current shunt mounted on
the board.
1. Connect the negative pole of the HV Battery Junction Box to one side of the board's
metal shunt.
2. Connect the positive pole of the HV Battery Junction Box to the other side of the
board's metal shunt.
4.6.2 Configuring the high-voltage domain
Configuring the kit's high-voltage components consists of the following steps.
1. Open high-voltage connector 1 (J8) on the RD9Z1-638BJBEVM board and attach the
5-pin connector cable as follows:
•Connect J8_1 to the HV ground.
•Connect J8_5 to the sensing position E.
2. Open high-voltage connector 2 (J6) on the RD9Z1-638BJBEVM board and attach the
7-pin connector cable as follows:
•Connect J6_1 to high-voltage sensing position F.
•Connect J6_4 to high-voltage sensing position G.
•Connect J6_7 to high-voltage sensing position H.
3. Open high-voltage connector 3 (JP1) ) on the RD9Z1-638BJBEVM board and attach
the 10-pin connector cable as follows:
•Connect JP1_1 to high-voltage sensing position A.
•Connect JP1_4 to high-voltage sensing position B.

NXP Semiconductors UM11396
RD9Z1-638BJBEVM Reference Design
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•Connect JP1_7 to high-voltage sensing position C.
•Connect JP1_7 to high-voltage sensing position D.
4.6.3 Configuring the low-voltage domain
The low-voltage domain consists of a low-voltage power supply connected to the
RD9Z1-638BJBEVM board's low-voltage connector (J7). Note that two of the pins in the
low-voltage connector are reserved for the CAN connection.
1. Open low-voltage connector (J7) on the RD9Z1-638BJBEVM board and attach the 4-
pin connector cable as follows:
•The first two terminals of the 4-pin cable are reserved for connecting to a CAN
network. See Section 6 "Setting up a CAN GUI (Optional)" below.
•Using the third terminal on the cable, connect J7_3 to the low-voltage power supply.
•Using the fourth terminal on the cable, connect J7_4 to the low-voltage ground.
4.6.4 Connecting to the PC
Configuring the appropriate connections to link the evaluation environment to the PC
workstation consists of the following steps:
1. Connecting the PEmicro Multilink Universal Debug Probe
•Open the probe cover and attach PEmicro's six-pin ribbon cable to the probe’s six-
pin header (Port C).
•Plug the other end of the 6-pin cable into the RD9Z1-638BJBEVM board’s BDM
connector (J1).
•Plug the PEmicro's USB cable into the PEmicro Universal Debug Probe’s USB port
and connect the other end of the cable to a USB port on the PC workstation.
2. Connecting the CAN card (Optional)
•Using the 4-pin cable, connect the cable’s first terminal to pin J7_1 on the
RD9Z1-638BJBEVM board’s low-voltage connector (J7). Connect the other end of
this line to the CANH connection on the CAN card.
•Connect the 4-pin cable’s second terminal to pin J7_2 on the evaluation board’s
low-voltage connector. Connect the other end of this line to the CANL connection on
the CAN card.
•Connect the CAN card to the PC workstation.
5 Installing the Software
The following section describes how to install and configure the Codewarrior Integrated
Development Envionment (IDE) software required to run the demonstration examples
and to exercise the RD9Z1-638BJBEVM in an evaluation environment.
5.1 Installing CodeWarrior
NXP's CodeWarrior provides an integrated environment that brings together all of the
software resources and capabilites requried to use the RD9Z1-638BJBEVM reference
design kit. If a previous version of CodeWarrior exists on the PC attached to the
RD9Z1-638BJBEVM board, check to assure that the version is at least 10.2 or later. If
CodeWarrior has not been installed, the following steps describe the installation process.
1. Go to http://www.nxp.com and navigate to the CodeWarrior Development Tools site.