Olympus BondMaster 600 User manual

DMTA-10045-01EN — Rev. E
August 2016
BondMaster 600
Composite Bond Tester
User’s Manual
This instruction manual contains essential information on how to use this Olympus product safely and effectively.
Before using this product, thoroughly review this instruction manual. Use the product as instructed.
Keep this instruction manual in a safe, accessible location.

Olympus Scientific Solutions Americas, 48 Woerd Avenue, Waltham, MA 02453, USA
Copyright © 2014, 2015, 2016 by Olympus. All rights reserved. No part of this publication
may be reproduced, translated, or distributed without the express written permission of
Olympus.
This document was prepared with particular attention to usage to ensure the accuracy of the
information contained therein, and corresponds to the version of the product manufactured
prior to the date appearing on the title page. There could, however, be some differences
between the manual and the product if the product was modified thereafter.
The information contained in this document is subject to change without notice.
Part number: DMTA-10045-01EN
Rev. E
August 2016
Printed in the United States of America
SD, miniSD, and microSD Logos are trademarks of SD-3D, LLC.
All brands are trademarks or registered trademarks of their respective owners and third
party entities.

DMTA-10045-01EN, Rev. E, August 2016
Table of Contents iii
Table of Contents
List of Abbreviations ....................................................................................... ix
Labels and Symbols ........................................................................................... 1
Important Information — Please Read Before Use ..................................... 5
Intended Use .......................................................................................................................... 5
Instruction Manual ................................................................................................................ 5
Instrument Compatibility ..................................................................................................... 6
Repair and Modification ....................................................................................................... 6
Safety Symbols ....................................................................................................................... 7
Safety Signal Words ............................................................................................................... 7
Note Signal Words ................................................................................................................. 8
Safety ....................................................................................................................................... 9
Warnings ................................................................................................................................. 9
Battery Precautions .............................................................................................................. 10
Hearing Protection .............................................................................................................. 11
Equipment Disposal ............................................................................................................ 11
CE (European Community) ............................................................................................... 12
WEEE Directive .................................................................................................................... 12
China RoHS .......................................................................................................................... 12
Korea Communications Commission (KCC) ................................................................... 13
EMC Directive Compliance ................................................................................................ 14
FCC (USA) Compliance ...................................................................................................... 14
ICES-001 (Canada) Compliance ........................................................................................ 14
Warranty Information ......................................................................................................... 15
Technical Support ................................................................................................................ 15
Introduction ...................................................................................................... 17

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Table of Contents iv
1. Package Contents ....................................................................................... 19
1.1 Unpacking .................................................................................................................. 19
1.2 Initial Inspection ........................................................................................................ 19
1.3 Contents of the Case ................................................................................................. 20
2. Overview of the BondMaster 600 ............................................................ 23
2.1 Operating Principle and Test Techniques .............................................................. 23
2.2 Connectors ................................................................................................................. 25
2.3 Power Requirements ................................................................................................. 28
2.3.1 Charger/Adaptor ............................................................................................ 29
2.3.2 Battery Compartment .................................................................................... 32
2.3.3 Lithium-Ion Battery ....................................................................................... 34
2.3.4 Alkaline Batteries ........................................................................................... 35
2.4 MicroSD Card Installation ....................................................................................... 36
2.5 BondMaster 600 Hardware Features ...................................................................... 37
2.5.1 Hardware Overview ...................................................................................... 38
2.5.1.1 Front Panel and SmartKnob ............................................................... 39
2.5.1.2 Keypad .................................................................................................. 40
2.5.2 Connectors ....................................................................................................... 45
2.5.2.1 PROBE Connector ............................................................................... 45
2.5.2.2 Input/Output and VGA OUT Connectors ....................................... 46
2.5.2.3 MicroSD and USB Port ....................................................................... 47
2.5.3 Various Hardware Features .......................................................................... 48
2.5.3.1 BondMaster 600 Stand ........................................................................ 49
2.5.3.2 O-Ring Gasket and Membrane Seals ................................................ 49
2.5.3.3 Display Protection ............................................................................... 50
2.5.4 Environmental Ratings .................................................................................. 50
3. Software User Interface ............................................................................ 51
3.1 Starting Up the BondMaster 600 ............................................................................. 51
3.1.1 Navigating the Application Menu ............................................................... 53
3.1.2 Main Inspection Screen ................................................................................. 53
3.2 Selecting from the Menus ........................................................................................ 55
3.3 Displaying All Parameters Simultaneously—ALL SETTINGS Menu .............. 56
3.3.1 Using the ALL SETTINGS Menu ................................................................. 57
3.3.2 Special Functions in the ALL SETTINGS Menu ........................................ 57
3.4 Displaying Real-Time Readings ............................................................................. 58
3.4.1 Enabling Real-Time Readings on the Main Inspection Screen ................ 59
3.4.2 Enabling Real-Time Readings in Full-Screen Mode
— FULL NEXT Key ........................................................................................ 60

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Table of Contents v
4. Initial Setup ................................................................................................ 63
4.1 Setting the User Interface Language and Decimal Symbol ................................ 63
4.2 Setting the Clock ....................................................................................................... 64
4.3 Changing the Display Settings ................................................................................ 65
4.4 Changing the Display Brightness ........................................................................... 65
4.5 Adjusting Auto Erase ............................................................................................... 66
4.6 Selecting the Startup Screen .................................................................................... 67
4.7 Activating the Crosshairs ........................................................................................ 67
5. Control Functions ...................................................................................... 69
5.1 PowerLink .................................................................................................................. 69
5.2 BondMaster 600 Controls ........................................................................................ 70
5.2.1 Display ............................................................................................................. 70
5.2.2 Power and Lock Buttons ............................................................................... 71
5.2.3 Function Keys ................................................................................................. 71
5.2.4 Menu Keys ...................................................................................................... 71
5.2.5 SmartKnob ...................................................................................................... 72
5.2.6 Hidden Function — Screen Capture ........................................................... 72
5.3 Modes and Menus .................................................................................................... 73
5.3.1 PC RF Mode — MAIN Menu ....................................................................... 73
5.3.2 PC Swept Mode — MAIN Menu ................................................................. 78
5.3.3 MIA Mode — MAIN Menu .......................................................................... 81
5.3.4 RESON Mode — MAIN Menu .................................................................... 83
5.3.5 PC RF Mode — DISP/DOTS Menu .............................................................. 84
5.3.6 PC Swept Mode — DISP/DOTS Menu ....................................................... 90
5.3.7 MIA Mode — DISP/DOTS Menu ................................................................ 91
5.3.8 RESON Mode — DISP/DOTS Menu ........................................................... 92
5.3.9 PC RF Mode — ALARM Menu in RF RUN ............................................... 93
5.3.10 PC RF Mode — ALARM Menu in RF+XY and XY RUN ......................... 96
5.3.11 PC RF Mode — ALARM Menu in XY-SCAN and XY RUN .................... 96
5.3.12 PC Swept Mode — ALARM Menu ............................................................. 96
5.3.12.1 Changing BOX Alarm Parameters in PC Swept Mode .................. 99
5.3.12.2 Changing SECTOR Alarm Parameters in PC Swept Mode ........ 100
5.3.12.3 Changing CIRCLE Alarm Parameters in PC Swept Mode ......... 101
5.3.12.4 Changing Spectrum Alarm Parameters in PC Swept Mode ....... 102
5.3.13 MIA Mode — Alarm Menu ........................................................................ 103
5.3.14 RESON Mode — Alarm Menu ................................................................... 105
5.3.15 MEM Menu ................................................................................................... 106
5.3.16 Memory Text Editor ..................................................................................... 109
5.3.17 Advanced Setup Menu — ADV SETUP Menu Key ................................ 112

DMTA-10045-01EN, Rev. E, August 2016
Table of Contents vi
6. Applications .............................................................................................. 121
6.1 Common BondMaster 600 Applications .............................................................. 122
6.1.1 Detecting Skin-to-Core Disbonds in Honeycomb Composite
— Flat or Constant Geometry Using PC RF or IMPULSE Techniques . 122
6.1.2 Detecting Skin-to-Core Disbonds in Honeycomb Composite
— Tapered or Varying Geometry Using PC Swept Technique .............. 133
6.1.3 Detecting Smaller Disbonds in Honeycomb Composite
— Mechanical Impedance Analysis (MIA) Technique ........................... 137
6.1.4 Detecting Repaired Areas (Potting) in Honeycomb Composite
— Mechanical Impedance Analysis (MIA) Technique ........................... 142
6.1.5 Inspecting Metal-to-Metal Bonds — Resonance Technique ................... 147
6.1.6 Detecting Interply Delamination in Composites
— General Procedure Using Resonance Technique ................................ 153
6.2 Advanced Guide for OEM Procedure and Application Development Using
the BondMaster 600 ................................................................................................ 160
6.2.1 Analyzing Frequency Response in Honeycomb Composite —
Selecting the Best Inspection Frequency Using PC Swept Technique .. 160
6.2.2 Finding the Best Frequency to Inspect Honeycomb Composite
— Mechanical Impedance Analysis (MIA) Technique ........................... 166
7. BondMaster PC Software ....................................................................... 173
7.1 USB Communication .............................................................................................. 173
7.2 Screen Capture Using BondMaster PC ................................................................ 173
7.3 Instrument Software Upgrade .............................................................................. 175
7.4 PDF Creation ........................................................................................................... 178
7.5 Commands ............................................................................................................... 180
7.6 Remote Control ....................................................................................................... 194
7.7 File Manager ............................................................................................................ 196
7.8 Unlock Options ....................................................................................................... 200
7.9 Backup ...................................................................................................................... 201
7.10 Restore ...................................................................................................................... 203
8. Maintenance and Troubleshooting ...................................................... 207
8.1 Lithium-Ion Battery ................................................................................................ 207
8.2 Probe Care and Diagnostics .................................................................................. 208
Appendix A: Specifications ......................................................................... 209
A.1 General and Environmental Specifications ......................................................... 209
A.2 Input/Output Specifications .................................................................................. 211
A.3 Bond Testing Specifications ................................................................................... 213
A.4 Pitch-Catch Tone Burst and Swept Mode Specifications .................................. 214

DMTA-10045-01EN, Rev. E, August 2016
Table of Contents vii
A.5 Mechanical Impedance Analysis and Resonance Mode Specifications .......... 216
A.6 Alarms, Connectivity, and Memory Specifications ............................................ 217
A.7 Interface Specifications .......................................................................................... 218
Appendix B: Accessories, Replacement Parts, and Upgrades ............... 221
List of Figures ................................................................................................. 225
List of Tables ................................................................................................... 231
Index ................................................................................................................. 233

DMTA-10045-01EN, Rev. E, August 2016
Table of Contents viii

DMTA-10045-01EN, Rev. E, August 2016
List of Abbreviations ix
List of Abbreviations
AC alternating current
CD-ROM compact disc read-only memory
DC direct current
EFUP environment-friendly use period
GB gigabyte
I/O input-output
ID identification
IP ingress protection
LCD liquid crystal display
LED light-emitting diode
Li-ion lithium-ion
MIA mechanical impedance analysis
N/A not applicable
OEM original equipment manufacturer
P/N part number
PC personal computer
PC pitch-catch
SD secure digital (card)
SPC statistical process control
USB universal serial bus
VAC volts alternating current
VGA video graphics array

DMTA-10045-01EN, Rev. E, August 2016
List of Abbreviations x

DMTA-10045-01EN, Rev. E, August 2016
Labels and Symbols 1
Labels and Symbols
Safety-related labels and symbols are attached to the instrument at the locations
shown in Figure i-1 on page 1 and Figure i-2 on page 2. If any or all of the labels or
symbols are missing or illegible, please contact Olympus.
Figure i‑1 Label attached to the back of the instrument
Instruction and rating label (see Table 1 on page 3)

DMTA-10045-01EN, Rev. E, August 2016
Labels and Symbols 2
Figure i‑2 Location of the serial number
To avoid the risk of electric shock, do not touch the inner conductors of the 11-pin
Fischer connector. Up to 80 V can be present on the inner conductors. The warning
symbol shown in the figure below warns of this electric shock risk.
Figure i‑3 The warning symbol
Serial number location (see Table 2 on page 4)
CAUTION
11-pin Fischer connector
Warning symbol

DMTA-10045-01EN, Rev. E, August 2016
Labels and Symbols 3
Table 1 Content of the rating label
Content
This symbol indicates the location of the membrane vent.
The direct current symbol.
The WEEE symbol indicates that the product must not be
disposed of as unsorted municipal waste, but should be
collected separately.
The regulatory compliance mark (RCM) label indicates that
the product complies with all applicable standards, and has
been registered with the Australian Communications and
Media Authority (ACMA) for placement on the Australian
market.
Seller and user shall be noticed that this equipment is suitable
for electromagnetic equipment for office work (class A) and it
can be used outside home. The MSIP code for the
BondMaster 600 is the following: MSIP-REM-OYN-B600.

DMTA-10045-01EN, Rev. E, August 2016
Labels and Symbols 4
The CE marking is a declaration that this product conforms to
all the applicable directives of the European Community. See
the Declaration of Conformity for details. Contact your Olympus
representative for more information.
The China RoHS mark indicates the product’s Environment-
Friendly Use Period (EFUP). The EFUP is defined as the
number of years for which listed controlled substances will not
leak or chemically deteriorate while in the product. The EFUP
for the BondMaster 600 has been determined to be 15 years.
Note: The Environment-Friendly Use Period (EFUP) is not
meant to be interpreted as the period assuring functionality
and product performance.
The warning symbol indicates that the user must read the
user’s manual in order to find out the nature of the potential
hazards and any actions to avoid them.
Table 2 Content of the serial number label
Content
SERIAL The serial number.
Table 1 Content of the rating label (continued)

DMTA-10045-01EN, Rev. E, August 2016
Important Information — Please Read Before Use 5
Important Information — Please Read Before Use
Intended Use
The BondMaster 600 composite bond tester is designed to perform nondestructive
inspections on industrial and commercial materials.
Do not use the BondMaster 600 for any purpose other than its intended use. It must
never be used to inspect or examine human or animal body parts.
Instruction Manual
This instruction manual contains essential information on how to use this Olympus
product safely and effectively. Before using this product, thoroughly review this
instruction manual. Use the product as instructed.
Keep this instruction manual in a safe, accessible location.
WARNING

DMTA-10045-01EN, Rev. E, August 2016
Important Information — Please Read Before Use 6
Some of the details of components and/or software images in this manual may differ
from your instrument’s components or software display. However, the principles
remain the same.
Instrument Compatibility
Only use the BondMaster 600 instrument with the following ancillary equipment:
• Rechargeable lithium-ion (Li-ion) battery pack (Olympus P/N: 600-BAT-L-2
[U8760058])
• Optional stand-alone external battery charger (Olympus P/N: EPXT-EC-X), where
“X” denotes the power cord type (see Table 18 on page 222).
• Charger/adaptor (Olympus P/N: EP-MCA-X), where “X” denotes the power cord
type (see Table 18 on page 222).
Always use equipment and accessories that meet Olympus specifications. Using
incompatible equipment could cause equipment malfunction and/or damage, or
human injury.
Repair and Modification
The BondMaster 600 does not contain any user-serviceable parts. Opening the
instrument might void the warranty.
IMPORTANT
CAUTION

DMTA-10045-01EN, Rev. E, August 2016
Important Information — Please Read Before Use 7
In order to prevent human injury and/or equipment damage, do not disassemble,
modify, or attempt to repair the instrument.
Safety Symbols
The following safety symbols might appear on the instrument and in the instruction
manual:
General warning symbol
This symbol is used to alert the user to potential hazards. All safety messages that
follow this symbol shall be obeyed to avoid possible harm or material damage.
Shock hazard caution symbol
This symbol is used to alert the user to potential electric shock hazards. All safety
messages that follow this symbol shall be obeyed to avoid possible harm.
Safety Signal Words
The following safety symbols might appear in the documentation of the instrument:
The DANGER signal word indicates an imminently hazardous situation. It calls
attention to a procedure, practice, or the like, which, if not correctly performed or
adhered to, will result in death or serious personal injury. Do not proceed beyond a
DANGER signal word until the indicated conditions are fully understood and met.
CAUTION
DANGER

DMTA-10045-01EN, Rev. E, August 2016
Important Information — Please Read Before Use 8
The WARNING signal word indicates a potentially hazardous situation. It calls
attention to a procedure, practice, or the like, which, if not correctly performed or
adhered to, could result in death or serious personal injury. Do not proceed beyond a
WARNING signal word until the indicated conditions are fully understood and met.
The CAUTION signal word indicates a potentially hazardous situation. It calls
attention to an operating procedure, practice, or the like, which, if not correctly
performed or adhered to, may result in minor or moderate personal injury, material
damage, particularly to the product, destruction of part or all of the product, or loss of
data. Do not proceed beyond a CAUTION signal word until the indicated conditions
are fully understood and met.
Note Signal Words
The following safety symbols could appear in the documentation of the instrument:
The IMPORTANT signal word calls attention to a note that provides important
information, or information essential to the completion of a task.
The NOTE signal word calls attention to an operating procedure, practice, or the like,
which requires special attention. A note also denotes related parenthetical
information that is useful, but not imperative.
The TIP signal word calls attention to a type of note that helps you apply the
techniques and procedures described in the manual to your specific needs, or
provides hints on how to effectively use the capabilities of the product.
WARNING
CAUTION
IMPORTANT
NOTE
TIP

DMTA-10045-01EN, Rev. E, August 2016
Important Information — Please Read Before Use 9
Safety
Before turning on the instrument, verify that the correct safety precautions have been
taken (see the following warnings). In addition, note the external markings on the
instrument, which are described under “Safety Symbols.”
Warnings
General Warnings
• Carefully read the instructions contained in this instruction manual prior to
turning on the instrument.
• Keep this instruction manual in a safe place for further reference.
• Follow the installation and operation procedures.
• It is imperative to respect the safety warnings on the instrument and in this
instruction manual.
• If the equipment is used in a manner not specified by the manufacturer, the
protection provided by the equipment could be impaired.
• Do not install substitute parts or perform any unauthorized modification to the
instrument.
• Service instructions, when applicable, are for trained service personnel. To avoid
the risk of electric shock, do not perform any work on the instrument unless
qualified to do so. For any problem or question regarding this instrument, contact
Olympus or an authorized Olympus representative.
• Do not touch the connectors directly by hand. Otherwise, a malfunction or electric
shock may result.
• Do not allow metallic or foreign objects to enter the device through connectors or
any other openings. Otherwise, a malfunction or electric shock may result.
WARNING

DMTA-10045-01EN, Rev. E, August 2016
Important Information — Please Read Before Use 10
Electrical Warning
The instrument must only be connected to a power source corresponding to the type
indicated on the rating label.
If an unauthorized power supply cord is used to power the instrument or charge the
batteries, Olympus cannot guarantee the electrical safety of the equipment.
Battery Precautions
• Before disposing of a battery, check your local laws, rules, and regulations, and
follow them accordingly.
• Transportation of lithium-ion batteries is regulated by the United Nations under
the United Nations Recommendations on the Transport of Dangerous Goods. It is
expected that governments, intergovernmental organizations, and other
international organizations shall conform to the principles laid down in these
regulations, thus contributing to worldwide harmonization in this field. These
international organizations include the International Civil Aviation organization
(ICAO), the International Air Transport Association (IATA), the International
Maritime Organization (IMO), the US Department of Transportation (USDOT),
Transport Canada (TC), and others. Please contact the transporter and confirm
current regulations before transportation of lithium-ion batteries.
• Do not open, crush, or perforate batteries; doing so could cause injury.
• Do not incinerate batteries. Keep batteries away from fire and other sources of
extreme heat. Exposing batteries to extreme heat (over 80 °C) could result in an
explosion or personal injury.
• Do not drop, hit, or otherwise abuse a battery, as doing so could expose the cell
contents, which are corrosive and explosive.
• Do not short-circuit the battery terminals. A short circuit could cause injury and
severe damage to a battery making it unusable.
WARNING
CAUTION
CAUTION