Onlogic K410 User manual

K410 / K430 Product Manual

Revision History
Revision
Date
First release of K400 manual
09/16/2021
Update including radio transmitter info, VCCI, RF,
and Safety info
1/25/2022
Updated DIO Link
05/04/2022
Table of Contents
Revision History 1
Table of Contents 2
1 - System Overview 5
1.1 - System Introduction 5
1.2 - Accessories 5
1.3 - Product Specifications 6
1.4 - Exterior Dimensions 8
1.4.1 - Karbon 410 Dimensions (K410) 8
1.4.2 - Karbon 430 Dimensions (K430) 8
1.5 - System Block Diagram 9
2 - I/O Definitions 10
2.1 - Front I/O Definition 10
Power Button / Power LED 10
SIM Card 10
USB 2.0 11
USB 3.2 11
ModBay COM Expansion 11
ModBay DIO Expansion 11
LED Functionality 12
2.2 - Bottom I/O Definition 13
3-Pin Terminal Power Connector 13
2

CAN Bus 14
LAN 1 & 2 14
DisplayPort 15
2.3 - Top I/O Definition 16
Antenna SMA Ports 16
2.4 - Motherboard Connectors 17
M.2 B-Key 17
M.2 E-Key 17
mPCIe 17
SO-DIMM1 & SO-DIMM2 18
RTC RESET 18
BIOS EEPROM 18
Power Switch Header 18
RTC Battery Header 18
TPM header 18
Onboard Power Header 19
High Speed Daughter Board 19
B-Key 1 19
B-Key 2 20
SIM 1 20
SIM 2 20
RTC Battery 20
3 - Mounting Instructions 21
3.1 - Wall Mounting (MTW101) 21
3.2 - DIN Rail Mounting - Edge (MTD102) 22
3.3 - DIN Rail Mounting - Bottom (MTD103) 23
3.3 - VESA Mounting (VMPL-1056) 24
4 - Power Management 25
4.1 - Wake-Up Events 25
3

4.2 - Protection Circuitry 25
5 - Regulatory Compliance 26
5.1 - FCC 26
5.2 - ISED 26
5.3 - CE 26
5.3.1 - EMC 26
5.3.2 - Safety 26
5.4 - UKCA 26
5.4.1 - EMC 26
5.4.2 - Safety 27
5.5 - Shock and Vibration 27
6 - Appendices 28
6.1 - Appendix A: Power Consumption 28
6.2 - Appendix B: BIOS Manual 30
6.3 - Appendix C: System Thermal Results 31
6.4 - Appendix D: Expansion Port Pinout 32
6.4.1 - M.2 B-Key 32
6.4.2 - M.2 E-Key 33
6.4.4 - mPCIe 34
6.5 - Appendix F: Safety Information 35
6.5.1 - Safe Use and Installation Instructions 35
6.5.2 - Précautions et guide d’installation 36
6.6 - Appendix G: Errata 37
4

1 - System Overview
1.1 - System Introduction
The Karbon 400 Series packs the power and advanced IoT capabilities of the latest Intel® Atom®
x6000E processors (formerly Elkhart Lake) into low profile, rugged and fanless systems built for the
challenges of the IoT Edge.
The Karbon 400 Series was designed to be installed anywhere you need ultra-reliable computing
power. Sensitive internal components are protected from dust, debris, chemicals, and moisture with
OnLogic's integrated Hardshell™ Fanless Technology. Its rugged design, -40° to 70°C operating
temperature range, 9~48 V power input, and the absence of any moving parts dramatically improve
the lifespan and reliability of the system.
1.2 - Accessories
●Terminal block kit (Power, CAN bus)
●Rubber Feet (4)
If you purchased additional items such as mounting brackets, power supplies, or cables, they will be
located in the system box or within the outer shipping carton.
All drivers and product guides can be found on the corresponding product page. For more information
on accessories and additional features, visit the Karbon series page.
Karbon Series Page: https://www.onlogic.com/computers/rugged/karbon/
Karbon 410 Page: https://www.onlogic.com/k410/
Karbon 430 Page: https://www.onlogic.com/k430/
5

1.3 - Product Specifications
Karbon K410
Karbon 430
Dimensions
180 x 123 x 50 mm
180 x 123 x 60 mm
CPU
Intel Atom x6211E (2 core, 2 thread, 1.3~3.0 GHz, 6W)
Intel Atom x6425E (4 core, 4 thread, 2.0~3.0 GHz, 12W)
Memory
2 SO-DIMM DDR4 3200 up to 32GB total with IBECC support
LAN Controller
2 Intel I210-IT
Motherboard
Expansion
M.2 3042/2260/80 B-key (PCIe x2, USB 2.0, SATA, SIM)
M.2 2230 E-key (PCIe x1, USB 2.0)
mPCIe (PCIe x1, USB 2.0, SATA, SIM)
Motherboard
I/O
2 GbE LAN (optional 2 PoE using module)
2 USB 3.2 Gen 2 Type-A
2 USB 2.0 Type-A
1 DisplayPort (DP 1.4 & HDMI 2.0b)
3-pin CAN bus
3-pin Power input
1 Power button
1 3FF Micro-SIM (mapped to motherboard mPCIe and M.2)
8 LED array (Power, Storage, Ignition, Watchdog, 4 User Configurable)
Motherboard
Headers
TPM 2.0 module header
PoE module header
DC power header
RTC battery holder
Daughterboard
Expansion
N/A
M.2 3042/52/2260/80 B-key (PCIe x1, USB
3.0, USB 2.0, SIM)
M.2 2242/60/80 B-key (PCIe x1, USB 3.0,
USB 2.0)
Daughterboard
I/O
N/A
3FF Micro-SIM (mapped to M.2 3042/52)
Daughterboard
Headers
N/A
3FF Micro-SIM (mapped to M.2 3042/52)
Voltage Input
9~48 VDC (3-pin Terminal Block with IGN pin)
Power
Protections
Reverse Power Input Protection
Over Voltage Protection (52.8V)
ESD Protection (15kV Air, 8kV Contact)
Chassis Grounding Nut
OS Support
Windows IoT Enterprise
Special
Features
Automotive Power with Ignition Sensing
Watchdog Timer
PTT and Secure Boot in BIOS
Mounting
Wall, DIN rail, VESA
Temperature
-40~70°C, Operating
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-40~85°C, Storage
Humidity
10~95% non-condensing, Operating
0~95% non-condensing, Storage
Shock
Tested according to IEC 60068-2-27 and MIL-STD-810H Method 516.6
Vibration
Tested according to IEC 60068-2-64 and MIL-STD-810H Method 514.6
Regulatory
Certifications
FCC part 15b (Class A), CE, VCCI, RCM
Meets requirements of CE Directives for I.T.E. (EMC 2014/30/EU, ErP
2009/125/EC, Low Voltage 2014/35/EU, Radio Equipment 2014/53/EU, RoHS 3
EU 2015/863, WEEE 2002/96/EC)
Meets requirements of IEC 60601-1-2:2014 Medical Electrical Equipment
Meets requirements of CEC Title 20 Appliance Efficiency Regulations
Meets requirements of E-Mark (UNECE Reg. 10, latest revision)
Meets requirements of EN 50155 (via testing to EN 50121-3-2)
Meets requirements of IEC 60945 Ed. 4 Maritime Navigation and
Radiocommunication Equipment and Systems
Meets requirements of IEC 62368-1 Audio/Video, Information And
Communication Technology Equipment - Part 1: Safety Requirements
Radio Specifications when equipped with INT-9260 Wifi/BT (device for indoor use)
Frequency
Bands
2.4GHz and 5GHz bands
Operating
Frequency
2400 - 2485 MHz
5150 - 5250 MHz, 5250 - 5350 MHz
5470 - 5725 MHz, 5725 - 5878 MHz
Channel
spacing /
Bandwidth
2.4GHz: 802.11b/g/n; 5 MHz / BT: 1MHz
Bandwidth: 20 MHz / 40 MHz
5 GHz: 802.11a/n/ac: 20, 40, 80, 160 MHz
RF output
power
20dBm (2400-2485 MHz) IEEE 802.11b/g/n& BT
10dBm (2400-2485 MHz) BLE
23dBm (5150-5725 MHz) IEEE 802.11a/n/ac
13.98 dBm (5725-5875MHz) IEEE 802.11a/n/ac
Type of
Modulation
2.4GHz: DSSS/OFDM/FHSS
5 GHz: OFDM
Type of
Antenna
Reference antenna is PIFA type (2dBi/2dBi gain)
Modes of
operation
Duplex (Tx/Rx)
Duty cycle
(access
protocol)
As In: IEEE 802.11 a/b/g/n/ac
7

Version of
firmware/soft
ware
Software Intel PROSet/Wireless WiFi Software
20..x and following versions for WIFI/BT
Antenna
Specifications
PIFA
(2dBi / 2dBi Gain for 2.4 and 5GHz)
RP-SMA connector
8

1.4 - Exterior Dimensions
1.4.1 - Karbon 410 Dimensions (K410)
1.4.2 - Karbon 430 Dimensions (K430)
9

1.5 - System Block Diagram
10

2 - I/O Definitions
2.1 - Front I/O Definition
Power Button & LED
The front power button can be used to turn on and off the Karbon system. The power button is a
momentary contact button with a blue LED backlight used to display the status of the system. A
single press while the system is on will initiate a graceful shutdown operation from the OS. Pressing
and holding the button for 4 seconds while the system is running will cause a hard reset of the
system. The system can be woken by a single press of the power button from any state.
The LED backlight will indicate the system status. A solid blue light indicates that the system is
powered in the S0 state. A flashing blue light indicates the system is in the sleep state. The LED is off
in S5 and deep sleep states.
SIM Card
A 3FF Micro-SIM card slot is present on the front panel of the Karbon 400 platform allowing native
support for OnLogic Extrovert 4G LTE modules. The SIM signals can be connected to either the mPCIe
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or M.2 B-Key internal expansion slots. This selection is controlled in BIOS with the default BIOS
setting being mPCIe. Please refer to the BIOS user manual for more information.
The SIM slot is a Push-Push type receptacle. To insert or remove the SIM card from the front panel of
the Karbon platform, please use a small implement to push the card into the slot until it clicks. To
remove the card, push with a small implement until the card clicks, then pull on the free end of the
card to remove it.
USB 2.0
There are two USB 2.0 Type-A ports on the front panel of the K400 platform. These ports are capable
of linking at 480Mbps transfer rates.
USB 3.2
There are two USB 3.2 Gen 2 Type A ports on the front panel of the K400 platform. These ports are
capable of linking at 10Gbps transfer rates.
ModBay COM Expansion
The K400 platform supports an optional COM DB9 add-in card (OnLogic MOD109). The serial port
mode and voltage between Off/5V/12V on Pin 9 on K400 can be selected in the BIOS configuration.
The serial ports support RS-232, RS-422, and RS-485 configurations. Refer to the BIOS manual in
Appendix B for configuration instructions.
Pin
RS-232
RS-422
RS-485
1
DCD
TX-
TX-/RX-
2
RX
TX+
TX+/RX+
3
TX
RX+
NC
4
NC
RX-
NC
5
GND
NC
NC
6
NC
NC
NC
7
RTS
NC
NC
8
CTS
NC
NC
9
RI/PWR
NC/PWR
NC/PWR
ModBay COM DB9 Pinout
ModBay DIO Expansion
The K410/K430 platform supports an optional Isolated Digital I/O add-in card (OnLogic MOD110).
This option allows for integration of the Karbon 400 Series with existing PLC integrations or other
12

digital logic applications. For a complete explanation of features, operating voltages, and safety
information, please refer to the DIO expansion information on the OnLogic support site.
https://www.onlogic.com/support/documentation/mod110-dio/
Pin
Definition
Pin
Definition
1
Power
2
GND
3
In0/QEP0A
4
Out0/PWM0
5
In1/QEP0B
6
Out1/PWM1
7
In2/QEP0I
8
Out2/PWM2
9
In3/QEP1A
10
Out3
11
In4/QEP1B
12
Out4
13
In5/QEP1I
14
Out5
15
In6
16
Out6
17
In7
18
Out7
19
CANL
20
CANH
ModBay DIO Pinout
LED Functionality
LED
On
Off
Blink
Pulse
HDD
-
-
Internal storage
drive activity with
supported devices
-
Power
Device is on
Device is off
Device is asleep
-
Automotive Ignition
Ignition input to
device is on
Ignition input to
device is off
-
-
Watchdog
-
-
-
-
Configurable
LED 1-4
User
Programmable
User
Programmable
User
Programmable
User
Programmable
13

2.2 - Bottom I/O Definition
K410 Bottom I/O
K430 Bottom I/O
3-Pin Terminal Power Connector
Mainboard power is applied to the Karbon 400 platform by Dinkle 2EHDRM-03P (Mating part: Dinkle:
2ESDVM-03P or equivalent 5.08mm pitch terminal plug). The system is operational from 9V~48V. The
maximum rated current of the connector is 15A per pin. Use a wire gauge that is rated for the
operational current. The ignition pin may be used to turn the system on when configured. The timing
14

is configurable through the OS, similar to K700/K300 configurations. Please see the OnLogic support
site for Ignition and timing configuration. See below for on-board connector pinout.
Pin
Definition
1
GND
2
Ignition
(9-48V)
3
DC Input
(9-48V)
Power Input Pinout
CAN Bus
Supports CAN 2.0 A/B at 100-1000 kbaud via the Programmable Services Engine. Messages may be
sent/received through the HECI (Host Embedded Controller Interface). A command line interface
utility for interfacing with the CAN device over HECI is provided, and applications can also interact
with the HECI driver directly. For more information, please refer to our technical documentation on the
OnLogic support site.
The internal CAN signals are unterminated; the CAN device should be externally terminated.
●3-pin CAN Bus
●Dinkle EC350V-03P terminal block
Pin
Definition
1
GND
2
CAN L
3
CAN H
CAN Bus Pinout
LAN 1 & 2
There are two LAN Ports on the K400 platform that support up to 1 Gbps link speeds over standard
shielded CAT5e or CAT6 cables. The connector is the industry standard RJ45 connector. The LAN link
state is shown by the two LEDs embedded within the port. The description is included below.
The PoE add-on card option enables Power over Ethernet for both LAN ports. Both ports are
configured for 802.3atcapabilities. A total power budget of 36W is provided for both ports, such that
two 802.3af devices may be used, with a single port connected to a 802.3at device as an additional
supported configuration.
15

LED
Color
State
Function
Link
-
Off
LAN link not
established
Green
On
LAN link
established
Blinking
LAN activity
occurring
Speed
-
Off
10 Mb/s
data rate
Green
On
100 Mb/s
data rate
Yellow
On
1000 Mb/s
data rate
LAN Activity Light Definition
DisplayPort
The Karbon 400 platform utilizes Intel’s Integrated processor graphics that power the onboard
DisplayPort with support for resolutions up to 4096x2304 at 60Hz. The port also supports
Multi-Stream Transport (MST) which allows for triple independent display output using a certified
MST hub. The DisplayPort connector supports CEC protocol.
16

2.3 - Top I/O Definition
Antenna SMA Ports
The Karbon 410 and 430 both have four SMA ports for antennas on the top of the system. The Karbon
430 includes two additional SMA ports on the front of the system.
17

2.4 - Motherboard Connectors
The motherboard is the same for K410 and K430.
M.2 B-Key
An M.2 B-Key slot on the Karbon 400 motherboard provides support for B-Key form-factor expansion
cards. Supported cards include 3042, 2242, 2260, 2280 form-factors. The B-Key connector supports
PCIe Gen 3 x2, USB 3.2 5Gbps, USB 2.0, SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen
III (6.0Gbps) devices.
The 3FF Micro SIM card slot is multiplexed to both the M.2 B-Key and mPCIe expansion slot. The
routing can be selected in the BIOS and is set to the mPCIe slot by default. Please refer to the BIOS
user manual (Appendix B) for more information.
A full pinout table for this expansion slot is provided in Appendix D.
M.2 E-Key
An M.2 E-Key slot on the Karbon 400 motherboard provides support for E-Key form-factor expansion
cards. Only 2230 form-factor cards are supported. The E-Key connector supports PCIe Gen 3 x1 and
USB 2.0 devices. A full pinout table for this expansion slot is provided in Appendix D.
mPCIe
A mPCIe slot is present on the Karbon 400 motherboard to allow support for mini-PCIe form-factor
expansion cards. Full length cards and half-length cards (with an adapter) are supported. The mPCIe
18

connector supports PCIe Gen 3 x1 and USB 2.0 devices. A full pinout table for this expansion slot is
provided in Appendix D.
The 3FF Micro-SIM card slot is multiplexed to both the M.2 B-Key and mPCIe expansion slot. The
routing can be selected in the BIOS and is set to the mPCIe slot by default. Please refer to the BIOS
user manual (Appendix B) for more information.
SO-DIMM1 & SO-DIMM2
Karbon 400 has two onboard DDR4 SO-DIMM slots:
●Maximum Capacity: 32GB DDR4-3200 total using two 16GB SO-DIMM modules
●Channel configuration: 1 DIMM Per Channel (DPC) - 2 Channels
●In Band ECC Support (IBECC)
RTC RESET
The snap dome tact switch behind the power button on the Karbon 400 motherboard may be used to
clear the CMOS settings in the BIOS. Remove external power to the system before clearing the CMOS.
Removing the RTC battery is not an accepted method for clearing BIOS settings.
BIOS EEPROM
If the BIOS needs to be updated, please refer to Appendix B for reflashing instructions.
Power Switch Header
The on-board power switch header can be used to control the power state of the Karbon 400 platform
in parallel with the front panel power button. Mating power switch cables should be a twisted-pair wire
with floating shield to assure proper immunity to EMI/RFI. The mating connector is a standard
2.54mm female header. It is recommended to keep wires at less than 3 meters in length. Switches
must be momentary contact type only.
RTC Battery Header
The RTC battery on the Karbon 400 platform is used to retain BIOS CMOS settings and maintain the
real-time clock for the system. If the RTC battery is low, CMOS settings will not be retained and you
may receive an alert in the operating system. Replacement batteries should be a UL listed type
CR2032 3V cell.
TPM header
Karbon 400 features an onboard TPM (Trusted Platform Module) header. It supports OnLogic’s
wide-temperature TPM 2.0 module (OnLogic TPM01). This gives the option to have a dedicated
secure module to secure the system through cryptographic keys.
19

Onboard Power Header
An onboard connector is provided for power to internal expansion cards. The connector is a JST
2.0mm PH series connector (pn: B4B-PH-K-S). A suitable mating connector from the same series
should be used. The Pinout is provided below. The maximum operating current per pin is 2A. The
header is only powered while the system is in the S0 operating state.
Pin
Function
1
5V
2
GND
3
GND
4
12V
High Speed Daughter Board
The Karbon 430 system supports an additional daughter board for additional high speed storage and
connectivity options. The daughter board is pictured below.
M.2 B-Key 1
The upper B-Key slot is provided to allow support for B-Key form-factor PCIe and USB expansion
cards. Supported cards include 3042, 3052, 2260, 2280 form-factors. The B-Key connector on the
Karbon expansion card supports PCIe Gen 3 x1, USB 3.2 5Gbps, USB 2.0 devices. B-Key SATA drives
are not electrically compatible with this slot.
20