Onlogic Karbon 700 Series User manual

Karbon 700 Product Manual

Revision History
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Revision History
Date
First release of Karbon 700 manual
08/22/2019
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1 - System Overview 5
1.1 - Accessories 5
1.2 - Product Specifications 6
1.3 - Exterior Features and Dimensions 8
1.3.1 - Front I/O 8
1.3.2 - Back I/O 8
1.3.3 - Karbon 700 Dimensions (K700-SE) 9
1.3.4 - Karbon 700 Dimensions with PCIe Expansion (K700-X2) 9
1.4 - Motherboard Overview 10
1.4.1 - System Block Diagram 10
1.4.2 - Motherboard Features 11
2 - I/O Definitions 13
2.1 - Serial Ports 13
2.2 - DIO 14
2.2.1 - DIO Connection Diagram 15
2.3 - Remote Power Switch 15
2.4 - LEDs 16
2.5 - Automotive Ignition Power Sensing (IGN) 17
2.6 - CAN Bus 17
2.6.1 - CAN Bus Connection Diagram 18
2.7 - LAN 18
3 - Mounting Instructions 19
3.1 - Wall Mount 19
3.2 - Wall Mount with Vibration Isolation 20
4 - Microcontroller 21
4.1 - Overview 21
5 - Power Management 21
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5.1 - Wake-Up Events 21
5.2 - Protection Circuitry 22
6 - Test Reports 22
6.1 - ISO 7637-2 and ISO 16750-2 Summary 22
6.1.1 - Electrical Supply/Load Voltage Drop Data 22
6.1.2 - Paragraph 4.11 Voltage Withstand Test Results 23
6.2 - Electrical Supply/Load Disturbance Data 23
6.2.1 - Paragraph 4.7 Reverse Voltage Test Results 23
6.2.2 - Paragraph 4.9 Open Circuit Test Results 24
6.2.3 - Paragraph 4.10 Open Circuit Test Results 24
6.2.4 - Paragraph 4.12 Open Circuit Test Results 24
6.3 - Conducted Transient Data 25
6.4 - EN 50121-3-2 Summary 25
6.4.1 - ESD Immunity Data 25
6.4.2 - Radiated Immunity Data 25
6.4.3 - Electrical Fast Transient Immunity Data 26
6.4.4 - Surge Immunity Data 26
6.4.5 - Conducted Immunity Data 26
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1 - System Overview
1.1 - Accessories
●5-pin Power Terminal Block Connector (Dinkle PN: 2ESDVM-05P)
●2-pin Remote Switch Terminal Block Connector (Dinkle PN: EC350V-02P)
●3-pin CAN bus Terminal Block Connector (Dinkle PN: EC350V-03P)
●10-pin DIO Terminal Block Connector (Dinkle PN: EC350V-10P)
●5-pin Terminal Block to 6-pin Molex Adapter (OnLogic PN: CBP133)
●SATA Power and Data Cables If Not Installed (OnLogic PN: CBD123)
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If you purchased additional items such as mounting brackets, power supplies or antennas,
they will be located in the system box or within the outer shipping carton.
All drivers and product guides can be found on the corresponding product page. For more
information on accessories and additional features, visit the Karbon 700 pages at:
US: https://www.onlogic.com/K700-SE/
https://www.onlogic.com/K700-X2/
EU: https://www.onlogic.com/eu-en/K700-SE/
https://www.onlogic.com/eu-en/K700-X2/
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1.2 - Product Specifications
Karbon 700 Series
Processor
Intel 8th Gen Coffee Lake & 9th Gen Coffee Lake Refresh
LGA1151 Celeron, Pentium, Core & Xeon E up to 80W
Memory
2 DDR4-2666 SO-DIMM up to 64GB total (non-ECC or ECC)
Chipset
Intel C246
Integrated Graphics
Intel UHD Graphics 610/630
Front I/O
1 Power button
4 USB 3.1 Gen 1 Type A
2 Serial RS-232/422/485
1 3.5 mm audio jack (mic-in, stereo out)
8-bit isolated DIO (4-in, 4-out)
8 Status LEDs
2-pin Remote switch
1 Mini-SIM slot (2FF)
2 Hot-swap drive bays (optional)
Back I/O
5-pin Power input
3 Full-size DisplayPort 1.2 supporting DP++ and HDMI 1.4
3 Gb LAN (2 Gb Mode A PoE optional)
2 USB 3.1 Gen 1 Type A
2 ModBay™ expansion slots
3-pin CAN bus 2.0B
1 External fan connector
Expansion & Storage
1 M.2 2280 M-key (PCIe x4, SATA)
1 M.2 2230/60/80 M-key (PCIe x2)
1 M.2 2230 E-key (PCIe x1, USB 2.0)
2 Full-length mPCIe (1 duplexed with mSATA)
2 2.5” SATA SSD/HDD drives (hot-swap optional)
1 PCIe x16 or 2 PCIe x8 with K700-X2 expansion chassis and riser
Max. PCIe dimensions: 211 x 129 x 41 mm (8.31 x 5.08 x 1.61 in)
Special Features
OnLogic Microcontroller (MCU)
Automotive Ignition Power Sensing
SuperCap backup for RTC battery
Optional TPM 2.0 module (Nuvoton NPCT750)
Operating Systems
Windows 10, Ubuntu 18.04
LAN Controllers
1 Intel I219-LM with AMT support
2 Intel I210-AT
Voltage Input
9~48 VDC with 5-pin terminal block
Dimensions
K700-SE: 240 x 242 x 82 mm (9.45 x 9.53 x 3.23 in)
K700-X2: 240 x 242 x 143 mm (9.45 x 9.53 x 5.63 in)
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Mounting
Wall/surface (bottom)
Wall/surface with Vibration Isolation (bottom)
Temperature
Operating Temperature: -40°C ~ 70°C (35W TDP CPU)
-40°C ~ 50°C (60W TDP CPU)
-40°C ~ 40°C (80W TDP CPU)
Storage Temperature: -40°C ~ 85°C
Humidity
Operating Humidity: 10~95% relative
Storage Humidity: 0~95% relative
Shock & Vibration
Shock: Tested according to IEC 60068-2-27 and MIL-STD-810G
Vibration: Tested according to IEC 60068-2-64 and MIL-STD-810G
Certifications
FCC 47 CFR Part 15
Low-Voltage (2014/35/EU)
Electromagnetic Compatibility (2014/30/EU)
Radio Equipment (2014/53/EU) - Only applicable
for configurations with wireless transmitters
EN 55032
EN 55035
RoHS 3 (2015/863/EU)
WEEE Directive (2012/19/EU)
IEC 60068-2-27
IEC 60068-2-64
MIL-STD-810G
Power Immunity According to
E-Mark 7637-2 & 16750-2
EN 50121
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1.3 - Exterior Features and Dimensions
1.3.1 - Front I/O
1.3.2 - Back I/O
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1.3.3 - Karbon 700 Dimensions (K700-SE)
1.3.4 - Karbon 700 Dimensions with PCIe Expansion (K700-X2)
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1.4 - Motherboard Overview
1.4.1 - System Block Diagram
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