Panasonic B01 User manual

ACCTF34E
2017.10 industrial.panasonic.com/ac/e/
B01
/ B02
High Current
Connectors
Operation manual

Operation manual for “High Current connectors B01/B02”
©Panasonic Corporation 2017 ACCTF34E 201710
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
1
Contents
01.Introduction.............................................................................................2
02.Precautions for product design...............................................................3
03.Precautions for mounting and reflow soldering.....................................13
04.Precautions for mating and unmating ...................................................20
Points which particularly need to be confirmed before designing products
are bold and underlined.

Operation manual for “High Current connectors B01/B02”
©Panasonic Corporation 2017 ACCTF34E 201710
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
2
01. Introduction
Our B2B connector for battery is designed for a high-performance and quick battery
charging of mobile device and a high electrical current of 6A(B01) or 10A(B02) is available.
Furthermore, the shape is ultra-small and low-profile design .
B01：stacking height of 0.6mm / 0.8mm , width of 2.4mm
B02：stacking height of 0.7mm , width of 2.2mm
This connector is designed for a high electrical current. Therefore, use the connector properly
on the basis of the connector’s specifications.
This connector is also designed with the durability and workability in mind.
However, the thickness of the molded part has been further reduced. Accordingly,
pay attention when using the connector and read this document before designing a product
and starting production.
B01 / B02 A35US
Application For Battery(Power) connect For Signalconnect
Space-saving
Excellent
Width:
B01:2.4mm
B02:2.2mm
Excellent
Width:
2.2mm
Low profile Excellent
Mated height
B01: 0.6mm/0.8mm
B02: 0.7mm
Excellent
Mated height
0.6mm
Wiring underneath Good
Exposed metal
part on the
rear face
Exposed
metal part
Good
Exposed metal
part on the
rear face
Exposed
metal part
Contact reliability Excellent Excellent
Drop resistance Very good Bellows-type
contact
With a thin plastic part Very good Bellows-type
contact
With a thin plastic part
Mountability Excellent
Header needs
special nozzle
Excellent
Header needs
special nozzle
Clicking feedback Excellent Excellent
2.2mm
0.6mm
Header
pickup
space:
0.8mm-
wide
bottom
Header
pickup
space:
0.7mm-
wide
bottom
B01：2.4mm
B02：2.2mm
B01：0.6mm
B02：0.7mm
/0.8mm

Operation manual for “High Current connectors B01/B02”
©Panasonic Corporation 2017 ACCTF34E 201710
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
3
02. Precautions for product design
02-1. Considerations in mechanical design
1) Prevention of problems during use
(1)The connectors have a simple locking structure, but make sure to consider
preventive measures against the detachment of mated connectors during
practical use.
- Make sure to eliminate any gaps between the casing and board.
- We recommend that the holding force is set greater than the insertion force of
the connector.
- Select an appropriate cushioning material with a suitable shape and dimensions,
and hold down the connector at the center. (If the holding position is off the
center, it may cause detachment of mated connectors.)
Cushioning material
Casing
Sub-board
(flexible board)
Connector
Reinforcing plate
Motherboard

Operation manual for “High Current connectors B01/B02”
©Panasonic Corporation 2017 ACCTF34E 201710
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
4
(2)If the board is insufficiently fixed as in the following drawing, the inertial
load applied to the connector may damage it. Pay attention to the following
points.
When an impact such as dropping as shown in the
drawing is applied:
(1) If both boards are not sufficiently fixed,
the connector will be damaged due to the
impact applied to the connector.
(2) In particular, if there is no gap between
the casing and sub-board (A<B), the sub-
board side will hit the casing wall first.
This impact may damage the connector.
<Preventive measures>
Securely fix both the motherboard and sub-board.
(1) Fixing motherboard
(Prevents inertial movement by drop impact
by fixing the side with a greater mass.)
(2) Hold down the sub-board to prevent it from
moving using a rubber cushioning material,
etc.
(3) It is safer if board gaps are set to A≥B so as
to prevent shearing damage on deviation of
the board by impact.
×
A<B
○
A
≥
B
Sub-board
(FPC)
Connector
Casing
Motherboard
(not fixed)
Connector
Casing
Motherboard
(not fixed)
Holding cushion
Sub-board (FPC)
<Preventive measures>

Operation manual for “High Current connectors B01/B02”
©Panasonic Corporation 2017 ACCTF34E 201710
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
5
(3)To facilitate the mating of connectors, we recommend that you pay attention
to the following points when designing the motherboard.
- Provide a reference mark.
- Design a layout that allows easy-checking of the connector mating condition.
Examples of reference mark
Flexible board
Reinforcing plate
Motherboard
Provide a reference
mark:
-Silk printing
-Pattern (copper foil)

Operation manual for “High Current connectors B01/B02”
©Panasonic Corporation 2017 ACCTF34E 201710
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
6
02-2. Precautions for board design
1) Circuit design
(1)When designing the terminal foot pattern, check the latest specifications and
examine the recommended foot pattern and dimensions of the metal mask opening.
The current recommendations are indicated on pages 12 to 15.
(2) The power terminal consists of 4 pins. When designing, in order to prevent an
excessive temperature rise, use 2 terminals for each positive terminal and negative
terminal of battery.
Pin assignment example（B01）
Pin assignment example（B02）

Operation manual for “High Current connectors B01/B02”
©Panasonic Corporation 2017 ACCTF34E 201710
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
7
(3)This connector is provided with soldering metals for preventing solder from
peeling off the terminal.
Make sure to design a foot pattern for the holding metal.
(4)Pay attention to the following point as a pattern
peeling preventive measure when removing the
connector.
- Make the foot pattern length longer than the
coverlay opening.
In general, at least 0.3 mm.
(5)Foot pattern dimensions indicated in the drawings are
intended to achieve the minimum area on the premise
that the reflow-soldering process is used. For manual
soldering or for ensuring solder reworkability, make
a longer pattern at the terminal tip.
Soldering terminal
Soldering terminal
Socket
Header
- Secure space for applying the soldering
iron tip.
Terminal looseness and unwanted
solder creep are preventable by
applying the soldering iron tip here.

Operation manual for “High Current connectors B01/B02”
©Panasonic Corporation 2017 ACCTF34E 201710
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
8
2) FPC board design
(1)Positions of connectors on the FPC
The FPC board is made by laminating a polyimide layer, copper foil, and adhesive
layers. Since each material has slightly different heat-shrinkable properties,
warpage may occur typically due the reflow heat in the following cases. This may
cause poor soldering. Make sure to arrange the board in a direction that minimizes
warpage.
■Example of the Assist carrier (ShinEtsu Polymer)
In case of a one-sided FPC board, warpage is
more likely to occur if a pattern is laid in a line,
or if the copper foil is applied over the entire
FPC board for noise-prevention purposes.
Since the FPC is soft, it is
difficult to keep it flat.
●Typical transfer jigs for the board
mounting process
- Magic resin (Daisho Denshi)
- Keiju board (Mitsubishi Resin)
- Assist carrier (ShinEtsu Polymer)
To keep the FPC board flat during
mounting, we recommend the use of a
“Sticky transfer jig” for the wiring board
mounting process.
Workpiece
(FPC board, etc.)
Elastomer
(Weak adhesive layer)
Elastomer
(Strong adhesive layer)
Substrate
Workpiece (FPC, etc.)
Assist carrier
Layout pin
STEP 1:
Provisional fixing of workpiece
STEP 2:
Mounting complete
STEP 3:
Removal of
workpiece
Removal pin

Operation manual for “High Current connectors B01/B02”
©Panasonic Corporation 2017 ACCTF34E 201710
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
9
(2)FPC board specifications
Control the thicknesses of the coverlay and adhesive to prevent poor
soldering.
This connector has no stand-off.
Therefore, minimize the thickness of the coverlay, etc. so as to prevent the
occurrence of poor soldering.
If poor soldering occurs frequently, check the actual thickness of each insulation
layer. Generally, the coverlay thickness is set to about 30 μm, including the
adhesive. If the thickness exceeds 30 μm, design the board so as to remove the
coverlay under the connector.
(3)This connector is often used for connecting the motherboard and FPC board. In
this case, if the FPC board is too short, a load that causes deviation will be applied
to the connector.
Make sure to create a design that provides some allowance in the FPC board.
Connector
terminal
Solder
Molded part of the connector
Coverlay (polyimide)
Adhesive (epoxy adhesive recommended)
Adhesive (epoxy adhesive recommended)
Copper foil
Base material (polyimide)
Reinforcing plate + Adhesive
(epoxy adhesive recommended)
NG: Too long
Fixed
Connector
NG: Too short
Positional deviation Motherboard
Part where FPC board
is fixed