Panasonic F4S User manual

ACCTF5E-5
2017.04 industrial.panasonic.com/ac/e/
F
4S
Narrow
-pitch Connectors
Operation manual

Operation manual for Narrow-pitch connectors F4S
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF5E-5 201704
- 1 -
Contents
01.Introduction.............................................................................................2
02.Precautions for product design...............................................................3
03.Precautions for mounting and reflow soldering.....................................15
04.Precautions for mating and unmating ...................................................21
05.Connectors for inspection and precautions for use...............................24
Points which particularly need to be confirmed before designing products
are bold and underlined.

Operation manual for Narrow-pitch connectors F4S
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF5E-5 201704
- 2 -
01. Introduction
Our F4S series consists of ultra-small connectors with a terminal pitch of 0.4 mm, a
stacking height of 1.00 mm, and a shorthand width of 3.6 mm. This connector is
designed for board-to-FPC connections that require a more space-saving connector than
our F4 Series.
For this purpose, the size and thickness of the molded part has been further reduced.
Select the types best suited to the conditions of use. Read this document before
designing a product and starting production.
F4S F4
Space-
saving
Excellent Very good
Width:
3.6mm
Width:
5.0mm
Wiring
underneath
Good
Exposed metal part
Excellent
No exposed metal part
Exposed
metal part on
the rear face
Contact
reliability Excellent
Excellent
Drop
resistance Very good Bellows-type contact
Excellent Bellows-type contact
Thin plastic part
Mountability Very good
Header needs
special nozzle
Excellent
No pick up
cover
Clicking
feedback
Excellent Very good
5.0
mm
3.6
mm
Header pickup
space:
Pick up the
0.8 mm-wide
bottom.
Header pickup
space:
2.3 mm-wide.

Operation manual for Narrow-pitch connectors F4S
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF5E-5 201704
- 3 -
02. Precautions for product design
02-1. Considerations in mechanical design
1) Position of the connector on a board
(1) When using board to board connectors, a pair of board shall NOT be connected
with multiple connectors. Otherwise, misaligned connector positions may cause
mating failure or product breakage.
Panasonic corporation does not guarantee the failures caused by using the
multiple connectors.
(2)Rigid boards tend to warp in a direction perpendicular to the rolling direction
during the production process. Poor soldering may occur depending on the
warping direction. Make sure to place the connector in a direction which reduces
warpage.
This space causes poor
soldering.
Tends to warp in the
manufacturing (lateral) direction.
Poor soldering can be reduced by
designing a mounting pattern to place
the connector in a lateral direction.
×

Operation manual for Narrow-pitch connectors F4S
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF5E-5 201704
- 4 -
2) Position of the connector in the mounting process
Design multi-pin connector layouts that do not require a swinging movement
during pickup and mounting.
In many cases, deviation of the connector mounting position is caused by the
inertia of the swinging movement of the mounter. A layout that does not require
swinging is thus required.
●Example of a connector layout requiring a swinging movement in the mounting process
3) Prevention of problems during use
(1)The F4S connectors have a simple locking structure, but make sure to
consider preventive measures against the detachment of mated connectors
during practical use.
- Make sure to eliminate any gaps between the casing and board.
- We recommend that the holding force is set greater than the insertion force of
the connector.
- Select an appropriate cushioning material with a suitable shape and dimensions,
and hold down the connector at the center. (If the holding position is off the
center, it may cause detachment of mated connectors.)
△
○
Pickup and mounting positions
Connector
Embossed tape
Motherboard
No rotation inertia
Connector
Rotary inertia is applied
Cushioning material
Casing
Sub-board
(flexible board)
Connector
Reinforcing plate
Motherboard

Operation manual for Narrow-pitch connectors F4S
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF5E-5 201704
- 5 -
(2)If the board is insufficiently fixed as in the following drawing, the inertial
load applied to the connector may damage it. Pay attention to the following
points.
(3)To facilitate the mating of connectors, we recommend that you pay attention to the
following points when designing the motherboard.
- Provide a reference mark.
- Design a layout that allows easy-checking of the connector mating condition.
When an impact such as dropping as shown in the
drawing is applied:
(1) If both boards are not sufficiently fixed,
the connector will be damaged due to the
impact applied to the connector.
(2) In particular, if there is no gap between
the casing and sub-board (A<B), the sub-
board side will hit the casing wall first.
This impact may damage the connector.
<Preventive measures>
Securely fix both the motherboard and sub-board.
(1) Fixing motherboard
(Prevents inertial movement by drop impact
by fixing the side with a greater mass.)
(2) Hold down the sub-board to prevent it from
moving using a rubber cushioning material,
etc.
(3) It is safer if board gaps are set to A≥B so as
to prevent shearing damage on deviation of
the board by impact.
×
A<B
○
A
≥
B
Sub-board
(FPC)
Connector
Casing
Motherboard
(not fixed)
Connector
Casing
Motherboard
(not fixed)
Flexible board
Reinforcing plate
Motherboard
Provide a reference
mark using:
-Silk printing
-Pattern (copper foil)
Holding cushion
Sub-board (FPC)
<Preventive measures>

Operation manual for Narrow-pitch connectors F4S
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF5E-5 201704
- 6 -
02-2. Precautions for board design
1) Circuit design
(1)When designing the terminal foot pattern, check the latest specifications and
examine the recommended foot pattern and dimensions of the metal mask opening.
The current recommendations are indicated on pages 13 and 14.
(2)This connector is provided with soldering metals for preventing solder from
peeling off the terminal.
Make sure to design a foot pattern for the holding metal.
(3)Foot pattern layout considering mountability
Since the header post is configured to extend to the bottom face of the molded
part, the following defects may occur if a pattern extends to the same area.
- When a large volume of solder is built up in the terminal back-fillet, solder is
likely to creep onto the molded part, causing solder bridges.
(Reason: Since slim designs are preferred, it is difficult to secure sufficient space
for pooling solder in the back-fillet.)
- Reworking becomes problematic if solder bridges occur.
Therefore, to prevent further solder creep, the terminal pattern is designed only up
to the molded part in MEW’s recommended PC-board pattern upon confirmation
of the soldering strength.
Holding metal
Socket
Header
Holding metal
This space is small, and thus when a
large volume of solder builds up
here, solder creeps onto the molded
part and causes solder bridges.
●Key point
When a through-hole is made
under the connector, we
recommend that you thin the
pattern inside the prohibited area
as shown in the left-hand drawing
and provide a through-hole
outside the prohibited area.
In general, the pattern width in
this area is 1/3 the terminal
pattern width.
Sectional view
Top view
Through-hole
prohibited
area
post
terminal

Operation manual for Narrow-pitch connectors F4S
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF5E-5 201704
- 7 -
(4)Precautions when providing a pattern and through-hole inside the prohibited
area
As shown below, the header’s post extends down to the bottomface of the molded
part, and the post extends horizontally beyond the molded part becomes the
terminal.
From this structure,pay attention to the following points.
①When providing an uninsulated through-hole, make sure to design it so that it
does not interfere with adjacent terminals.
②It is recommended that the patterns not be interfered in contiguous contacts.
(5)Precautions when providing an insulated through-hole in a prohibited area
As shown below, the header’s post extends down to the bottomface of the molded
part, and the post extends horizontally beyond the molded part becomes the
terminal.
If an insulated through-hole is placed in the prohibited area, the gap between the
pattern and connector terminal becomes wider, which may result in poor soldering.
①
interfering with
adjacent terminal
②
interfering with
adjacent terminal
Lead out straight to avoid
interference with adjacent terminals
Sectional view
A gap becomes
wider and increases
the risk of poor
soldering.
●Key point.
We recommend that you provide a through
-hole closer to the center, out of the prohibited area.
A 50-µm step
between the terminal
and molded part
A gap can be
absorbed by a step
between the molded
part and the
terminal.
Sectional view
Top view
Through-hole
prohibited area
●Key point
When leading out a pattern
that is not insulated inside, be
careful not to contact any
adjacent terminals.
●If there is a through-hole in the prohibited area
post
terminal

Operation manual for Narrow-pitch connectors F4S
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF5E-5 201704
- 8 -
(6)Pay attention to the following points when providing a through hole by
extending the foot pattern.
If a through-hole is created simply by extending the foot pattern by the same
width, solder is absorbed into the through-hole during the reflow process, which
may cause defective or poor soldering of the terminals.
①Thin and extend the tip of the foot
pattern before creating a through-hole.
②Prevent solder from reaching the land
by using a coverlay or resist.
(7)Pay attention to the following point as a pattern
peeling preventive measure when removing the
connector.
- Make the foot pattern length longer than the
coverlay opening.
In general, at least 0.3 mm.
(8)Foot pattern dimensions indicated in the drawings are
intended to achieve the minimum area on the premise
that the reflow-soldering process is used. For manual
soldering or for ensuring solder reworkability, make
a longer pattern at the terminal tip.
In general, 1/3 the
terminal pattern
width.
- Secure space for applying the soldering
iron tip.
Terminal looseness and unwanted
solder creep are preventable by
applying the soldering iron tip here.

Operation manual for Narrow-pitch connectors F4S
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF5E-5 201704
- 9 -
2) FPC board design
(1)Positions of connectors on the FPC
The FPC board is made by laminating a polyimide layer, copper foil, and adhesive
layers. Since each material has slightly different heat-shrinkable properties,
warpage may occur typically due the reflow heat in the following cases. This may
cause poor soldering. Make sure to arrange the board in a direction that minimizes
warpage.
■Example of the Assist carrier (ShinEtsu Polymer)
In case of a one-sided FPC board, warpage is
more likely to occur if a pattern is laid in a line,
or if the copper foil is applied over the entire
FPC board for noise-prevention purposes.
Since the FPC is soft, it is
difficult to keep it flat.
●Typical transfer jigs for the board
mounting process
- Magic resin (Daisho Denshi)
- Keiju board (Mitsubishi Resin)
- Assist carrier (ShinEtsu Polymer)
To keep the FPC board flat during
mounting, we recommend the use of a
“Sticky transfer jig” for the wiring board
mounting process.
Workpiece
(FPC board, etc.)
Elastomer
(Weak adhesive layer)
Elastomer
(Strong adhesive layer)
Substrate
Workpiece (FPC, etc.)
Assist carrier
Layout pin
STEP 1:
Provisional fixing of workpiece
STEP 2:
Mounting complete
STEP 3:
Removal of
workpiece
Removal pin