Panasonic P5KF User manual

ACCTF1E-4
2017.04 industrial.panasonic.com/ac/e/
P
5KF
Narrow
-pitch Connectors
Operation manual

Operation manual for Narrow-pitch connectors P5KF
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF1E-4 201704
- 1 -
Contents
01.Introduction.............................................................................................2
02.Precautions for equipment design ..........................................................3
03.Precautions during mounting-to-reflow .................................................13
04.Precautions for mating..........................................................................19
Parts that require special confirmation are bold and underlined.

Operation manual for Narrow-pitch connectors P5KF
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF1E-4 201704
- 2 -
01. Introduction
The P5KF narrow-pitch connector has a terminal pitch of 0.5 mm, and stacking height
of 1.5mm. This connector is designed for parts requiring space reduction. For this
purpose, the molded part has been downsized and made thinner.
Select models best suited to the situation and conditions of use. Read this document
before designing the equipment and starting production.

Operation manual for Narrow-pitch connectors P5KF
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF1E-4 201704
- 3 -
02. Precautions for equipment design
02-1. Precautions for mechanical design
1) Position of connectors on a board
(1) When using board to board connectors, a pair of board shall NOT be connected
with multiple connectors. Otherwise, misaligned connector positions may cause
mating failure or product breakage.
Panasonic corporation does not guarantee the failures caused by using the multiple
connectors.
(2)Solid board is tend to warp to vertical direction against mill direction of
production process. Some warp directions can cause poor soldering. Therefore,
arrange the board in a direction that can minimize warp.
This gap causes poor
soldering.
Tendency to warp easily to
production direction (horizontal direction)
It is possible to prevent poor soldering
by the arrangement of mounting
connector on the horizontal direction.
×

Operation manual for Narrow-pitch connectors P5KF
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF1E-4 201704
- 4 -
2) Position of connectors during mounting
When using a multiple-pin connector, it is preferable that the connector be placed
in a position that does not require swing motion of the mounter during pickup and
mounting. The inertial force of the swing motion of mounter often displaces the
connectors so that connector arrangement without swing operation is required.
●Connector arrangement with swing motion (rotation) during picking up and mounting
3) Prevention of problems during equipment operations
(1) Although this product is equipped with a simple locking mechanism, insert
cushioning material in the equipment enclosure in order to prevent the header
from being detached from the socket or damaged during operation.
- Please consider that there should be no gap between the enclosure and the board.
- It is recommended that holding force to the sub board be bigger than connector
insertion force.
- With regard to the cushioning material, select an appropriate shape, size and
material and position the center of the connector.（Unbalanced control causes
unmating.)
Pickup positions
Connector
Embossed tape
Main board
No inertial force
during mounting
Connector
Inertial force during
mounting
Support plate
Main board
Enclosure
Flexible PC
board
Connector
Cushioning material

Operation manual for Narrow-pitch connectors P5KF
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF1E-4 201704
- 5 -
(2) When the board fixation is not enough as the lower chart , the connector is
affected by the load of the inertial force and might be damaged.
Please consider as follows.
Shock of fall
(1) If the both boards are not fixed sufficiently,
the connector is affected by the shock and
might be damaged.
(2)
If there is no gap between enclosure and sub
board （A＜B）
, the sub board strikes against
the enclosure. Due to the impact of its strike,
the connector is affected and might be
damaged.
<Prevention>
Please fix the both main and sub-board
sufficiently
(1) Fix the main board
(Fix the side that has the larger mass and
prevent the inertial motion of drop impact.)
(2) Hold with object such as rubber cushion
not to move by the drop impact.
(3) Guide of the board is to be A≧B, to
prevent the damage of the gap made by drop
impact.
×
A<B
○
A
≧
B
Sub-board
(FPC)
Connector
Enclosure
Main board
(not fixed)
Connector
Enclosure
Main board
(fixed)
Object to hold
Sub-board
(FPC)
<Prevention>

Operation manual for Narrow-pitch connectors P5KF
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF1E-4 201704
- 6 -
02-2. Precautions for printed circuit design
1) Circuit design
(1)To obtain a good front fillet and back fillet, please review the foot pattern
dimensions recommended in the specifications or catalog for terminal foot pattern
design.
(2)Do not provide through holes on the extension of the
foot pattern. During reflow, the printed solder will be
absorbed by the through hole section, and this will
cause poor solder at the terminal section.
(3)Please control the insulation coating thickness
(resist thickness) on the pattern surface.
The coating thickness can ordinarily be controlled
to the µm level.
If the thickness is too great, it will press up on the
connector bottom, and will cause terminal poor
solder.
(4)Be sure to consult with us beforehand if you want to
perform through hole wiring on the bottom side of
the connector. Basically, you should avoid through
holes on the connector bottom side. They will cause
terminal poor solder.
(5)When mounting to an FPC board, we recommend using the type with a boss.
This makes it possible to limit connector movement during the reflow process,
and reduce soldering trouble.
Resist
Foot
pattern
Board

Operation manual for Narrow-pitch connectors P5KF
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF1E-4 201704
- 7 -
2) Flexible PC board design
(1) Positions of connectors on the FPC
FPC consists of polyimide, copper foil and bond layer. Each contraction rate of
those material by heat is different so that warp of FPC may occurred and may
cause poor soldering. Therefore, positioning connector on FPC minimizing
influence of warp.
■ Example of Assist carrier (ShinEtsu Polymer Co., Ltd)
In case of a one-sided FPC board, warpage is
more likely to occur if a pattern is laid in a line,
or if the copper foil is applied over the entire
FPC board for noise-prevention purposes.
It is difficult to keep FPC
flat because FPC is flexible
●Example of carrier for mounting process
- Magic resin (Daisho Denshi)
- Silicon gum board
(Mitsubishi Resin)
- Assist carrier
(ShinEtsu Polymer Co., Ltd)
When mounting connector, it is
recommended that the usage of carrier with
adherent surface for mounting process to keep
FPC even.
Processed part
(FPC)
Elastomer
(adhesive layer)
Elastomer
(adhesive layer)
Board material
Processed part (FPC)
Assist carrier
Pin tool foｒlayout
STEP 1:
Temporal fixation
STEP 2:
Completion of m
ounting
process
STEP 3:
Pick up after
completion
of
mounting process
Pin tool for
removing

Operation manual for Narrow-pitch connectors P5KF
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF1E-4 201704
- 8 -
(2) Flexible PC board specifications
Control the thicknesses of the coverlay and adhesive to prevent poor
soldering.
There is a clearance of approx. 0.05 mm between the bottom surface of the
terminal and the mold casing. Therefore, minimize the coverlay thickness,
otherwise poor soldering may be result.
If poor soldering occurs frequently, check the actual thickness of each insulation
layer. Generally, the coverlay thickness is set to about 30 μm, including the
adhesive. If the thickness exceeds 30 μm, remove the coverlay under the
connector from the design.
(3) This connector can be used for main board-to- FPC connection.
In case that the flexible board is too short, excessive load affects the connector
and may be shifted out.
Please design as the flexible board is appropriately slack.
Connector
terminal
Mold casting of the connector
Coverlay (polyimide)
Adhesive (Epoxy adhesive recommended)
Adhesive (Epoxy adhesive recommended)
Copper foil
Base material (polyimide)
Support plate + Adhesive
(Epoxy adhesive recommended)
fixation
Connector
Wrong:
too short
Positional gap
Motherboard
Part where
FPC board is fixed
Wrong:
too long

Operation manual for Narrow-pitch connectors P5KF
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF1E-4 201704
- 9 -
3) Support plate design
Select a support plate with an appropriate thickness and hardness to prevent
solder or the pattern from being removed during unmating of the connector.
(1) It is recommended to use glass-reinforced epoxy plates, which can easily
provide adequate hardness.
(2) When using a polyimide material to prevent lint from being generated,
follow the rules below.
- Select a plate as a thick as possible.
(Generally, plates of 0.2 mm thick or more may be used.)
- It is recommended to use a hard adhesive (epoxy-base) to bond the plate to
a flexible PC board.
- Two-ply support plates bonded with epoxy adhesive are harder than single
support plates of the same thickness.
(3) As a rule, always cut the support plate materials into pieces in the same
direction, otherwise, some plates will warp during reflow soldering and
cause poor soldering.
(It is recommended to cut the material in the direction of the reinforcing
fiber.)
(4) In order to achieve greater device thinness, methods that use metals such as
stainless steel are used for support plates when extremely thin support plates
are desired.
(5) Design the support plates so that the edges are 0.5~1.0 mm or more outside
the tips of the foot pattern traces in order to protect the soldered joints of the
connector terminals from stress caused when the connector is unmated or
when the flexible PC board is bent.
(6) Foot pattern design
When using thin support plates, take the following
measures to improve the support’s effectiveness.
- Design the foot pattern traces longer than
the coverlay opening edge. Normally, the
distance is set to approx. 0.3 mm. For
greater support, it is recommended that the
distance be at least doubled.
When the connector is
unmated, the edges are
to be 0.5~1.0mm
Support plate
0.5
～
1.0 mm
In case that support plate is thin or flexible and too large, the
support plate tends to be bent and may not be sufficiently effective.

Operation manual for Narrow-pitch connectors P5KF
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF1E-4 201704
- 10 -
4) Metal Mask Design
Since this connector is designed with low-profile, please pay attention to the
following precautions for reflow soldering.
(1) In addition to the amount of applied solder, the reflow-soldering environment and
temperature profile affect the finish quality after reflow soldering. Please make
sure to adjust the amount of solder applied after checking the finish quality in a
test run.
(2) Compared with natural air reflow soldering, N2 reflow soldering can reduce
oxidization of the melted solder surface. This significantly improves the solder
wettability. Therefore, please make sure to apply an appropriate amount of solder
(3) Do not apply an excessive amount of solder, otherwise, solder or flux may creep
near the contact section and reduce contact reliability or cause interference during
mating. Please pay careful attention.
(4) It is recommended that solder with a grain diameter of 32 μm or smaller is used
so as to print a constant amount of solder.

Operation manual for Narrow-pitch connectors P5KF
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF1E-4 201704
- 11 -
Recommended specifications of mounting pattern on PC-board and
window size of metalmasking
Product:Narrow-pitch connector P5KF series socket
(Part No.:AXK5F○○○○○)
Recommended mounting pattern on PC board (Top view)
Recommended window size of metalmasking (Top view)
Thickness of metalmasking:150μm
(Window ratio:56%)
Thickness of metalmasking:120μm
(Window ratio:69%)

Operation manual for Narrow-pitch connectors P5KF
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF1E-4 201704
- 12 -
Recommended specifications of mounting pattern on PC-board and
window size of metalmasking
Product:Narrow-pitch connector P5KF series header
(Part No.:AXK6F○○○○○)
Recommended mounting pattern on PC board (Top view)
Recommended window size of metalmasking (Top view)
Thickness of metalmasking:150μm
(Window ratio:58%)
Thickness of metalmasking:120μm
(Window ratio:72%)

Operation manual for Narrow-pitch connectors P5KF
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF1E-4 201704
- 13 -
03. Precautions during mounting –to- reflow
03-1. Mounters
We recommend that you select a multi-function mounter to mount connectors.
Even if you select a high-speed mounter, please use a multi-function head and load
control.
03-2. Precautions for selecting a pickup nozzle for
mounting connectors
Select a pickup nozzle with a pickup area that provides a theoretical lift force 10
times greater than the connector’s weight.
Theoretical lifting force (gr) = Vacuum pressure (mmHG) /760 ×1.033×Nozzle
area (cm2)
Sample vacuum pressure of machines: 480 to 520 mmHG
Shape of nozzle
Size of pickup face
Socket
Header

Operation manual for Narrow-pitch connectors P5KF
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF1E-4 201704
- 14 -
03-3. Precautions for reflow soldering
(1) Check the actual temperature profile at the connector mounting position and
check that it matches the recommended temperature profile.
(2) When the resin part of the connector is melted or deformed during reflow
soldering, check whether or not the heating temperature is excessive, or there is
an electronic component with a large heat capacity near the connector-mounting
position.
(3) If the soldering is defective, carry out the following check.
If solder reaches the contact section or its periphery, it is possible that the amount
of solder applied was excessive, or that wicking has occurred. In this case, check
the amount of solder applied and the temperature at the connector-mounting
position.
Special care is required with an N2 reflow oven.
(4) Larger front fillets can be achieved by extending the screen opening outward and
shifting the solder application position outward.
(5) Take the following precautions to minimize temperature variations among
connector terminals during reflow soldering onto flexible PC boards.
- If the base on which a flexible PC board is mounted is made of metal (e.g.
aluminum), ensure that the flexible PC board and the base are kept in close
contact.
- If a metal support plate is used, ensure closer contact between the base and the
plate (e.g. double-sided adhesive tape).
Temperature
Time

Operation manual for Narrow-pitch connectors P5KF
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF1E-4 201704
- 15 -
03-4. Manual soldering and Solder rework
This connector has been miniaturized in order to achieve a narrow pitch and an ultra-
low profile. Therefore, take great care when carrying out manual soldering or rework.
(1) When carrying out manual soldering or rework, avoid contact between the
soldering iron tip and the resin part and do not overheat the iron, otherwise the
resin will melt.
(2) During solder rework, solder should be supplied at, and the soldering iron should
be applied to the tip of each pattern trace on the PC board in order to minimize
contact with the terminals.
(3) When carrying out manual soldering or solder rework, avoid using flux if
possible in order to prevent it from rising to the contact section. (For details,
see the next page.)
(4) When using flux, apply as little as possible to each tip of the foot pattern
trace. Since this connector has an ultra-low profile, an excessive amount of flux
may cause an unwanted rise of flux and require flux cleaning.
(5) After manual soldering or solder rework, carry out an inspection or check for
solder rise and abnormalities in the contact section using a magnifying glass.

Operation manual for Narrow-pitch connectors P5KF
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF1E-4 201704
- 16 -
03-5. Detailed precautions for solder rework
(1) Flux-applying tools
In order to prevent solder from rising to the
contact section, the use of a brush pen type
flux applicator that allows an appropriate
amount of solder to be applied is
recommended.
(e.g., BON-102F, made by Japan Bonkote Co., Ltd)
(2) Selection of soldering iron (for lead-free solder in particular)
Recommendation for 0.5 mm narrow pitch connectors:
-Cutter-blade-shaped iron tip
(BJ7-KF made by Japan Bonkote Co., Ltd.)
- Iron tip with a temperature sensor
- Temperature-controllable iron tip
In addition, it is necessary to check whether
or not the displayed iron tip temperature
differs from the actual.
Recommended actual iron temperature:
340 to 360˚C
Conventional method:
Dropper type
Recommendation:
Brush pen type

Operation manual for Narrow-pitch connectors P5KF
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF1E-4 201704
- 17 -
The extended trace length should be long
enough so that the iron tip does not touch the
leads.
03-6. Detailed precautions for manual soldering
(1) General precautions
- When applying flux, apply it thinly on each foot
pattern using a brush pen as shown on the
previous page.
(Place the connector at a predetermined
position after applying flux.)
- The use of a soldering iron with a retractable-
knife shape tip as shown in the previous page is
also recommended.
- While heating with the soldering iron, it is
recommended to slide the iron tip on the foot
pattern along the terminals without touching them.
- Apply the soldering iron to the foot pattern
to heat it. Complete soldering in 1 or 2 seconds.
Connector’s resistance to soldering heat
- 300 °C: 5 sec max., - 350 °C: 3 sec max.
- Thin wire solder with a diameter of 0.3 - 0.4 mm is recommended.
- Final soldering is recommended after provisionally soldering the terminals at
both ends.
- Note that when the soldering iron touches the terminal, wicking or contact
failure may occur.
(2)Detailed precautions on how to apply the iron tip
Do not press down on the terminals with the iron
tip, otherwise, the contact may be deformed.
Do not press forward on the terminal tip with
the iron tip, otherwise, the contact may be
deformed.
Move the iron tip in
this direction.
Apply the iron tip to the end of the
foot pattern trace to heat and melt solder.
Solder wire
Soldering
iron tip

Operation manual for Narrow-pitch connectors P5KF
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF1E-4 201704
- 18 -
03-7. Cleaning flux from PC board
Cleaning this product is not needed.
If cleaning it, pay attention to the following points to prevent the negative effect to
the product.
(1) To increase the cleanliness of the cleaning fluid and cleaning operations, prepare
equipment for cleaning process beginning with boil cleaning, ultrasonic cleaning,
and then vapor cleaning.
(2) Carefully oversee the cleanliness of the cleaning fluids to make sure that the
contact surfaces do not become dirty from the cleaning fluid itself.
(3) Since some powerful cleaning solutions may dissolve molded components of the
connector and wipe off or discolor printed letters, we recommend semi-aqueous
cleaning solvent. Please consult us if you wish to use other types of cleaning
fluids.
(4) Please note that the surfaces of molded parts may whiten when cleaned with
alcohol.

Operation manual for Narrow-pitch connectors P5KF
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF1E-4 201704
- 19 -
04. Precautions for mating
04-1. Precautions for mating in assembly
This product is designed to be small and thin. The product takes ease of handling into
consideration, but position shifts during mating and slanted mating may result in
contact buckling and deformation, so please perform mating work according to the
following procedure.
-Procedure-
(1)Position the child board block so there is a rough match between the socket and
header mating positions.
(2)Move the child board block gently to the left and right and up and down, and
check that the mating positions of the socket and header roughly match.
(3)Press with a light force, and mate the connectors.
Board block
Connector
Press
Positioning and position checking
Mating