Panasonic VL-SV74BX User manual

Order No.KMA1904116CE
Video Intercom System
Model No. VL-SV74BX
VL-SV74CX
VL-SV74AZ
VL-SV74ML
VL-SV74SX
VL-SV74VN
VL-SV74VNP
Model No. VL-MV74BX
VL-MV74CX
VL-MV74AZ
VL-MV74ML
VL-MV74SX
VL-MV74VN
VL-MV74VNP
Model No. VL-V524LCE
VL-V524LSX
VL-V524LVN
Model No. VL-MB524BX
VL-MB524SX
VL-MB524VN
-S: Silver version
-W: White version
(BX for Asia, Middle Near East and Africa)
(CX for Middle East and Africa, Hong Kong, Singapore)
(AZ for Australia and NewZealand)
(ML for Malaysia)
(SX for India)
(VN/VNP for Vietnam)
© Panasonic Corporation 2019
Unauthorized copying and distribution is a violation of law.

Table of Contents
Page Page
1. Safety Precautions............................................................5
1.1. For Service Technicians.......................................................5
1.2. Insulation Resistance Test (by Insulation resistance
tester).............................................................................................5
1.3. Power Caution....................................................................... 5
2. Warning..............................................................................6
2.1. Battery Caution......................................................................6
2.2. About Lead Free Solder (PbF: Pb free)............................... 6
2.2.1. Suggested Pbf Solder.......................................................6
2.3. Discarding of P.C. Board......................................................7
2.4. Note For Repairing................................................................7
2.5. Disposal of old Equipment...................................................7
3. Specifications....................................................................8
3.1. Main monitor station (VL-MV74)...........................................8
3.2. Door phone (VL-V524L).........................................................8
4. Technical Descriptions.....................................................9
4.1. Block Diagram....................................................................... 9
4.2. IC Operation.........................................................................11
4.2.1. Monitor Station Section...................................................11
4.2.2. Door Station Section.......................................................15
5. Location of Controls and Components........................ 17
6. Installation Instructions................................................. 18
7. Operating Instructions................................................... 19
8. Service Mode...................................................................20
8.1. Things to do after replacing IC...........................................20
8.1.1. Main Monitor Station.......................................................20
9. Troubleshooting Guide.................................................. 21
9.1. Operation Check of the Door Station................................ 21
9.2. Operation Check of the Main Monitor Station.................. 25
9.2.1. Defect of Communication Between the Main Monitor
Station and Extension Monitor..................................................26
9.2.2. Defect of the Extension Monitor Video Recording..........27
9.2.3. Defect of the Main Monitor Station Power Supply.......... 28
9.2.4. Defect of the Main Monitor Station Video Recording......32
9.2.5. Defect of the Communication Between the Main Monitor
Station and the Door Station.....................................................33
9.2.6. Defect of the Communication Between the Extention
Monitor Station and the Door Station........................................34
9.2.7. Defect of the Key board unit........................................... 35
9.3. Signal Route.........................................................................36
10. Disassembly and Assembly Instructions...................42
10.1. Main Monitor Station.........................................................42
10.1.1. How to Remove the AC Cord [No.1].............................42
10.1.2. How to Remove the Cabinet Cover [No.2]....................42
10.1.3. How to Remove the Main Board, Speaker and LCD [No.
3]...............................................................................................43
10.1.4. How to Remove the Power board, Key board [No.4]....44
10.2. Door Station.......................................................................45
10.2.1. How to Remove the Front Panal [No.1]........................45
10.2.2. How to Remove the Door Station [No.2].......................46
10.2.3. How to Remove the Main Board and Camera Unit [No.3]
..................................................................................................47
10.2.4. How to Remove the Mic Board and Speaker [No.4].....48
10.2.5. Installation of the lead wires..........................................50
10.2.6. Item to be checked after completion of assembly
(camera lens angle adjustment)................................................50
11. Measurements and Adjustments.................................51
11.1. Main Monitor Station.........................................................51
11.1.1. Main Board....................................................................51
11.1.2. Factory Mode................................................................53
11.2. Door Station.......................................................................56
12. Miscellaneous............................................................... 57
12.1. How to Replace the Flat Package IC................................57
12.1.1. Preparation................................................................... 57
12.1.2. Flat Package IC Removal Procedure............................57
12.1.3. Flat Package IC Installation Procedure.........................58
12.1.4. Bridge Modification Procedure......................................58
13. Schematic Diagram.......................................................59
13.1. Main Monitor Station.........................................................60
13.1.1. Main Board (1) / External I/F.........................................60
13.1.2. Main Board (2) / BBIC...................................................61
13.1.3. Main Board (3) / DPJP3_KEY.......................................62
13.1.4. Main Board (4) / LCD....................................................63
13.1.5. Main Board (5) / External I/F_Electric lock....................64
13.1.6. Main Board (6) / DCDC.................................................65
13.1.7. Main Board (7) / AM communication_base unit............66
13.1.8. Main Board (8) / AM communication_add base unit.....67
13.1.9. Main Board (9) / KEY....................................................68
13.1.10. Power Board...............................................................69
13.2. Door Station.......................................................................70
13.2.1. Main Board....................................................................70
13.2.2. MIC Board.....................................................................71
14. Printed Circuit Board....................................................72
14.1. Main Monitor Station.........................................................72
14.1.1. Main Board (Component View).....................................72
14.1.2. Main Board (Bottom View)............................................73
14.1.3. Key Board.....................................................................74
14.1.4. Power Board.................................................................75
14.2. Door Station Board............................................................76

14.2.1. Main Board....................................................................76
14.2.2. MIC Board.....................................................................77
15. Exploded View and Replacement Parts List.............. 78
15.1. Exploded View...................................................................78
15.1.1. Main Monitor Station.....................................................78
15.1.2. Door Station..................................................................79
15.1.3. Accessories and Packing Materials Location................80
15.2. Replacement Parts List.....................................................84
15.2.1. Main Monitor Station.....................................................84
15.2.2. Door Station..................................................................93
15.2.3. Accessories and Packing Materials..............................95
15.2.4. Fixtures and Tools........................................................ 98

1 Safety Precautions
1. Before servicing, unplug the power cord to prevent an electrical shock.
2. When replacing parts, use only manufacturer’s recommended components for safety.
3. Check the condition of power cord. Replace if wear or damage is evident.
4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.
5. Before returning the serviced equipment to the customer, make the insulation resistance test to prevent a shock hazard.
1.1 For Service Technicians
•Repair service shall be provided in accordance with repair technology information such as service manual so as
to prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
•ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
1.2 Insulation Resistance Test (by Insulation resistance tester)
1. Unplug the power cord and short the two prongs of the plug with a jumper wire.
2. Measure the resistance value with ohmmeter between the jumpered AC plug and each exposed metal part, such as
screw threads, control shafts, handle brackets, etc.
Note:
Some exposed parts may be isolated from the chassis by design. These will read infinity.
3. If the measurement is outside the specified limits, there is a possibility of shock hazard. The equipment should be
repaired and rechecked before it is returned to the customer.
1.3 Power Caution
The power socket wall outlet should be located near this equipment and be easily accessible.
- 5 -

2 Warning
2.1 Battery Caution
Risk of explosion if battery is replace by an incorrect type.
Dispose of used batteries according to the instructions.
2.2 About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn),
Silver, (Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
•PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
•PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).
•If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as
possible and be sure that any remaining is melted prior to applying the Pb solder.
•When applying PbF solder to double layered boards, please check the component side for excess which may flow onto
the opposite side (See figure, below).
2.2.1 Suggested Pbf Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and
Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with
other materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
- 6 -

2.3 Discarding of P.C. Board
When discarding P. C. Board, delete all personal information such as telephone directory, caller list and recorded images or
scrap P. C. Board.
2.4 Note For Repairing
1. Before carrying out repair, inform the user that there is a possibility of the user data inside the equipment becoming lost.
2. There is a possibility that the equipment to be repaired contains personal data or set data, so take adequate care.
3. When we loan you substitute equipment in order to carry out repair, please initialize the user data and setting data of the
substitute equipment.
2.5 Disposal of old Equipment
This symbol on the products, packaging, and/or accompanying documents means that used electrical and electronic
products must not be mixed with general household waste.
For proper treatment, recovery and recycling of old products, please take them to applicable collection points in accordance
with your national legislation.
By disposing of them correctly, you will help to save valuable resources and prevent any potential negative effects on human
health and the environment. For more information about collection and recycling, please contact your local municipality.
Penalties may be applicable for incorrect disposal of this waste, in accordance with national legislation.
(Only for European Union and countries with recycling systems)
Information on Disposal
For the purpose of recycling to facilitate effective utilization of resources, please return this product to a nearby authorized
collection center, registered dismantler or recycler, or Panasonic service center when disposing of this product.
Please see the Panasonic website for further information on collection centers, etc.
http://www.panasonic.com/in/corporate/sustainability/panasonic-india-i-recycle-program.html
(India Only)
- 7 -

3 Specifications
Design and specifications are subject to change without notice.
3.1 Main monitor station (VL-MV74)
Power source: 220-240 V AC, 50/60 Hz
Power consumption: Standby: 2.3 W
During operation: 11.3 W
Dimensions (mm):
(height x width x depth) Approx. 158 x 201 x 25 (excluding protruding sections)
Mass (Weight): VL-MV74BX/VN: approx. 705 g
VL-MV74CX/ML: approx. 760 g
VL-MV74SX: approx. 730 g
VL-MV74AZ: approx. 715 g
Operating environment: Ambient temperature: approx. 0 °C to +40 °C
Relative humidity (non-condensing): up to 90 %
Display: Approx. 17.8 cm (7.0 inches wide colour display)
Talking method: Hands-free
Installation method: Wall mount (mounting bracket isupplied)
3.2 Door phone (VL-V524L)
Power source: Power supplied by the main monitor
Dimensions (mm):
(height x width x depth) Approx. 152 x 102 x 35.5 (excluding protruding sections)
Mass (Weight): Approx. 225 g
Operating environment: Ambient temperature: approx. -15 °C to +55 °C
Relative humidity (non-condensing): up to 90 %
Viewing angle: Horizontally: approx. 85°
Vertically: approx. 54°
Installation method: Wall mount (mounting base supplied)
Flush mount (flush mount box sold separately)
Minimum illuminance required: 1 lx (within approx. 50 cm from the camera lens)
Lighting method: LED lights
- 8 -

4 Technical Descriptions
4.1 Block Diagram
The block diagram of Video intercom system is shown in Fig 4.1.
Image signal root:
The image data is converted into NTSC signal by Camera unit, and the NTSC signal is modulated into FM signal.
FM signal is sent to the Monitor station through the interphone cable with ASK signal which modulated from command signal
and voice signal. Demodulated NTSC signal is displayed on the LCD of Monitor station.
Route to Extention monitor:
The buffered FM signal is sent to the extention monitor through the interphone cable with ASK signal which modulated from
command signal and voice signal.
Demodulated NTSC signal is displayed on the LCD of Extention monitor.
Voice signal root:
The voice signal from the microphone of Door station is sent through the hybrid circuit(HYB), and interphone cable to the
speaker of Monitor station. While the voice from the microphone of Monitor station reaches the speaker of the Door station
through the reverse route.
Route to Extention monitor:
The voice signal from Door station is sent through another HYB, and interphone cable to Extention monitor.
In Extention monitor, The voice signal from Monitor station is sent through HYB and Sub CPU to the speaker of Extention
monitor.
While the voice from the microphone of Extention monitor reaches the speaker of the Door station through the reverse route.
Command signal route:
The CPU command on Door station is modulated to ASK signal and sent to the Monitor station.This ASK signal is
demodulated in Monitor station to pass to the CPU, and vice versa. (2-way communication)
Route to Extention monitor:
The Main CPU command of Monitor station is modulated to ASK signal and sent to Extention monitor.
This ASK signal is demodulated in Extention monitor to pass to Main CPU, and vice versa. (2-way communication)
Fig. 4.1. Video intercom system block diagram
- 9 -

Call Signal from Door station:
When the call button is pressed in Stand-by mode, the short between lines causes the DC voltage of the interphone cable to
go down. The monitor station detects this voltage reduction and then rings. Then LCD of the Monitor station is turned ON.
Fig. 4.2. Call signal from Door station
Communication to Extention monitor:
When the call is detected by Monitor station.
The Main CPU command of Monitor station is modulated to ASK signal and sent to Extention monitor.
This ASK signal is demodulated by Extention monitor.
Extention monitor detects this call and then rings.
Then LCD of Extention monitor is turned ON.
- 10 -

4.2 IC Operation
4.2.1 Monitor Station Section
4.2.1.1 Main Monitor station Diagram
Switching
Door sta 2 detection circuit
Door sta 1 detection circuit
Door Opener 1 Door Opener 2
2 22
2 2 2 2 2 2 2 2
CN600
Power supply circuit for door sta +22V
+12V
V5A FM power
supply circuit
NTSC Signal
VDD33 3VB (X390)
32kHz
VDD33
+
VDD33
VDD33
VDD33
SPI 1 SPI 3
UART2 UART1
UART 3
SPI 2
DPJP3
IC100
Main CPU
VDD12
VDD33 VDD12
1.2V DCDC
SDRAM
(128Mbit)
(IC300)
SCLK,SDA
CKE,CLK,UB,LB,CS,RAS,
CAS,WE
ABUS[0-15]
DBUS[0-15]
RTC
I2C
FM demodulation/ ASK communication (IC670)
Switching
AMP
AM Signal
AM communication circuit
Debug
Serial
BBIC
Serial
BBRX()
AM communication circuit
External input
External input
External input 1 External input 2
AC/DC
circuit
DC/D
VDD40 +4VRF
+4VSP BB1.8V
VDD33
RF3.2V
BB3.3V BB1.8V
AVDD33
VDD50
22V
SP
(IC801) (IC582)
(IC760)
(IC582) (IC500)
AMP
AMP
AMP
AMP
AMP
AMP
MIC
+12V
3.3VREG
DC/D DC/D
Electric Lock control 1 Electric Lock control 2
Electric Lock Electric Lock
Sub monitor IN
Sub monitor OUT Sub monitor OUT Sub monitor OUT
Power supply for Core Power supply for I/O Power supply for RF VDDIO_EBI
BB3.3V
BB1.8V
BB1.8V
JTAG BBIC_TX_RES,BBIC_TX BBIC_RX_RES,BBIC_RX,BBIC_nFREEZE
LCD_HD,LCD_VD,LCD_CLK,LCDC_TX. LCDC_CK.LCDC_CS,LCD_nRST
VDD33 (CN200)
7''
800 480
WVGA
LCD
QSPI(128Mbit)
LCD_R[0-7],LCD_G[0-7]
BBIC_SPI_TX,BBIC_SPI_CLK, BBIC_SPI_RX
Debug Serial
DBGD,DGBC
RSTB
LED[1]
Debug Serial
AM32
JTAG
VDD33
VDD60
RESET_SW
(SW100)
27MHz (X380)
STOP BL_ON BL circuit
(IC970)
Touch
Controller
(IC1002)
DC/DC
(IC1001)
PAD PAD
V12
TALK KEY_RST I2C_SDA I2C_SCL KEY INT
RST GND +5V SDA SCL INT
RST
IC
(IC101)
BB_nRST
J2_CONT
A2_IN A1_IN
BBIC_DOWNLD
AM2_TX,AM2_RX
AM_RX
MODE_SE
(IC160)
(IC642)
J1_CONT
BBTX( ), BBRX( )
(IC500)
JTAG
QSPI(8Mbit)
D[0-15]
A[1-16]
SRAMCS
10.368MH
(X401)
EEPROM(64Kbit)
(IC401)
SRAM(1Mbitor2Mbit)
(IC404)
CA_CALL
V_SEL1*
2
V_SEL2*
CB_CALL
SUB_TALKON
LOGIC_CNT
EXV_CNT1
EXV_CNT2
LOGIC_CNT
DPH_SEL1
CAM_PWR
MODE_SEL
AM_TX
AM_PWM
LINE_Z
DOUT_IN
FM_ON
AM_TX
AM_RX
AM_PWM
PBX_IF
Power Board
Key Board
CN601
PBX I/F
Sub CPU
IC405
20
6
URAT_CNT
VL-MV74 : Main monitor station diagram
- 11 -

4.2.1.2 Main Board
4.2.1.2.1 External Interface Part
Regulator for Power 5V (IC910)
Input voltage: +12V
Output voltage: +5V
Package: 8pin SOP-8
Outline of Operation: It generate from +12V to +5V.
Regulator for BBIC & SP AMP 4V (IC930)
Input voltage: +12V
Output voltage: +4V
Package: 8pin SOP-8
Outline of Operation: It generate from +12V to +4V.
Regulator for 3.3V (IC920)
Input voltage: +12V
Output voltage: +3.3V
Package: 8pin SOP-8
Outline of Operation: It generate from +12V to +3.3V.
FM Demodulation (IC670)
Operating Power Supply : +5V
Package: 24pin SOP
Outline of Operation: The video signal (FM) from the Door
Station is demodulated.
Regulator for 5V (IC671)
Input voltage: +12V
Output voltage: +5V
Package: 5pin SOT-25A.
Outline of Operation: It generate from +12V to +5V (FM
Demodulation).
OP AMP for Door station (IC500)
Operating Power Supply : +12V
Package: 8pin SSOP-8
Outline of Operation: The sound signal (send & receive)
are converted to 2 line from 4 line.
PBX OFF-HOOK detection photo coupler (IC800)
Operating Power Supply : +3.3V
Package: 4pin
Outline of Operation: The off hook signal is detected.
OP AMP for PBX 2/4 conversion (IC801)
Operating Power Supply : +12V
Package: 8pin SSOP-8
Outline of Operation: The sound signal (send & receive)
are converted to 2line from 4line.
- 12 -

4.2.1.2.2 Audio Part
Sub CPU (IC405)
Operating Power Supply : +3.3V
Operating Power Supply : +4V (SP AMP)
Operating Power Supply : +3.2V (RF)
Operating Power Supply : +1.8V (Core)
Package: 206pin
Package Size: 15 x 15 mm
Outline of Operation: Baseband signal processing/Sound
signal processing/Part of RF and voice control.
System clock frequency: 10.368MHz (X401)
8M FROM (IC402)
Operating Power Supply : +1.8V
Package: 8pin SOIC
Memory capacity: 8Mbit
Outline of Operation: Storing the program of IC405.
EEPROM(IC401)
Operating Power Supply : +3.3V
Package: SOP-J8
Memory capacity: 64kbit
Outline of Operation: Storing the parameter of IC405.
1MSRAM (IC404)
Operating Power Supply : +1.8V
Package: 48-ball VFBGA
Memory capacity: 1Mbit
Outline of Operation: Work area of IC405.
4.2.1.2.3 Video/Timer/LCDIF/TSP Part
OP AMP for LCD_BL Circuit (IC270)
Operating Power Supply : +3.3V
Package: 8pin SSOP-8
Outline of Operation: Control of LCD_BL current.
Timer (IC390)
Operating Power Supply : +3V
Package: 8pin SNT-8A
Outline of Operation: timer of IC100.
System clock frequency: 32.768KHz (X790).
4.2.1.2.4 DPJP3 Part
DPJP3 (IC100)
Operating Power Supply : +1.2V +3.3V
Package: 216pin LQFP216
Package: 26 x 26 mm
Outline of Operation: Video signal processing/Part of LCD
and the other control.
System clock frequency: 27MHz
SDRAM(IC300)
Operating Power Supply: +1.2V +3.3V
Package: 54pin TSOP II
Memory capacity: 128Mbit
Outline of Operation: Work area of IC100.
FLASH MEMORY(IC350)
Operating Power Supply: +3.3V
Package: 8pin SOIC
Memory capacity: 128Mbit
Outline of Operation: Storing the program of IC100.
- 13 -

4.2.1.3 Power Board
4.2.1.3.1 Power Supply Part
Power control IC (IC1)
Input voltage: AC 220V~240V
Output voltage: DC 23V, DC 12V
Package: 8pin DIP
Outline of Operation: It generate from AC 220V~240V to DC 23V, DC 12V.
4.2.1.4 KEY Board
4.2.1.4.1 Key Part
Regulator for Power 3.3V (IC1001)
Input voltage: +5V
Output voltage: +3.3V
Package: 5pin SOT-89-5
Outline of Operation: It generate from +5V to +3.3V.
Touch Button Controller(IC1002)
Operating Power Supply: +3.3V
Package: 28pin MLPQ-UT28
Outline of Operation: Detect capacitance change caused by touching button.
- 14 -

4.2.2 Door Station Section
4.2.2.1 Door station Diagram
MAIN Board
MIC
Speaker
Call Button
[SW301]
LED
[LED1]
+5V
Regulator
[IC202]
Trans
[T1]
To Monitor
Voice
Amplifier
[IC100]
+5V
SP amp
[IC102]
2
2
2
Diode
Bridge
[D2-D5]
Camera Unit
FM Signal
Modulator
[IC200]
+5V
Video signal
FM signal
DC 20V
MCU
[IC203]
White LED
[LED200, LED201]
VL-V524L : Door station diagram
AM signal
Illumination
sensor
[IC204]
6
- 15 -

4.2.2.2 Main Board
Call Button (SW301)
Outline of Operation : When a visitor presses the Call Button, a chime tone will ring at the monitor station.
FM Signal Modulator (IC200)
Operating Power Supply : +5V (+5V : 2, 9pin)
Package : 24pin SOP
Outline of Operation : The frequency modulation of the video signal taken in from Camera Unit is carried out.
+5V Regulator (IC202)
Input Voltage : +20V
Output Voltage : +5V
Package : SOT-23-6W
Outline of Operation : It generate from +20V to +5V.
Voice Amplifier (IC100)
Operating Power Supply : +5V
Package : 8pin SSOP8
Outline of Operation :
•The voice signal from the Microphone is amplified and sent to the Monitor Station.
•The voice signal from the Monitor Station is amplified and sent to the SP amp (IC102).
Speaker Amplifier (IC102)
Operating Power Supply : +5V
Package : VSP-8pin
Outline of Operation : The voice signal from the Voice amp (IC100) is amplified and sent to the Speaker.
MCU (IC203)
Operating Power Supply : +5V
Package : 32pin QFP
Outline of Operation :
•It communicates with the Monitor Station by AM signal through IC200.
•It controls of the camera, the electric lock, and the lighting, by the operation from the Monitor Station.
•Control (zoom processing, backlighting compensation) of a camera is carried out by I2C communication.
•At night, MCU turns on LED200 and LED201 automatically based on the information from IC204.
Illumination sensor (IC204)
Operating Power Supply: +5V
Package: 4pin COB
Outline of Operation: The surrounding brightness is detected and the level is outputted to MCU.
- 16 -

5 Location of Controls and Components
Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
- 17 -

6 Installation Instructions
Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
- 18 -

7 Operating Instructions
Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
- 19 -

8 Service Mode
8.1 Things to do after replacing IC
If repairing FLASH Memory, EEPROM, it is necessary to initialize and adjustment. The set doesn't operate if it is not executed.
8.1.1 Main Monitor Station
GND (black)
UTX (yellow)
To Serial Port
(COM port *1)
JIG Cable
CL109 (GND)
CL107 (DP1)
CL108 (DP2)
URX (red)
1. Connect the AC cord into the power outlet.
2. Connect the PC to the Main monitor using the 3-Wire cable, as shown below.
1. Serial JIG cable: PQZZ1CD300E
2. PC in which "Tera Term (Ver. 4.78 later)" (communication software) is installed
3. Macro file CD-ROM for setting: PNZZN511EX
Procedure
Preparation
Main Board
(Main Monitor Station)
3. Start the communication software (Tera Term). The settings are shown below.
4. To confirm the connection, type in "EPD F", then press the Enter key. The response is "OK".
5. Refer to the “Measurements and Adjustments” for adjustment.
6. Disconnect the AC cord, and disconnect the 3-wire cable.
PC
Note:
*1 COM port names may vary depending
on what your PC calls it.
Check COM port number in advance.
ձOpen "Tera Term", select "Serial Port: COM䕕" at "Tera Term: New connection", then click "OK".
ղSelect "Terminal" on the tab of "Setup" to open "Tera Term: Terminal setup".
ճSelect "Receive: CR+LF" and "Transmit: CR" at "New-Line". And then click "OK".
մSelect "Serial port" on the tab of "Setup" to open "Tera term: Serial port setup". And then select the below items,
then click "OK".
Baud rate: 57600
Data: 8 bit
Parity: none
Stop: 1 bit
Flow control: none
յSelect [Setup] Ѝ[Terminal...] It checks to Local echo.
նSelect [Control] Ѝ[Macro] Attached macro (dp3_term.ttl) is performed.
- 20 -