Panasonic KX-NS500AG User manual

© Panasonic System Networks Co., Ltd. 2014
Unauthorized copying and distribution is a violation
of law.
ORDER NO. KMS1409096CE
Hybrid IP-PBX
Model No. KX-NS500AG
(for Argentina)

2
KX-NS500AG
TABLE OF CONTENTS PAGE PAGE
1 Safety Precautions -----------------------------------------------4
1.1. For Service Technicians ---------------------------------4
1.2. Insulation Resistance Test-------------------------------4
2Warning--------------------------------------------------------------4
2.1. Battery Caution ---------------------------------------------4
2.2. Caution--------------------------------------------------------4
2.3. About Lead Free Solder (PbF: Pb free) --------------5
2.3.1. Suggested PbF Solder-------------------------------5
2.4. Discarding of P. C. Board --------------------------------5
3 Specifications ------------------------------------------------------6
3.1. General Description ---------------------------------------6
3.2. Characterstics-----------------------------------------------6
4 Technical Descriptions------------------------------------------7
4.1. Block Diagram ----------------------------------------------7
4.2. Main Unit -----------------------------------------------------9
4.2.1. CPU Board (MPR) ------------------------------------9
4.2.2. Main Unit Mother Board ---------------------------10
4.2.3. SLIC/CODEC (SLC) Block------------------------10
4.2.4. DSP (LCOT) Block----------------------------------10
4.2.5. DPT I/F Block-----------------------------------------10
4.3. Expansion Unit-------------------------------------------- 11
4.3.1. CPU Board (SPR) ---------------------------------- 11
4.3.2. Expansion Unit Mother Board--------------------12
4.3.3. SLIC/CODEC (SLC) Block------------------------12
4.4. Power Circuit----------------------------------------------13
4.5. Power Supply Unit ---------------------------------------14
4.5.1. Block Diagram and Circuit Description of
PSU-----------------------------------------------------14
4.6. AC input, Rectification Smoothing Circuit----------14
4.7. Main Converter -------------------------------------------15
4.8. Output voltage --------------------------------------------16
4.9. Battery voltage input and output----------------------18
4.10. Alarm Signal Sending Circuit--------------------------19
4.11. Protection Circuit-----------------------------------------20
5 Location of Controls and Components------------------21
5.1. Name and Locations ------------------------------------21
6 Installation Instructions---------------------------------------22
6.1. System Components------------------------------------22
7 Operating Instructions ----------------------------------------22
7.1. System Capacity -----------------------------------------22
8 Test Mode----------------------------------------------------------22
8.1. Utillity--------------------------------------------------------22
9 Troubleshooting Guide----------------------------------------23
9.1. MPR/SPR/Mother Board -------------------------------23
9.1.1. Startup--------------------------------------------------24
9.1.2. Battery Alarm-----------------------------------------28
9.1.3. Using Voice Mail-------------------------------------29
9.1.4. Others--------------------------------------------------31
9.1.5. SLIC/CODEC (SLC) Block------------------------31
9.1.6. DSP (LCOT) Block----------------------------------31
9.1.7. DPT I/F Block-----------------------------------------31
9.2. Power Supply ---------------------------------------------32
9.2.1. No Voltage is Output at All (1)--------------------32
9.2.2. No voltage is Output at All (2)--------------------33
9.2.3. 41V are Not Output ---------------------------------34
9.2.4. Battery Backup Function Does Not
Operate / PSU can Not Charge Batteries-----35
10 Disassembly and Assembly Instructions---------------36
10.1. Mother Board and CPU Board ----------------------- 36
10.2. Fan and Power Supply Board ------------------------ 37
11 Miscellaneous --------------------------------------------------- 38
11.1. How To Replace a Flat Package IC----------------- 38
11.1.1. Preparation------------------------------------------- 38
11.1.2. Removal Procedure-------------------------------- 38
11.1.3. Procedure--------------------------------------------- 38
11.1.4. Removing Solder From Between Pins--------- 38
11.2. How to Replace the LLP (Leadless Leadframe
Package) IC and IC ground plate-------------------- 39
11.2.1. Preparation------------------------------------------- 39
11.2.2. Caution ------------------------------------------------ 39
11.2.3. How to Remove the IC ---------------------------- 39
11.2.4. How to Install the IC-------------------------------- 39
11.2.5. How to Remove a Solder Bridge (Doesn't
apply to IC ground plate.)------------------------- 40
11.3. Terminal Guide of the ICs, Transistors and
Diodes------------------------------------------------------ 41
11.3.1. Mother Board ---------------------------------------- 41
11.3.2. CPU Board ------------------------------------------- 42
11.3.3. Power Supply Board ------------------------------- 43
12 Schematic Diagram -------------------------------------------- 44
12.1. Mother Board --------------------------------------------- 44
12.1.1. No.1 ---------------------------------------------------- 44
12.1.2. No.2 ---------------------------------------------------- 46
12.1.3. No.3 ---------------------------------------------------- 48
12.1.4. No.4 ---------------------------------------------------- 50
12.1.5. No.5 ---------------------------------------------------- 52
12.1.6. No.6 ---------------------------------------------------- 54
12.1.7. No.7 ---------------------------------------------------- 56
12.2. Memo------------------------------------------------------- 59
12.3. CPU Board ------------------------------------------------ 60
12.3.1. No.1 ---------------------------------------------------- 60
12.3.2. No.2 ---------------------------------------------------- 62
12.3.3. No.3 ---------------------------------------------------- 64
12.3.4. No.4 ---------------------------------------------------- 66
12.3.5. No.5 ---------------------------------------------------- 68
12.3.6. No.6 ---------------------------------------------------- 70
12.4. Relay Board----------------------------------------------- 72
12.5. Memo------------------------------------------------------- 73
12.6. Power Supply Board------------------------------------ 74
12.7. Waveform-------------------------------------------------- 78
12.7.1. CPU Board Voltage--------------------------------- 78
12.7.2. CPU Board Reset Signal-------------------------- 81
12.7.3. CPU Board Clock----------------------------------- 83
12.7.4. CPU Board NAND Access------------------------ 85
12.7.5. CPU Board SRAM Access ----------------------- 87
12.7.6. Power Supply Board ------------------------------- 88
13 Printed Circuit Board------------------------------------------ 89
13.1. Mother Board --------------------------------------------- 89
13.1.1. Component View------------------------------------ 89
13.1.2. Bottom View------------------------------------------ 90
13.2. CPU Board ------------------------------------------------ 91
13.2.1. Component View------------------------------------ 91
13.2.2. Bottom View------------------------------------------ 92
13.3. Reley Board----------------------------------------------- 93
13.3.1. Component View------------------------------------ 93
13.3.2. Bottom View------------------------------------------ 93

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KX-NS500AG
13.4. Memo--------------------------------------------------------94
13.5. Power Supply Board-------------------------------------94
13.5.1. Component View-------------------------------------94
13.5.2. Bottom View-------------------------------------------95
14 Appendix Information of Schematic Diagram ---------96
15 Exploded View and Replacement Parts List -----------97
15.1. IC Date ------------------------------------------------------97
15.1.1. IC400 ---------------------------------------------------97
15.1.2. IC401 ---------------------------------------------------99
15.1.3. IC201 -------------------------------------------------101
15.2. Cabinet and Electrical Parts -------------------------109
15.2.1. PSU --------------------------------------------------- 110
15.3. Accessories and Packing Materials---------------- 111
15.4. Replacement Parts List ------------------------------- 112
15.4.1. Cabinet and Electrical Parts -------------------- 112
15.4.2. Accessories and Packing Materials----------- 112
15.4.3. Mother Board Parts-------------------------------- 112
15.4.4. CPU Board Parts ----------------------------------123
15.4.5. Power Supply Board parts-----------------------127
16 Appendix---------------------------------------------------------131

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KX-NS500AG
1 Safety Precautions
1. Before servicing, unplug the AC power cord to prevent an electric shock.
2. When replacing parts, use only the manufacturer's recommended components.
3. Check the condition of the power cord. Replace if wear or damage is evident.
4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.
5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent
the customer from being exposed to shock hazards.
1.1. For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent fires,
injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
1.2. Insulation Resistance Test
1. Unplug the power cord and short the two prongs of the plug with a jumper wire.
2. Turn on the power switch.
3. Measure the resistance value with ohmmeter between the jumpered AC plug and each exposed metal cabinet part, such as
screw threads, control shafts, handle brackets, etc.
Note:
Some exposed parts may be isolated from the chassis by design. These will read infinity.
4. If the measurement is outside the specified limits, there is a possibility of shock hazard. The equipment should be repaired
and rechecked before it is returned to the customer.
2Warning
2.1. Battery Caution
1. Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the
manufacturer. Dispose of used batteries according to the manufacturer's lnstructions.
1. The lithium battery is a critical component (type No.CR2354). Please observe for the proper polarity and the exact location
when replacing it and soldering the replacement lithium battery in.
2.2. Caution
The power socket wall outlet should be located near this equipment and be easily accessible.

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KX-NS500AG
2.3. About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50~ 70F, (30~ 40C) higher than Pb solder. Please use a soldering iron with tempera-
ture control and adjust it to 700± 20F, (370± 10C).
Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100F, (600C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
2.3.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
2.4. Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.

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KX-NS500AG
3 Specifications
3.1. General Description
*1 Except the 19-inch rack mounting equipment
3.2. Characterstics
Main CPU Cortex A8 600 MHz
Power Input 100 V AC to 130 V AC: 2.2 A/200 V AC to 240 V AC: 1.3 A;50 Hz/60 Hz
Power Consumption (when fully mounted) 110 W
External Backup Battery External battery port is not supported.
Memory Backup Duration 7 years
Dialling Trunk Dial Pulse (DP) 10 pps, 20 pps
Tone (DTMF) Dialling with Caller ID (FSK/DTMF)
1600 Maximum
Extension Dial Pulse (DP) 10 pps, 20 pps
Tone (DTMF) Dialling with Caller ID (FSK)
SLC1 and 2 port support PFT in combination with the LCOT1 and LCOT2 port connected to
an analogue trunk respectively.
Mode Conversion DP-DTMF, DTMF-DP
Ring Frequency 20 Hz/25 Hz (selectable)
Operating
Environment Temperature 0 C to 40 C
Humidity 10%to 90% (non-condensing)
Conference Call Trunk From 10 x 3-party conference call to 4 x 8-party conference call
Music on Hold (MOH) Maximum 8 ports (Level Control: 31.5 dB to +31.5 dB per 0.5 dB)
MOH: Selectable Internal/External Music Source port
External Paging Maximum 6 Ports (Volume Control: -15.5 dB to per 0.5 dB)
LAN Port 1 (for LAN connection) 10BASE-T/100BASE-TX (Auto MDI/MDI-X)
Extension Connection Cable SLT 1-pair wire (T, R)
DPT 1-pair wire (D1, D2) or
2-pair wire (T, R, D1, D2)
PT-interface CS 1-pair wire (D1, D2)
PT-interface CS (High-density) 4-pair wire (D1, D2)
DSS Console and Add-on Key Module 1-pair wire (D1, D2)
Air-cooling method FAN
Dimension 430 mm (W) x 88 mm (H) x 367 mm (D)
Weight (when fully mounted) Under 4.5 kg *1
Terminal Equipment Loop Limit • SLT: 600 including set
• Doorphone: 20 
Minimum Leakage Resistance 15 000 maximum
Maximum Number of Extension
Instruments per Line 1 for SLT
Ring Voltage 65 Vrms at 20 Hz/25 Hz depending on the Ringing Load
Trunk Loop Limit 1600 maximum
Hookswitch Flash/Recall Timing Range 24 ms to 2032 ms
Door Opener Current Limit 24 V DC/30 V AC, 1 A maximum
External Sensor Current Limit Power to the external sensor is provided from the DPH2 card and must be grounded
through the DPH2 card. For the connection diagram.
The PBX detects input from the sensor when the signal is under 100 .
Paging Terminal Impedance 600 
MOH (Music on Hold) Terminal Impedance 10 000 

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KX-NS500AG
4 Technical Descriptions
4.1. Block Diagram
The NS500 series PBX is constructed in Main Unit (NS500) and up to three expansion unit (NS520).
In Main Unit (NS500), CPU Board (MPR) (Master Processor) which controlls whole call of this system is equipped, and, in an
expansion unit, CPU Board (SPR) (Slave Processor) controlling various line interfaces in the unit is equipped with.
Each expansion units are connected to Main Unit with star topology, and time slot exchange function is equipped in Main Unit.
The exclusive interface between basic and expansion units are built with one pair of TDM interface of 8.192MHz, and voice chan-
nel, control channel and addition information channel are secured.
All interface cards except digital extension intefarce (DHLC/DLC) are controlled by CPU Board (MPR)/CPU Board (SPR) directly.
Table.1 Main Unit Card Description
Table.2 Expansion Unit Card Description
Card Description
CPU Board (MPR) Master CPU of NS500 system which controls Main Unit and up to three expansion unit.
Main Unit Mother Board
(LCOT6+MCSLC16+DLC2) Ext and Trunk combo card which support analog trunk (6ch), analog extension line (16ch) and digital exclusive line (2ch).
Card Description
CPU Board (SPR) CPU Board (SPR) is a sub CPU card controlling the line card in the expansion unit.
Expansion Unit Mother Board
(MCSLC16) Extension line card.
MPR
CortexA8
600MHΈ
Master
FPGA
DPT
I/F
2port
PLD1
Extension
ίEXT_PLDὸ
MCSLC16
S-lab
SLIC/CODEC
x8
LCOT6
DSPG
DE56x3
DSP
RMT
NAND
1GB
SRAM
512KB
EXP-M
DDR3
512MB
Extension
Trunk/DPH
TDM Bus
CPU Bus
IIO SPI
LED(2)/SW(1)/USB Host(1)
Mother Board
CPU
SD Card
PLD2
Trunk
ίCO_PLDὸ
Fig.1 Block Diagram
Main Unit

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KX-NS500AG
Table.3 Main Unit Option Card Description
Card Description
SD(L/M/S) SD card is used for strage memory of UM. SD card is implemented on CPU Board (MPR) .
The capacity of SD card are:
SD(M):16GB§SD(L):8GB§SD(XS):2GB
In the case of NS500, it is necessary to implement it when using a VoIP functions.
RMT Modem card which is userd for remote maintenance purpose.
This card is implemented on MRP card.
DSP(L/M/S) DSP option cards (KX-NS0112/NS0111/NS0110) are used to realize VoIP function, UM function, a voice confer-
ence function.
NS500 can implement only DSP-S.
EXP-M EXP-M is the expansion interface card which connects up to three expansion units to a Main Unit.
In each unit interval, below signals are connected:
1) 8.192MHz clock to supply from a Main Unit to an expansion unit by reference clock
2) Frame header signal of 8KHz
3) TDM bus of 8.192MHz from/to basic and expansion unit.
The TDM bus takes advantage of 128 time slots for a voice, control, addition information channel.
Exchange of the non-blocking is possible by a time switch in the Main Unit.

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KX-NS500AG
4.2. Main Unit
The Main Unit is constructed by CPU Board (MPR) and Mother Board. The block diagram and operation of each card are
described here.
4.2.1. CPU Board (MPR)
Fig.2 shows detail block diagram of CPU Board (MPR) , and each function of CPU Board (MPR) is described in Table.4.
Table.4 CPU Board (MPR) Function Description
Device/Function Block Description
CPU CPU controls exchange and monitoring functions of the whole NS500 system.
DDR3 DDR3 is main memory of CPU Board (MPR). Operating system, application program and concerning data are
stored in this memory.
NAND Flash Program and system data are stored in this memory.
SRAM SRAM is backed up by battery, and system information is stored this non-volatilized memory.
FPGA FPGA provides basic PBX function such as time switch, tone generation and so on.
USB USB master port for maintenance.
L2SW/LAN(RJ45) LAN port is used for VoIP and Web-MC connection.
SD Card UM voice data are stored in this SD card.
RTC RTC is battery backed up clock which maintains system clock of NS500 system.
ARM
Cortex- A8
600MHz
L1 32K/32K w/SED
L2 256K w/ECC
176K ROM 64K RAM 64K RAM
Crypto
DDR
Interface
DDR3
512MB
NAND
NAND
FLASH
1GB
UART
McASP
Ethernet
USB
SD
GPIO
Interrupt
etc.
DC/DC(+3.3V,+1.8V,+1.1V)
I2C
AC_ALM, DC_ALM, System Reset, FPGA_REBOOT, DONE
EXP-M
Connector
DSP option
Connector
RMT Option
Connector
Master
FPGA
USB
TypeA
LAN
RJ45
RMII
USB- Host- I/F
SRAM
512KB
LED
RTC
+5V
External bus
ER,DR
SLIDE SW
SD-I/F
80PIN CONNECTOR (CPUInterface)
TDM
L2SW
PHY
STATUS
PBX MODE
PHY
PHY
DC/DC
+3.3V
+15V
8bit
8bit
16bit
SD-Card
Connector
16bit
+5V +VBAT
Expansion bus
UART-I/F
+5V
Fig.2 CPU Board (MPR) Block Diagram

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KX-NS500AG
4.2.2. Main Unit Mother Board
Fig.3 shows detail block diagram of Mother Board, and each function of Base is described in Table.5.
Table.5 Main Unit Mother Board Function Description
4.2.3. SLIC/CODEC (SLC) Block
Refer to Service Manual of KX-NS5173/KX-NS5174.
4.2.4. DSP (LCOT) Block
Refer to Service Manual of KX-NS5180.
4.2.5. DPT I/F Block
Refer to Service Manual of KX-NS5170/KX-NS5171/KX-NS5172.
Device/Function Block Description
PLD1(EXT_PLD) PLD1 controls and monitors SLIC/CODEC LSI of each analog line port.
PLD2(CO_PLD) PLD2 controls the trunk controller DSP which is used in each analog trunk port.
SLIC/CODEC SLIC/CODEC is exclusive LSI which is used for analog line interface.
1) Line interface power supply
2) Dial pulse detection
3) DTMF receiver / Caller ID generation
4) Bell signal generation
5) Hooking detection / Ringtrip detection
6) 2W/4W conversion
7) CODEC function
DSP(CO) DSP(CO) is exclusive LSI which is used analog trunk port.
1) Dial pulse generation
2) DTMF signal generation / Caller ID detection
3) Bell signal detection
4) CPC signal detection
5) 2W/4W conversion
6) CODEC function
DPT I/F DPT I/F is Digital Line Interface.
6
Trunkoption
Connector
Extension option
Connector
80PIN CONNECTOR (CPU Interface)
RJ45
MOH
PAG
RJ45
RJ45
POWER I/F
Connector
Expansion bus
SLIC/CODEC bus (SPI)
TDM Highway bus
AFE
DSP
(2ch) AFE
AFESLIC/CODEC(2ch)
AFE
AFE
AFE
AFE
AFE
AFE
AFE
SLIC/CODEC(2ch)
SLIC/CODEC(2ch)
SLIC/CODEC(2ch)
SLIC/CODEC(2ch)
SLIC/CODEC(2ch)
SLIC/CODEC(2ch)
SLIC/CODEC(2ch)
DPT
I/F
(2ch)
DSP
(2ch)
ACALM, DCALM +40V, GND
+15V, GND
Dial Pulse, CPC DET
Dial Pulse, CPC DET
RJ45
RJ45
RJ45
IIO bus
PLD1
(EXT_PLD)
DSP
(2ch) AFE
Dial Pulse, CPC DET
DPT-I/F
FAN I/F
Connector
VBAT
+15V, GND
PLD2
(CO_PLD)
INT(2)
DC/DC
+3.3V, GND
15
12V
INT_SLIC
INT_DSP
INT
INT_EXT
INT_CO
FAN_ALM
RJ45
MOH
PAG
RJ45
MOH
PAG
CO1-CO2
CO2-CO3
CO4-CO5
Relay
RJ45
SLT2
SLT1
Fig.3 Main Unit Mother Board BlockDiagram

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KX-NS500AG
4.3. Expansion Unit
The expansion unit is constructed by CPU Board (SPR) and Mother Board. The block diagram and operation of each card are
described here.
4.3.1. CPU Board (SPR)
Fig.4 shows detail block diagram of CPU Board (SPR), and each function of CPU Board (SPR) is described in Table.6.
Table.6 CPU Board (SPR) Function Description
Card Description
CPU CPU controls the line card in the expansion unit by the control from an CPU Board (MPR).
DDR3 DDR3 is main memory of CPU Board (SPR). Operating system, application program and concerning data are
stored in this memory.
NAND Flash CPU program is stored in this memory.
FPGA FPGA provides control and monitoring function of each line card.
ARM
Cortex- A8
300MHz
L1 32K/32Kw/SED
L2256Kw/ECC
176K ROM 64K RAM64K RAM
Crypto
DDR
Interface
DDR3
128MB
NAND NAND
FLASH
256MB
UART
SD
GPIO
Interrupt
etc.
DC/DC(+3.3V,+1.8V,+1.1V)
AC_ALM, DC_ALM, SystemReset, FPGA_REBOOT, DONE
Slave
FPGA
LED
+5V
Externalbus
80PIN CONNECTOR (CPU Interface)
STATUS
DC/DC
+3.3V
+15V
8bit
8bit
+5V+VBAT
LVDS
Down
Highway
Up
Highway
FH+CLK
(8MHz)
Interrupt
Exp I/F
RJ45
NETREF
Expansion bus
Fig.4 CPU Board (SPR) BlockDiagram

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KX-NS500AG
4.3.2. Expansion Unit Mother Board
Fig.5 shows detail block diagram of Mother Board, and each function of Base is described in Table.7.
Table.7 Expansion Unit Mother Board Function Description
4.3.3. SLIC/CODEC (SLC) Block
Refer to Service Manual of KX-NS5173/KX-NS5174.
Device/Function Block Description
PLD1(EXT_PLD) PLD1 controls and monitors SLIC/CODEC LSI of each analog line port.
SLIC/CODEC SLIC/CODEC is exclusive LSI which is used for analog line interface.
8) Line interface power supply
9) Dial pulse detection
10) DTMF receiver / Caller ID generation
11) Bell signal generation
12) Hooking detection / Ringtrip detection
13) 2W/4W conversion
14) CODEC function
Trunkoption
Connector
Extension option
Connector
80PIN CONNECTOR (CPU Interface)
RJ45
POWER I/F
Connector
Expansion bus
SLIC/CODEC bus (SPI)
TDM Highway bus
AFESLIC/CODEC(2ch)
AFE
AFE
AFE
AFE
AFE
AFE
AFE
SLIC/CODEC(2ch)
SLIC/CODEC(2ch)
SLIC/CODEC(2ch)
SLIC/CODEC(2ch)
SLIC/CODEC(2ch)
SLIC/CODEC(2ch)
SLIC/CODEC(2ch)
ACALM, DCALM +40V, GND
+15V, GND
RJ45
RJ45
RJ45
PLD1
(EXT_PLD)
FAN I/F
Connector
+15V, GND
INT(2)
DC/DC
+3.3V, GND
15
12V
INT_SLIC
INT_EXT
INT_CO
FAN_ALM
RJ45
PFT
RJ45
PFT
PFT1-PFT2
PFT2-PFT3
SLT4
SLT3
Relay
To SLT3-SLT4
PFT Relay
RJ45
SLT2
SLT1
Fig.5 Expansion Unit Mother Board BlockDiagram

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KX-NS500AG
4.4. Power Circuit
Fig.6 shows power circuit diagram of NS500.
In AC/DC convert blotck, AC input voltage is converted to DC+15V and DC+41V. DC+15V/+41V is distributed to each card.
Base
Trunk#2
MPR/SPR
DSP
RMT
EXP-M
AC/DC
FG Plate
+41 V
+15 V
15V/3.3V
Extension#2
Extension#1
Trunk#1
15V/3.3V
15V/5V
PMIC
15V/5VUSB
Fig.6Power Circuit BlockDiagram

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KX-NS500AG
4.5. Power Supply Unit
This unit is switching regulator power supply and supplies DC voltages to DCPU Board (MPR), and optional card (free slot).
PSU (power supply unit) has two outputs (41V, 15V). 15V output is supplied only in DCPU Board (MPR) and option card. Other
outputs are mainly used as an object for the electric supply to a terminal.
4.5.1. Block Diagram and Circuit Description of PSU
4.6. AC input, Rectification Smoothing Circuit
1) Filter Circui
This circuit consists of the following components and removes the exogenous noise or the noise generated at power supply.
C1, C2: normal mode filter (X condenser)
L1, L2: common mode noise filter
C3, C4: common mode noise filter (Y condenser)

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KX-NS500AG
2) Rectification Smoothing Circuit
This circuit consists mainly of the following components and performs DC-AC conversion.
D1: Diode Bridge
C5: Primary Smoothing Condenser
3) Surge Absorber Circuit
As the main component of this circuit, Z1 protects against exogenous noise such as lightning surge.
Z1: Varistor
4) Inrush Current Avoiding Circuit
Immediately after AC input applies voltage, the following components control inrush current to the Smoothing Condenser.
NTC1, NTC3: thermistor
5) AC Detection Circuit
This circuit consists of the following components and detects AC input.
Main components: D81,D82,R80-R95,Q80,Q81,Q82,PC80
AC voltage commutates through D81, D82.
When AC voltage is over the threshold, Q80, Q81, and Q82 are switched ON to allow AC Detection Circuit to transfer AC input
status to the secondary side AC alarm signal delivery section through PC80
4.7. Main Converter
This section describes the main converter circuit which insulates the primary DC voltage and converts the voltage to a Secondary
voltage (41V output).
1) Main Converter Section (Primary)
This main converter consists of the following components; Isolated, and Self-excited Pseudo Resonance Type Converter.
Q1: main switch FET
T101: isolation transformer
IC1: IC controls Q1
PC1: device for transfer control secondary side
Other peripheral circuit
Secondary side output condition is transferred by PC1 to the primary side.
Q1 is switched to ON/OFF in IC1 to control the secondary side voltage.
2) Main converter section (Secondary)
T101: The output of this isolation transformer is 41V, and is the power supply for output voltage in section 3.
41V output:
This output consists of the Rectification Smoothing Circuit of D101, C101.
This is the output described in section 3, 15V and 41V output for power supply, and also for battery output as described in
section 4.

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3) Latch Circuit
The main converter latch circuit works to prevent output voltage from reaching an abnormally high state.
This circuit uses mainly the latch function of IC1.
When secondary side protection circuit reaches an abnormal state (section 6 protection circuit), the signal is sent to primary side
through PC50.
The main converter latch circuit then works to stop the operation.
To release the latch status, release abnormal state, then switch the AC input OFF and leave for over 60 seconds before restart-
ing AC input again
4.8. Output voltage
This section describes the operation of the circuit that converts the main converter output to 15V and 41V.
1) 15V Output
1-1) 15V Output Converter Circuit
This separately-excited depressor chopper converter consists mainly of IC202, D204, L201, C209, C210, R212-R214.
Input power supply is 41V output of the Main converter described in section 2.
15V output is supplied by the ON/OFF switching action of IC202, D204 and Smoothing Circuit of L201, C209, C210.
Output voltage is set by the resistance rate of IC202, R212-R214.
Oscillating frequency IC202 is 300kHz(typ).
1-2) 15V Output Overcurrent Protection Circuit
Operation is protected the IC202 internal Overcurrent Protection Circuit.

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2) 41V Output voltage
2-1) 41V Output
FET Q151 is in ON status during normal operation, conducts to main converter output and the potentiostatically-controlled volt-
age is output.
Q151 is in ON status when the sub winding voltage of coil L201 of 15V output converter has force applied to it.
2-2) 41V Output Overcurrent Protection Circuit
This circuit consists mainly of R161, Q152.
When Overcurrent flows to R161, the voltage potential difference of R161 is detected, Q152 is turned ON, and Q151 is turned
OFF.
Consequently the fold back current limiting shuts down 41V output.

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4.9. Battery voltage input and output
This section describes the operation of battery input and output.
1) Battery voltage output (charge time)
Charge circuit has constant voltage and constant current.
When the battery voltage is high, a controlled fixed voltage of the main converter is output.
When the battery voltage is low, a controlled fixed current of main converter is output.
When the battery switch SW181 turns ON and CN102áB-áC is short circuited, the main converter output supplies voltage with
controlled circuit, and Q181, Q182, Q183 change to ON. The voltage from L201 (sub winding voltage) is applied to the gate ter-
minal of Q161, Q163 and the battery output.
When the battery voltage is low, battery output is limited to a fixed current controlled by R170, R171, R172, and Q162.
When voltage is even lower.
Consequently the fold back current limiting shuts down 41V output.
2) Battery voltage input (power outage)
Battery voltage conducts to FET Q163 and diode D163, and is supplied by main converter output (C101, C102, C109).
When the battery voltage is reduced, Q181, Q182, Q183 on the battery control circuit go OFF. Q163 of the battery input/output
DC switch circuit goes to OFF status and releases the battery which stops the power supply.

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4.10. Alarm Signal Sending Circuit
This section describes the operation of the circuit that sends the AC alarm/DC alarm signal
1) Alarm Circuit Power Supply
This power supply consists mainly of Q301, D301. The output of the main converter (described in section 2) drops from 41V to
around 26V for a more stable supply.
2) AC alarm signal sending circuit
When the AC Detection Circuit (described in section 1 (5)) detects AC input as "Yes", the Secondary side transistor of PC80
turns ON. This action turns Q312 ON and then a LOW signal is sent to AC alarm output.
However, if the AC input is detected as "No", the Secondary side transistor of PC80 turns OFF. This action turns Q312 OFF and
then AC alarm sending output becomes OPEN. (Open collector output)
3) DC Alarm Signal Sending Circuit
When 41V is output normally, transistors Q303 and Q304 in the output voltage detection circuit turn ON. Q302 also turns on and
then DC alarm sending output becomes LOW.
When 41V output becomes abnormal, transistors Q303 and Q304 turn OFF, Q302 turns OFF and DC alarm sending output
becomes OPEN. (Open collector output)

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4.11. Protection Circuit
This section describes the Overvoltage Protection Circuit and Overheat Protection Circuit.
1) Abnormal Condition Detection Circuit
Abnormal condition detection circuit is a thyristor circuit which is comprised of Q306 and Q307. When power supply operation
becomes abnormal, a signal is sent to the abnormal detection circuit and Q307 is turned ON. A current flows through the diode
of PC50, which is sent to the control circuit of main converter. The operation of main converter is then stopped.
2) Overheat Detection Circuit
When internal temperature of power supply rises abnormally, resistance values of PTC thermistor PT301 increase, transistor
Q305 turns ON, and signal is sent to the abnormal detection circuit through D312.
3) Overvoltage Protection Circuit
When 15V or 41V output becomes abnormal, that voltage is sent to the abnormal detection circuit through zener diode D311
4) Reverse Connection Protection Circuit
When the battery is connected in reverse, + terminal of the battery becomes negative voltage, D167, D168, D169 start to con-
duct and transistor Q313 turns ON.
Dropper Circuit voltage (in section 5) is sent to the abnormal detection circuit through zener diode D319.