Panasonic KX-TES824LA User manual

© 2005 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
KX-TES824LA
KX-TEM824LA
KX-TE82461X
KX-TE82474X
KX-TE82480X
KX-TE82483X
KX-TE82491X
KX-TE82492X
KX-TE82493X
KX-A227X
(for Latin America)
Advanced Hybrid System
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING
If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear, please read and follow the special instructions described in this manual on the use of PbF and how
it might be permissible to use Pb solder during service and repair work.
ORDER NO. KMS0502047C3

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 5
1.1. SUGGESTED PbF SOLDER 5
1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED 6
2 FOR SERVICE TECHNICIANS 7
3 CAUTION 8
3.1. SAFETY PRECAUTIONS 8
3.2. INSULATION RESISTANCE TEST 8
3.3. BATTERY CAUTION 8
3.4. CAUTION 8
4 SPECIFICATIONS 9
4.1. GENERAL DESCRIPTION 9
4.2. CHARACTERISTICS 9
4.3. SYSTEM CAPACITY 9
5 SYSTEM OVERVIEW 10
5.1. SYSTEM COMPONENTS 10
5.2. SYSTEM CONNECTION DIAGRAM 11
6 NAMES AND LOCATIONS 12
7 CONNECTION 12
7.1. SERIAL INTERFACE CONNECTION 12
8 DISASSEMBLY INSTRUCTIONS 13
8.1. DISASSEMBLY INSTRUCTION 13
9 BLOCK DIAGRAM 16
9.1. SYSTEM BLOCK DIAGRAM 16
9.2. POWER BLOCK DIAGRAM 17
9.3. KX-TES824LA/KX-TEM824LA 1AP BLOCK DIAGRAM
17
9.4. KX-TEM824LA 2AP BLOCK DIAGRAM 18
9.5. KX-TES824LA/KX-TEM824LA POWER SUPPLY UNIT
BLOCK DIAGRAM 18
10 EXPLANATION OF BLOCK DIAGRAM 19
10.1. MAIN UNIT (KX-TES824LA/KX-TEM824LA) 19
11 CIRCUIT OPERATION 21
11.1. POWER SUPPY CIRCUIT 21
11.2. CO INTERFACE CIRCUIT 23
11.3. CROSS POINT SWITCH CIRCUIT 27
11.4. INTERCOM CIRCUIT 29
11.5. POWER FAILURE THROUGH CALL SWITCHING
CIRCUIT 30
11.6. DATA COMMUNICATION CIRCUIT 31
11.7. CONTROL CIRCUIT 33
11.8. TONE GENERATOR CIRCUIT 34
11.9. DTMF GENERATOR CIRCUIT 35
11.10. DTMF RECEIVER CIRCUIT 36
11.11. INT CALLID INTERFACE CIRCUIT 37
11.12. MODEM INTERFACE CIRCUIT 37
11.13. USB INTERFACE CIRCUIT 38
11.14. OGM INTERFACE CIRCUIT 38
11.15. RINGING SIGNAL GENERATOR CIRCUIT 39
11.16. SMDR INTERFACE CIRCUIT 39
11.17. DOORPHONE CARD INTERFACE (KX-TE82461X) 40
11.18. OGM CARD INTERFACE (KX-TE82491X) 40
11.19. BUILT in VOICE MESSAGE CARD INTERFACE (KX-
TE82492X) 41
11.20. CALL ID CARD INTERFACE (KX-TE82493X) 41
12 TROUBLESHOOTING GUIDE 42
12.1. NO OPERATION (Check POWER SUPPLY BOARD,
MAIN BOARD) 42
12.2. NO DIAL TONE (KX-TES824LA, MAIN BOARD OF KX-
TEM824LA) 43
12.3. CANNOT DIAL (KX-TES824LA, MAIN BOARD OF KX-
TEM824LA) 44
12.4. CANNOT CALL EXTENSION (KX-TES824LA, MAIN
BOARD OF KX-TEM824LA) 45
12.5. CANNOT USE PROPRIETARY TELEPHONE (KX-
TES824LA, MAIN BOARD OF KX-TEM824LA) 45
12.6. CANNOT RECEIVE INCOMING CALL (KX-TES824LA,
MAIN BOARD OF KX-TEM824LA) 45
12.7. CANNOT SEND DTMF DIALING (KX-TES824LA, MAIN
BOARD OF KX-TEM824LA) 46
12.8. CANNOT RECEIVE CALL DIAL TONE (KX-TES824LA,
MAIN BOARD OF KX-TEM824LA) 46
12.9. CANNOT SEND A HOLD ON MUSIC (KX-TES824LA,
MAIN BOARD OF KX-TEM824LA) 47
12.10. NO DIAL TONE (SUB BOARD OF KX-TEM824LA) 47
12.11. CANNOT DIAL (SUB BOARD OF KX-TEM824LA) 48
12.12. CANNOT CALL EXTENSION (SUB BOARD OF KX-
TEM824LA) 48
12.13. CANNOT USE PROPRIETARY TELEPHONE (SUB
BOARD OF KX-TEM824LA) 49
12.14. CANNOT RECEIVE INCOMING CALL (SUB BOARD OF
KX-TEM824LA) 49
12.15. CANNOT SEND DTMF DIALING (SUB BOARD OF KX-
TEM824LA) 49
12.16. CANNOT RECEIVE CALL DIAL TONE (SUB BOARD OF
KX-TEM824LA) 50
12.17. CANNOT SEND A HOLD ON MUSIC (SUB BOARD OF
KX-TEM824LA) 50
13 IC DATA 51
13.1. IC700 51
13.2. IC6 53
14 TERMINAL GUIDE OF ICS, TRANSISTORS AND DIODES 55
15 HOW TO REPLACE A FLAT PACKAGE IC 56
15.1. PREPARATION 56
15.2. REMOVAL PROCEDURE 56
15.3. INSTALLATION PROCEDURE 56
15.4. REMOVING SOLDER FROM BETWEEN PINS 56
16 FIXTURES AND TOOLS 57
17 CABINET AND ELECTRICAL PARTS LOCATION 58
18 ACCESSORIES AND PACKING MATERIALS 59
19 REPLACEMENT PARTS LIST (KX-TES824LA/KX-TEM824LA)
60
19.1. CABINET AND ELECTRICAL PARTS 60
19.2. ACCESSORIES AND PACKING MATERIALS 60
CONTENTS
Page Page
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KX-TES824LA / KX-TEM824LA /

19.3. MAIN BOARD PARTS 60
19.4. POWER SUPPLY BOARD PARTS 70
19.5. SUB BOARD PARTS 71
19.6. FIXTURES AND TOOLS 77
20 FOR THE SCHEMATIC DIAGRAM 78
21 SCHEMATIC DIAGRAM (KX-TES824LA/KX-TEM824LA) 80
21.1. MAIN No.1 (Extention A-D Block) 80
21.2. MAIN No.2 (Extention E-H Block) 84
21.3. MAIN No.3 (CO Block) 88
21.4. MAIN No.4 (Cross-Point Block) 92
21.5. MAIN No.5 (ASIC, Memory Block) 96
21.6. SUB 100
21.7. POWER SUPPLY 110
22 PRINTED CIRCUIT BOARD (KX-TES824LA/KX-TEM824LA) 114
22.1. MAIN BOARD 114
22.2. SUB BOARD 116
22.3. POWER SUPPLY 118
23 KX-TE82461X (4-PORT DOORPHONE CARD) 119
23.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED 120
23.2. LOCATION OF OPTIONAL CARDS 121
23.3. DOORPHONE/DOOROPENER CARD BLOCK DIAGRAM
122
23.4. EXPLANATION OF BLOCK DIAGRAM/CIRCUIT
OPERATIONS 124
23.5. TROUBLESHOOTING GUIDE 125
23.6. IC DATA 126
23.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES 127
23.8. ACCESSORIES AND PACKING MATERIALS 128
23.9. REPLACEMENT PARTS LIST (KX-TE82461X) 129
23.10. FOR THE SCHEMATIC DIAGRAM 131
23.11. SCHEMATIC DIAGRAM (KX-TE82461X) 132
23.12. PRINTED CIRCUIT BOARD (KX-TE82461X) 134
24 KX-TE82474X (8-PORT SLT EXTENSION CARD) 135
24.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED 136
24.2. LOCATION OF OPTIONAL CARDS 137
24.3. BLOCK DIAGRAM 140
24.4. EXPLANATION OF BLOCK DIAGRAM 140
24.5. TROUBLESHOOTING GUIDE 147
24.6. IC DATA 149
24.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES 150
24.8. CABINET AND ELECTRICAL PARTS 151
24.9. ACCESSORIES AND PACKING MATERIALS 151
24.10. REPLACEMENT PARTS LIST (KX-TE82474X) 152
24.11. FOR THE SCHEMATIC DIAGRAM 156
24.12. MEMO 157
24.13. SCHEMATIC DIAGRAM (KX-TE82474X) 158
24.14. PRINTED CIRCUIT BOARD (KX-TE82474X) 164
25 KX-TE82480X (2-PORT ANALOGUE CO LINE AND 8-PORT
SLT EXTENSION CARD) 166
25.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED 167
25.2. LOCATION OF OPTIONAL CARDS 168
25.3. BLOCK DIAGRAM 172
25.4. EXPLANATION OF BLOCK DIAGRAM 172
25.5. CIRCUIT OPERATION 173
25.6. TROUBLESHOOTING GUIDE 183
25.7. IC DATA 186
25.8. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES 187
25.9. CABINET AND ELECTRICAL PARTS 188
25.10. ACCESSORIES AND PACKING MATERIALS 188
25.11. REPLACEMENT PARTS LIST (KX-TE82480X) 189
25.12. FOR THE SCHEMATIC DIAGRAM 195
25.13. SCHEMATIC DIAGRAM (KX-TE82480X) 196
25.14. PRINTED CIRCUIT BOARD (KX-TE82480X) 204
26 KX-TE82483X (3-PORT ANALOGUE CO LINE AND 8-PORT
HYBRID EXTENSION) 206
26.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED 207
26.2. LOCATION OF OPTIONAL CARDS 208
26.3. BLOCK DIAGRAM 210
26.4. EXPLANATION OF BLOCK DIAGRAM 210
26.5. CIRCUIT OPERATION 211
26.6. TROUBLESHOOTING GUIDE 222
26.7. IC DATA 225
26.8. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES 227
26.9. CABINET AND ELECTRICAL PATRS 228
26.10. ACCESSORIES AND PACKING MATERIALS 228
26.11. REPLACEMENT PARTS LIST (KX-TE82483X) 229
26.12. FOR THE SCHEMATIC DIAGRAM 235
26.13. SCHEMATIC DIAGRAM (KX-TE82483X) 236
26.14. PRINTED CIRCUIT BOARD (KX-TE82483X) 246
27 KX-TE82491X (MESSAGE EXTENSION CARD FOR DISA/UCD
OGMs) 248
27.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED 249
27.2. LOCATION OF OPTIONAL CARDS 250
27.3. BLOCK DIAGRAM 251
27.4. TROUBLESHOOTING GUIDE 252
27.5. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES 253
27.6. ACCESSORIES AND PACKING MATERIALS 253
27.7. REPLACEMENT PARTS LIST (KX-TE82491X) 254
27.8. FOR THE SCHEMATIC DIAGRAM 255
27.9. SCHEMATIC DIAGRAM (KX-TE82491X) 256
27.10. PRINTED CIRCUIT BOARD (KX-TE82491X) 258
28 KX-TE82492X (2-CHANNEL VOICE MESSAGE CARD) 259
28.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED 260
28.2. LOCATION OF OPTIONAL CARDS 261
28.3. BLOCK DIAGRAM 262
28.4. CIRCUIT OPERATIONS 263
3
KX-TES824LA / KX-TEM824LA /

28.5. TROUBLESHOOTING GUIDE 264
28.6. IC DATA 266
28.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES 267
28.8. ACCESSORIES AND PACKING MATERIALS 267
28.9. REPLACEMENT PARTS LIST (KX-TE82492X) 268
28.10. FOR THE SCHEMATIC DIAGRAM 269
28.11. SCHEMATIC DIAGRAM (KX-TE82492X) 270
28.12. PRINTED CIRCUIT BOARD (KX-TE82492X) 272
29 KX-TE82493X (3-PORT CALLER ID CARD) 273
29.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED 274
29.2. LOCATION OF OPTIONAL CARDS 275
29.3. BLOCK DIAGRAM 276
29.4. CIRCUIT OPERATIONS 276
29.5. TROUBLESHOOTING GUIDE 277
29.6. IC DATA 278
29.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES 280
29.8. ACCESSORIES AND PACKING MATERIALS 280
29.9. REPLACEMENT PARTS LIST (KX-TE82493X) 281
29.10. FOR THE SCHEMATIC DIAGRAM 283
29.11. SCHEMATIC DIAGRAM (KX-TE82493X) 284
29.12. PRINTED CIRCUIT BOARD (KX-TE82493X) 286
30 KX-A227X (BACK-UP BATTERY CABLE) 287
30.1. ACCESSORIES AND PACKING MATERIALS 288
30.2. REPLACEMENT PARTS LIST (KX-A227X) 289
4
KX-TES824LA / KX-TEM824LA /

1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn),
Silver, (Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
• • •
• PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
• • •
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).
• • •
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
• • •
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
1.1. SUGGESTED PbF SOLDER
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
5
KX-TES824LA / KX-TEM824LA /

1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED
6
KX-TES824LA / KX-TEM824LA /

2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
7
KX-TES824LA / KX-TEM824LA /

3 CAUTION
3.1. SAFETY PRECAUTIONS
1. Before servicing, unplug the power cord to prevent an electric shock.
2. When replacing parts, use only the manufacturer´s recommended components for safety.
3. Check the condition of the power cord. Replace if wear or damage is evident.
4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.
5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent
the customer from being exposed to shock hazards.
3.2. INSULATION RESISTANCE TEST
1. Unplug the power cord and short the two prongs of the plug with a jumper wire.
2. Turn on the power switch.
3. Measure the resistance value with ohmmeter between the jumpers AC plug and each exposed metal cabinet part, such as
screw threads, control shafts, handle brackets, etc.
Note:
Some exposed parts may be isolated from the chassis by design. These will read infinity.
4. If the measurement is outside the specified limits, there is a possibility of shock hazard. The equipment should be repaired and
rechecked before it is returned to the customer.
3.3. BATTERY CAUTION
1. Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the
manufacturer. Dispose of used batteries according to the manufacturer’s Instructions.
2. The lithium battery is a critical component (type No.CR23541). Please observe for the proper polarity and the exact location
when replacing it and soldering the replacement lithium battery in.
3.4. CAUTION
The power socket wall outlet should be located near this equipment and be easily accessible.
8
KX-TES824LA / KX-TEM824LA /

4 SPECIFICATIONS
4.1. GENERAL DESCRIPTION
Control Bus Original bus (16-bit, 24 MHz)
Switching Space Division CMOS Crosspoint Switch
Power Input 100 V AC to 240 V AC, 1.5A to 0.75A, 50 Hz/60Hz
External Battery +24 V DC (+12 V DC x 2)
Maximum Power Failure Tolerance 300 ms (without using backup batteries)
Memory Backup Duration 7 years
Dialling Outside (CO) Line Pulse (10 pps, 20 pps) or Tone (DTMF)
Extension Pulse (10 pps, 20 pps) or Tone (DTMF)
Intercom Path 4
Mode Conversion Pulse-DTMF
Ring Frequency 20 Hz/25 Hz (selectable)
Operating Environment Temperature 0°Cto40°C
Humidity 10 % to 90 % (non-condensing)
Conference Call Outside (CO) Line 2
Music on Hold (MOH) 1 port
Selectable MOH: Internal/External/Tone
Paging Internal 1
Extension 1 port
Serial Interface Port RS-232C 1
USB 1.1 1
Extension Connection Cable SLT 1 pair wire (T, R)
PT 2-pair wire (T, R, H, L)
DSS Console 1-pair wire (H, L)
Dimension 368 mm (W) x 284 mm (H) x 102 mm (D)
Weight (when fully expanded) Approx. 3.5 kg
4.2. CHARACTERISTICS
Terminal Equipment Loop Limit PT 40 Ω
SLT 600 Ωincluding set
Doorphone 20 Ω
Minimum Leakage Resistance 15000 Ωminimum
Maximum Number of Extension
Instruments per Line
1 PT or SLT in standard connection
1 PT and 1 SLT in parallel connection
Ring Voltage 75 Vrms at 20 Hz/25 Hz depending on the ringing load
Outside (CO) Line Loop Limit 1600 Ωmaximum
Hookswitch Flash/Recall Timing Range 24 ms-2032 ms
Door Opener Current Limit 30 V DC/125 V AC, 3 A maximum
Paging Terminal Impedance 600 Ω
MOH Terminal Impedance 10000 Ω
4.3. SYSTEM CAPACITY
4.3.1. System Capacity
KX-TES824 KX-TEM824
Basic System Outside (CO) lines 3 6
Extensions 8 16
Fully Expanded System Outside (CO) lines 8 8
Extensions 24 24
9
KX-TES824LA / KX-TEM824LA /

4.3.2. Maximum Cards Terminal Equipment
ltem KX-TES824 KX-TEM824
Extension Terminal 48 48
3-Port Analogue CO Line and 8-Port Hybrid Extension Card 1 -
2-Port Analogue CO Line and 8-Port Single Line Telephone Extension Card 1 1
8-Port Single Line Telephone Extension Card 1 1
Message Expansion Card for DISA/UCD OGMs 1 1
4-Port Doorphone Card 1 1
3-Port Caller ID Card 3 3
2-Channel Voice Message Card 1 1
Doorphone 4 4
Door Opener 4 4
Pager 1 1
Music on Hold (MOH) 1 1
DSS Console 2 2
4.3.3. System Data
ltem Max. Quantity
Operator 1
System Speed Dialling 100
One-touch Dialling 24 per extension (PT)
Personal Speed Dialling 10 per extension
Call Park Area 10
Absent Message 6
Toll Restriction (TRS) COS 5
Extension Group 8
Message Waiting 8 per extension
Message for Built-in Voice Message 128 messages (total 60 minutes)
5 SYSTEM OVERVIEW
5.1. SYSTEM COMPONENTS
Model Description
Main Unit KX-TES824LA
KX-TEM824LA
Advances Hybrid System: 3 to 8 Outside (CO) Lines, 8 to 24 Extensions
Advances Hybrid System: 6 to 8 Outside (CO) Lines, 16 to 24 Extensions
Optional Service Cards KX-TE82461X
KX-TE82474X
KX-TE82480X
KX-TE82483X
KX-TE82491X
KX-TE82492X
KX-TE82493X
4-Port Doorphone Card
8-Port Single Line Telephone Extension Card
2-Port Analogue CO Line and 8-Port Single Line Telephone Extension Card
3-Port Analogue CO Line and 8-Port Hybrid Extension Card
Message Expansion Card for DISA/UCD OGMs
2-Channel Voice Message Card
3-Port Caller ID Card
Proprietary Equipment KX-T30865
KX-A227X
Doorphone
Backup Battery Cable
10
KX-TES824LA / KX-TEM824LA /

5.2. SYSTEM CONNECTION DIAGRAM
• • •
• Connect a display-equipped proprietary telephone (PT) to extension jack 01, as this extension is automatically designated as
the manager extension.
11
KX-TES824LA / KX-TEM824LA /

6 NAMES AND LOCATIONS
7 CONNECTION
7.1. SERIAL INTERFACE CONNECTION
12
KX-TES824LA / KX-TEM824LA /

8 DISASSEMBLY INSTRUCTIONS
8.1. DISASSEMBLY INSTRUCTION
1. Loosen the top cover screw (A).
2. Remove the top front cover.
Note
The screw cannot be removed front the cover.
3. Remove the 2 bottom-cover screws (B).
4. Open the bottom front cover.
13
KX-TES824LA / KX-TEM824LA /

5. Remove the 2 screws (A).
6. Remove the power supply board cover.
7. Pull out the 4 connectors.
8. Remove the 1 screw (D).
9. Remove the power supply board.
10. Pull out the 1 connector.
11. Remove the 2 screws (A) and (C).
12. Remove the main board.
14
KX-TES824LA / KX-TEM824LA /

Procedure:
• • •
• Insert the SW CABLE into AC POWER SWICH.
Caution:
• • •
• Be sure each colored wire is inserted to the correct lug (very important).
15
KX-TES824LA / KX-TEM824LA /

9 BLOCK DIAGRAM
9.1. SYSTEM BLOCK DIAGRAM
Ton e
Power Switch
DPH4 Card
BV2
BV1
DOOR1
DOOR2
BV Card
OGM Card
Serial
Flash
PIO
CO
8
Int.CID
3
BV
2
BGM
1
DPH
2
INT
4
Paiging
2
Tone
2
DTMF-R
2
DTMF-G
1
8port
Extension
Block
2port
Co
Block
PIO
8port
Extension
Block
3port
Co
Block
PIO
Cross Point
DTMF-R
8port
Extension
Block
3port
Co
Block
Cross Point
Flash
ROM
SRAM
CPU DSP
SRAM
8Mbit
CN710
DSP#2
DSP#1
CN707
DPH Block #1,#2
PIO
DPH Block #3, #4
CN708
CID Card #3
FPGA
PIO
S/P
FSK Detect x3
Jack x8
Cross Point
Jack x2 Jack x8 Jack x3 Jack x8 Jack x3
DTMF Detect
Stutter Detect x3
CID
Card
#1
Same as
CID
Card
#3
CN706 CN711
CN712
3AP Card 2AP Card 1AP Card
DTMF-G
for CO
CO1-3
ext1-8
CO4-6
ext9-16
CO7-8
ext17-24
RS232C
Bell
AC75V
25Hz
CN60
0
Ext Paging
Ext Music
CN601
Host I/F
AC IN
25Hz
+15V
-15V
+3.3V
22
USB
Int. CID x 3 BGM MODEM(Rx, Tx) OGM(Play, Rec) x2
Voltage
check
Rectification
Rectification
battery
backup
circuit
Over current
Detect circuit
control
circuit
Voltage
change
noise filter
LN FG
Surge protector
Ringer
Amp.
circuit
C N
7 0 5
24
V
G
N D
E
x
p a n
s
i
o n
C
o n n e
c
t
o
r
E
x
p a n
s
i
o n
C
o n n e
c
t
o
r
DTMF-R
KX-TES824LA/KX-TEM824LA SYSTEM BLOCK DIAGRAM
+27V
POWER
SUPPLY
IC601
L1, L2
Z1
IC8
IC7
IC2A~C
IC1A~C
IC7
IC600, IC601, IC602
IC613 IC614
IC511 IC512
IC500 IC501 IC502
IC704 IC705
IC701 IC702 IC703
IC700 IC10
IC6 IC705 IC704 IC700
CN703 CN704
IC1 IC2 IC3 IC4
CID
Card
#2
Same as
CID
Card
#3
16
KX-TES824LA / KX-TEM824LA /

9.2. POWER BLOCK DIAGRAM
9.3. KX-TES824LA/KX-TEM824LA 1AP BLOCK DIAGRAM
CO CID
CONNECTOR
Door Phone
Door Opener
CONNECTOR
BV Card
CONNECTOR
Exp308
(2AP)
/Exp208
(3AP)
Card
EXP
CONNECTOR
OGM Card
CONNECTOR
D-Sub
USB
POWER UNIT
CONNECTOR
25Hz
NINT AC
TONE(D)
(UART)RXD, TXD
(DSP)Serial Flash i/f
(APT i/f)PRX2-3, PTX2-3, PTXE1-3
CO4-8
Host i/f
TAM1-2, TONE
DOOR1, 2
PIO
ASIC
CROSS
POINT
ROM
SRAM
ASIC
8086
DSP
PIO
APT i/f
BELL
(APT i/f)PRX,PTX,PTXE1-3
(I/O)HOOK1-8,BELL1-8
Q1-4,TOE1,2,STD1,2
TONE
620,440,350Hz
DTMFR(1,2)
(For EXT)
EXT1-8
BGM
PAGE
CO1-3
DTMF
Generator
(I/O) CO1
CO2
CO3
Paging jack
MOH jack
EXT1
EXT2
EXT3
EXT4
EXT5
EXT6
EXT7
EXT8
KX-TES824LA/KX-TEM824LA 1AP BLOCK DIAGRAM
CN706
CN708
CN707
CN701, CN702
CN710
CN703
CN704
CN705
IC700
IC709
IC704
IC613, IC614
IC600
IC601
IC602
IC6
IC7
CN601
CN600
17
KX-TES824LA / KX-TEM824LA /

9.4. KX-TEM824LA 2AP BLOCK DIAGRAM
Q1- 4,TOE1,2,STD1,2
CROSS
POINT
DTMFR(1,2)
(For EXT)
PIO
ASIC
(I/O)HOOK9-16,BELL9-16
CO4-6
EXT9-16
(I/O)
Exp308
(2AP)
/Exp208
(3AP)
Card
EXP
CONNECTOR
CO4-6
(APT i/f)PRX2,PTX2,PTXE1-3
CID4-6
Host i/f CO4
CO5
CO6
EXT9
EXT11
EXT10
EXT12
EXT13
EXT14
EXT15
EXT16
KX-TEM824LA 2AP BLOCK DIAGRAM
IC10
CN501, CN502
IC510, IC511
IC500, IC501, IC502
9.5. KX-TES824LA/KX-TEM824LA POWER SUPPLY UNIT BLOCK DIAGRAM
Noise
Filter
Rectification
&
Smoothing
Controller
Over
Current
Detection
Rectification
&
Smoothing
Voltage
Detection
DC-DC
Converter
Ringer
Amplifier
FG
SW
(14)
Battery
Back up
+24V
GND
+27V
GND
+15V
-15V
3.3V
OUTPUT
AC75V 25Hz
INTPUT
20/25Hz
AC
Alarm
AC IN
L
N
AC Input
Power
Down
Detection
Primary Circuit Secondary Circuit
Surge
Absorber
KX-TES824LA/KX-TEM824LA POWER SUPPLY UNIT BLOCK DIAGRAM
CN1
F1
F2
Z1 L1, L2
D10~D13, C5
D31
D32 Q22
Q23
Q2
Q1 PC1
T1
D101, C101
PC31
IC601
Q201, T2, IC201
CN301
Q101
Q503
RL501
Q503
RL501
18
KX-TES824LA / KX-TEM824LA /

10 EXPLANATION OF BLOCK DIAGRAM
10.1. MAIN UNIT (KX-TES824LA/KX-TEM824LA)
10.1.1. Power Supply Circuit
This power supply unit is a switching power supply. Power supply unit supplies DC voltage (+27V,+15V,-15V,3.3V) to main board
and other optional cards. And this unit has an adaptor circuit to back up battery. And this unit amplified the BELL signal (20/25Hz
sign wave outputted from the ASIC) and supply bell signal to the telephone.
10.1.2. COL Interface Circuit
There are the interface circuits linking the CO line (CO1 -CO3) and the cross point circuit section.
In case of KX-TEM824, the system has 6CO line (CO1 - CO6).
10.1.3. Cross Point Circuit
This is a space division switching system for connecting the following:
The eight extension circuits with the eight CO, DTMF generator, DTMF receiver, INT-CALL ID, MODEM, OGM, VB, paging, music
on hold, tone etc.
It is composed of 3 C-MOS IC´s. (8 X 16 matrix: 2pcs and 4 X 8 matrix: 1pce).
*In case of KXTEM824, the system has 6 C-MOS IC´s (8 X 16 matrix: 3pcs and 4 X 8 matrix: 2pce, 8 X 8 matrix: 2pce).
10.1.4. Intercom Circuit
This is the interface circuit of the single line telephone, and it is composed of 8 intercom circuit (ICM1-8) In case of KX-TEM824,
the system has 16 intercom circuits(ICM1-16).
10.1.5. Power Failure Through Call Switching Circuit
KXTES824 have one power failure transfer circuit (CO1-EXT101).
In case of KXTEM824,the system has 2 power failure circuit (CO1-EXT101 CO4 -EXT109).
10.1.6. Data Communication Circuit
The APT i/f module which performs communication with a private telephone machine is built in ASIC.
8ch are controlled per block. Control of 3 blocks (24ch) is possible for ASIC at the maximum.
10.1.7. Control Circuit
A control block consists of only the [ASIC] CPU (compatibility with Intel 8086) (IC700), Flash ROM (8Mbit) (IC705), SRAM (4Mbit)
(IC704), and PIO ASIC (IC6). PIO ASIC mainly performs extension control and PIO built in ASIC CPU mainly performs extension
control. RTC (Real Time Clock) and SRAM inside CPU are backed up by the lithium battery in order to hold time, system data, etc.
10.1.8. Tone Generator Circuit
The rectangle wave generated by the timer of ASIC is changed into sine wave with a low path filter, and various tones are
generated.
10.1.9. DTMF Generator Circuit
A DTMF generator is used for dispatch to outside line, and communication with the voice mail connected to the extension.
10.1.10. DTMF Receiver Circuit
The circuit which receives the Dial Tone Multi Frequency by which extension dispatch is carried out with the DTMF receiver
connected to the crossing point.
10.1.11. Int Call ID Circuit
FSK/Dial Tone Multi Frequency generated by DSP in ASIC are connected even to a crossing point through AMP. The circuit which
sends out a CALLID signal to the telephone connected to an extension by connecting the line of INT-CALL-ID with arbitrary
extensions.
10.1.12. Modem Circuit
The MODEM signal generated by DSP in ASIC is connected even to a crossing point through AMP.
The circuit which connects the line of MODEM with arbitrary outside line, and enables MODEM communication with outside line.
19
KX-TES824LA / KX-TEM824LA /

10.1.13. USB Circuit
The circuit which makes communication possible by PC and 1.1 standards by the USB controller in ASIC.
10.1.14. OGM Circuit
4M connected to ASIC by the memory controller in ASIC A maximum of 3-minute storing of OGM is possible to a serial flash Circuit.
10.1.15. Ring Signal Generator Circuit
This section generates the ring signal for the single line telephone. A 20/25Hz square wave is generated by the ASIC timer and sent
to low pass filter and the ringing signal amplifier circuit and stepped by BELL transformer, and then passed it through the ringing
signal switching relay to the single line telephone.
10.1.16. SMDR Interface Circuit
This is the RS232C interface port. When the port is connected to a printer. The port can be used to output the SMDR feature
recording messages and the contents of the system program.
10.1.17. Door Phone Interface
An intercom card interface consists of two intercom paths connected to a crossing point, and address data and CS signals.
10.1.18. OGM Interface
An OGM card interface consists of the memory control signal, and the address data and CS signal which are connected to ASIC.
10.1.19. Call ID Interface
A CALLID card interface consists of three CALLID signal lines from outside line, and address data and CS signal.
10.1.20. BV Interface
BV card interface consists of two BV telephone call paths connected to a crossing point, and address data and CS signals.
20
KX-TES824LA / KX-TEM824LA /