Qsan XCUBESAN XS5226S XCUBESAN XS3224D User manual

XCubeSAN Series
Hardware Manual
Applicable Models:
XS5224D, XS5216D, XS5212D, XS5212S, XS5226D, XS5226S
XS3224D, XS3224S, XS3216D, XS3216S, XS3212D, XS3212S
XS3226D, XS3226S, XS1224D, XS1224S, XS1216D, XS1216S
XS1212D, XS1212S, XS1226D, XS1226S
QSAN Technology, Inc.
www.QSAN.com

Copyright
© Copyright 2018 QSAN Technology, Inc. All rights reserved. No part of this document may be
reproduced or transmitted without written permission from QSAN Technology, Inc.
July 2019
This edition applies to QSAN XCubeSAN XS5200 / XS3200 / XS1200 series SAN storage systems.
QSAN believes the information in this publication is accurate as of its publication date. The
information is subject to change without notice.
Trademarks
QSAN, the QSAN logo, XCubeSAN, and QSAN.com are trademarks or registered trademarks of QSAN
Technology, Inc.
Intel, Xeon, Pentium, Intel Inside, and the Intel Inside logo are trademarks of Intel Corporation in the
United States and other countries.
Other trademarks and trade names used in this document to refer to either the entities claiming the
marks and names or their products are the property of their respective owners.

Notices i
Notices
This XCubeSAN hardware owner’s manual is applicable to the following XCubeSAN models:
XCubeSAN Storage System 4U 19” Rack Mount Models
Model Name
Controller Type
Form Factor, Bay Count, and Rack Unit
XS5224D
Dual Controller
LFF 24-disk 4U Chassis
XS3224D
Dual Controller
LFF 24-disk 4U Chassis
XS3224S
Single Controller
LFF 24-disk 4U Chassis
XS1224D
Dual Controller
LFF 24-disk 4U Chassis
XS1224S
Single Controller
LFF 24-disk 4U Chassis
XCubeSAN Storage System 3U 19” Rack Mount Models
Model Name
Controller Type
Form Factor, Bay Count, and Rack Unit
XS5216D
Dual Controller
LFF 16-disk 3U Chassis
XS3216D
Dual Controller
LFF 16-disk 3U Chassis
XS3216S
Single Controller
LFF 16-disk 3U Chassis
XS1216D
Dual Controller
LFF 16-disk 3U Chassis
XS1216S
Single Controller
LFF 16-disk 3U Chassis
XCubeSAN Storage System 2U 19” Rack Mount Models
Model Name
Controller Type
Form Factor, Bay Count, and Rack Unit
XS5212D
Dual Controller
LFF 12-disk 2U Chassis
XS5212S
Single Controller
LFF 12-disk 2U Chassis
XS3212D
Dual Controller
LFF 12-disk 2U Chassis
XS3212S
Single Controller
LFF 12-disk 2U Chassis
XS1212D
Dual Controller
LFF 12-disk 2U Chassis
XS1212S
Single Controller
LFF 12-disk 2U Chassis
XS5226D
Dual Controller
SFF 26-disk 2U Chassis
XS5226S
Single Controller
SFF 26-disk 2U Chassis
XS3226D
Dual Controller
SFF 26-disk 2U Chassis
XS3226S
Single Controller
SFF 26-disk 2U Chassis
XS1226D
Dual Controller
SFF 26-disk 2U Chassis

ii © Copyright 2018 QSAN Technology, Inc. All Right Reserved.
XS1226S
Single Controller
SFF 26-disk 2U Chassis
Information contained in this manual has been reviewed for accuracy. But it could include
typographical errors or technical inaccuracies. Changes are made to the document
periodically. These changes will be incorporated in new editions of the publication. QSAN
may make improvements or changes in the products. All features, functionality, and product
specifications are subject to change without prior notice or obligation. All statements,
information, and recommendations in this document do not constitute a warranty of any
kind, express or implied.
Any performance data contained herein was determined in a controlled environment.
Therefore, the results obtained in other operating environments may vary significantly.
Some measurements may have been made on development-level systems and there is no
guarantee that these measurements will be the same on generally available systems.
Furthermore, some measurements may have been estimated through extrapolation. Actual
results may vary. Users of this document should verify the applicable data for their specific
environment.
This information contains examples of data and reports used in daily business operations.
To illustrate them as completely as possible, the examples include the names of individuals,
companies, brands, and products.
All of these names are fictitious and any similarity to the names and addresses used by an
actual business enterprise is entirely coincidental.
Regulatory Statements
FCC Statement
This device has been shown to be in compliance with and was tested in accordance with
the measurement procedures specified in the Standards and Specifications listed below.
Technical Standard: FCC Part 15 Class A
IC ICES-003
This device complies with Part 15 of the FCC rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired operation.

Notices iii
A
VCC1-A
CE Statement
This device has been shown to be in compliance with and was tested in accordance with
the measurement procedures specified in the Standards and Specifications listed below.
Technical Standard: EMC DIRECTIVE 2014/30/EU
(EN55022 / EN55024)
UL Statement
Rack Mount Instructions - The following or similar rack-mount instructions are included with
the installation instructions:
1. Elevated Operating Ambient - If installed in a closed or multi-unit rack assembly, the
operating ambient temperature of the rack environment may be greater than room
ambient. Therefore, consideration should be given to installing the equipment in an
environment compatible with the maximum ambient temperature (Tma) specified by the
manufacturer.
2. Reduced Air Flow - Installation of the equipment in a rack should be such that the
amount of air flow required for safe operation of the equipment is not compromised.
3. Mechanical Loading - Mounting of the equipment in the rack should be such that a
hazardous condition is not achieved due to uneven mechanical loading.
4. Circuit Overloading –Careful consideration should be given to the connection of the
equipment to the supply circuit and the effect that overloading of the circuits might have
on overcurrent protection and supply wiring. Appropriate consideration of equipment
nameplate ratings should be used when addressing this concern.
5. Reliable Earthing - Reliable earthing of rack-mounted equipment should be maintained.
Particular attention should be given to supply connections other than direct connections
to the branch circuit (e.g. use of power strips).

iv © Copyright 2018 QSAN Technology, Inc. All Right Reserved.
CAUTION:
The main purpose of the system left and right ears are for 19” rack use
only. Do NOT use those ears to carry or transport the system.
The ITE is not intended to be installed and used in a home, school or public area accessible
to the general population, and the thumbscrews should be tightened with a tool after both
initial installation and subsequent access to the panel.
Warning: Always remove all power supply cords before service
This equipment intended for installation in restricted access locations.
Access should only be allowed by qualified SERVICE PERSONS or by USERS who have
been instructed about the reasons for the restrictions applied to the location and about
any precautions that shall be taken.
Access is through the use of a TOOL or lock and key, or other means of security, and is
controlled by the authority responsible for the location.
Recommended operation temperature: 0 ~ 40 (31.99 ~ 103.99 F); operation rating
(100-127 Vac, 50-60Hz, 10.0A; 200-240 Vac, 50-60Hz, 5.0A)
CAUTION: (English)
Risk of explosion if battery is replaced by incorrect type. Please replace
the same or equivalent type battery use and dispose of used batteries
according to the instructions.
ATTENTION: (French)
IL Y A RISQUE D'EXPLOSION SI LA BATTERIE EST REMPLACEE PAR UNE
BATTERIE DE TYPE INCORRECT. METTRE AU REBUT LES BATTERIES
USAGEES CONFORMEMENT AUX INSTRUCTIONS.
VORSICHT: (German)
Explosionsgefahr bei unsachgemasem Austausch der Batterie.
Entsorgung gebrauchter Batterien nach Anleitung.
ADVERTENCIA: (Spanish)
Las baterias pueden explotar si no se manipulan de forma apropiada. No
desmonte ni tire las baterias al fuego. Siga las normativas locales al
desechar las baterias agotadas.
: (Simplified Chinese)

Notices v
: (Traditional Chinese)
INFORMATION:
QSAN provides limited warranty for QSAN-branded hardware products:
System hardware and peripheral product (s): 3years limited warranty
from date of original purchase.
Battery Backup Module or super capacitor module (applies for cache-
to-flash module): 1year limited warranty from date of original
purchase.
For more detail warranty policy, please refer to QSAN official web site:
https://www.qsan.com/warranty

vi © Copyright 2019 QSAN Technology, Inc. All Right Reserved.
Table of Contents
Notices ............................................................................................................................ i
Regulatory Statements ....................................................................................................................ii
Preface .........................................................................................................................xiv
About This Manual ........................................................................................................................xiv
Related Documents.......................................................................................................................xiv
Technical Support .........................................................................................................................xiv
Information, Tip, and Caution ........................................................................................................xv
Conventions....................................................................................................................................xv
1. Overview................................................................................................................. 1
1.1. XCubeSAN Series Product Overview................................................................................. 1
1.2. XCubeSAN Series Hardware Features .............................................................................. 3
1.3. XCubeSAN Series Hardware Specifications ..................................................................... 4
1.4. XCubeSAN Series Package Contents................................................................................ 9
1.5. XCubeSAN Series Optional Accessories........................................................................... 9
2. System Components Overview.............................................................................. 13
2.1. Front Panel ........................................................................................................................ 13
2.2. System Disk Drive Numbering ......................................................................................... 16
2.3. Supported Disk Drives and SSDs..................................................................................... 17
2.4. Rear Panel ......................................................................................................................... 18
2.4.1. Rear Panel Layout .............................................................................................. 18
2.4.2. Controller Module............................................................................................... 20
2.5. Power Supply Unit............................................................................................................. 22
2.6. Fan Module........................................................................................................................ 23
2.7. Cache-to-Flash Memory Protection................................................................................. 25
2.7.1. Mechanism of Cache Data Protection.............................................................. 27
2.7.2. Features of the Cache-to-Flash Module ........................................................... 28
3. Installing the System Hardware............................................................................. 29
3.1. Installation Checklist ........................................................................................................ 29
3.2. Installing Disk Drives into the Trays ................................................................................ 29
3.3. Installing the Optional Host Cards................................................................................... 36
3.4. Installing the Optional Memory Modules ........................................................................ 44
3.5. Installing the Optional Cache-to-Flash Modules............................................................. 48
3.6. Installing the Optional Slide Rails .................................................................................... 52
3.7. Installing the Trays into the System ................................................................................ 55

Contents vii
3.8. Connecting the System to a Host.................................................................................... 56
3.8.1. Connecting to the Management Ports ............................................................. 57
3.8.2. Dual Path (MPIO) Deployment .......................................................................... 57
3.8.3. Expansion Deployment ...................................................................................... 58
3.9. Connecting Power Cords and Powering ON the System ............................................... 59
3.10. Powering OFF the System................................................................................................ 61
3.11. Wake-on-LAN / Wake-on-SAS to Power ON / OFF the System...................................... 62
3.12. Connecting a UPS ............................................................................................................. 63
3.13. Connecting the Optional USB LCM.................................................................................. 64
3.14. Discover and Carry Out the Initial Configuration for the System................................... 65
4. Deployment Types and Cabling ............................................................................. 66
4.1. Deployment Types ............................................................................................................ 66
4.2. Cabling the System........................................................................................................... 67
4.2.1. Expansion Configuration Rules......................................................................... 67
4.2.2. Single Path Deployment..................................................................................... 69
4.2.3. Dual Path (MPIO) Deployment .......................................................................... 70
4.2.4. Multi-server Attached Cabling Deployment...................................................... 72
4.2.5. Expansion Topology and Deployment .............................................................. 75
4.2.6. Introduction of Remote Replication.................................................................. 78
5. Descriptions of LEDs and Buttons ......................................................................... 82
5.1. Front Panel ........................................................................................................................ 82
5.1.1. System Controls and Indicators........................................................................ 82
5.1.2. Disk Drive LEDs .................................................................................................. 84
5.2. Rear Panel ......................................................................................................................... 85
5.2.1. Controller LEDs................................................................................................... 85
5.2.2. Power Supply Unit LED ...................................................................................... 86
5.2.3. Host Card LEDs .................................................................................................. 87
5.2.4. Cache-to-Flash Module LEDs and Button......................................................... 90
6. Quick Maintenance ............................................................................................... 92
6.1. Removing / Installing the Controller Module .................................................................. 92
6.2. Removing / Installing the Power Supply Unit.................................................................. 97
6.3. Removing / Installing the Fan Module........................................................................... 100
6.4. Removing the Host Card ................................................................................................104
6.5. Removing the Cache-to-Flash Modules ........................................................................106
7. Support and Other Resources.............................................................................. 110
7.1. Getting Technical Support.............................................................................................. 110
7.2. Online Customer Support ............................................................................................... 112
7.3. Accessing Product Updates...........................................................................................116
7.4. Documentation Feedback ..............................................................................................117

viii © Copyright 2019 QSAN Technology, Inc. All Right Reserved.
Appendix..................................................................................................................... 118
End-User License Agreement (EULA) ........................................................................................ 118