Quectel 5G Module Series Supplement

RM500Q-GL
Hardware Design
5G Module Series
Version: 1.1
Date: 2021-03-10
Status: Released
www.quectel.com

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While Quectel has made efforts to ensure that the functions and features under development are free
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Copyright
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Copyright © Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved.

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Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to
comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergency help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as mobile phone or other cellular terminals. Areas with
potentially explosive atmospheres include fueling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders.

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About the Document
Revision History
Version
Date
Author
Description
1.0
2020-08-31
Norton ZHANG/
Kingson ZHANG
Qiqi WANG
Initial
1.1
2021-03-10
Norton ZHANG
Jerax KONG
1. Updated the status of 5G NR SA bands (in Table 2);
2. Added the supported GNSS system: GZSS (in Table 2);
3. Updated application fields of the module (in Chapter 2.1);
4. Updated the content and notes of key features (Chapter
2.2);
5. Updated 5G NR features (in Table 3);
6. Updated the temperature range of the module;
7. Updated I/O parameter definitions and deleted M.2 Socket
2 PCIe-based Pinout descriptions (in Chapter 2.6);
8. Updated the description of turn-on/turn-off/reset timing and
PCIe timing of the module (in Chapter 3.4, Chapter 3.5,
Chapter 3.6 and Chapter 4.3.4);
9. Updated the content of (U)SIM interfaces (Chapter 4.1);
10. Updated MIMO1 to PRX MIMO, and MIMO2 to DRX MIMO
(in Chapter 5);
11. Updated WCDMA information of ANT0 and ANT3 (in Table
30 and Table 31);
12. Updated 5G NR receiving sensitivity data (Table 33);
13. Added new chapters: Chapter 1.2, Chapter 1.3, Chapter
5.3.4, and Chapter 5.3.5;
14. Updated current consumption data (Table 40);
15. Updated the reference image of the module (Figure 38).

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Contents
Safety Information.......................................................................................................................................3
About the Document...................................................................................................................................4
Contents.......................................................................................................................................................5
Table Index...................................................................................................................................................8
Figure Index...............................................................................................................................................10
1Introduction........................................................................................................................................11
1.1. Introduction ...............................................................................................................................11
1.2. Reference Standard..................................................................................................................11
1.3. Special Mark .............................................................................................................................12
2Product Concept................................................................................................................................13
2.1. General Description..................................................................................................................13
2.2. Key Features.............................................................................................................................14
2.3. Evaluation Board.......................................................................................................................17
2.4. Functional Diagram...................................................................................................................17
2.5. Pin Assignment.........................................................................................................................18
2.6. Pin Description..........................................................................................................................19
3Operating Characteristics.................................................................................................................24
3.1. Operating Modes.......................................................................................................................24
3.1.1. Sleep Mode....................................................................................................................24
3.1.2. Airplane Mode................................................................................................................26
3.2. Communication Interface with a Host.......................................................................................26
3.3. Power Supply............................................................................................................................27
3.3.1. Decrease Voltage Drop..................................................................................................27
3.3.2. Reference Design for Power Supply..............................................................................28
3.3.3. Monitor the Power Supply..............................................................................................29
3.4. Turn on......................................................................................................................................29
3.5. Turn off......................................................................................................................................31
3.5.1. Turn off the Module Through FCPO#............................................................................31
3.5.2. Turn off the Module Through AT Command..................................................................32
3.6. Reset the Module......................................................................................................................33
4Application Interfaces .......................................................................................................................35
4.1. (U)SIM Interfaces......................................................................................................................35
4.1.1. Pin Definition of (U)SIM..................................................................................................35
4.1.2. (U)SIM Hot-plug.............................................................................................................36
4.1.3. Normally Closed (U)SIM Card Connector......................................................................37
4.1.4. Normally Open (U)SIM Card Connector........................................................................38
4.1.5. (U)SIM Card Connector Without Hot-plug.....................................................................39
4.1.6. (U)SIM Design Notices...................................................................................................40
4.2. USB Interface............................................................................................................................40

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4.3. PCIe Interface...........................................................................................................................42
4.3.1. PCIe Operating Mode....................................................................................................42
4.3.2. Pin Definition of PCIe.....................................................................................................43
4.3.3. Reference design for PCIe.............................................................................................44
4.3.4. PCIe Timing....................................................................................................................45
4.4. PCM Interface...........................................................................................................................47
4.5. Control and Indication Interfaces..............................................................................................49
4.5.1. W_DISABLE1#...............................................................................................................49
4.5.2. W_DISABLE2#...............................................................................................................50
4.5.3. WWAN_LED#.................................................................................................................51
4.5.4. WAKE_ON_WAN#.........................................................................................................51
4.5.5. DPR* ..............................................................................................................................52
4.5.6. STATUS*........................................................................................................................53
4.6. Cellular/WLAN COEX Interface*...............................................................................................53
4.7. Antenna Tuner Control Interface*.............................................................................................53
4.8. Configuration Pins.....................................................................................................................54
5RF Characteristic ...............................................................................................................................56
5.1. Cellular Antenna Interfaces.......................................................................................................56
5.1.1. Pin Definition..................................................................................................................56
5.1.2. Pin Mapping ...................................................................................................................57
5.1.3. Operating Frequency .....................................................................................................57
5.1.4. Receiving Sensitivity......................................................................................................59
5.1.5. Output Power .................................................................................................................61
5.2. GNSS Antenna Interface ..........................................................................................................62
5.2.1. General Description .......................................................................................................62
5.2.2. GNSS Frequency...........................................................................................................62
5.2.3. GNSS Performance .......................................................................................................63
5.3. Antenna Connectors.................................................................................................................64
5.3.1. Antenna Connector Location .........................................................................................64
5.3.2. Antenna Connector Size................................................................................................64
5.3.3. Antenna Connector Installation......................................................................................65
5.3.4. Recommended RF Connector for Installation ...............................................................67
5.3.4.1. Assemble Coaxial Cable Plug Manually.............................................................67
5.3.4.2. Assemble Coaxial Cable Plug with Jig ...............................................................68
5.3.5. Recommended Manufacturers of RF Connector and Cable.........................................69
5.4. Antenna Requirements.............................................................................................................69
6Electrical Characteristics and Reliability........................................................................................70
6.1. Power Supply Requirements ....................................................................................................70
6.2. Current Consumption................................................................................................................70
6.3. Digital I/O Characteristic...........................................................................................................75
6.4. Electrostatic Discharge.............................................................................................................76
6.5. Thermal Dissipation ..................................................................................................................76
6.6. Absolute Maximum Ratings......................................................................................................78

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6.7. Operating and Storage Temperatures......................................................................................78
7Mechanical Dimensions and Packaging .........................................................................................79
7.1. Mechanical Dimensions of the Module.....................................................................................79
7.2. Top and Bottom Views of the Module.......................................................................................80
7.3. M.2 Connector...........................................................................................................................80
7.4. Packaging .................................................................................................................................81
8Appendix References........................................................................................................................82

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Table Index
Table 1: Special Mark.................................................................................................................................12
Table 2: Frequency Bands and GNSS Systems of RM500Q-GL Module.................................................13
Table 3: Key Features of RM500Q-GL...................................................................................................... 14
Table 4: Definition of I/O Parameters......................................................................................................... 19
Table 5: Pin Description............................................................................................................................. 19
Table 6: Overview of Operating Modes ..................................................................................................... 24
Table 7: Definition of VCC and GND Pins................................................................................................. 27
Table 8: Definition of FCPO#.....................................................................................................................29
Table 9: Turn-on Timing of the Module......................................................................................................31
Table 10: Turn-off Timing of the Module Through FCPO#........................................................................32
Table 11: Turn-off Timing of the Module Through AT Command and FCPO# ......................................... 32
Table 12: Definition of RESET# Pin........................................................................................................... 33
Table 13: Reset Timing of the Module.......................................................................................................34
Table 14: Pin Definition of (U)SIM Interfaces ............................................................................................35
Table 15: Pin Definition of USB Interface.................................................................................................. 40
Table 16: Pin Definition of PCIe Interface.................................................................................................. 43
Table 17: Power-up Timing of M.2 Specification....................................................................................... 45
Table 18: PCIe Turn-on Timing of the Module........................................................................................... 46
Table 19: Pin Definition of PCM Interface.................................................................................................. 48
Table 20: Pin Definition of Control and Indication Interfaces..................................................................... 49
Table 21: RF Function Status ....................................................................................................................49
Table 22: GNSS Function Status...............................................................................................................50
Table 23: Network Status Indications of WWAN_LED#............................................................................51
Table 24: State of WAKE_ON_WAN#.......................................................................................................52
Table 25: Function of the DPR Signal........................................................................................................ 52
Table 26: Pin Definition of COEX Interface ............................................................................................... 53
Table 27: Pin Definition of Antenna Tuner Control Interface..................................................................... 53
Table 28: Configuration Pins List of M.2 Specification.............................................................................. 54
Table 29: Configuration Pins of the Module...............................................................................................54
Table 30: Pin Definition of RM500Q-GL Antenna Connectors.................................................................. 56
Table 31: RM500Q-GL Cellular Antenna Mapping.................................................................................... 57
Table 32: Module Operating Frequency....................................................................................................57
Table 33: RM500Q-GL Conducted RF Receiving Sensitivity.................................................................... 59
Table 34: RF Output Power .......................................................................................................................61
Table 35: GNSS Frequency....................................................................................................................... 62
Table 36: GNSS Performance ................................................................................................................... 63
Table 37: Major Specifications of the RF Connector................................................................................. 65
Table 38: Antenna Requirements.............................................................................................................. 69
Table 39: Power Supply Requirement.......................................................................................................70
Table 40: RM500Q-GL Current Consumption........................................................................................... 70
Table 41: Logic Levels of Digital I/O (1.8 V).............................................................................................. 75

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Table 42: (U)SIM 1.8 V I/O Requirements.................................................................................................75
Table 43: (U)SIM 3.0V I/O Requirements.................................................................................................. 76
Table 44: Electrostatic Discharge Characteristics (Temperature: 25 ºC , Humidity: 40 %)....................... 76
Table 45: Absolute Maximum Ratings....................................................................................................... 78
Table 46: Operating and Storage Temperatures.......................................................................................78
Table 47: Related Documents....................................................................................................................82
Table 48: Terms and Abbreviations........................................................................................................... 82

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Figure Index
Figure 1: Functional Block Diagram........................................................................................................... 17
Figure 2: Pin Assignment...........................................................................................................................18
Figure 3: DRX Run Time and Current Consumption in Sleep Mode.........................................................25
Figure 4: Sleep Mode Application with USB Remote Wakeup.................................................................. 25
Figure 5: Power Supply Limits During Radio Transmission ...................................................................... 27
Figure 6: Reference Circuit for VCC Pins..................................................................................................28
Figure 7: Reference Design for Power Supply .......................................................................................... 28
Figure 8: Turn on the Module with a Host GPIO........................................................................................ 30
Figure 9: Turn-on Timing of the Module.....................................................................................................30
Figure 10: Turn-off Timing Through FCPO#.............................................................................................. 31
Figure 11: Turn-off Timing Through AT Command and FCPO#............................................................... 32
Figure 12: Reference Circuit of RESET# with NPN Driver Circuit............................................................. 33
Figure 13: Reference Circuit of RESET# with Button................................................................................34
Figure 14: Reset Timing of the Module...................................................................................................... 34
Figure 15: Reference Circuit for Normally Closed (U)SIM Card Connector.............................................. 38
Figure 16: Reference Circuit for Normally Open (U)SIM Card Connector................................................ 39
Figure 17: Reference Circuit for a 6-pin (U)SIM Card Connector ............................................................. 39
Figure 18: Reference Circuit for USB 3.1/2.0 Interface.............................................................................41
Figure 19: PCIe Interface Reference Circuit.............................................................................................. 44
Figure 20: PCIe Power-on Timing Requirements of M.2 Specification..................................................... 45
Figure 21: PCIe Power-on Timing of the Module.......................................................................................46
Figure 22: Primary Mode Timing................................................................................................................ 47
Figure 23: Auxiliary Mode Timing .............................................................................................................. 48
Figure 24: W_DISABLE1# and W_DISABLE2# Reference Circuit...........................................................50
Figure 25: WWAN_LED# Reference Circuit..............................................................................................51
Figure 26: WAKE_ON_WAN# Signal Reference Circuit........................................................................... 52
Figure 27: Recommended Circuit for Configuration Pins..........................................................................55
Figure 28: Antenna Connectors on the Module......................................................................................... 64
Figure 29: RM500Q-GL RF Connector Dimensions (Unit: mm)................................................................ 65
Figure 30: Specifications of Mating Plugs Using Ø 0.81 mm Coaxial Cables...........................................66
Figure 31: Connection between RF Connector and Mating Plug Using Ø 0.81 mm Coaxial Cable.........66
Figure 32: Connection between RF Connector and Mating Plug Using Ø 1.13 mm Coaxial Cable.........67
Figure 33：Plug in a Coaxial Cable Plug ..................................................................................................67
Figure 34：Pull out a Coaxial Cable Plug .................................................................................................68
Figure 35：Install the Coaxial Cable Plug with Jig.................................................................................... 68
Figure 36: Thermal Dissipation Area Inside and on Bottom Side of the Module (Unit: mm) ....................77
Figure 37: Mechanical Dimensions of RM500Q-GL (Unit: mm)................................................................79
Figure 38: Top and Bottom View of the Module........................................................................................80
Figure 39: Tray Size (Unit: mm).................................................................................................................81
Figure 40: Tray Packaging Procedure....................................................................................................... 81

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1Introduction
1.1. Introduction
This document introduces RM500Q-GL module and describes its air interface and hardware interfaces
which are connected with customers’ applications.
This document helps you quickly understand the interface specifications, electrical and mechanical
details, as well as other related information of the module. To facilitate its application in different fields,
reference design is also provided for reference. Coupled with application notes and user guides, you can
easily design and set up mobile applications with RM500Q-GL. You can also view the RM500Q-GL
reference design to understand the module hardware architecture. For details, see document [1].
1.2. Reference Standard
The module complies with the following standards:
⚫PCI Express M.2 Specification Revision 3.0, Version 1.2
⚫PCI Express Base Specification Revision 3.0
⚫Universal Serial Bus 3.1 Specification
⚫ISO/IEC 7816-3
⚫MIPI Alliance Specification for RF Front-End Control Interface version 2.0
⚫3GPP TS 27.007 and 3GPP TS 27.005

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1.3. Special Mark
Table 1: Special Mark
Mark
Definition
*
When an asterisk (*) is used after a function, feature, interface, pin name, AT command, or
argument, it indicates that the function, feature, interface, pin name, AT command, or
argument is under development and currently not supported, unless otherwise specified.
[…]
Brackets ([…]) used after a pin enclosing a range of numbers indicate all pins of the same
type. For example, ANTCTL[1:2] refers to both two ANTCTL pins, ANTCTL1 and
ANTCTL2.

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2Product Concept
2.1. General Description
RM500Q-GL is a 5G NR/LTE-FDD/LTE-TDD/UMTS/HSPA+ wireless communication module with receive
diversity. It provides data connectivity on 5G NR SA and NSA, LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+,
HSDPA, HSUPA and WCDMA networks. RM500Q-GL is standard M.2 Key-B WWAN module. For more
details, see PCI Express M.2 Specification Revision 3.0, Version 1.2.
RM500Q-GL is an industrial-grade module for industrial and commercial applications only.
RM500Q-GL supports embedded operating systems such as Windows, Linux and Android, and also
provides GNSS and voice functionality to meet specific application demands.
The following table shows the frequency bands and GNSS systems of RM500Q-GL module.
Table 2: Frequency Bands and GNSS Systems of RM500Q-GL Module
Mode
RM500Q-GL
5G NR SA
n1/n2/n3/n5/n7/n8/n12/n20/n25/n28/n38/n40/n41/n48*/n66/n71/n77/n78/n79
5G NR NSA
n38/n41/n77/n78/n79
LTE-FDD
B1/B2/B3/B4/B5/B7/B8/B12/B13/B14/B17/B18/B19/B20/B25/B26/B28/B29/B30/
B32/B66/B71
LTE-TDD
B34/B38/B39/B40/B41/B42/B43/B48
LAA
B46
WCDMA
B1/B2/B3/B4/B5/B8/B19
GNSS
GPS/GLONASS/BeiDou(COMPASS)/Galileo/QZSS

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RM500Q-GL can be applied in the following fields:
⚫Rugged tablet PC and laptop computer
⚫Remote monitor system
⚫Smart metering system
⚫Wireless CPE
⚫Smart TV
⚫Outdoor Live devices
⚫Wireless router and switch
⚫Other wireless terminal devices
2.2. Key Features
The following table describes key features of RM500Q-GL.
Table 3: Key Features of RM500Q-GL
Feature
Details
Function Interface
⚫PCI Express M.2 Interface
Power Supply
⚫Supply voltage: 3.135–4.4 V
⚫Typical supply voltage: 3.7 V
(U)SIM Interface
⚫Compliant with ISO/IEC 7816-3
⚫Supported (U)SIM card: Class B (3.0 V) and Class C (1.8 V)
⚫(U)SIM1 and (U)SIM2 interfaces
⚫Dual SIM Single Standby
USB Interface
⚫Compliant with USB 3.1 and 2.0 specifications, with maximum transmission
rates up to 10 Gbps on USB 3.1 and 480 Mbps on USB 2.0.
⚫Used for AT command communication, data transmission, firmware upgrade,
software debugging, GNSS NMEA sentence output and voice over USB.
⚫Supported USB serial drivers: Windows 7/8/8.1/10, Linux 2.6–5.4, Android
4.x/5.x/6.x/7.x/8.x/9.x/10
PCIe Interface
⚫Complaint with PCIe Gen 3
⚫PCIe ×1, supporting 8 Gbps per lane.
⚫Used for AT command communication, data transmission, firmware upgrade,
software debugging, GNSS NMEA sentence output
PCM Interface
⚫Used for audio function with external codec
⚫Supports 16-bit linear data format
⚫Supports long and short frame synchronization
⚫Supports master and slave modes, but must be the master in long frame

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synchronization
Transmitting
Power
⚫WCDMA bands: Class 3 (24 dBm +1/-3 dB)
⚫LTE bands: Class 3 (23 dBm ±2 dB)
⚫LTE B38/B40/B41/B42/B43 bandsHPUE 1): Class 2 (26 dBm ±2 dB)
⚫5G NR bands: Class 3 (23 dBm ±2 dB)
⚫5G NR n41/n77/n78/n79 bands HPUE: Class 2 (26 dBm +2/-3 dB)
5G NR Features
⚫Supports 3GPP Rel-15
⚫Supported modulations:
- Uplink: π/2-BPSK, QPSK, 16QAM, 64QAM and 256QAM
- Downlink: QPSK, 16QAM, 64QAM and 256QAM
⚫Supported MIMO:
- Uplink: 2 ×2 MIMO2) on n41/n77/n78/n79
- Downlink: 4 ×4 MIMO on n1/n2/n3/n7/25/n38/n40/n41/n48*/n66/n77/
n78/n79
⚫SCS 15 kHz 3) and 30 kHz3)
⚫SA and NSA operation modes4)
- NSA on n38/n41/n77/n78/n79
- SA on all the 5G bands
⚫Option 3x, 3a, 3, and Option 2
⚫Max. transmission data rates5)
- NSA: 2.5 Gbps (DL)/ 650 Mbps (UL)
- SA: 2.1 Gbps (DL)/ 900 Mbps (UL)
LTE Features
⚫Supports 3GPP Rel-15
⚫LTE Category: DL Cat 16; UL Cat 18
⚫Supported Modulations:
- Uplink QPSK, 16QAM, 64QAM and 256QAM*
- Downlink QPSK, 16QAM, 64QAM and 256QAM
⚫Supports 1.4/3/5/10/15/20 MHz RF bandwidth
⚫Supports DL 4 ×4 MIMO on:
B1/B2/B3/B4/B7/B25/B30/B32/B34/B38/B39/B40/B41/B42/B43/B48/B66
⚫Max. transmission data rates 5): 1.0 Gbps (DL)/ 200 Mbps (UL)
UMTS Features
⚫Supports 3GPP Rel-9 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA
⚫Supports QPSK, 16QAM and 64QAM modulations
⚫Max. transmission data rates 5):
- DC-HSDPA: 42 Mbps (DL)
- HSUPA: 5.76 Mbps (UL)
- WCDMA: 384 kbps (DL/UL)
Rx-diversity
⚫5G NR/LTE/WCDMA Rx-diversity
GNSS Features
⚫Qualcomm Gen9C Lite
⚫Protocol: NMEA 0183
⚫Data Update Rate: 1 Hz
Antenna
⚫ANT0, ANT1, ANT2_GNSSL1, and ANT3

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1. 1) HPUE is only for single carrier.
2. 2) Uplink 2 ×2 MIMO is only supported in 5G SA mode.
3. 3) 5G NR FDD bands only support 15 kHz SCS, and NR TDD bands only support 30 kHz SCS.
4. 4) See document [2] for bandwidth supported by each frequency band in the NSA and SA modes.
5. 5) The maximum rates are theoretical and for the actual values, refer to the network configuration.
6. 6) To meet this operating temperature range, you need to ensure effective thermal dissipation, for
example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range,
the module can meet 3GPP specifications.
7. 7) To meet this extended temperature range, you need to ensure effective thermal dissipation, for
example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range,
the module remains the ability to establish and maintain functions such as voice, SMS, emergency
call, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not
influenced, while one or more specifications, such as Pout, may undergo a reduction in value,
exceeding the specified tolerances of 3GPP. When the temperature returns to the normal operating
temperature level, the module will meet 3GPP specifications again.
Interfaces
AT Commands
⚫Compliant with 3GPP TS 27.007 and 3GPP TS 27.005
⚫Quectel enhanced AT commands
Internet Protocol
Features
⚫Supports QMI/NTP* protocols
⚫Supports the protocols PAP and CHAP usually used for PPP connections
Firmware Upgrade
⚫USB 2.0 interface
⚫PCIe interface
⚫DFOTA
SMS
⚫Text and PDU modes
⚫Point-to-point MO and MT
⚫SMS cell broadcast
⚫SMS storage: ME by default
Physical
Characteristics
⚫M.2 Key-B
⚫Size: (30.0 ±0.15) mm ×(52.0 ±0.15) mm ×(2.3 ±0.2) mm
⚫Weight: approx. 8.7 g
Temperature
Range
⚫Operating temperature range: -30 °C to +70 °C 6)
⚫Extended temperature range: -40 °C to +85 °C 7)
⚫Storage temperature range: -40°C to +90°C
RoHS
⚫All hardware components are fully compliant with EU RoHS directive
NOTES

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2.3. Evaluation Board
To help you develop applications conveniently with RM500Q-GL, Quectel supplies an evaluation board
(PCIe Card EVB), a USB to RS-232 converter cable, a USB type-B cable, antennas and other peripherals
to control or test the module. For more details, see document [3].
2.4. Functional Diagram
The following figure shows the functional diagram of RM500Q-GL.
⚫Power management
⚫Baseband
⚫LPDDR4X SDRAM + NAND Flash
⚫Radio frequency
⚫M.2 Key-B interface
ANT0
ANT3
ANT2_GNSSL1
38.4MHz XO
Qlink
Control
Tx
PRx
DRx
PCI Express M.2 Key-B Interface
FULL_CARD_POWER_OFF#
W_DISABLE2#
USB 2.0 & USB 3.1
(U)SIM1
WWAN_LED#
WAKE_ON_WAN#
RFFE
W_DISABLE1#
GPIOs
ANT1
PCIe 3.0 ×1
(U)SIM2
GND
RESET#
VCC
SPMI
Clock IC
BB_CLK 19.2MHz RF_CLK 38.4MHz
EBI1
EBI2
32.768kHz
PMIC
MCP
NAND 4Gb x 8
LPDDR4X 4Gb x 16
Baseband
Sub-6 GHz
Transceiver
Tx/Rx Blocks ET
Figure 1: Functional Block Diagram

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2.5. Pin Assignment
The following figure shows the pin assignment of RM500Q-GL. The top side contains the four antenna
connectors.
PIN2
PIN74
BOT
PIN1
PIN75
TOP
Pin Name No.
CONFIG_2 75
GND 73
GND 71
CONFIG_1 69
RESET# 67
RFFE_VIO_1V8 65
ANTCTL2 63
ANTCTL1 61
LAA_TX_EN 59
GND 57
PCIE_REFCLK_P 55
PCIE_REFCLK_M 53
GND 51
PCIE_RX_P 49
PCIE_RX_M 47
GND 45
PCIE_TX_P 43
PCIE_TX_M 41
GND 39
USB_SS_RX_P 37
USB_SS_RX_M 35
GND 33
USB_SS_TX_P 31
USB_SS_TX_M 29
GND 27
DPR 25
WAKE_ON_WAN# 23
CONFIG_0 21
Notch
Notch
Notch
Notch
GND 11
USB_DM 9
USB_DP 7
GND 5
GND 3
CONFIG_3 1
PIN11
PIN10
No. Pin Name
74 VCC
72 VCC
70 VCC
68 AP2SDX_STATUS
66 USIM1_DET
64 COEX_TXD
62 COEX_RXD
60 WLAN_TX_EN
58 RFFE_DATA
56 RFFE_CLK
54 PCIE_WAKE_N
52 PCIE_CLKREQ_N
50 PCIE_RST_N
48 USIM2_VDD
46 USIM2_RST
44 USIM2_CLK
42 USIM2_DATA
40 USIM2_DET
38 SDX2AP_STATUS
36 USIM1_VDD
34 USIM1_DATA
32 USIM1_CLK
30 USIM1_RST
28 PCM_SYNC
26 W_DISABLE2#
24 PCM_DOUT
22 PCM_DIN
20 PCM_CLK
Notch
Notch
Notch
Notch
10 WWAN_LED#
8 W_DISABLE1#
6
FULL_CARD_POWER_OFF#
4 VCC
2 VCC
Figure 2: Pin Assignment

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2.6. Pin Description
Table 4: Definition of I/O Parameters
Type
Description
AI
Analog Input
AO
Analog Output
AIO
Analog Input/Output
DI
Digital Input
DO
Digital Output
DIO
Digital Input/Output
OD
Open Drain
PI
Power Input
PO
Power Output
PU
Pull Up
PD
Pull Down
The following table shows the pin definition and description of RM500Q-GL.
Table 5: Pin Description
PIN
No.
Pin Name
I/O
Description
DC
Characteristic
Comment
1
CONFIG_3
DO
Not connected
internally
2
VCC
PI
Power supply
Vmin = 3.135 V
Vnorm = 3.7 V
Vmax = 4.4 V
3
GND
Ground
4
VCC
PI
Power supply
Vmin = 3.135 V
Vnorm = 3.7 V
Vmax = 4.4 V