Rockwell Automation Trusted TMR 24V DC User manual

Rockwell Automation Publication ICSTT-RM451D-EN-P - March 2021
Supersedes Publication ICSTT-RM451C-EN-P - January 2019
Product Description
Original Instructions
Trusted TMR 24V DC/48V DC
Output Module - 40 Channel
PD-T8461 Issue 16

Trusted TMR 24V DC/48V DC Output Module - 40 Channel
2 Rockwell Automation Publication ICSTT-RM451D-EN-P - March 2021
Important User Information
Read this document and the documents listed in the additional resources section about installation, configuration, and
operation of this equipment before you install, configure, operate, or maintain this product. Users are required to familiarize
themselves with installation and wiring instructions in addition to requirements of all applicable codes, laws, and standards.
Activities including installation, adjustments, putting into service, use, assembly, disassembly, and maintenance are required to
be carried out by suitably trained personnel in accordance with applicable code of practice.
If this equipment is used in a manner not specified by the manufacturer, the protection provided by the equipment may be
impaired.
In no event will Rockwell Automation, Inc. be responsible or liable for indirect or consequential damages resulting from the use
or application of this equipment.
The examples and diagrams in this manual are included solely for illustrative purposes. Because of the many variables and
requirements associated with any particular installation, Rockwell Automation, Inc. cannot assume responsibility or liability for
actual use based on the examples and diagrams.
No patent liability is assumed by Rockwell Automation, Inc. with respect to use of information, circuits, equipment, or software
described in this manual.
Reproduction of the contents of this manual, in whole or in part, without written permission of Rockwell Automation, Inc., is
prohibited.
Throughout this manual, when necessary, we use notes to make you aware of safety considerations.
WARNING:
Identifies information about practices or circumstances that can cause an explosion in a hazardous environment, which may lead to
personal injury or death, property damage, or economic loss.
ATTENTION:
Identifies information about practices or circumstances that can lead to personal injury or death, property damage, or economic loss.
Attentions help you identify a hazard, avoid a hazard,and recognize the consequence.
IMPORTANT
Identifies information that is critical for successful application and understanding of the product.
Labels may also be on or inside the equipment to provide specific precautions.
SHOCK HAZARD:
Labels may be on or inside the equipment, for example, a drive or motor, to alert people that dangerous voltage may be present.
BURN HAZARD:
Labels may be on or inside the equipment, for example, a drive or motor, to alert people that surfaces may reach dangerous
temperatures.
ARC FLASH HAZARD:
Labels may be on or inside the equipment, for example, a motor control center, to alert people to potential Arc Flash. Arc Flash will
cause severe injury or death. Wear proper Personal Protective Equipment (PPE). Follow ALL Regulatory requirements for safe work practices and for
Personal Protective Equipment (PPE).

Rockwell Automation Publication ICSTT-RM451D-EN-P - March 2021 3
Table of Contents
Summary of changes .................................................................................. 5
About this Publication................................................................................ 5
Chapter 1
Chapter 2
Field Termination Unit (FTU)................................................................... 11
Field Interface Unit (FIU).......................................................................... 11
Host Interface Unit (HIU) .........................................................................12
Front Panel Unit (FPU) ..............................................................................12
Line Monitoring and Output States..........................................................13
Housekeeping.............................................................................................13
Fault Detection/Testing.............................................................................13
Sequence of Events Characteristics..........................................................14
Output Switch Structure............................................................................14
Switch Diagnostics...............................................................................16
Short Circuit Protection ......................................................................16
Group Fail-Safe Switches ....................................................................16
Chapter 3
Module Insertion and Removal ................................................................19
Cable Selection...........................................................................................19
Termination...............................................................................................20
Module Pin-out Connections ...................................................................20
Trusted Module Polarisation/Keying........................................................21
Chapter 4
Module Configuration...............................................................................23
T8461 Complex Equipment Definition.....................................................23
Rack 3: AI.............................................................................................. 25
Rack 4: CI ............................................................................................. 25
Rack 5: LINE_FLT................................................................................ 26
Rack 6: DISCREP................................................................................. 26
Rack 7: HKEEPING ............................................................................. 26
Rack 8: INFO........................................................................................ 28
Sequence of Events Configuration .......................................................... 29
Chapter 5
Front Panel .................................................................................................31
Module Status LEDs ..................................................................................32
I/O Status Indicators..................................................................................33
Preface
Product overview
Description
Installation
Application
Operation

Table of Contents
4 Rockwell Automation Publication ICSTT-RM451D-EN-P - March 2021
Chapter 6
Fault Reporting ..........................................................................................35
Field Wiring Faults ....................................................................................35
Module Faults .............................................................................................35
Companion Slot..........................................................................................36
SmartSlot ....................................................................................................36
Cold Start ....................................................................................................36
Transfer between Active and Standby Modules.......................................37
Chapter 7
Appendix A
Fault Finding and Maintenance
Specifications
History of Changes

Rockwell Automation Publication ICSTT-RM451D-EN-P - March 2021 5
Preface
This manual includes new and updated information. Use these reference
tables to locate changed information.
Grammatical and editorial style changes are not included in this summary.
Global changes
This table identifies changes that apply to all information about a subject in
the manual and the reason for the change. For example, the addition of new
supported hardware, a software design change, or additional reference
material would result in changes to all of the topics that deal with that subject.
Subject
Reason
Updated branding
Marketing product change
This manual specifies the maintenance requirements and describes the
procedures to assist troubleshooting and maintenance of a Trusted system.
This manual is for plant maintenance personnel who are experienced in the
operation and maintenance of electronic equipment and are trained to work
with safety systems.
Disclaimer
It is not intended that the information in this publication covers every
possible detail about the construction, operation, or maintenance of a control
system installation. You should also refer to your own local (or supplied)
system safety manual, installation, and operator/maintenance manuals.
Revision and updating policy
This document is based on information available at the time of its publication,
however, they are subject to change from time to time. The latest versions of
the manuals are available at the Rockwell Automation Literature Library:
rok.auto/literature.
Trusted release
This technical manual was updated for Trusted Release 4.0.
Summary of changes
About this Publication

Preface
6 Rockwell Automation Publication ICSTT-RM451D-EN-P - March 2021
Latest product information
See the Trusted Release Note for the revision of this document applicable to
the release at rok.auto/pcdc.
For the latest information about this product, review the Product
Notifications and Technical Notes available at rok.auto/knowledgebase.
Some of the Articles in the Knowledgebase require a TechConnect℠Support
Contract. For more information, go to Knowledgebase Document ID: IP622-
TechConnect Support Contract - Access Level & Features.
Tip: Sign in to your Rockwell Automation account to view Knowledgebase articles.

Rockwell Automation Publication ICSTT-RM451D-EN-P - March 2021 7
Chapter 1
Product overview
The Trusted® Triple Modular Redundant (TMR) 24V DC / 48V DC Digital
Output Module interfaces to 40 field devices. Triplicated diagnostic tests are
performed throughout the Module including measurements for current, and
voltage on each portion of the voted output channel. Tests are also performed
for stuck on and stuck off failures. Fault tolerance is achieved through a TMR
architecture within the Module for each of the 40 output channels.
Automatic line-monitoring of the field device is provided. This feature enables
the Module to detect both open and short circuit failures in field wiring and
load devices.
The Module provides onboard Sequence of Events (SOE) reporting with a
resolution of 1 ms. An output change of state triggers an SOE entry. Output
states are automatically determined by voltage and current measurements
onboard the Module.
This Module is not approved for direct connection to hazardous areas and
should be used in conjunction with Intrinsic Safety Barrier devices.
Features
•40 TMR output channels per Module.
•Comprehensive, automatic diagnostics and self-test.
•Automatic line monitoring per channel to detect open circuit and short
circuit field wiring and load faults.
•2500V impulse withstand opto/galvanic isolation barrier.
•Automatic overcurrent protection (per channel), no external fuses
required.
•Onboard Sequence of Events (SOE) reporting with 1 ms resolution.
•Module can be hot-replaced online using dedicated Companion
(adjacent) Slot or SmartSlot (one spare slot for many Modules)
configurations.
•Front Panel output status light-emitting diodes (LEDs) for each
channel indicate output status and field wiring faults.
•Front Panel Module status LEDs indicate Module health and
operational mode (Active, Standby, Educated).
•TϋV Certified IEC 61508 SIL 3.
•Outputs are powered in isolated groups of eight. Each such group is a
Power Group (PG).

Rockwell Automation Publication ICSTT-RM451D-EN-P - March 2021 9
Chapter 2
Description
The TMR 24V DC/48V DC Digital Output Module is a member of the Trusted
range of Input/Output (I/O) Modules. All Trusted I/O Modules share common
functionality and form. At the most general level, all I/O Modules interface to
the Inter-Module Bus (IMB) which provides power and allows communication
with the TMR Processor. In addition, all Modules have a field interface that is
used to connect to Module-specific signals in the field. All Modules are Triple
Modular Redundant (TMR).

Chapter 2 Description
10 Rockwell Automation Publication ICSTT-RM451D-EN-P - March 2021
Figure 1: Module Architecture
All High Integrity I/O Modules are made up of four sections: Host Interface
Unit (HIU), the Field Interface Unit (FIU), the Field Termination Unit (FTU),
and the Front Panel Unit (or FPU).

Chapter 2 Description
Rockwell Automation Publication ICSTT-RM451D-EN-P - March 2021 11
Figure 2 shows a simplified block diagram of the Trusted 24/48V DC Digital
Output Module.
Figure 2: Functional Block Diagram
The Field Termination Unit (FTU) is the section of the I/O Module that
connects all three FIUs to a field interface. The FTU provides the Group Fail-
Safe switches and passive components necessary for signal conditioning,
overvoltage protection, and EMI/RFI filtering. When installed in a Trusted
Controller or Expander Chassis, the FTU field connector interconnects to the
Field I/O Cable Assembly attached at the rear of the Chassis.
The SmartSlot link is passed from the HIU to the field connections via the
FTU. These signals go directly to the field connector and maintain isolation
from the I/O signals on the FTU. The SmartSlot link is the intelligent
connection between Active and Standby Modules for coordination during
Module replacement.
The Field Interface Unit (FIU) is the section of the Module that contains the
specific circuits necessary to interface to the particular types of field I/O
signals. Each Module has three FIUs, one per slice. For the TMR 24V DC/48V
DC Digital Output Module, the FIU contains one stage of the output switch
structure, and sigma-delta (ΣΔ) output circuit for each of the 40 field outputs.
Two additional ΣΔ circuits provide optional monitoring of the external field
I/O supply voltage.
Field Termination Unit (FTU)
Field Interface Unit (FIU)

Chapter 2 Description
12 Rockwell Automation Publication ICSTT-RM451D-EN-P - March 2021
The FIU receives isolated power from the HIU for logic. The FIU provides
additional power conditioning for the operational voltages that are required
by the FIU circuitry. An isolated 6.25 Mbit/sec serial link connects each FIU to
one of the HIU slices.
The FIU also measures a range of onboard “housekeeping” signals that help in
monitoring the performance and operating conditions of the Module. These
signals include power supply voltages, current consumption, onboard
reference voltages, and board temperature.
The HIU is the point of access to the Inter-Module Bus (IMB) for the Module.
It also provides power distribution and local programmable processing
power. The HIU is the only section of the I/O Module to directly connect to the
IMB Backplane. The HIU is common to most high integrity I/O types and has
type dependent and product range common functions. Each HIU contains
three independent slices, commonly referred to as A, B, and C.
All interconnections between the three slices incorporate isolation to help
prevent any fault interaction between the slices. Each slice is considered a
Fault Containment Region (FCR), as a fault on one slice has no effect on the
operation of the other slices.
The HIU provides the following services common to the Modules in the
family:
•High Speed Fault Tolerant Communications with the TMR Processor
via the IMB interface.
•FCR Interconnect Bus between slices to vote incoming IMB data and
distribute outgoing I/O Module data to IMB.
•Galvanically isolated serial data interface to the FIU slices.
•Redundant power sharing of dual 24V DC chassis supply voltage and
power regulation for logic power to HIU circuitry.
•Magnetically isolated power to the FIU slices.
•Serial data interface to the FPU for Module status LEDs.
•SmartSlot link between Active and Standby Modules for coordination
during Module replacement.
•Digital Signal Processing to perform local data reduction and self-
diagnostics.
•Local memory resources for storing Module operation, configuration,
and field I/O data.
•Onboard housekeeping, which monitors reference voltages, current
consumption and board temperature.
The Front Panel Unit (FPU) contains the necessary connectors, switches,
logic, and LED indicators for the Front Panel. For every type of Trusted I/O
Module, the FPU contains the Slice Healthy, Active/Standby, the Educated
LED indicators, and the Module removal switches. Additional bicolor LEDs
provide status indication for the individual I/O signals. Serial data interfaces
Host Interface Unit (HIU)
Front Panel Unit (FPU)

Chapter 2 Description
Rockwell Automation Publication ICSTT-RM451D-EN-P - March 2021 13
connect the FPU to each of the HIU slices to control the LED status indicators
and monitor the Module removal switches.
The Module automatically monitors the output channel current and voltage to
determine the state of the output channel. The numerical output state and
line fault status are reported back to the application and are represented
below.
Table 1 Line Monitoring Fault Status
Description
Numerical Output State
Line Fault Status
Field Short Circuit
5
1
Output Energized (On)
4
0
No Load, Field Open
Circuit
3 1
Output De-energized (Off)
2
0
No Field Supply Voltage 1 1
It is recommended to fit a dummy load resistor to unused outputs so that a
current is drawn that exceeds the NO-LOAD threshold. This helps prevent the
Module from signaling a NO-LOAD fault.
The Output Module automatically performs local measurements of several
onboard signals that can be used for detailed troubleshooting and verification
of Module operating characteristics. Measurements are made within each
slice’s HIU and FIU.
Extensive diagnostics provide the automatic detection of Module faults. The
TMR architecture of the Output Module and the diagnostics performed verify
the validity of all critical circuits. Using the TMR architecture provides a Fault
Tolerant method to withstand the first fault occurrence on the Module and
continue normal output controls without interruption in the system or
process. Faults are reported to the user through the Healthy status indicators
on the Front Panel of the Module and through the information that is
reported to the TMR Processor. Under normal operations, all three Healthy
indicators are green. When a fault occurs, one of the Healthy indicators
flashes red. It is recommended that this condition is investigated and if the
cause is within the Module, it should be replaced.
Module replacement activities depend on the type of spare Module
configuration that is chosen when the system was configured and installed.
The Module may be configured with a dedicated Companion Slot or with a
SmartSlot for a spare replacement Module.
From the IMB to the field connector, the I/O Module contains extensive fault
detection and integrity testing. As an output device, most testing is performed
in a non-interfering mode. Data input from the IMB is stored in redundant
error-correcting RAM on each slice portion of the HIU. Received data is voted
on by each slice. All data transmissions include a confirmation response from
the receiver.
Line Monitoring and Output
States
Housekeeping
Fault Detection/Testing

Chapter 2 Description
14 Rockwell Automation Publication ICSTT-RM451D-EN-P - March 2021
Periodically, the TMR Processor commands the onboard Digital Signal
Processors (DSPs) to perform a Safety Layer Test (SLT). The SLT results in the
DSP verifying with the TMR Processor its ability to process data with
integrity. In addition, the DSP uses Cyclical Redundancy Checks (CRC) to
verify the variables and configuration stored in Flash memory.
Between the HIU and FIU are a series of galvanically isolated links for data
and power. The data link is synchronized and monitored for variance. Both
FIU and HIU have onboard temperature sensors to characterize temperature-
related problems.
The power supplies for both the HIU and FIU boards are redundant, fully
instrumented and testable. Together these assemblies form a Power Integrity
Subsystem.
The Module automatically measures the field voltage and current to
determine the state of each output channel. An event occurs when the output
transitions from one state to another. When a channel changes state, the
onboard timer value is recorded. When the TMR Processor next reads data
from the Output Module, the channel state and real-time clock value are
retrieved. The TMR Processor uses this data to log the state change into the
system Sequence of Events (SOE) log. The user may configure each output to
be included in the system SOE log. Full details of SOE are contained in
Trusted Sequence of Events and Process Historian Package Product
Description, publication ICSTT-RM243.
The Digital Output Module provides a TMR switch topology where the load is
driven by a total of three fully monitored, fail-safe (6 element) switch
channels, one physically resident on each FIU in the Module. Any single
switch or entire slice failure is designed to leave two of the three fail-safe
switch channels operational to power the load.
Figure 3: Output Switch Structure
Sequence of Events
Characteristics
Output Switch Structure

Chapter 2 Description
Rockwell Automation Publication ICSTT-RM451D-EN-P - March 2021 15
The upper switches in shown in Figure 3 are denoted as N.O. (Normally
Open), and are controlled by the FIU on which they are physically resident1.
The lower switches are depicted as N.C. (Normally Closed), and are controlled
by the “upstream” neighboring FIU2.
Tip: In this context, N.O. is defined as being in the off state in the absence of control signal power,
and similarly, N.C. is the on state in the absence of control signal power. These switches are
constructed from enhancement mode MOSFETs and are both guaranteed to be off in the absence of
Module power to create gate voltage signals to bias them on3(unlike electromechanical relays for
example).
The reason that the lower switches are specified to be on in the absence of
control signal power is to allow two channels to power the load should an
entire slice fail. Even if an entire slice fails, the surviving output circuits
carries the necessary control.
The structure of each FIU output is shown in this diagram:
Figure 4: Simplified Switch Circuit Diagram
A resistor provides a means of continuously monitoring the switch current. A
signal transistor is used to drive the gate of Switch 2. It provides Switch 2 with
a negative gate voltage, to minimize its on resistance, and serves to hold
Switch 2 on in case the secondary gate control loses power.
The Zener diode between the gate of Switch 2 and source is only required to
protect the gate from large voltage spikes on the drain that might capacitively
couple through when Switch 1 and Switch 2 are in the off state.
1Their “home” FIU.
2The home FIU, supplies an independent control signal for the “downstream” FIU
FSS.
3For an unfaulted transistor.

Chapter 2 Description
16 Rockwell Automation Publication ICSTT-RM451D-EN-P - March 2021
The resistors in series with the gate of Switch 1 and the signal transistor serve
to protect the drive logic if there is a malicious switch failure. The pull-up
resistors define the gate voltages in the absence of power.
Switch Diagnostics
During normal operation, Switch 1 and Switch 2 are maintained on. In this
state, Switch 1 and Switch 2 exhibit a low resistance.
To determine the ability of the system to control the load via Switch 1 and
Switch 2, their gate voltages are modulated, one at a time. As the gate voltages
are modulated, the monitoring signals synchronously change in a predictable
fashion. The local DSP analyzes the relative amplitude and phase of these
small AC signals, to determine the on resistance and threshold voltages of
each switch.
The current to the load does not need to be completely interrupted to obtain a
level of confidence in the ability of the transistors to turn off. For the TMR
switch configuration in the on state, only one fail-safe switch at a time needs
to be modulated, while the other two bear the load current.
Short Circuit Protection
Output channels are classified as protected under IEC 61131-2, specifically
‘Protected Outputs Requirements’.
While energizes, the channel output current is monitored to protect the
channel switches from damage by a sustained overcurrent condition. Having
detected a sustained overcurrent condition a short-circuit fault state is
latched and the output is de-energized.
While de-energized, the output may be optionally be configured to detect
short-circuit field faults (resistance less than 40 Ω) through System .INI file
configuration. The detection of short-circuits while de-energized relies upon a
partial energizing of the field circuit to determine the channel load resistance.
The partial energizing of a field circuit is designed to constrain any change in
field voltage or current to less than 2V or 100 mA, respectively.
A latched short-circuit fault state can be cleared by operating the system Fault
Reset button or by transitioning the commanded channel state.
The output also includes a non-replaceable fusible link for absolute protection
Group Fail-Safe Switches
To support safe operation, the Output Module is equipped with a series of
switches that provide source power to a group of eight output channels, a
Power Group. The output Module Group Fail-Safe Switch (GFSS) is intended

Chapter 2 Description
Rockwell Automation Publication ICSTT-RM451D-EN-P - March 2021 17
as a final control switch, which can de-energize any outputs that cannot be de-
energized in the normal way. For safety, the presence of two or more faults
within the Output Module causes the Group Fail-Safe Switches to de-energize,
resulting in all outputs in its group to de-energize.
There are three switches in parallel, which comprise the GFSS, one associated
with each 'slice' of the power group. The GFSS’ are controlled via a signal from
one of the other two neighboring slices. This means that if one slice
determines from the output states that an output is not in a de-energized
state when it should be, then it can command its own GFSS and those of the
other slices GFSS to de-energize. This results in two of the three elements of
the GFSS structure to de-energize, leaving only one GFSS element energized.
If two slices do the same thing, then the last GFSS output de-energizes. For
example, this would occur if two or more output switch elements fail in a
'stuck-on' state such that the output cannot de-energize.
The GFSS control signal is generated by a charge pump driven from the
comms clock to the slice power group. If the clock fails, then the GFSS bias
collapses. This means that even if the ability of the slice to communicate with
a power group is lost, the GFSS can still be de-energized by stopping the
comms clock. If a slice fails, the watchdog on the HIU times out and resets the
slice, this shuts down the FIU power supply and the associated GFSS control
signal also de-energizes.

Rockwell Automation Publication ICSTT-RM451D-EN-P - March 2021 19
Chapter 3
Installation
Before installation, visually inspect the Module for damage. Ensure that the
Module housing appears undamaged and inspect the I/O connector at the
back of the Module for bent pins. If the Module appears damaged or any pins
are bent, do not install the Module. Do not try to straighten bent pins. Return
the Module for replacement.
Ensure that the Module is of the correct type.
Record the Module type, revision, and serial number of the Module before
installation.
WARNING:
The Module contains static sensitive parts. Static handling precautions must be
observed. Specifically ensure that exposed connector pins are not touched. Under no
circumstances should the Module housing be removed.
To install the Module:
1. Ensure that the field cable assembly is installed and correctly located.
2. If I/O Module keys are used, verify that all keys are installed in the
correct positions and properly seated in their slots.
3. Release the ejector tabs on the Module using the release key. Ensure
that the ejector tabs are fully open.
4. Holding the ejectors, carefully insert the Module into the intended slot.
5. Push the Module fully home by pressing on the top and bottom of the
Module fascia.
6. Close the Module ejectors, ensuring that they click into their locked
position.
The Module should mount into the chassis with a minimum of resistance. If
the Module does not mount easily, do not force it. Remove the Module and
check it for bent or damaged pins. If the pins have not been damaged, try
reinstalling the Module.
I/O cables suitable for use with the Trusted TMR 24/48V DC Digital Output
Module are detailed in the following Product Descriptions.
•Trusted I/O Companion Slot Cables Product Description, publication
ICSTT-RM311 (PD-TC200)
•Trusted I/O SmartSlot Cables Product Description, publication ICSTT-
RM313 (PD-TC500)
Module Insertion and
Removal
Cable Selection

Chapter 3 Installation
20 Rockwell Automation Publication ICSTT-RM451D-EN-P - March 2021
The Product Descriptions that are detailed above also detail the types of Field
Termination Assembly (FTA) or Versatile Field Termination Assembly (VFTA)
which may be used with this type of Module.
Custom length multi-core FTA cables are 0.5 mm2with a resistance of 40
Ω/km. For example, a 50-m cable has 4-Ω loop impedance at 0.5 A, this
equates to a 2V DC volt drop.
Unused outputs should be commanded off in the application and wired
through a 10K 0.5-W resistor to zero volts.
This table describes the module pin-out connections:
Table 2 Field Connector Pin-out
C
B
A
1
SmartSlot Link C
SmartSlot Link B
SmartSlot Link A
2
3
Chan 5 (+)
Pwr Group 1 (+)
Chan 1 (+)
4
Chan 6 (+)
Pwr Group 1 (+)
Chan 2 (+)
5
Pwr Group 1 Rtn
Pwr Group 1 (+)
Pwr Group 1 Rtn
6
Chan 7 (+)
Pwr Group 1 (+)
Chan 3 (+)
7
Chan 8 (+)
Pwr Group 1 (+)
Chan 4 (+)
8
9 Chan 13 (+) Pwr Group 2 (+) Chan 9 (+)
10
Chan 14 (+)
Pwr Group 2 (+)
Chan 10 (+)
11
Pwr Group 2 Rtn
Pwr Group 2 (+)
Pwr Group 2 Rtn
12
Chan 15 (+)
Pwr Group 2 (+)
Chan 11 (+)
13
Chan 16 (+)
Pwr Group 2 (+)
Chan 12 (+)
14
15 Chan 21 (+) Pwr Group 3 (+) Chan 17 (+)
16
Chan 22 (+)
Pwr Group 3 (+)
Chan 18 (+)
17
Pwr Group 3 Rtn
Pwr Group 3 (+)
Pwr Group 3 Rtn
18
Chan 23 (+)
Pwr Group 3 (+)
Chan 19 (+)
19
Chan 24 (+)
Pwr Group 3 (+)
Chan 20 (+)
20
21 Chan 29 (+) Pwr Group 4 (+) Chan 25 (+)
22 Chan 30 (+) Pwr Group 4 (+) Chan 26 (+)
23
Pwr Group 4 Rtn
Pwr Group 4 (+)
Pwr Group 4 Rtn
24
Chan 31 (+)
Pwr Group 4 (+)
Chan 27 (+)
25
Chan 32 (+)
Pwr Group 4 (+)
Chan 28 (+)
26
27 Chan 37 (+) Pwr Group 5 (+) Chan 33 (+)
28 Chan 38 (+) Pwr Group 5 (+) Chan 34 (+)
29
Pwr Group 5 Rtn
Pwr Group 5 (+)
Pwr Group 5 Rtn
30
Chan 39 (+)
Pwr Group 5 (+)
Chan 35 (+)
32
Chan 40 (+)
Pwr Group 5 (+)
Chan 36 (+)
32
Termination
Module Pin-out Connections