Sirona Orthophos XG Plus DS/Ceph User manual

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<$paratext[B1_Kapitel,B1_Kapitel_o.N.] Sirona Dental Systems GmbH
Operating Instructions ORTHOPHOS XGPlus DS/Ceph
59 87 594 D 3352
2D 3352.201.01.18.02
General information
Dear Customer, Thank you for purchasing your ORTHOPHOS XG Plus
panoramic X-ray unit from Sirona.
This system enables you to take standard views (jaw
area), sinus views (maxillary sinuses) and temporoman-
dibular joint views using digital imaging technology.
If the system is equipped with a cephalometer arm, you
can furthermore take cephalometric images using digital
imaging technology.
The technical documentation supplied is also part of
the product. Keep these documents handy at all times
(file them in the X-ray System Logbook in Germany).
To safeguard your warranty claims, please complete the
attached “Installation Report/Warranty Passport”
together with the service engineer immediately after the
installation of your unit.
Please familiarize yourself with the unit by reading
through these Operating Instructions before taking
any X-rays of patients. Please comply with the applica-
ble radiation protection regulations and warnings at
all times.
These operating instructions presuppose that you are
familiar with the use of SIDEXIS software. According to
the X-ray Ordinance of the Federal Republic of Ger-
many, owners of X-ray equipment must perform con-
stancy tests at regular intervals in order to ensure the
safety of operating staff and patients.
Your ORTHOPHOS XG Plus Team
Maintenance In the interest of the safety and health of patients, users
and other persons, inspection and preventive mainte-
nance must be performed at scheduled intervals to
ensure the operational reliability and functional safety of
your product (IEC 601-1/DIN EN 60601-1 etc.).
The system owner must ensure that all inspections and
maintenance events take place.
If the system owner fails to fulfill the obligation to have
inspections and maintenance work performed or ignores
error messages, Sirona Dental Systems GmbH and its
authorized dealers cannot assume any liability for result-
ing damage.

Sirona Dental Systems GmbH Tableofcontents
Operating Instructions ORTHOPHOS XGPlus DS/Ceph
59 87 594 D 3352
D 3352.201.01.18.02 3
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Table of contents
1Warning and safety information .............................................................................. 5
1.1 General safety information................................................................................................................ 5
1.2 ESD protective measures ................................................................................................................. 8
1.3 About the physics of electrostatic charges ....................................................................................... 8
2Technical description ............................................................................................... 10
3Controls and functional elements ........................................................................... 15
3.1 Operating and Display Elements ...................................................................................................... 15
3.2 General touchscreen functions ......................................................................................................... 18
4Accessories ............................................................................................................... 27
4.1 Rests and supports for panoramic exposures .................................................................................. 27
4.2 Important when inserting the temporomandibular joint supports ...................................................... 28
4.3 Protective sleeves for panoramic exposures .................................................................................... 29
4.4 Protective sleeves for cephalometer................................................................................................. 30
4.5 Accessories for transversal slices TSA............................................................................................. 30
5Program group panoramic images.......................................................................... 31
5.1 P1 standard panoramic image, P1 A artifact reduced,
P1 C with a constant magnification factor of 1.25............................................................................. 31
5.2 P2 normal view, limited to teeth without ascending rami, P2 A artifact-reduced,
P2 C with a constant magnification factor of 1.25............................................................................. 32
5.3 P10 normal view for children with significant dose reduction, P10 A artifact-reduced,
P10 C with a constant magnification factor of 1.25........................................................................... 33
5.4 P12 Slice thickness, anterior tooth region ........................................................................................ 34
5.5 BW1 Bite wing exposures in the posterior tooth region .................................................................... 35
5.6 BW2 Bite wing exposures in the anterior tooth region...................................................................... 36
6Program group temporomandibular joint (TMJ) views.......................................... 37
6.1 TM1.1/TM1.2 Temporomandibular joints lateral with closed and open mouth in one image............ 37
6.2 TM2.1/TM2.2 Temporomandibular joints in posterior – anterior projection with closed and
open mouth in one image ................................................................................................................. 39
6.3 TM3 Temporomandibular joints lateral, ascending rami................................................................... 41
6.4 TM4 Temporomandibular joints in posterior/anterior projection ....................................................... 42
6.5 TM5 Temporomandibular joints lateral, multislice ............................................................................ 43
6.6 TM6 Temporomandibular joints, multislice in posterior – anterior projection.................................... 44
7Program group sinus views ..................................................................................... 45
7.1 S1 Paranasal sinuses ....................................................................................................................... 45
7.2 S2 Maxillary sinuses with two views in one image ........................................................................... 46
7.3 S3 Paranasal sinuses (linear slice orientation)................................................................................. 47
7.4 S4 Maxillary sinuses with two views in one image (linear slice orientation) ..................................... 48
8Program group multislice views .............................................................................. 49
8.1 MS1 Multislice (posterior tooth region) ............................................................................................. 49

Table of contents Sirona Dental Systems GmbH
Operating Instructions ORTHOPHOS XGPlus DS/Ceph
59 87 594 D 3352
4D 3352.201.01.18.02
9Operation ................................................................................................................... 50
9.1 Preparing the exposure.................................................................................................................... 50
9.2 Optional: Taking exposures from a SIDEXIS exposure template .................................................... 53
9.3 Positioning the patient...................................................................................................................... 54
9.4 Finishing the preparations (panoramic views) ................................................................................. 65
9.5 Making the basic settings in program level 3 ................................................................................... 66
9.6 Changing the startup settings in program level 4............................................................................. 66
9.7 Selecting the exposure parameters ................................................................................................. 67
9.8 Releasing the exposure ................................................................................................................... 68
9.9 Remote control................................................................................................................................. 71
10 Cephalometric exposures (CEPH)........................................................................... 72
10.1 Preparing a cephalometric exposure (CEPH function) .................................................................... 72
10.2 Preparations on the cephalometer................................................................................................... 74
10.3 Positioning a ceph patient................................................................................................................ 75
10.4 Selecting the exposure parameters ................................................................................................. 82
10.5 Making the basic settings in program level 3 ................................................................................... 83
10.6 Changing the startup settings in program level 4............................................................................. 83
10.7 Releasing a cephalometric exposure............................................................................................... 84
11 Transversal slices (TSA) .......................................................................................... 87
11.1 Preparing a TSA exposure............................................................................................................... 87
11.2 Patient positioning............................................................................................................................ 94
11.3 TSA universal bite block .................................................................................................................. 98
11.4 Preselecting the exposure settings and releasing the exposure...................................................... 100
11.5 Program settings, basic settings, startup settings............................................................................ 101
11.6 TSA exposure with TSA slice orientation (alternative)..................................................................... 102
11.7 Slice orientations.............................................................................................................................. 104
12 Program values ......................................................................................................... 107
12.1 Panoramic views – program values for index 2A ............................................................................. 107
12.2 Panoramic views – program values for index 4A ............................................................................. 108
12.3 Panoramic views - program values for index 1A.............................................................................. 109
12.4 Program values for cephalometric exposures.................................................................................. 110
12.5 TSA exposure values....................................................................................................................... 111
13 List of messages ....................................................................................................... 114
13.1 List of help messages ...................................................................................................................... 114
13.2 Error message structure .................................................................................................................. 115
14 Care of outer surfaces .............................................................................................. 117
15 Inspection and maintenance.................................................................................... 118
15.1 Annual check performed by the system owner or other authorized persons ................................... 118
15.2 Maintenance by the service engineer .............................................................................................. 118
15.3 Image quality check ......................................................................................................................... 118
16 Disposal ..................................................................................................................... 119
17 Activating functions.................................................................................................. 120
17.1 Via the Easypad touchscreen .......................................................................................................... 120
17.2 Via web browser on the PC ............................................................................................................. 122

Sirona Dental Systems GmbH 1 Warningand safety information
Operating Instructions ORTHOPHOS XGPlus DS/Ceph 1.1 Generalsafetyinformation
59 87 594 D 3352
D 3352.201.01.18.02 5
1Warning and safety information
1.1 General safety information
Identification of warning and safety information To prevent any personal injury or material damage,
please observe the warning and safety information pro-
vided in the present operating instructions. All such infor-
mation is highlighted by the signal words
NOTICE,CAUTION or WARNING.
Symbols used Observe information in accompanying docu-
ments. They are attached to the unit.
Single use devices are identified with the sym-
bol shown on the left.
Intended use This system is intended for generating panoramic or
cephalometric X-ray images.
This system must not be used in areas subject to explo-
sion hazards.
Maintenance and repair As manufacturers of medical electrical equipment we
can assume responsibility for the safety-related features
of the equipment only if maintenance and repair are
carried out only by ourselves or agencies expressly
authorized by us, and if components affecting safe oper-
ation of the system are replaced with original spare
parts upon failure.
We suggest that you request a certificate showing the
nature and extent of the work performed from those who
carry out such work; it must contain any changes in rated
parameters or working ranges (if applicable), as well as
the date, the name of the company and a signature.
Modifications to the system Modifications to this system which might affect the safety
of the system owner, patients or other persons are pro-
hibited by law!
For reasons of product safety, this product may be
operated only with original Sirona accessories or
third-party accessories expressly approved by Sirona.
The user assumes the risk of using non-approved
accessories.
Combination with other equipment Permissible combinations are specified in the Declara-
tion of Conformity by the system integrator.
The Declaration of Conformity is included in the techni-
cal documentation.
Ventilation slots Under no circumstances may the ventilation slots on the
unit be covered, since otherwise the air circulation will be
obstructed.

1 Warning and safety information Sirona Dental Systems GmbH
1.1 General safety information Operating Instructions ORTHOPHOS XGPlus DS/Ceph
59 87 594 D 3352
6D 3352.201.01.18.02
Do not spray disinfectants or other similar products into
the ventilation slots.
X-raying of patients X-rays of patients must be taken only when the system
works without errors.
The system may only be operated by skilled or prop-
erly trained personnel.
The movements of the unit must not be obstructed by
physical constitution nor clothing, dressings, wheel-
chairs or hospital beds!
Do not leave the patient unattended in the unit.
Electromagnetic compatibility (EMC) Medical electrical equipment is subject to special pre-
cautionary measures regarding EMC. It must be
installed and operated as specified in the document
“Installation Requirements”.
Information on avoiding, detecting and eliminating unin-
tended electromagnetic effects: The ORTHOPHOS
XGPlus DS/Ceph acquisition unit is Class Bequipment
(classified according to CISPR 11, EN 60601-1-2: 2001
based on IEC 60601-1-2). This system may be operated
in a residential area.
Portable and mobile RF communications equipment
may interfere with medical electrical equipment. There-
fore, the use of mobile wireless phones in medical office
or hospital environments must be prohibited.
Please also observe the ESD protective measures in
Chapter 1.2.
Removing the sensor To remove the sensor, hold it firmly, press the pushbutton
fully in and hold it down. Remove the sensor from its
holder by pulling it downward.
DO NOT DROP THE SENSOR!
A shock sensor for detecting shocks or drops is built in.
When removing the sensor or handling a sensor that has
already been removed, make sure not to touch the sen-
sor plug on the unit end, especially not while touching
the patient at the same time.
Precautionary measures when switching on the
unit
Following extreme changes in temperature, condensa-
tion may occur; therefore, please do not switch the sys-
tem on until it has reached normal room temperature
(see chapter “Technical description”).
No patient may be positioned in the unit during
power-on.
In case of an error that requires switching the unit off and
back on again, the patient must be removed from the
unit, at the latest before switching the unit on again!

Sirona Dental Systems GmbH 1 Warningand safety information
Operating Instructions ORTHOPHOS XGPlus DS/Ceph 1.1 Generalsafetyinformation
59 87 594 D 3352
D 3352.201.01.18.02 7
Emergency Stop If any parts of the unit happen to touch the patient during
the rotary movement (PAN exposure) or during the scan
movement (cephalometric exposure), let go of the expo-
sure release button (X-Ray) immediately or stop the unit
by actuating the unit main switch or an Emergency Stop
switch!
Interference with electronic devices worn on the
patient’s body.
To prevent the malfunctioning of electronic devices and
data storage devices, e.g. radio-controlled watches,
telephone cards, etc., these objects must be removed
prior to X-raying.
Radiation protection The valid radiation protection regulations must be
observed.
The operator should move as far away from the X-ray
tube assembly as allowed by the coiled cable of the
exposure release button.
The statutory radiation protection equipment must be
used.
With the exception of the patient, no other persons
without radiation protection are allowed to stay in the
room. In exceptional cases, a third person may provide
assistance, but not the practice staff. During the whole
exposure, visual contact with the patient and the unit
must be maintained.
In case of malfunctions, cancel the exposure immedi-
ately by letting go of the exposure release button.
Hygiene information The protective sleeves must be exchanged and the ster-
ilizable accessories must be resterilized for each new
patient to prevent any transmission of infective agents
which might cause serious illnesses.
Suitable hygienic measures must be taken to prevent
cross contamination among patients, users and other
persons.
Dismantling and reinstallation When dismantling and reinstalling the system, proceed
according to the installation instructions for new installa-
tion in order to guarantee its proper functioning and sta-
bility.
Laser light
localizer used
The system incorporates Class 1 laser products.
The light localizers are intended for correct patient posi-
tioning. They must not be used for any other purposes.
A minimum distance of 100mm between the eye and the
laser is required. Do not stare into the beam. Safe oper-
ation is described in chapter “9.3 Positioning the
patient”.
The light localizers may be switched on only when func-
tioning perfectly. Repair work must be carried out by
authorized staff only.

1 Warning and safety information Sirona Dental Systems GmbH
1.2 ESD protective measures Operating Instructions ORTHOPHOS XGPlus DS/Ceph
59 87 594 D 3352
8D 3352.201.01.18.02
1.2 ESD protective measures
ESD stands for ElectroStatic Discharge.
ATTENTION
Connector pins or sockets bearing ESD warning labels
must not be touched or interconnected without ESD
protective measures.
ESD protective measures include:
• Procedures for preventing electrostatic charge
build-up (e.g. air conditioning, air moistening, con-
ductive floor coverings and non-synthetic clothing)
• Discharging the electrostatic charges of your own
body on the frame of the UNIT, the protective ground
wire or large metallic objects
• Connecting yourself to ground using a wrist band.
We therefore recommend that all persons working with
this system be instructed on the significance of this
warning label. Furthermore, they also should receive
training in the physics of electrostatic discharges which
can occur in the practice and the destruction of elec-
tronic components which may result if such components
are touched by electrostatically charged USERS.
The content of this training is explained in Chapter 1.3.
1.3 About the physics of electrostatic charges
ESD stands for ElectroStatic Discharge. Electrostatic
discharge must be preceded by electrostatic charging.
Static electric charges generally build up whenever two
bodies are rubbed against each other, e.g. when walking
(shoe soles against the floor) or driving a vehicle (tires
against the street pavement). The amount of charge
depends on several factors:
Thus the charge is higher in an environment with low air
humidity than in one with high air humidity; it is also
higher with synthetic materials than with natural materi-
als (clothing, floor coverings).
The following rule of thumb can be applied to assess the
transient voltages resulting from an electrostatic dis-
charge.
An electrostatic discharge is:
• perceptible at 3,000 V or higher
• audible at 5,000 V or higher (cracking, crackling)
• visible at 10,000 V or higher (arc-over)

Sirona Dental Systems GmbH 1 Warningand safety information
Operating Instructions ORTHOPHOS XGPlus DS/Ceph 1.3 About the physics of electrostatic charges
59 87 594 D 3352
D 3352.201.01.18.02 9
The transient currents resulting from these discharges
have a magnitude of 10 amperes. They are not hazard-
ous for humans because they last for only several nano-
seconds.
Voltage differentials exceeding 30,000 volts per centi-
meter may lead to a charge transfer (electrostatic dis-
charge, lightning, arc-over).
Integrated circuits (logical circuits and microprocessors)
are used in order to implement a wide variety of func-
tions in dental/X-ray/CEREC systems. The circuits must
be miniaturized to a very high degree in order to include
as many functions as possible on these chips. This leads
to structure thicknesses as low as a few ten thousandths
of a millimeter.
It is obvious that integrated circuits which are connected
to plugs leading outside of the unit via cables are sensi-
tive to electrostatic discharge. Even voltages which are
imperceptible to the user can cause breakdown of the
structures, thus leading to a discharge current which
melts the chip in the affected areas. Damage to individ-
ual integrated circuits may cause malfunction or failure
of the system.
To prevent this from happening, the ESD warning label
next to the plug warns of this hazard.
1 nanosecond = 1/1,000,000,000 second =
1 billionth of a second

2 Technical description Sirona Dental Systems GmbH
Operating Instructions ORTHOPHOS XGPlus DS/Ceph
59 87 594 D 3352
10 D 3352.201.01.18.02
2Technical description
Model designation ORTHOPHOS XGPlus DS/Ceph
Nominal voltage: 200 – 240V
Permissible deviation: ±10%
Permissible drop under load: 10%
Rated current: 12A
Nominal power output: 2 kW at 90 kV/12 mA with any radiation time
Nominal frequency: 50/60Hz
Internal line impedance: max. 0.8 Ohm
Main building fuse: 25 A slow-blow (16 A for standalone connection)
Power consumption: 2 kVA
Power output of tube assembly: 90 kV/12 mA = 1080 W with any radiation time
Tube voltage: 60 – 90kV (for 90 kV max. 12 mA)
Tube current: 3 –16mA (at 16 mA max. 66 kV)
Maximum setting range 60 kV/3 mA to 90 kV/12 mA
High-voltage waveform: High-frequency multipulse
Residual ripple ≤4 kV
Program duration: see chapter 12
Exposure time: see chapter 12
Image acquisition scale: For P1, normal dental arch (slice center) approx. 1:1.19, i.e. the
acquired image is magnified by approx. 19 % on average com-
pared to reality.
Exposure time for cephalometry max. 14.9 s
Total filtration of X-ray tube assembly > 2.5 Al/90 IEC 522 1976
Focal spot size acc. to IEC 336,
measured in the central X-ray beam: 0.5mm
Marking of focal spot:

Sirona Dental Systems GmbH 2 Technicaldescription
Operating Instructions ORTHOPHOS XGPlus DS/Ceph
59 87 594 D 3352
D 3352.201.01.18.02 11
Automatic exposure blocking (see page 46): The duration of automatic exposure blocking (cooling period)
depends on the set kV/mA level and the actual exposure time.
Depending on the tube load, a pause duration of 8 s to 300 s is
automatically set by the system.
Example: For program P1 with 80 kV/14 mA as exposure
parameters and a radiation time of 14.1 s, the resulting pause
duration is 255 s.
Class I equipment
Degree of protection against electric shock:
Type B equipment
Degree of protection against ingress of water: Ordinary equipment
(without protection against ingress of water)
Year of manufacture (on the rating plate)
Operating mode: Continuous operation
Long-term power output: 100W
Anode material: Tungsten
Exposure parameters for determining leakage radia-
tion:
1.1mA/90kV
Transport and storage temperature: -10°C – +70°C (14 °F – 158 °F)
Air humidity: 10% – 95%
Admissible operating temperature: Acc. to IEC 601-1 between +10°C and +40°C (50°F – 104°F)
Panoramic exposures:
Sensor (image receptor):
Pan sensor type: Digital CCD line sensor, repluggable for
panoramic exposure technique
Active sensor area, Pan type: 138 x 6.48 mm
Detail resolution: 0.027 mm pixel size
Focus/sensor distance 497 mm
Cephalometric exposures:
Sensor (image receptor):
Ceph sensor type: Digital CCD line sensor, repluggable for
panoramic or ceph exposure technique
Active sensor area, Ceph type: 230 mm x 6.48 mm
Detail resolution: 0.027 mm pixel size
Focus-sensor distance: 1714 mm

2 Technical description Sirona Dental Systems GmbH
Operating Instructions ORTHOPHOS XGPlus DS/Ceph
59 87 594 D 3352
12 D 3352.201.01.18.02
X-ray tube: SR 90/15 from Siemens
or
OCX 100 CEI
This product bears the CE mark in accordance with the
provisions of the Council Directive 93/42/EEC of
June 14, 1993 concerning medical devices.
TSA exposure:
Sensor (image receptor):
TSA senor type: Digital CCD line sensor, repluggable for
panoramic or ceph exposure technique
Active sensor area, TSA type 60 mm x 20 mm
Detail resolution: 0.0195 mm pixel size
Focus-sensor distance: 497 mm
Minimum requirements for PC systems:
Hard disk: > 4 GB/database
> 50 MB/SIDEXIS installation
RAM: min. 256 MB
Drives: CD-ROM
MOD drive, min. 640 MB (one per system/network)
Operating system: Minimum requirement: Windows 2000 Workstation (SP 4),
Windows XP Professional Workstation (SP 2), or Vista. For
further information, please visit the Sidexis homepage at
www.sidexis.com or refer to the Sidexis user manual.
Graphics system: Min. resolution 1024 x 768 pixels, min. color depth 8 bits
Network: 10/100 MBit Ethernet
Communication interface: RJ45 for LAN cable
ORTHOPHOS XGPlus DS/Ceph complies with IEC 601-2-28/1993
ORTHOPHOS XGPlus DS/Ceph complies with IEC 601-1-3/1994
ORTHOPHOS XGPlus DS/Ceph complies with IEC 601-2-7/1998
ORTHOPHOS XGPlus DS/Ceph complies with AS/NZS 3200.1.0
Original language: German
Reg. No.: China
Product Standard No.:
SFDA (I) 2008 2303722
YZB / GEM 4911 - 2008
0123

Sirona Dental Systems GmbH 2 Technicaldescription
Operating Instructions ORTHOPHOS XGPlus DS/Ceph
59 87 594 D 3352
D 3352.201.01.18.02 13
Cooling curve of tube housing
Cooling curve of X-ray tube
Heating curve of tube housing
Central X-ray beam/anode angle
060 120 180 240 300 360 420 480 540 600 660 720
10
20
30
40
50
60
70
80
90
100
110
120
130
HUx104
t
min
1 HU = 1.35 Joule
0123456
5
10
15
20
min
t
25 HUx1031 HU = 1.35 Joule
0123456
5
10
15
20
min
t
25
HUx1031 HU = 1.35 Joule
SR 90/15 OCX 100
78
30
0123456
130
h
t
HUx1041 HU = 1.35 Joule
Anode angle
Central X-ray beam

2 Technical description Sirona Dental Systems GmbH
Operating Instructions ORTHOPHOS XGPlus DS/Ceph
59 87 594 D 3352
14 D 3352.201.01.18.02
These operating instructions are valid for the basic and
full versions of the system.
The following programs and functions are included in the basic version:
18 panoramic programs:
P1, P1 A, P1 C, P2, P10
P1 L, P1 R
P12
BW1, BW1 L, BW1 R
BW2
TM1.1/TM1.2 with angle input
TM1A.1/TM1A.2 with angle input
TM2.1/TM2.2
S1
S2
MS1
5 Ceph programs:
C1, C2, C3, C3 F, C4
Half-views of right/left side possible only with P1 (not upper/lower jaw).
The full version offers the following programs
and functions in addition to those featured in the basic version:
Additional pan programs:
Constant magnification factor of 1.25 P2 C, P10 C
Artifact-reduced display P2 A, P10 A
Selectable right/left side image detail and individual quadrants P1A/C, P2/A/C, P10/A/C
Image detail selectable upper jaw/lower jaw and single quadrants P1A/C, P2/A/C, P10/A/C
Selectable upper jaw/lower jaw image detail P12
Temporomandibular joint views TM2.1/TM2.2 with angle input, TM2A.1/TM2A.2 with angle input, TM3, TM4,
TM5, TM6
Sinus views S3, S4
Presetting for “jaw shape” available.
Quickshot function possible (for Pan P1, P1 A, P1 C, P2, P2 A, P2 C, P10, P10 A, P10 C, and Ceph C1 to C4).
Execution of exposure templates from SIDEXIS possible without cooling periods, e.g.: orthodontic image series
P1 - C3 - C4.
Welcome screen with patient data from SIDEXIS.
Ceph – shadowing in the upper cranial region preselectable for programs C3 and C3 F.
Ceph – shadowing in the thyroid area for programs C1 and C2 can be preselected.
Option for basic version and full version:
TSA function (transversal slices)
It is possible to upgrade a basic version system to a full version system and/or to include the TSA function. For
this purpose you must purchase a certificate with a corresponding activation key code (see chapter 17).
If you order a new unit with TSA function from the factory, it is activated already at the factory.

Sirona Dental Systems GmbH 3 Controls and functionalelements
Operating Instructions ORTHOPHOS XGPlus DS/Ceph 3.1 Operating and Display Elements
59 87 594 D 3352
D 3352.201.01.18.02 15
3Controls and functional elements
3.1 Operating and Display Elements
on the Panoramic unit
1. Main switch
2. Light localizer with height adjustment of FH light line
3. Light localizer central light beam for face center
4. Control mirror for patient positioning
5. Tray for jewelry, etc.
6. Forehead support
7. Temple supports
8. Pushbutton for sensor (image receptor) removal
9. Sensor (image receptor) according to the unit ver-
sion
for XG Pan
for XG Ceph
for XG Pan/TSA
for XG Ceph/TSA
10. Exposure release button (must be pressed and held
down during the entire exposure)
11. Touch bar for swiveling the control mirror in and out
12. Easypad (swiveling control panel)
13. Drawer for accessories
14. Handles for patient
15. Holder for chin rest, bite blocks or
contact segments, etc.
16. Bite block, contact segment or chin rest
17. Primary diaphragm field on the X-ray tube assembly
T
R
CEPH
PAN
Aufnahmebereit
Aufnahmebereit
1260
64
64kV
8mA
?
P1
14,2 s
14,2 s
TS
123 56789
10 13 14 16
15
12
4
17
11

3 Controls and functional elements Sirona Dental Systems GmbH
3.1 Operating and Display Elements Operating Instructions ORTHOPHOS XGPlus DS/Ceph
59 87 594 D 3352
16 D 3352.201.01.18.02
Controls and scales on the cephalometer
8. Pushbutton for sensor removal
9. Sensor (image receptor)
18. Nose support
19. Locking knob for nose support
20. Scale for horizontal nose support adjustment
21. Rotating element for rotary movement of head sup-
ports
22. Secondary diaphragm with FH line light localizer
23. Scale for vertical nose support adjustment
24. Projection scale
25. Ear plugs with holders
26. Carpus support plate
Magnification of the lateral view
With this exposure technique, a metal scale (24) inte-
grated in the nose support is displayed on the X-ray
image.
Using this scale, the magnification factor in the median
plane can be determined precisely via a measurement.
ATTENTION
Never support yourself on the cephalometer or the
ceph arm, hang objects from them or place objects
on them. Otherwise their adjustment may be altered,
thus resulting in incorrect images.
60 90 120
70 80 100 110
20
30
40
50
60 90 120
70 80 100 110
20
30
40
50
9
23
19 20 21 22
23
8
8
25 25
24
24
20
26
18

Sirona Dental Systems GmbH 3 Controls and functionalelements
Operating Instructions ORTHOPHOS XGPlus DS/Ceph 3.1 Operating and Display Elements
59 87 594 D 3352
D 3352.201.01.18.02 17
Controls and displays on the Easypad with
touchscreen
27. "Move forehead support away from forehead"
key
28. Light localizers ON/OFF
29. "Move forehead support to forehead" key
30. "Unit up" arrow key
31. "Unit down" arrow key
32. Optical radiation indicator
33. "Unit ON" LED
34. "Open temple supports" key
35. “T“ key for test cycle without radiation
36. “R“ key for unit return
37. "Close temple supports" key
38. Touchscreen – touch-sensitive screen
ATTENTION
Never touch the touchscreen with sharp or pointed ob-
jects (ball-point pens, pencils, etc.)!
Display aids for patient head positioning
The icon for the patient's head that is displayed in the
upper right corner for panoramic and TSA images will
guide you in positioning the patient's head.
AThe gray patient's head icon shows the head pos-
ture: straight (FH), bent forward with open or closed
mouth, or reclined.
BA colored symbol (yellow or blue) will indicate if a
bite block or a contact segment should be used.
CThe red line indicates the reflecting light localizer
line (FH), the white line is only an auxiliary line to
indicate the head inclination.
DIn addition, for temporomandibular joint and sinus
views the temporomandibular joint support is dis-
played in blue.
If the end of the joint is marked with a small circle
with a dot in its middle, you will need to attach ear
holders. If this icon is not displayed, use contact
pads only.
T
R
CEPH
PAN TS
Filmkassette einlegen
1260
64
68kV
8mA
?
P6.1
12,1s
14 s
PAN
1260
10
64kV
8mA
?
P1
14,1 s
14,1 s
CEPH TS
Ready for exposure
Ready for exposure
27 28 29 31 32 33 30
34 35 36 37 38
P1, P2, P10, P12
TM1.1, TM3, TM5
TM2.1, TM4, TM6
S1
MS1
TM1.2
TM2.2
S2
A
C
B
D

3 Controls and functional elements Sirona Dental Systems GmbH
3.2 General touchscreen functions Operating Instructions ORTHOPHOS XGPlus DS/Ceph
59 87 594 D 3352
18 D 3352.201.01.18.02
3.2 General touchscreen functions
Touchscreen = touch-sensitive screen, i.e. touching the
screen surface triggers different functions.
Color codes:
orange – selected
white – presettings
light blue – selectable
grey and white – auxiliary symbols
Touchscreen symbols
1. Display of height setting value
2. Display of forehead support setting value
3. Program selection keys –/+
Sequence: P 1, P 2, P 10, P 12, BW1, BW2, TM 1,
TM 2, TM3, TM 4, TM 5, TM 6, S 1, S2, S3, S4, MS 1
4. Orange – display of the exposure area for the select-
ed program (dental arch or dental arch segment)
5. Display of program group selection
6. Program display; touch to loop through P1 (normal
panoramic view), P1C (with constant magnification),
P1A (artifact-reduced display)...
7. Display of head posture (FH or bent forward or back-
ward, mouth open or closed) with reference line for
the chosen program
8. Submenu column (options)
9. Blue arrows: Select submenu, close menu
10. Preselection of exposure parameters (patient sym-
bols)
11. Red symbol for light localizer ON (is displayed as
long as the laser light of the light localizer is switched
on)
12. Program-specific menu area
13. Comment line for help and error messages
14. Expected radiation time (upon completion actual ra-
diation time)
15. Light gray symbol for dental arch
16. Light gray symbol for temporomandibular joints
17. Display of color-coded bite block or contact segment
for the chosen program
18. Quickshot display – ON (visible)/OFF (hidden) for re-
duction of cycle time
19. When you touch the ?symbol, the help or info
screen is displayed
SID = 19,6”
6x 12”
SID = 19,6”
6 x 12”
CEPH
PAN
1260
10
64kV
8mA
?
P1
9,0 s
9,0 s
Quick
TS
Ready for exposure
Ready for exposure
123563789
10 12 13 15 17 19
11
4
16
18 14

Sirona Dental Systems GmbH 3 Controls and functionalelements
Operating Instructions ORTHOPHOS XGPlus DS/Ceph 3.2 Generaltouchscreenfunctions
59 87 594 D 3352
D 3352.201.01.18.02 19
Program settings
When you touch a symbol in the “submenu” column (8),
a submenu line for program settings opens.
There are 4 submenu lines for program settings
available:
1. Selection of half-view and individual quadrants
In this submenu, you can select a half-view of the jaw,
i.e. right or left side (P1, P2, P10, BW1) or upper or lower
jaw (P1, P2, P10, P12) for programs P1, P2 and P10
including constant magnification and artifact-reduced
display.
The preselected type of exposure is also displayed in the
submenu column (8).
Selection of individual quadrants
The full version of XG Plus offers the option of selecting
individual quadrants.
For each selection, please make sure that you know
where to touch the icon (see finger).
You can reactivate the full screen mode by touching the
center of the quadrant field.
CEPH
PAN
PAN
TS LS
1260
10
64kV
8mA
?
P1
8,5 s
8,5 s
CEPH
PAN
PAN
TS LS
1260
10
64kV
8mA
?
P1
14,1 s
14,1 s
RL
RL
CEPH
PAN
PAN
TS LS
1260
10
64kV
8mA
?
P1
8,5 s
8,5 s
RL
10
P1
14,1 s
14,1 s
PAN
PAN
LS
CEPH
RL
64kV
8mA
?
Ready for exposure
Ready for exposure
Ready for exposure
Ready for exposure
8
8
8
8

3 Controls and functional elements Sirona Dental Systems GmbH
3.2 General touchscreen functions Operating Instructions ORTHOPHOS XGPlus DS/Ceph
59 87 594 D 3352
20 D 3352.201.01.18.02
Half-view and individual quadrant exposures
The adjacent illustrations show the X-ray image displays
and indicate how the half-views and the individual quad-
rants are associated with the patient.
Individual quadrant exposures are possible
only in the XG Plus full version.
The program duration for individual quadrant exposures
equals the program duration for half-view exposures.
RLRL
RLRL
Halbseite rechts Halbseite links
RLRL
RLR
Einzelquadrant rechts Einzelquadrant links
L
L
Right half-view Left half-view
Right individual quadrant Left individual quadrant