ST X-NUCLEO-53L8A1 User manual

Introduction
The X-NUCLEO-53L8A1 is an expansion board for any STM32 Nucleo development board equipped with the Arduino R3
connectors. It provides a complete evaluation kit that allows you to learn, evaluate, and develop applications based on the
VL53L8 series Time-of-Flight sensors.
The expansion board is delivered with a cover glass holder in which you can fit three different spacers of 0.25, 0.5, and 1 mm
height below the cover glass to simulate various air gaps. A small oval cover glass fitting the sensor is included.
Several ST expansion boards can be stacked through the Arduino connectors, which allow, for example, the development of
VL53L8 applications with Bluetooth or Wi-Fi interfaces.
Figure 1. X-NUCLEO-53L8A1 expansion board, spacers, cover glass holder, and oval cover glass
Getting started with the X-NUCLEO-53L8A1 Time-of-Flight expansion board
based on the VL53L8 series for STM32 Nucleo
UM3120
User manual
UM3120 - Rev 1 - March 2023
For further information contact your local STMicroelectronics sales office. www.st.com

1Getting started
1.1 Safety considerations
1.1.1 Electrostatic precautions
Warning: Take electrostatic precautions, including ground straps, when using the X-NUCLEO-53L8A1
expansion board. Failure to prevent electrostatic discharge could damage the device.
Figure 2. Electrostatic logo
1.1.2 Laser safety considerations
The VL53L8CX contains a laser emitter and the corresponding drive circuitry.
The laser output is designed to remain within Class 1 laser safety limits under all reasonable foreseeable
conditions, including single faults, in compliance with the IEC 60825-1:2014.
The laser output power must not be increased by any means and no optics should be used with the intention of
focusing the laser beam.
Caution: Use of controls or adjustments, or performance of procedures other than those specified herein may result in
hazardous radiation exposure.
Figure 3. Class 1 laser product label
Figure 4. Laser notice 56: applies to IEC 60825-1:2014
1.2 Features
•VL53L8CX, low-power, high performance 8x8 multizone Time of-Flight sensor
• Hideable behind a dark cover window
• Accurate absolute ranging distance, independent of the reflectance of the target
• Up to 400 cm ranging
UM3120
Getting started
UM3120 - Rev 1 page 2/23

• Histogram-based technology
• I²C (up to 1 MHz) or SPI (up to 20 MHz) interface
• Multiobject detection capability
• 0.25, 0.5, and 1 mm spacers to simulate air gaps
• One cover glass to protect the sensor from dust
• Compatible with STM32 Nucleo development boards
• Equipped with Arduino UNO R3 connectors
• Full system software supplied, including code examples and graphical user interface
• RoHS, CE, UKCA, and China RoHS compliant
1.3 VL53L8 series Time-of-Flight sensor characteristics
• Laser wavelength : 940 nm
• Invisible laser radiation
• Maximum laser power emitted : 215 mW
• Integration time : 2 ms minimum
1.4 Spacers and covers
The X-NUCLEO-53L8A1 expansion board is delivered with:
• three spacers of 0.25 mm, 0.5 mm, and 1 mm height, used to simulate different air gaps between the
VL53L8 and the rectangular-shaped cover glass;
• two twelve-pin headers that allow connecting the two mini PCB of the SATEL boards to the X-
NUCLEO-53L8A1 expansion board through flying wires.
Attention: The VL53L8 is delivered with a liner to prevent potential foreign material from piercing the module holes during
the assembly process. Remove this liner before use.
1.5 Ordering information
Table 1. Ordering information
Order code PCB version Core product
X-NUCLEO-53L8A1A X$NUCLEO-53L8A1A VL53L8
1.6 Ordering information for the VL53L8 series Time-of-Flight sensors
This board is equipped with a noncommercial VL53L8CA evaluation purposes only Time of Flight sensor. Its
equivalent orderable products are listed in the following table. For a detailed description of each sensor, please
refer to its datasheet on the product web page. Additional information is available from the user manual and
collateral documents of the target ToF sensor.
Table 2. VL53L8 series ordering information
RPN CPN Datasheet Features
VL53L8CX VL53L8CXV0GC/1 DS14161 Low-power high-performance 8x8
multizone Time-of-Flight
UM3120
VL53L8 series Time-of-Flight sensor characteristics
UM3120 - Rev 1 page 3/23

2Using the expansion board
The X-NUCLEO-53L8A1 expansion board allows the user to test the VL53L8 sensor functionality, to program it
and to understand how to develop an application using this sensor.
The X-NUCLEO-53L8A1 integrates:
• the VL53L8 sensor;
• Arduino UNO R3 connectors;
• Connectors for SATEL-VL53L8 optional breakout boards;
Important: Program a microcontroller to control the VL53L8CX through the I2C bus.
The application software and an example of the C-ANSI source code are available on the sensor web page.
The X-NUCLEO-53L8A1 expansion board can be connected to the STM32 Nucleo development board through
the Arduino UNO R3 connectors (CN5, CN6, CN8, and CN9).
I²C (up to 1 MHz) and SPI (up to 20 MHz) interfaces are available on the X-NUCLEO-53L8A1 expansion board.
The user can choose between the two using the J9 jumper to configure the SPI_I2C_N signal as depicted in the
following picture.
Figure 5. Use onboard jumper J9 to select between I2C and SPI interfaces
UM3120
Using the expansion board
UM3120 - Rev 1 page 4/23

3Breakout boards
The X-NUCLEO-53L8A1 package does not include the VL53L8 breakout boards.
You can purchase them in a pack of two PCBs as SATEL-VL53L8.
For mechanical integration purposes, it could be interesting to use the mini PCB by breaking the SATEL-VL53L8
along the red line as shown in the figure below. It is easier to integrate this setup into a customer's device thanks
to its small size.
Figure 6. SATEL-VL53L8
The SATEL-VL53L8 boards cannot be directly plugged onto the X-NUCLEO-53L8A1 through the two 6-pin
headers (see Figure 7).
They can be connected to the X-NUCLEO-53L8A1 by using the mini PCB through flying wires (see
Figure 9. VL53L8 mini PCB flying wire connection to the X-NUCLEO-53L8A1 expansion in SPI mode. J9 jumper
with pin 1 and 2 connected).
The schematic can be duplicated for the sensor on the right allowing the use of both mini PCB.
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Breakout boards
UM3120 - Rev 1 page 5/23

Figure 7. SATEL-VL53L8 breakout boards can not be connected to the X-NUCLEO-53L8A1 expansion
board
Figure 8. VL53L8 mini PCB flying wire connection to the X-NUCLEO-53L8A1 expansion board in I2C
mode. J9 jumper with pin 2 and 3 connected
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Breakout boards
UM3120 - Rev 1 page 6/23

Figure 9. VL53L8 mini PCB flying wire connection to the X-NUCLEO-53L8A1 expansion in SPI mode. J9
jumper with pin 1 and 2 connected
UM3120
Breakout boards
UM3120 - Rev 1 page 7/23

4Graphical user interface (GUI) and programming example for the
X-NUCLEO-53L8A1
To evaluate the VL53L8 device performance, use the related GUI or the X-CUBE-TOF1.
The X-NUCLEO-53L8A1 expansion board requires the NUCLEO-F401RE development board to use the GUI or
run the ranging examples included in the X-CUBE-TOF1.
Important: Despite the fact that the X-NUCLEO-53L8A1 can be stacked on any STM32 Nucleo board equipped the Arduino
R3 connectors, the GUI is designed to work with the NUCLEO-F401RE only.
Download the GUI (in the Tools and Software tab of the X-NUCLEO-53L8A1 web page) or the X-CUBE-TOF1 to
evaluate the VL53L8.
UM3120
Graphical user interface (GUI) and programming example for the X-NUCLEO-53L8A1
UM3120 - Rev 1 page 8/23

5Schematic diagrams
Note: These schematic diagrams refer to the board latest version.
Figure 10. X-NUCLEO-53L8A1 circuit schematic (1 of 5)
MISO
MOSI_SDA
NCS
MCLK_SCL
GPIO1
GPIO2
LPn
SPI_I2C_N
Sensor
Sensor.SchDoc
MCLK_SCL
SPI_I2C_N
PWR_EN
NCS
GPIO1
GPIO2
MOSI_SDA
MISO
LPn
Right
Satellite_Connector.SchDoc
MOSI_SDA
GPIO1
MCLK_SCL
GPIO2
IO_MCLK_SCL
IO_MOSI_SDA
MISOIO_MISO
NCSIO_NCS
IO_LPn LPn
IO_GPIO1
IO_GPIO2
IO_LPn_LEFT
IO_GPIO1_RIGHT
IO_GPIO1_LEFT GPIO1_LEFT
IO_GPIO2_LEFT
LPn_RIGHTIO_LPn_RIGHT
IO_GPIO2_RIGHT
GPIO1_RIGHT
GPIO2_LEFT
LPn_LEFT
GPIO2_RIGHT
NCS_LEFT
NCS_RIGHT
IO_NCS_LEFT
IO_NCS_RIGHT
Level Shifters
Level_Shifters.SchDoc
MCLK_SCL
SPI_I2C_N
PWR_EN
NCS
GPIO1
GPIO2
MOSI_SDA
MISO
LPn
Left
Satellite_Connector.SchDoc
PA1
PA0
PA3
PA4
PA2
PA6
PA5
PA7
PA8
PA10
PA9
PC1
PC0
PC7
PB0
PB10
PB6
PB5
PB4
PB3
PB8
PB9
Host
Host.SchDoc
PWR_EN
Power
Power.SchDoc
3V3
1
2
3
J7
1
2
3
J8
J7[1-2]
J8[1-2]
1
2
3
J9
J9[2-3]
1%
R40
1k
1%
R41
1k
IOVDD
1%
R18
2.2k
1%
R19
2.2k
TP1
TP2
TP3
M4
FIDUCIAL
M3
FIDUCIAL
M2
FIDUCIAL
M1
FIDUCIAL
PWR_EN_Right
PWR_EN_Left
PWR_EN_Sensor
SILK
SPI_I2C_N
[1-2] : SPI
[2-3] : I2C
GND1
Clip
GND2
Clip
M6
FIDUCIAL
M5
FIDUCIAL
One jumper for all devices
SILK
[1-2] : I2C
[2-3] : SPI
Note: The display connector is an optional connector to connect an SSD1306 I2C OLED display to output the ranging data or other meaningful information if
required. The related application note and example code will be available on st.com.
UM3120 - Rev 1 page 9/23
UM3120
Schematic diagrams

Figure 11. X-NUCLEO-53L8A1 circuit schematic (2 of 5)
3V3_NUCLEO5V_NUCLEO
PB8
PB9
PC7
PB10
PB4
PB5
PA10
PA2
PA3
PA1
PA0
PA4
PB0
PC1
PC0
PA9
PB6
PA7
PA6
PA5
PB3
PA8
1
2
3
4
5
6
7
8
CN6
1
2
3
4
5
6
7
8
9
10
CN5
2.54mm, T/H, Vert
1
2
3
4
5
6
7
8
CN9
2.54mm, T/H, Vert
1
2
3
4
5
6
CN8
2.54mm, T/H, Vert
Nucleo Arduino connectors
HDR 8x1 Male 2.54mm
UM3120 - Rev 1 page 10/23
UM3120
Schematic diagrams

Figure 12. X-NUCLEO-53L8A1 circuit schematic (3 of 5)
5V_NUCLEO 3V3
35V
C4
1uF
PWR_EN 6.3V
C3
10uF
10V
C5
4.7uF
AVDD IOVDD
35V
C2
1uF
10V
C1
4.7uF
VIN_LDO
VIN_LDO
SB1[1-2]
PWR_EN PWR_EN 35V
C6
1uF
PWR_EN
VIN_LDO
3.3V LDO for AVDD 1.8V LDO for CORE_1V8 and IOVDD
SB1
3.3V LDO for Level shifter s
Power Section
25V
C19
10nF
1%
R1
47k
1%
R30
47k
IN
1
GND
2
EN
3
OUT 5
1V8 BYP 4
U2
LDK130M18R
IN
1
GND
2
EN
3
OUT 5
3V3 BYP 4
U1
LDK130M33RY
IN
1
GND
2
EN
3
OUT 5
3V3 BYP 4
U3
LDK130M33RY
Alternate part #XC6222D331MR-G Alternate part #XC6222B181MR-G 1.8VAlternate part #XC6222D331MR-G
UM3120 - Rev 1 page 11/23
UM3120
Schematic diagrams

Figure 13. X-NUCLEO-53L8A1 circuit schematic (4 of 5)
AVDD
1%
R4
47k
1%
R5
47k
1%
R2
2.2k
1%
R3
2.2k
J3
J3[1-2]
J2
J2[1-2]
1%
R6
47k
IOVDD
1%
R14
47k
1%
R16
47k
1%
R17
47k
GPIO1
GPIO2
MCLK_SCL
MOSI_SDA
MISO
NCS
IOVDD
LPn
SPI_I2C_N
IOVDD
J1
J1[1-2]
SENSOR
CORE_1V8_S
IOVDD
IOVDD_SAVDD_S
10V
C7
4.7uF
50V
C21
100nF
50V
C8
100nF
SPI_I2C_N LOW: I2C MODE
SPI_I2C_N HIGH: SPI MODE
GPIO1: Open drain Interrupt Output
GPIO2: Open drain output/SYNC input
GND
C3
GND
C6
GND
A7
GND
A6
MOSI/SDA A4
MISO C5
GND
C7
AVDD C4
CORE_1V8 B7
GPIO1 A1
GPIO2 B1 LPn
A2
IOVDD A3
MCLK/SCL A5
NCS C2
SPI_I2C_N
C1
THERM
B4
U4
VL53L8CA
NOTE
AVDD = 3V3 +/- 5%
CORE_1V8 = 1V8 +/- 10%
IOVDD = 1V8 +/- 10%
UM3120 - Rev 1 page 12/23
UM3120
Schematic diagrams

Figure 14. X-NUCLEO-53L8A1 circuit schematic (5 of 5)
Satellite board connector
GPIO1
GPIO2
MCLK_SCL
MOSI_SDA
MISO
NCS
LPn
SPI_I2C_N
IOVDD
PWR_EN
AVDD 5V_NUCLEOIOVDD
J12_Right
HDR_3x1 Female 2.54mm
1
2
3
4
5
6
7
8
9
10
11 J6_Right
HDR_11x1 Female 2.54mm
NOTE
CORE_1V8 and IOVDD is
from the same 1.8V regulator
UM3120 - Rev 1 page 13/23
UM3120
Schematic diagrams

6Bill of materials
Table 3. X-NUCLEO-53L8A1 bill of materials
Item Quantity Reference Part/value Description Manufacturer Order code
1 3 C2, C4, C6 1 μF CAP, CER, 1uF, 35V, X5R,
0402 Murata GRM155R6YA105KE11D
2 1 C3 10 μF Capacitance, ceramic, 10 μF,
6.3 V, X5R, 0603 Kemet C0603C106M9PACTU
3 10
C8, C9, C10,
C11, C12, C13,
C14, C15, C16,
C21
100 nF Capacitance, ceramic, 100 μF,
50 V, X5R, 0402 Murata GRM155R61H104KE19
4 1 CN5 2.54 mm, T/H, Vert Connectors, header, 10POS,
10x1, 2.54 mm, T/H, VERT Harwin M20-9991045
5 2 CN6, CN9 2.54 mm, T/H, Vert Connectors, header, 08 POS,
8x1, 2.54 mm, T/H, VERT Harwin M20-9990845
6 1 CN8 2.54 mm, T/H, Vert Connectors, header, 06 POS,
6x1, 2.54 mm, T/H, VERT Harwin M20-9990645
7 2 GND1, GND2 Clip TESTPOINT, CLIP, TIN, SMD Harwin S1751-46R
8 3 J1, J2, J3 2x1 2.54 mm T/H Connectors, header, 2POS,
2.54 mm, T/H, VERT Harwin M20-9990245
9 6
J1[1-2], J2[1-2],
J3[1-2], J7[1-2],
J8[1-2], J9[2-3]
0.1" Jumper Link Link, header, 2.54 mm Harwin M7571-05
10 2 J6_Left,
J6_Right
HDR_11x1 Female
2.54 mm
Connectors, header 11POS,
SNGL, 2.54 mm, T/H Samtec SSW-111-01-G-S
11 3 J7, J8, J9 2.54 mm T/H Connectors, header, 3POS,
SNGL, 2.54 mm, T/H Harwin M20-9990345
12 2 J12_Left,
J12_Right
HDR_3x1 Female
2.54 mm
Connectors RCPT 3POS 0.1
Gold PCB Samtec SSW-103-01-G-S
13 7
R4, R5, R6,
R14, R16, R17,
R30
47 k Resistors, 47 k, 1 %, 1/10 W,
0402 Panasonic ERJ2RKF4702X
14 4 R2, R3, R18,
R19 2.2 k Resistors, 2.2 k, 1 %, 1/16 W, 0402 Stackpole Electronics RMCF0402FT2K20
15 4 R20, R22, R23,
R26 10 k Resistors, 10 k, 1 %, 1/16 W, 0402 Yageo RC0402FR-0710KL
16 2 R40, R41 1 k Resistors, 1 k, 1 %, 1/16 W,
0402 Yageo RC0402FR-071KL
17 1 SB1[1-2] Solder bridge Link, solder N/A N/A
18 2 U1, U3 LDK130M33RY,
SOT23-5L
IC, REG, LDO, 3.3 V, 0.3 A,
SOT23-5L ST LDK130M33RY
19 1 U2 LDK130M18R,
SOT23-5L
IC, REG, LDO, 1.8 V, 0.3 A,
SOT23-5L ST LDK130M18R
20 1 U4 VL53L8CA Multi-zone time-of-flight ranging
sensor ST VL53L8CAV0GC/1
21 4 U5, U6, U7, U8 PI4ULS3V204 IC, 4-bit bi-directional level
shifter, TQFN3.5x3.5-14 Diodes Incorporated PI4ULS3V204ZBEX
22 1 C19 10 nF Capacitor, ceramic, 10 nF, 25V,
X5R, 0402 AVX 04023D103KAT2A
23 1 R1 47 k Resistor, 47 k, 1 %, 1/10 W,
0402 Panasonic ERJ2RKF4702X
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Bill of materials
UM3120 - Rev 1 page 14/23

Item Quantity Reference Part/value Description Manufacturer Order code
24 4 R21, R24, R25,
R28 10 k Resistors, 10 k, 1 %, 1/16 W, 0402 Yageo RC0402FR-0710KL
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Bill of materials
UM3120 - Rev 1 page 15/23

7Board versions
Table 4. X-NUCLEO-53L8A1 versions
PCB version Schematic diagrams Bill of materials
X$NUCLEO-53L8A1A(1) X$NUCLEO-53L8A1A schematic diagrams X$NUCLEO-53L8A1A bill of materials
1. This code identifies the X-NUCLEO-53L8A1 evaluation board first version. It is printed on the board PCB.
UM3120
Board versions
UM3120 - Rev 1 page 16/23

8Regulatory compliance information
Formal Notice Required by the U.S. Federal Communications Commission
For evaluation only; not FCC approved for resale
FCC NOTICE
This kit is designed to allow:
(1) Product developers to evaluate electronic components, circuitry, or software associated with the kit to
determine
whether to incorporate such items in a finished product and
(2) Software developers to write software applications for use with the end product.
This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all
required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product
not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless
the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit
must operate under the authority of an FCC license holder or must secure an experimental authorization under
part 5 of this chapter 3.1.2.
Formal Product Notice Required by Industry Canada Innovation, Science and Economic Development
Canada compliance:
For evaluation purposes only. This kit generates, uses, and can radiate radio frequency energy and has not been
tested for compliance with the limits of computing devices pursuant to Industry Canada (IC) rules.
À des fins d'évaluation uniquement. Ce kit génère, utilise et peut émettre de l'énergie radiofréquence et n'a pas
été testé pour sa conformité aux limites des appareils informatiques conformément aux règles d'Industrie Canada
(IC).
Formal product notice required by EU
This device is in conformity with the essential requirements of the Directive 2014/30/EU (EMC) and of the
Directive 2015/863/EU (RoHS).
Notice for the United Kingdom
This device is in compliance with the UK Electromagnetic Compatibility Regulations 2016 (UK S.I. 2016 No. 1091)
and with the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment
Regulations 2012 (UK S.I. 2012 No. 3032).
UM3120
Regulatory compliance information
UM3120 - Rev 1 page 17/23

Appendix A References
•VL53L8CX: DS14161
•X-NUCLEO-53L8A1: DB4921
•X-CUBE-TOF1: DB4449
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References
UM3120 - Rev 1 page 18/23

Revision history
Table 5. Document revision history
Date Revision Changes
03-Mar-2023 1 Initial release.
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UM3120 - Rev 1 page 19/23

Contents
1Getting started ....................................................................2
1.1 Safety considerations ...........................................................2
1.1.1 Electrostatic precautions ...................................................2
1.1.2 Laser safety considerations.................................................2
1.2 Features ......................................................................2
1.3 VL53L8 series Time-of-Flight sensor characteristics .................................3
1.4 Spacers and covers ............................................................3
1.5 Ordering information ............................................................3
1.6 Ordering information for the VL53L8 series Time-of-Flight sensors .....................3
2Using the expansion board ........................................................4
3Breakout boards...................................................................5
4Graphical user interface (GUI) and programming example for the X-NUCLEO-53L8A1
....................................................................................8
5Schematic diagrams ...............................................................9
6Bill of materials...................................................................14
7Board versions ...................................................................16
8Regulatory compliance information ...............................................17
Appendix A References ..............................................................18
Revision history .......................................................................19
List of tables ..........................................................................21
List of figures..........................................................................22
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Contents
UM3120 - Rev 1 page 20/23