
L2 Repair Document TCLCommunication Ltd.
9030G/9030Q/VDF1400 Level 2 Repair Document
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Content
1Level 2 repair process ..............................................................................................4
2Warranty Check and Visual Inspection ...................................................................5
2.1 Warranty confirmation of L1.....................................................................................5
2.2 Visual mechanical check..........................................................................................6
2.3 Pretest........................................................................................................................7
3Battery......................................................................................................................12
3.1 Battery information.................................................................................................12
3.2 Battery test ..............................................................................................................14
3.3 Battery specification...............................................................................................15
3.4 Note of Battery ........................................................................................................16
4Software download .................................................................................................17
4.1. Equipments requested when download:............................................................17
4.2. Handset driver installation .....................................................................................17
4.3. SW download process............................................................................................17
5 Disassembly and assembly VDF1400........................................................................21
5.1 ESD Safety...............................................................................................................21
5.2 Disassembly tool.....................................................................................................21
5.3 Disassembly process...............................................................................................22
5.4 Disassembly Notice:................................................................................................29
5.5 Reassembly process................................................................................................29
5.6 Disassembly process evaluation............................................................................30
6Disassembly Complete...........................................................................................30
7Level 2 repair...........................................................................................................30
8PCBA exchange.......................................................................................................38
9Other component exchange...................................................................................39
10 Function test............................................................................................................39