TCL VFD 700 Technical manual

L2E Repair Document TCLCommunication Ltd.
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SHINE PLUS VF
VFD 700
Note: this manual is non-contractual and TCL Communication Ltd. can modify it without prior
notice on the characteristics of described equipments.

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1.0 2016/4/15 Draft creation Peter ye
Rev. Date Modification description Prepared By Checked By Approved By

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Content
1Level 2 repair process...........................................................................................................................5
2Warranty Check and Visual Inspection..............................................................................................6
2.1 Warranty confirmation of L1...........................................................................................................6
2.2 Visual mechanical check...................................................................................................................7
2.3 Pretest.................................................................................................................................................8
3Battery .................................................................................................................................................16
3.1 Battery information.........................................................................................................................16
3.2 Battery test.......................................................................................................................................18
3.4 Note of Battery.................................................................................................................................20
4. Software download............................................................................................................................20
4.1 Equipments requested when download：.....................................................................................20
4.2 Install driver.....................................................................................................................................20
4.3 SW download process......................................................................................................................21
5 Disassembly and assembly VFD 700.................................................................................................25
5.1 ESD Safety........................................................................................................................................25
5.2 Disassembly tool...............................................................................................................................25
5.3 Disassembly process.........................................................................................................................26
Disassembly Notice:.............................................................................................................................33
5.4 Reassembly Process.........................................................................................................................34
5.5 Disassembly process evaluation......................................................................................................35
6Disassembly Complete........................................................................................................................36
7Level 2 repair ......................................................................................................................................39
7.1 power on issue ..................................................................................................错误！未定义书签。
7.2 Charge issue......................................................................................................错误！未定义书签。
7.3 Display issue .....................................................................................................错误！未定义书签。
7.4 Vibrator issue...................................................................................................错误！未定义书签。
7.5 Touch panel issue.............................................................................................错误！未定义书签。
7.6 SIM recognize issue.........................................................................................错误！未定义书签。
7.7 TF card recognized issue.................................................................................错误！未定义书签。
7.8 Main camera issue...........................................................................................错误！未定义书签。
7.9 Sub camera issue .............................................................................................错误！未定义书签。
7.10 MIC issue.......................................................................................................错误！未定义书签。
7.11 Speaker issue..................................................................................................错误！未定义书签。

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8PCBAexchange...................................................................................................................................50
8.1 Position of L2 enhance components on main PCBA....................................................................50
8.2 Trouble shooting for common failures...........................................................................................53
8.3 L2 enhance spare part list...............................................................................................................69
9PCBAexchange...................................................................................................................................70
10 Other component exchange.............................................................................................................70
Function Test..........................................................................................................................................71
APPENDIX 1 Packaging Requirements..............................................................................................72

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1 Level 2 repair process
Reassembly
Record in BIG
End
OK
Retest
OK
OK
Start
Visual Inspection
Warranty Check
Pretest & Failure confirm
SW Upgrade
Disassembly
L2 Repair
Retest
Function test
PCBA Replace
NG
NG
NG
Restore User Information
Back up user data
L2E Repair
Retest
OK
NG

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2 Warranty Check and Visual Inspection
2.1 Warranty confirmation of L1
IMEI sticker check:
1) Power on the handset, enter *#06#
2) If the IMEI sticker in the back casing is not lost:
We should make sure that the IMEI number MUST be the same with the one on the IMEI sticker; if
not, it’s out of warranty policy.
Humidity sensitive label
If humidity sensitive label is not good, the cell phone will be considered as out of guarantee.
1). Liquid was detected by humidity sensitive label.
2). Position of humidity sensitive sticker.

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2.2 Visual mechanical check
Mechanical warranties check items:
1) Corrosion
Corrosion on the USB connector, SIM connector, and other metal surfaces。
2) Hole (diameter > 1mm)
Holes on any surface, including the front casing, furnished frame, battery cover, touch Lens,
keypad…
3) Bump
Bumps (diameter > 1mm) on any surface, including front casing, decorate frame, battery
cover, touch Lens, keypad, etc.
4) Scratch
Scratches (length > 3mm) on any surface, including the front casing, decorate frame, battery
cover, touch Lens, keypad, etc.
5) Distortion
Bend, twisted or crushed on the h/s, cover/casing or connectors, etc.
6) Broken
Touch broken, casing/cover broken, etc.
7) Dropped
Keypad tear off, touch lens, connectors dropped, etc.

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8) Gap
External physical damage relating to abnormal use, like front case and frame opened
9) Others
Damage caused by disassembly ,wrong part assembly, loss of components
Use in abnormal environment like high temperature causing plastic melts
2.3 Pretest
1) Check that the SIM card is set correctly.
2) Insert the battery.
3) Power on the cell phone.
4) If the cell phone cannot power on, visually check the condition of the battery connector. Replace
it if necessary.
5) If the cell phone asks to input NCK code, this means it is SIM locked and can only be worked
with dedicated SIM card. Use the correct SIM card.
6) Enter the phone code if necessary.
7) Enter auto test in power off mode:
8) Press *#2886# in dial screen and then you will see the interface displaying the SW version.
Select “Auto” to start the auto test, or select “MANU” to do the MMI test manually.
If one of the test failed during “Auto” test mode, it will ask you “Restart?”, press “YES” to restart the
auto test from the first one and “NO” to exit the auto test, while “NEXT” to continue the auto test.

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Traceability
I. You can get some information such as IMEI, CU-REF, PTH, Date Code, etc.
II. Press “Pass” to continue.
TP0
I. “Please draw on the yellow area” according to instructions;
II. Press “Pass” to continue.
TP1
I. “Please draw on the yellow area” according to instructions;
II. Press “Pass” to continue.
TP2
III.“Please draw on the yellow area” according to instructions;
IV.Press “Pass” to continue.
LCD MIRE
I. You will see the LCD display three colors: RED, GREEN and BLUE if it
functions well;
II. Press “Pass” to continue;
LCD BLACK
I. You will see the LCD displays black if it functions well;
II. Press “Pass” to continue;

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LCD GRAYCHART
I. You will see the LCD displays grey if it functions well;
II. Press “Pass” to continue;
LCD GRAYLEVEL
I. You will see the LCD displays grey level if it functions well;
II. Press “Pass” to continue;
LCD WHITE
I. You will see the LCD displays white if it functions well;
II. Press “Pass” to continue;
KEYPAD
I. Press the key displayed on the screen. The key on the screen will turn grey
when you press it if it functions well;
II. Press “Pass” to continue.
BACKLIGHT
I. The screen backlight will be flashing if it functions well;
II. Press “Pass” to continue.
CAMERA
Press “Pass” to continue if the front camera functions well.
CAMERA IMG FRONT