
L2 Repair Document TCLCommunication Ltd.
8050X_D_G&E Level 2 Repair Document
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Content
1Level 2E repair process............................................................................................4
2Warranty Check and Visual Inspection ...................................................................5
2.1 Warranty confirmation of L1.....................................................................................5
2.2 Visual mechanical check..........................................................................................6
2.3 Pretest........................................................................................................................6
3Battery......................................................................................................................11
3.1 Battery information.................................................................................................11
3.2 Battery test ..............................................................................................................13
3.3 Battery specification...............................................................................................14
3.4 WARNING of Battery disassembling .....................................................................18
4Software download .................................................................................................18
4.1. Equipments requested when download:............................................................18
4.2. Handset driver installation .....................................................................................18
4.3. SW download process............................................................................................19
5 Disassembly and assembly 8050E ............................................................................23
5.1 ESD Safety...............................................................................................................23
5.2 Disassembly tool.....................................................................................................23
5.3 Disassembly process...............................................................................................24
5.4 Reassembly process................................................................................................35
5.5 Disassembly process evaluation............................................................................35
6Disassembly Complete...........................................................................................35
7Level 2 repair...........................................................................................................36
8L2 Enhance repair...................................................................................................44
8.1 Position of L2 enhance components on PCBA ....................................................45
8.2 Trouble shooting for common failures..................................................................47
8.3 L2 enhance spare part list......................................................................................60
9PCBA exchange.......................................................................................................62
10 Other component exchange...................................................................................62
10 Function test............................................................................................................63