
L2E Repair Document TCLCommunication Ltd.
4017A_D_E_F_X_S Level 2 enhance Repair Document
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Content
1Level 2 enhance repair process...............................................................................4
2Warranty Check and Visual Inspection ...................................................................5
2.1 Warranty confirmation of L1.....................................................................................5
2.2 Visual mechanical check ..........................................................................................6
2.3 Pretest........................................................................................................................7
2.5 Accessories inspection ............................................................................................8
2.6 Cell phone maintenance procedure ........................................................................9
3Software download .................................................................................................15
3.1 Equipments requested when download:............................................................16
3.2 Install driver.............................................................................................................16
3.3 SW download process............................................................................................17
5Disassembly and assembly 4017...........................................................................21
5.1 ESD Safety ...............................................................................................................21
5.2 Disassembly tool.....................................................................................................21
5.3 Disassembly process .............................................................................................22
5.4 Reassembly Process ..............................................................................................29
5.5 Disassembly process evaluation...........................................................................30
6Disassembly Complete...........................................................................................31
7Level 2 repair ...........................................................................................................33
8L2 Enhance repair ...................................................................................................41
8.1 Position of L2 enhance components on main PCBA...........................................41
8.2 Trouble shooting for common failures..................................................................43
8.3 L2 enhance spare part list ......................................................................................52
9PCBA exchange.......................................................................................................52
10 Other component exchange...................................................................................53
11 Final test ..................................................................................................................54