
L2 Repair Document TCLCommunication Ltd.
Rev.
5056O Level 2 Repair Document
Page
1.0 3/60
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Content
1Level 2E repair process............................................................................................4
2Warranty Check and Visual Inspection ...................................................................5
2.1Warranty confirmation of L1.....................................................................................5
2.2Visual mechanical check..........................................................................................6
2.3Pretest........................................................................................................................7
3Battery......................................................................................................................12
3.1Battery information.................................................................................................12
3.2Battery test ..............................................................................................................14
3.3Battery specification...............................................................................................16
3.4WARNING of Battery disassembling .....................................................................17
4Software download .................................................................................................18
4.1. Equipments requested when download:............................................................18
4.2. Handset driver installation .....................................................................................18
4.3. SW download process............................................................................................19
5 Disassembly and assembly 5056O............................................................................22
5.1 ESD Safety...............................................................................................................22
5.2 Disassembly tool.....................................................................................................22
5.3 Disassembly process...............................................................................................22
6Level 2 repair...........................................................................................................22
5.4 Reassembly process................................................................................................30
5.5 Disassembly process evaluation............................................................................31
7Disassembly Complete...........................................................................................31
8L2 Enhance repair...................................................................................................40
8.1Position of L2 enhance components on PCBA ....................................................41
8.2Trouble shooting for common failures..................................................................42
8.3L2 enhance spare part list......................................................................................54
9PCBA exchange.......................................................................................................54
10Other component exchange...................................................................................54
10Function test............................................................................................................55