Texas Instruments AWR1443 User manual

AWR1443, AWR1243 Evaluation Module
(AWR1443BOOST, AWR1243BOOST) mmWave
Sensing Solution
User's Guide
Literature Number: SWRU507B
May 2017–Revised January 2019

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Table of Contents
Contents
1 Getting Started .................................................................................................................... 5
1.1 Introduction................................................................................................................ 5
1.2 Key Features.............................................................................................................. 5
1.3 What is Included.......................................................................................................... 5
2 Hardware ............................................................................................................................ 6
2.1 Block Diagram............................................................................................................ 7
2.2 Connecting BoosterPack™ to LaunchPad™ or MMWAVE-DEVPACK........................................... 7
2.3 Power Connections ...................................................................................................... 8
2.4 Connectors................................................................................................................ 8
2.5 PC Connection.......................................................................................................... 12
2.6 Antenna .................................................................................................................. 13
2.7 Jumpers, Switches, and LEDs ....................................................................................... 15
3 Design Files and Software Tools.......................................................................................... 17
3.1 Software, Development Tools, and Example Codes for AWR1443.............................................. 17
4 Design Revision History...................................................................................................... 18
5 Mechanical Mounting of PCB............................................................................................... 18
6 PCB Storage and Handling Recommendations ...................................................................... 20
7 Regulatory Information ....................................................................................................... 20
Revision History.......................................................................................................................... 21

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List of Figures
List of Figures
1 EVM Front View.............................................................................................................. 6
2 EVM Rear View .............................................................................................................. 6
3 BoosterPack™ Block Diagram............................................................................................. 7
4 3V3 and 5-V Mark on the LaunchPad™ (White Triangle).............................................................. 7
5 Power Connector ............................................................................................................ 8
6 20-Pin BoosterPack™ Connectors (J5 and J6).......................................................................... 8
7 High Density Connector (60 Pin)......................................................................................... 10
8 CAN Connector............................................................................................................. 11
9 XDS110 Ports............................................................................................................... 12
10 PCB Antenna ............................................................................................................... 13
11 Antenna Pattern in H-Plane............................................................................................... 13
12 Antenna Pattern in E-Plane............................................................................................... 14
13 SOP Jumpers............................................................................................................... 15
14 Current Measurement Point............................................................................................... 15
15 S1 Switch to Select Between SPI or CAN Interface................................................................... 17
16 LDO Bypass Enable ....................................................................................................... 18
17 Vertical Assembly of the EVM............................................................................................ 19
List of Tables
1 20-Pin Connector Definition (J6)........................................................................................... 9
2 20-Pin Connector Definition (J5)........................................................................................... 9
3 HD Connector Pin Definition.............................................................................................. 10
4 SOP Modes ................................................................................................................. 15
5 Push Buttons................................................................................................................ 16
6 LEDs ......................................................................................................................... 16
7................................................................................................................................ 18

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AWR1443BOOST, AWR1243BOOST Evaluation Module mmWave Sensing
Solution
User's Guide
SWRU507B–May 2017–Revised January 2019
AWR1443BOOST, AWR1243BOOST Evaluation Module
mmWave Sensing Solution

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AWR1443BOOST, AWR1243BOOST Evaluation Module mmWave Sensing
Solution
(1) BoosterPack, LaunchPad are trademarks of Texas Instruments.
(2) ARM is a registered trademark of ARM Limited.
(3) Windows is a registered trademark of Microsoft Corporation.
(1)(2)(3)
1 Getting Started
1.1 Introduction
The AWR1443 BoosterPack™ is an easy-to-use evaluation board for the single-chip AWR1443 mmWave
sensing device from TI, with direct connectivity to the TI MCU LaunchPad™ ecosystem. The evaluation
board contains everything needed to start developing on a low-power ARM®-R4F controller. The
evaluation board includes onboard emulation for programming and debugging, onboard buttons, and
LEDs, for quick integration of a simple user interface. The standard 20-pin BoosterPack headers make the
evaluation board compatible with a wide variety of TI MCU LaunchPads and enables easy prototyping.
The AWR1243 BoosterPack is an evaluation board for the AWR1243 mmWave high-performance front
end. The evaluation platform enables raw capture of ADC data from the front end and evaluation of RF
performance.
1.2 Key Features
• 40-pin LaunchPad standard that leverages the LaunchPad ecosystem
• XDS110-based JTAG emulation with serial port, for onboard QSPI flash programming (for AWR1443)
• Backchannel UART through USB to PC, for logging purposes
• Onboard antenna
• 60-pin high density (HD) connector, for raw ADC data over CSI, or the high-speed debug interface
• Onboard CAN transceiver (for AWR1443)
• One button and two LEDs, for user interaction
• 5-V power jack, to power the board
1.3 What is Included
1.3.1 Kit Contents
• AWR1443BOOST or AWR1243BOOST
• Mounting brackets, screws, and nuts, to allow placing the PCB vertical
• Micro USB cable to connect to the PC
NOTE: Not included: 5 V, >2.5-A supply brick with 2.1-mm barrel jack (center positive). TI
recommends using an external power supply that complies with applicable regional safety
standards such as UL, CSA, VDE, CCC, PSE, and so on. The cable length of the power cord
must be < 3 m.
1.3.2 mmWave Proximity Demo
TI provides sample demo codes to easily get started with the AWR1443 evaluation module and
experience the functionality of the AWR1443 mmWave sensor. For details on getting started with these
demos, see the mmWave SDK User Guide.

Micro USB
Connector
PMIC
20-Pin LaunchPad
Connector (J6)
XDS110
20-Pin LaunchPad
Connector (J5)
Heat Sink Area
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2 Hardware
Figure 1 and Figure 2 show the front and rear views of the evaluation board, respectively.
Figure 1. EVM Front View
Figure 2. EVM Rear View

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2.1 Block Diagram
Figure 3. BoosterPack™ Block Diagram
2.2 Connecting BoosterPack™ to LaunchPad™ or MMWAVE-DEVPACK
This BoosterPack can be stacked on top of the Launchpad, or the MMWAVE-DEVPACK, using the two
20-pin connectors. The connectors do not have a key to prevent the misalignment of the pins or reverse
connection. Therefore, ensure reverse mounting does not take place. On the AWR1443 BoosterPack, we
have provided 3V3 marking near pin 1 (see Figure 4). This same marking is provided on compatible
LaunchPads which must aligned before powering up the boards.
Figure 4. 3V3 and 5-V Mark on the LaunchPad™ (White Triangle)

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2.3 Power Connections
The BoosterPack is powered by the 5-V power jack (>2.5-A current limit). As soon as the power is
provided, the NRST and 5-V LEDs glow, indicating that the board is powered up (see Figure 5).
Figure 5. Power Connector
NOTE: After the 5-V power supply is provided to the EVM, TI recommends pressing the NRST
switch (SW2) once to ensure a reliable boot up state.
2.4 Connectors
2.4.1 20-Pin BoosterPack™ Connectors
The BoosterPack has the standard LaunchPad connectors (J5 and J6) which enable the BoosterPack to
be directly connected to all TI MCU LaunchPads (see Table 1). While connecting the BoosterPack to other
LaunchPads, ensure the pin 1 orientation is correct by matching the 3V3 and 5-V signal marking on the
boards (see Figure 6).
Figure 6. 20-Pin BoosterPack™ Connectors (J5 and J6)

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Table 1 and Table 2 provide the connector-pin information.
Table 1. 20-Pin Connector Definition (J6)
Pin Number Description Pin Number Description
1 NERROUT 2 GND
3 NERRIN 4 NC
5 MCUCLK OUT 6 SPI_CS
7 NC 8 GPIO1
9 MSS LOGGER 10 nRESET
11 WARMRST 12 SPI_MOSI
13 BSS LOGGER 14 SPI_MISO
15 SOP2 16 HOSTINT
17 SOP1 18 GPIO2
19 SOP0 20 NC
Table 2. 20-Pin Connector Definition (J5)
Pin Number Description Pin Number Description
1 5 V 2 3V3
3 GND 4 GND
5 ANA1 6 RS232TX (Tx from IWR
device)
7 ANA2 8 RS232RX (Rx into IWR device)
9 ANA3 10 SYNC_IN
11 ANA4 12 NC
13 PGOOD (onboard VIO) 14 SPI_CLK
15 PMIC Enable 16 GPIO0
17 SYNC_OUT 18 SCL
19 PMIC CLK OUT 20 SDA
• PGOOD – This signal indicates the state of the onboard VIO supply for the AWR device coming from
the onboard PMIC. A high on the PGOOD signal (3.3 V) indicates that the supply is stable. Because
the IOs are not failsafe, the MCU must ensure that it does not drive any IO signals to the AWR device
before this IO supply is stable. Otherwise, there could be leakage current into the IOs.
• PMIC Enable – This signal goes onboard PMIC enable. The MCU can use this signal to completely
shut down the PMIC and AWR device to save power. The power up of the PMIC takes approximately 5
ms once the Enable signal is released.
NOTE: To enable this feature, the R102 resister must be populated on the EVM.
• ANA1/2/3/4 – These are inputs to the GPADCs (general purpose ADC) available on the AWR1443
device.

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2.4.2 60-Pin High Density (HD) Connector
The 60-pin HD connector provides high speed data over CSI or the HS_DEBUG interface, and controls
signals (SPI, UART, I2C, NRST, NERR, and SOPs) and JTAG debug signals (see Table 3). This
connector can be connected to the MMWAVE-DEVPACK board and interface with the TSW1400 (see
Figure 7).
Figure 7. High Density Connector (60 Pin)
Table 3. HD Connector Pin Definition
Pin Number Description Pin Number Description
1 5 V 2 5 V
3 5 V 4 TDO
5 TDI 6 TCK
7 SPI_CS 8 TMS
9 SPI_CLK 10 HOSTINT
11 SPI_MOSI 12 SPI_MISO
13 PGOOD (onboard VIO) 14 NERROUT
15 NC 16 SYNC_IN
17 NC 18 GND
19 NC 20 DEBUG_VALIDP
21 NC 22 DEBUG_VALIDM
23 NC 24 GND
25 NC 26 DEBUG_FRCLKP
27 NC 28 DEBUG_FRCLKM
29 NC 30 GND
31 NC 32 DEBUG/CSI_3P
33 NC 34 DEBUG/CSI_3M
35 NC 36 GND
37 NC 38 DEBUG/CSI_2P
39 NC 40 DEBUG/CSI_2M
41 NC 42 GND